CN219543880U - Quick cooling die for semiconductor - Google Patents
Quick cooling die for semiconductor Download PDFInfo
- Publication number
- CN219543880U CN219543880U CN202320259134.XU CN202320259134U CN219543880U CN 219543880 U CN219543880 U CN 219543880U CN 202320259134 U CN202320259134 U CN 202320259134U CN 219543880 U CN219543880 U CN 219543880U
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- cavity
- hole
- fixedly connected
- semiconductor
- top surface
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 238000001816 cooling Methods 0.000 title claims abstract description 22
- 239000003570 air Substances 0.000 abstract description 23
- 239000012080 ambient air Substances 0.000 abstract description 11
- 239000003292 glue Substances 0.000 abstract description 11
- 238000002347 injection Methods 0.000 abstract description 11
- 239000007924 injection Substances 0.000 abstract description 11
- 238000007711 solidification Methods 0.000 abstract description 4
- 230000008023 solidification Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 description 13
- 238000004891 communication Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 8
- 238000007599 discharging Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductor processing, and discloses a semiconductor rapid cooling die which comprises a base, wherein the top surface of the base is fixedly connected with a lower die plate, the top surface of the base is fixedly connected with a supporting rod, the top surface of the supporting rod is fixedly connected with a top plate, the bottom surface of the top plate is fixedly connected with a telescopic rod, and the bottom surface of the telescopic rod is fixedly connected with a distribution frame. According to the utility model, the annular cavity is formed in the upper die plate, the annular cavity is positioned at the outer side of the die cavity, each group of annular cavities is communicated through the second communicating cavity, the first hole and the second hole are respectively formed in the two side surfaces of the upper die plate, the air pump is used for sucking ambient air and introducing the ambient air into the first hole through the communicating pipe, so that after glue injection is completed, the ambient air is introduced into the annular cavity, the ambient air introduced into the annular cavity is used for absorbing glue injection heat, the glue injection is accelerated, the temperature is reduced and the solidification is carried out, the actual encapsulation molding efficiency is improved, and the use effect is good.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor rapid cooling die.
Background
In the process of processing and producing the semiconductor chip, the semiconductor chip is often required to be packaged, the semiconductor chip is protected and supported, the reliability of the semiconductor chip is improved, and currently, the semiconductor is mainly packaged by injection molding in the process of packaging the semiconductor.
In the prior art, a semiconductor packaging substrate is usually placed in a bottom positioning cavity in the use process, and after the semiconductor is positioned and placed, a top packaging template is used for sleeving the semiconductor downwards, and is matched with external supply equipment, so that the injection quantity is introduced into a cavity of an upper template, and the injection packaging of the semiconductor is completed.
Disclosure of Invention
In order to overcome the defects in the prior art, the utility model provides a semiconductor rapid cooling die which has the advantages of rapid cooling and rapid discharging.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a quick cooling die of semiconductor, includes the base, the top surface fixedly connected with lower bolster of base, the top surface fixedly connected with bracing piece of base, the top surface fixedly connected with top board of bracing piece, the bottom surface fixedly connected with telescopic link of top board, the bottom surface fixedly connected with distribution frame of telescopic link, the bottom surface fixedly connected with cope match-plate pattern of distribution frame, communication chamber and die cavity have been seted up respectively to the top surface and the bottom surface of cope match-plate pattern, the through-hole has been seted up to the inside of cope match-plate pattern, the upper and lower both ends of through-hole are linked together with communication chamber and die cavity respectively, annular chamber and No. two intercommunication chambeies have been seted up respectively to the inside of cope match-plate pattern, annular chamber is located the outside of die cavity, no. one hole and No. two holes have been seted up respectively to the both sides face of cope match-plate pattern, the top surface of cope match-plate pattern is equipped with the air pump, fixed intercommunication has communicating pipe between air pump and the cope match-plate pattern, the one end and the hole of communicating pipe are linked together.
As a preferable technical scheme of the utility model, two adjacent groups of annular cavities are communicated through a second communication cavity, the first hole and the second hole are communicated with the annular cavities, the adjacent annular cavities are communicated through the second communication cavity, ventilation of each group of annular cavities is realized when the adjacent annular cavities are introduced into one group of annular cavities through the first hole, and heat absorption and temperature reduction of glue injection in cavities at the inner side of the annular cavities are realized by introducing ambient air into each group of annular cavities, so that rapid temperature reduction is realized.
