CN219485732U - Wafer clamping mechanism - Google Patents

Abstract

The present application discloses a wafer clamping mechanism, which relates to the field of wafer handling, and includes a finger body, on which a supporting base for supporting wafers is detachably connected, and on which the finger body rotates in the horizontal direction A pressing plate is connected, and the finger body is provided with a driving member for driving the pressing plate to rotate, and the pressing plate is used for pressing the wafer onto the support plate. This application helps to improve the stability of wafer fixation.

Description

A wafer clamping mechanism

technical field

The present application relates to the field of wafer handling, in particular to a wafer clamping mechanism.

Background technique

At present, during the wafer handling process, it is usually completed by using a manipulator, and the fingers on the manipulator play a vital role in it.

Because the wafer is relatively expensive, in order to prevent damage to the wafer during the handling process, the wafer will be fixed by a patch ring. Referring to Figure 1, the wafer includes the middle wafer 10 and the wafer 10 peripheral side The patch ring 20 is provided with two gaps 30 on the patch ring 20 .

The existing finger usually adopts vacuum adsorption type, which uses negative pressure to achieve adsorption and fixation of the patch ring, and then realizes the handling operation, but the stability of the wafer fixation depends on the stability of the gas source. If the gas source is unstable, that is, The wafer is fixed unstable, there will be cases where the wafer will fall, and there is room for improvement.

Utility model content

In order to improve the stability of wafer fixing, the present application provides a wafer clamping mechanism.

A wafer clamping mechanism provided by this application adopts the following technical scheme:

A wafer clamping mechanism, comprising a finger body, the finger body is detachably connected with a supporting base for supporting wafers, the finger body is connected with a pressure plate rotating in the horizontal direction, and the finger body is provided with a useful The driver is used to drive the rotation of the pressing plate, and the pressing plate is used to press the wafer onto the support plate.

By adopting the above technical scheme, the wafer in the wafer cassette is supported by the supporting seat of the finger body, and then the driving part drives the pressure plate to rotate, so that the pressure plate is pressed tightly on the patch ring to realize the fixing of the wafer, and then The manipulator can drive the fingers to move to realize the handling operation of the wafer. The clamping fingers in this application help to improve the stability of wafer fixation compared with suction fingers.

Preferably, the driving member is configured as a driving cylinder, the pressing plate is hinged to the piston rod of the driving cylinder, the side of the pressing plate away from the piston rod of the driving cylinder is connected to a connecting plate, and the connecting plate rotates away from the side of the pressing plate Connected to the finger body, the rotation axis of the connecting plate is horizontal, and the side of the pressing plate away from the piston rod of the driving cylinder is provided with a pressing claw.

By adopting the above technical solution, the drive cylinder is operated. When the piston rod is extended, the upper side of the driving platen rotates, and then the lower side of the platen and the connecting plate will rotate accordingly, thereby making the pressure jaws pressed against the surface of the wafer. Realize the fixation of the wafer.

Preferably, a positioning column is provided on the supporting seat, and the positioning column abuts and fits with the notch of the patch ring.

By adopting the above technical scheme, when the manipulator drives the fingers to move into the wafer box, the position of the wafer is realized by the abutment between the positioning column and the notch of the patch ring, and the position of the wafer is limited, which is helpful It is used to prevent the wafer from moving before the pressing jaws are not pressed against the placement ring.

Preferably, a supporting plate is provided on the supporting seat, and a guiding surface is formed at an end of the supporting plate.

By adopting the above technical solution, when the manipulator drives the fingers to move into the wafer cassette, if there is a slight error in the height of the manipulator, the guide surface can be used to guide the wafer to the support plate smoothly, avoiding the conflict between the support plate and the wafer .

Preferably, the support seat is connected to the finger body by bolts.

By adopting the above technical solution, the support seat and the finger body are connected by bolts to realize the detachable connection of the two. When the support seat is damaged after long-term use, it is easy to replace it.

Preferably, a storage slot is opened on the support plate, and a first photoelectric sensor is arranged in the storage slot, the first photoelectric sensor is located on the side of the support plate close to the pressing plate, and the first photoelectric sensor is connected to the drive Cylinder signal connection.

By adopting the above technical scheme, when the patch ring is in contact with the positioning column, the photoelectric sensor detects the patch ring at this time, and transmits the signal to the driving cylinder to make it move, and then makes the pressure claw press on the patch to realize the alignment. Wafer fixation.

Preferably, a connection block is fixedly connected to the end of the piston rod of the driving cylinder, the pressure plate is hinged to the connection block, a moving plate is provided on one side of the connection block, and a second photoelectric sensor is provided on the finger body, so The second photoelectric sensor is signal-connected with the driving cylinder, and when the moving plate moves to the second photoelectric sensor, the second photoelectric sensor transmits a signal to the driving cylinder to stop the driving cylinder.

By adopting the above technical solution, the driving cylinder drives the piston rod to extend. When the pressing claw is pressed tightly on the patch ring, the moving plate blocks the light emitted by the second photoelectric sensor, and the second photoelectric sensor transmits a signal to the driving cylinder, so that Stopping the drive cylinder helps prevent the drive cylinder from continuing to operate, causing the pressure jaws to exert too much force on the patch ring, resulting in damage to the patch ring.