As a preferable technical scheme of the utility model, the top surface of the distribution frame is fixedly communicated with a curved pipe, the outer end of the curved pipe is fixedly communicated with a communication frame, and hot melt glue is injected into the distribution frame by utilizing the curved pipe and the communication frame and matching with an external supply mechanism, and then through holes.
As a preferable technical scheme of the utility model, the top surface of the lower template is provided with a positioning cavity, the inside of the lower template is provided with a sleeve hole, the upper end of the sleeve hole is communicated with the positioning cavity, the inside of the lower template is provided with a side hole, the side hole is communicated with the sleeve hole, and air introduced into the side hole is conveniently introduced into the sleeve hole by utilizing the side hole and each group of sleeve holes.
As a preferable technical scheme of the utility model, the top surface of the base is fixedly connected with a spring, the spring is positioned in the sleeve hole, the top end of the spring is fixedly connected with a movable rod, the movable rod is movably sleeved in the sleeve hole, and the elasticity of the spring is utilized to push the movable rod to move upwards when air is introduced into the sleeve hole, so that the packaging substrate in the positioning cavity is pushed out, convenient discharging is realized, and convenient resetting is realized by utilizing the elasticity of the spring.
As a preferable technical scheme of the utility model, the side surface of the lower template is provided with the side groove, the side groove is communicated with the side hole, the side surface of the side groove is fixedly sleeved with the magnetic plate, and the movable pipe is used for introducing air into the side hole when the movable pipe is sleeved in the side groove by utilizing the communication of the residual side hole of the side groove.
As a preferable technical scheme of the utility model, a movable pipe is fixedly connected to one side surface of the upper template, one end of the movable pipe is communicated with the second hole, air discharged from the second hole is led out by utilizing the movable pipe, a metal frame is sleeved at the movable end of the movable pipe and is adsorbed and fixed with the magnetic plate when the metal frame is sleeved in the side groove, so that air is stably introduced into the side hole, and air is introduced into the sleeve hole, and the pneumatic thrust discharging is realized.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the annular cavity is formed in the upper die plate, the annular cavity is positioned at the outer side of the die cavity, each group of annular cavities is communicated through the second communicating cavity, the first hole and the second hole are respectively formed in the two side surfaces of the upper die plate, the air pump is used for sucking ambient air and introducing the ambient air into the first hole through the communicating pipe, so that after glue injection is completed, the ambient air is introduced into the annular cavity, the ambient air introduced into the annular cavity is used for absorbing glue injection heat, the glue injection is accelerated, the temperature is reduced and the solidification is carried out, the actual encapsulation molding efficiency is improved, and the use effect is good.
2. According to the utility model, the sleeve hole is formed in the lower die plate, the top end of the through hole is communicated with the positioning cavity, the movable rod is movably sleeved in the sleeve hole, the bottom surfaces of the movable rods are fixedly connected, after packaging of a semiconductor is completed, gas is introduced into the upper die plate by using the air pump again, the second hole and the movable tube are matched, after the movable tube is sleeved in the side groove, the gas is introduced into the side hole and into the sleeve hole, the movable rod in the sleeve hole is pushed to move upwards, so that the semiconductor packaging substrate in the positioning cavity is automatically pushed out, convenient discharging is completed, and the operation efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the present utility model;
FIG. 3 is an enlarged schematic view of the structure shown at A in FIG. 2;
FIG. 4 is a schematic cross-sectional view between a base and a lower template of the present utility model;
FIG. 5 is an enlarged schematic view of the structure at B in FIG. 4;
FIG. 6 is a schematic bottom view of the lower die plate of the present utility model;
FIG. 7 is a schematic cross-sectional view of a lower die plate of the present utility model;
fig. 8 is an exploded view of the lower die plate of the present utility model.