Preferably, a stopper is provided at the end of the supporting seat away from the finger body.

By adopting the above technical scheme, when the manipulator drives the fingers to move into the wafer box, the fingers are located below the wafer to be picked up, and the manipulator drives the fingers to rise, so that the wafer falls onto the supporting seat, and the stopper and the patch ring are used to The abutment realizes the limitation and positioning of the wafer, which helps to further improve the stability of wafer handling.

In summary, the present application includes at least one of the following beneficial technical effects:

1. Use the driving cylinder to drive the pressure plate to rotate, so that the pressure claws are pressed on the wafer to achieve the fixation of the wafer. Compared with the adsorption finger, the fixed clamping type is more stable, which helps to improve the stability of the wafer handling ;

2. Use the first photoelectric sensor and the second photoelectric sensor to transmit signals to the driving cylinder, so that the driving cylinder can run in time and stop in time. On the one hand, it helps to quickly compress the patch ring, and on the other hand, it helps to prevent excessive force from the pressing claws. Large, resulting in damage to the patch ring;

3. The wafer is positioned and limited by the stopper, which helps to further improve the stability of wafer fixing.

Description of drawings

FIG. 1 is a schematic diagram of the overall structure of a wafer in the related art;

FIG. 2 is a schematic diagram of the overall structure of Embodiment 1 of the present application;

Fig. 3 is a partial structural schematic diagram of Embodiment 1 of the present application, mainly reflecting the structure of the pressing plate;

FIG. 4 is a partial structural schematic diagram of Embodiment 2 of the present application, mainly showing the structure of the stopper.

Reference signs: 1. Finger body; 11. Installation groove; 12. Cover plate; 2. Support seat; 3. Support plate; 31. Positioning column; 32. Guide surface; 33. Storage groove; 34. Block ; 4, pressing plate; 41, pressing claw; 5, driving member; 51, connecting block; 6, connecting plate; 7, first photoelectric sensor; 8, moving plate; 9, second photoelectric sensor; 10, wafer; 20, patch ring; 30, gap.

Detailed ways

The present application will be described in further detail below in conjunction with accompanying drawings 2-4.

The embodiment of the present application discloses a wafer clamping mechanism.

Example 1

Referring to Fig. 2 and Fig. 3, the wafer clamping mechanism includes a finger body 1, and the finger body 1 is connected with a support seat 2 through bolts, and two support plates 3 are integrally formed on the support seat 2, and between the two support plates 3 The center is arranged in a U shape, and the finger body 1 is connected with a pressure plate 4 rotating along the horizontal direction, and the finger body 1 is provided with a driving member 5 for driving the pressure plate 4 to rotate. The manipulator drives the finger body 1 to move, so that the supporting plate 3 supports the wafer, and then the driving member 5 drives the pressing plate 4 to rotate and press it on the patch ring to realize the fixing of the wafer.

The finger body 1 is provided with a mounting groove 11, the driving member 5 is set as a driving cylinder, and the driving cylinder is fixedly installed in the mounting groove 11. The end of the piston rod of the driving cylinder is fixedly connected with a connecting block 51, and the pressing plate 4 is hinged with the connecting block 51. The side of the pressure plate 4 away from the connection block 51 is hinged with a connection plate 6, and the side of the connection plate 6 away from the pressure plate 4 is hinged in the installation groove 11 of the finger body 1, and the end of the pressure plate 4 away from the connection block 51 is integrally formed with two pressure claws 41, used to compress the patch ring; wherein, the rotation axes of the pressing plate 4 and the connecting plate 6 are all arranged horizontally.

The cylinder is driven by operation, and the piston rod is elongated. Under the rotation of the pressing plate 4 and the connecting plate 6, the pressing jaw 41 will be pressed against the patch ring to realize the fixing of the wafer.

In addition, the finger body 1 is connected with a cover plate 12 at the opening of the mounting groove 11 for covering the driving cylinder, the pressing plate 4, etc. in the mounting groove 11, which helps to improve the aesthetics of the finger.

Positioning posts 31 are fixedly installed on the sides of the two supporting plates 3 close to the finger body 1 , and the two positioning posts 31 correspond to the two notches one by one, and the positioning posts 31 abut and fit with the corresponding notches. The positioning of the wafer is realized by the abutting fit between the positioning column 31 and the notch of the patch ring, which helps to prevent the wafer from moving before it is fixed.

The end of the support plate 3 away from the finger body 1 is formed with a guide surface 32. When the manipulator drives the finger to move into the wafer cassette, if there is a slight error in the height of the manipulator, the guide surface 32 can be used to smoothly guide the wafer to the support. On the support plate 3, avoid the conflict between the support plate 3 and the wafer, which will affect the handling work.

One of the supporting plates 3 is provided with a receiving groove 33, the receiving groove 33 is located on the side of the supporting plate 3 close to the finger body 1, the first photoelectric sensor 7 is installed in the receiving groove 33, and the first photoelectric sensor 7 is connected with the drive cylinder signal. Connect; when the gap on the patch ring abuts against the positioning column 31, the patch ring blocks the light emitted by the first photoelectric sensor 7, and now the first photoelectric sensor 7 transmits a signal to the drive cylinder to drive the drive cylinder to run, and then The driving claw 41 is pressed against the patch ring to realize the clamping and fixing operation of the wafer.

One side of the connection block 51 is fixedly connected with a moving plate 8, and the finger body 1 is located in the installation groove 11 and a second photoelectric sensor 9 is installed. The second photoelectric sensor 9 is connected with the driving cylinder signal. When the claw 41 is pressed on the patch ring, the moving plate 8 blocks the light emitted by the second photoelectric sensor 9, and the second photoelectric sensor 9 will transmit a signal to the driving cylinder to stop it, which helps to prevent the driving cylinder from Continue to move, so that the force of the pressing claw 41 on the patch ring is too large, resulting in damage to the patch ring.

The implementation principle of a wafer clamping mechanism in the embodiment of the present application is as follows: the manipulator drives the clamping finger to move into the wafer box, supports the wafer, and utilizes the abutment between the positioning column 31 and the gap of the patch ring to first Position the wafer, then the first photoelectric sensor 7 will transmit a signal to the drive cylinder, and the drive cylinder will drive the pressure plate 4 to rotate, so that the pressure jaw 41 is pressed against the patch ring to realize the fixation of the wafer, and then move Under the action of the plate 8 and the second photoelectric sensor 9, the second photoelectric sensor 9 transmits a signal to the driving cylinder to stop its operation, that is, the clamping and fixing action of the wafer is completed, and then the manipulator can move to realize the moving action of the wafer ; In this process, the wafer is fixed by using the pressing claw 41 to press the patch ring tightly. This fixing method is stable, which helps to improve the stability of the wafer when it is transported.

Example 2

Referring to FIG. 4 , the difference between this embodiment and Embodiment 1 is that no positioning column 31 and guide surface 32 are set on the support plate 3 , and the end of the support plate 3 away from the finger body 1 is fixedly connected with a stopper 34 . When taking out the wafer, the support plate 3 moves to the bottom of the wafer, then lifts up, and then moves outward, and the wafer is limited by the contact between the stopper 34 and the patch ring, and then the pressure claw 41 is pressed on On the patch ring, the wafer can be fixed.

All of the above are preferred embodiments of the application, and are not intended to limit the protection scope of the application. Therefore, all equivalent changes made according to the structure, shape, and principle of the application should be covered by the protection scope of the application. Inside.

Claims (8)

1. A wafer clamping mechanism, characterized in that: it comprises a finger body (1), the finger body (1) is detachably connected with a support seat (2) for holding a wafer, and the finger body ( 1) A pressing plate (4) is connected to rotate along the horizontal direction, the finger body (1) is provided with a driving member (5) for driving the pressing plate (4) to rotate, and the pressing plate (4) is used to press the wafer Tightly on the support plate (3). 2. A wafer clamping mechanism according to claim 1, characterized in that: the driving member (5) is configured as a driving cylinder, the pressing plate (4) is hinged to the piston rod of the driving cylinder, and the pressing plate (4) One side away from the driving cylinder piston rod is rotatably connected to a connecting plate (6), and the side of the connecting plate (6) away from the pressure plate (4) is rotatably connected to the finger body (1), and the connecting plate ( 6) The axis of rotation is horizontal, and the side of the pressing plate (4) away from the piston rod of the driving cylinder is provided with a pressing claw (41). 3. A wafer clamping mechanism according to claim 1, characterized in that: the supporting seat (2) is provided with a positioning column (31), and the positioning column (31) is connected with the patch ring Gap butt fit. 4. A wafer clamping mechanism according to claim 1, characterized in that: a support plate (3) is provided on the support seat (2), and the end of the support plate (3) A guide surface (32) is formed. 5. A wafer clamping mechanism according to claim 1, characterized in that: the supporting base (2) is connected to the finger body (1) by bolts. 6. A wafer clamping mechanism according to claim 4, characterized in that: a storage groove (33) is opened on the support plate (3), and a first A photoelectric sensor (7), the first photoelectric sensor (7) is located on the side of the supporting plate (3) close to the pressing plate (4), and the first photoelectric sensor (7) is connected to the driving cylinder for signals. 7. A wafer clamping mechanism according to claim 2, characterized in that: the end of the piston rod of the driving cylinder is fixedly connected with a connecting block (51), and the pressing plate (4) and the connecting block (51) Hinged, one side of the connecting block (51) is provided with a moving plate (8), the finger body (1) is provided with a second photoelectric sensor (9), and the second photoelectric sensor (9) is connected with the drive cylinder Signal connection, when the moving plate (8) moves to the second photoelectric sensor (9), the second photoelectric sensor (9) transmits a signal to the driving cylinder to stop the driving cylinder. 8. A wafer clamping mechanism according to claim 1, characterized in that: a stopper (34) is provided at the end of the supporting seat (2) away from the finger body (1).