In the figure: 1. a base; 2. a lower template; 3. a support rod; 4. a top plate; 5. a telescopic rod; 6. a dispensing frame; 7. an upper template; 8. a cavity; 9. a through hole; 10. a first communicating cavity; 11. a ring cavity; 12. a second communicating cavity; 13. a first hole; 14. a second hole; 15. an air pump; 16. a communicating pipe; 17. a curved tube; 18. a communication frame; 19. a positioning cavity; 20. trepanning; 21. a side hole; 22. a movable tube; 23. a movable rod; 24. a spring; 25. a side groove; 26. a magnetic plate.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1 to 8, the utility model provides a semiconductor rapid cooling die, which comprises a base 1, the top surface of the base 1 is fixedly connected with a lower die plate 2, the top surface of the base 1 is fixedly connected with a supporting rod 3, the top surface of the supporting rod 3 is fixedly connected with a top plate 4, the bottom surface of the top plate 4 is fixedly connected with a telescopic rod 5, the bottom surface of the telescopic rod 5 is fixedly connected with a distribution frame 6, the bottom surface of the distribution frame 6 is fixedly connected with an upper die plate 7, a first communicating cavity 10 and a cavity 8 are respectively formed in the top surface and the bottom surface of the upper die plate 7, through holes 9 are respectively formed in the upper die plate 7, the upper end and the lower end of the through holes 9 are respectively communicated with the first communicating cavity 10 and the cavity 8, a ring cavity 11 and a second communicating cavity 12 are respectively formed in the upper die plate 7, the ring cavity 11 is positioned on the outer side of the cavity 8, a first hole 13 and a second hole 14 are respectively formed in the two side surfaces of the upper die plate 7, an air pump 15 is arranged on the top surface of the upper die plate 7, a communicating pipe 16 is fixedly communicated between the air pump 15 and the upper die plate 7, and one end of the communicating pipe 16 is communicated with the first hole 13.
Wherein, two adjacent groups of annular cavities 11 are communicated through a second communicating cavity 12, and a first hole 13 and a second hole 14 are communicated with the annular cavities 11.
Through utilizing No. two intercommunication chambeies 12 to communicate adjacent ring chamber 11, guarantee to let in a set of ring chamber 11 via hole No. 13, realize the ventilation of every group ring chamber 11, through let in every group ring chamber 11 with the ambient air, realize the heat absorption cooling of injecting glue in the die cavity 8 of ring chamber 11 inboard to realize quick cooling.
Wherein, the top surface of the distribution frame 6 is fixedly communicated with a curved pipe 17, and the outer end of the curved pipe 17 is fixedly communicated with a communication frame 18.
By using the curved pipe 17 and the communicating frame 18, and matching with an external supply mechanism, the hot melt adhesive is introduced into the dispensing frame 6, and then is injected through the through hole 9.
Wherein, the top surface of lower bolster 2 has seted up location chamber 19, and the trepanning 20 has been seted up to the inside of lower bolster 2, and the upper end of trepanning 20 is linked together with location chamber 19, and the side opening 21 has been seted up to the inside of lower bolster 2, and side opening 21 is linked together with trepanning 20.
By utilizing the side holes 21 with each set of the sleeve holes 20, air introduced into the side holes 21 is conveniently introduced into the sleeve holes 20.
The top surface of the base 1 is fixedly connected with a spring 24, the spring 24 is positioned in the sleeve hole 20, the top end of the spring 24 is fixedly connected with a movable rod 23, and the movable rod 23 is movably sleeved in the sleeve hole 20.
By utilizing the elasticity of the spring 24, the movable rod 23 is pushed to move upwards when air is introduced into the trepanning 20, so that the packaging substrate in the positioning cavity 19 is pushed out, convenient discharging is realized, and convenient resetting is realized by utilizing the elasticity of the spring 24.
Wherein, the side face of the lower template 2 is provided with a side groove 25, the side groove 25 is communicated with the side hole 21, and the side face of the side groove 25 is fixedly sleeved with a magnetic plate 26.
By utilizing the side slots 25 to communicate with the remaining side holes 21, the movable tube 22 passes air into the side holes 21 when sleeved in the side slots 25.
Wherein, a side of the upper template 7 is fixedly connected with a movable pipe 22, and one end of the movable pipe 22 is communicated with the second hole 14.
The air exhausted from the second hole 14 is led out by utilizing the movable pipe 22, and the movable end of the movable pipe 22 is sleeved with the metal frame, and the metal frame is fixedly adsorbed with the magnetic plate 26 when sleeved in the side groove 25, so that the air is stably introduced into the side hole 21, and the air is introduced into the sleeve hole 20, and the pneumatic thrust discharging is realized.
The working principle and the using flow of the utility model are as follows: during packaging, a semiconductor packaging substrate is placed in a positioning cavity 19 at the top of a lower die plate 2, a semiconductor is placed at the top of the packaging substrate, a telescopic rod 5 is started, the telescopic rod 5 drives an upper die plate 7 to move downwards, the upper die plate 7 moves into the positioning cavity 19, a die cavity 8 is sleeved outside the semiconductor, an external supply mechanism is started, glue injection is introduced into a first communication cavity 10 through a communication frame 18 and a curved pipe 17 and is injected into the die cavity 8 through a through hole 9, then an air pump 15 is started, ambient air is sucked into the first hole 13 through a communication pipe 16 and is introduced into each group of annular cavities 11, heat exchange cooling and solidification are carried out on the glue injection in the die cavity 8, and the air after heat absorption is discharged through a second hole 14, so that rapid cooling solidification is completed; when the packaged packaging substrate is required to be taken out, the movable end of the movable tube 22 is aligned to the side groove 25, the air pump 15 is started again, so that gas is introduced into the side hole 21 through the upper template 7 and the movable tube 22 and into the sleeve hole 20, and the movable rod 23 in the sleeve hole 20 is pushed to move upwards, so that the packaging substrate is pushed out of the positioning cavity 19, and discharging is completed.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a semiconductor rapid cooling mould, includes base (1), its characterized in that: the top surface of the base (1) is fixedly connected with a lower template (2), the top surface of the base (1) is fixedly connected with a supporting rod (3), the top surface of the supporting rod (3) is fixedly connected with a top plate (4), the bottom surface of the top plate (4) is fixedly connected with a telescopic rod (5), the bottom surface of the telescopic rod (5) is fixedly connected with a distribution frame (6), an upper template (7) is fixedly connected with the bottom surface of the distribution frame (6), the top surface and the bottom surface of the upper template (7) are respectively provided with a first communicating cavity (10) and a cavity (8), a through hole (9) is arranged in the upper die plate (7), the upper end and the lower end of the through hole (9) are respectively communicated with a first communicating cavity (10) and a cavity (8), an annular cavity (11) and a second communicating cavity (12) are respectively arranged in the upper die plate (7), the annular cavity (11) is positioned at the outer side of the cavity (8), a first hole (13) and a second hole (14) are respectively formed on two side surfaces of the upper template (7), an air pump (15) is arranged on the top surface of the upper template (7), a communicating pipe (16) is fixedly communicated between the air pump (15) and the upper template (7), one end of the communicating pipe (16) is communicated with the first hole (13).
2. A semiconductor rapid cooling die according to claim 1, wherein: two adjacent groups of annular cavities (11) are communicated with each other through a second communicating cavity (12), and the first holes (13) and the second holes (14) are communicated with the annular cavities (11).
3. A semiconductor rapid cooling die according to claim 1, wherein: the top surface of distribution frame (6) is fixed to be linked together and is had curved tube (17), the outer end of curved tube (17) is fixed to be linked together and is had intercommunication frame (18).
4. A semiconductor rapid cooling die according to claim 1, wherein: the locating cavity (19) has been seted up to the top surface of lower bolster (2), trepanning (20) have been seted up to the inside of lower bolster (2), trepanning (20) upper end and locating cavity (19) are linked together, side opening (21) have been seted up to the inside of lower bolster (2), side opening (21) are linked together with trepanning (20).
5. A semiconductor rapid cooling die according to claim 1, wherein: the top surface of base (1) fixedly connected with spring (24), spring (24) are arranged in trepanning (20).
6. The rapid cooling semiconductor die set according to claim 5, wherein: the top end of the spring (24) is fixedly connected with a movable rod (23), and the movable rod (23) is movably sleeved in the sleeve hole (20).
7. A semiconductor rapid cooling die according to claim 1, wherein: a side groove (25) is formed in the side face of the lower die plate (2), and the side groove (25) is communicated with the side hole (21).
8. The rapid cooling semiconductor die set according to claim 7, wherein: the side surface of the side groove (25) is fixedly sleeved with a magnetic plate (26).
9. A semiconductor rapid cooling die according to claim 1, wherein: a movable pipe (22) is fixedly connected to one side surface of the upper template (7).
10. The rapid cooling semiconductor die of claim 9, wherein: one end of the movable pipe (22) is communicated with the second hole (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320259134.XU CN219543880U (en) | 2023-02-20 | 2023-02-20 | Quick cooling die for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320259134.XU CN219543880U (en) | 2023-02-20 | 2023-02-20 | Quick cooling die for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219543880U true CN219543880U (en) | 2023-08-18 |
Family
ID=87700934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320259134.XU Active CN219543880U (en) | 2023-02-20 | 2023-02-20 | Quick cooling die for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219543880U (en) |
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2023
- 2023-02-20 CN CN202320259134.XU patent/CN219543880U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |