CN219478215U - Switching circuit board, circuit board assembly and electronic equipment - Google Patents

Abstract

The application discloses a switching circuit board, circuit board subassembly and electronic equipment relates to electronic components technical field. The switching circuit board comprises a main body part and a shielding part, wherein the main body part is provided with a first surface and a second surface which are opposite in a first direction, a first connecting part is arranged on the first surface, and the first connecting part is used for being electrically connected with an electronic component; the shielding part is arranged on the first surface and protrudes relative to the first surface, and the shielding part is arranged around at least part of the first connecting part.

Description

Switching circuit board, circuit board assembly and electronic equipment

Technical Field

The application belongs to the technical field of electronic components, and particularly relates to a switching circuit board, a circuit board assembly and electronic equipment.

Background

In the related art, many electronic components need to be electrically connected to each other to transmit signals or energy, for example, direct electrical connection between components, or electrical connection between components through an electrical connector.

However, when two electronic components are connected, for example, when a circuit Board is directly electrically connected to the components, or when two circuit boards are electrically connected through a BTB connector (Board-to-Board Connectors), if the connection location between the electronic components is relatively close to a device having electromagnetic radiation, the electromagnetic radiation will interfere with SI (signal integrity, signal Integrality) quality between the electronic components.

Disclosure of Invention

The application aims to provide a switching circuit board, a circuit board assembly and electronic equipment, and at least solves the technical problem that electromagnetic radiation has larger interference on connection between electronic components.

In order to solve the technical problems, the application is realized as follows:

in a first aspect, an embodiment of the present application provides a switching circuit board, where the switching circuit board includes a main body portion and a shielding portion, the main body portion has a first surface and a second surface opposite to each other in a first direction, a first connection portion is disposed on the first surface, and the first connection portion is configured to be electrically connected to an electronic component; the shielding part is arranged on the first surface and protrudes relative to the first surface, and the shielding part is arranged around at least part of the first connecting part.

In a second aspect, the present application further provides a circuit board assembly, the circuit board assembly including the interposer circuit board as provided in the first aspect and an electronic component including a first component and an electrical connector electrically connected between the interposer circuit board and the first component.

In a third aspect, the present application also provides an electronic device comprising a circuit board assembly as provided in the second aspect.

In the switching circuit board that this application provided, the switching circuit board includes main part and shielding portion, is provided with first connecting portion on the first surface of main part, and first connecting portion can carry out the electricity with electronic components and be connected in order to transmit the signal, for example, first connecting portion can carry out the electricity with first components or electric connector and be connected in order to transmit the signal. The shielding part is protruding relative to the first surface and surrounds at least part of the first connecting part, so that when the first connecting part is electrically connected with the electronic component, the shielding part can shield the interference of at least part of electromagnetic radiation, the quality of signal transmission between the switching circuit board and the electronic component is improved, and the interference of the electromagnetic radiation on the work of the electronic component is reduced.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

For a clearer description of the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, it will be obvious that the drawings described below are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art, wherein:

fig. 1 is a schematic diagram illustrating connection between a switching circuit board and an electronic component according to some embodiments of the present application;

fig. 2 is a schematic structural diagram of a switching circuit board according to some embodiments of the present application;

FIG. 3 is a schematic diagram of a circuit board according to other embodiments of the present application;

FIG. 4 is a schematic cross-sectional view of a interposer circuit board according to some embodiments of the present application;

fig. 5 is a schematic bottom view of a switching circuit board according to some embodiments of the present disclosure;

FIG. 6 is a schematic diagram of a circuit board assembly according to some embodiments of the present application;

FIG. 7 is a schematic view of a circuit board assembly according to other embodiments of the present application;

fig. 8 is a schematic structural view of a circuit board assembly according to still other embodiments of the present application.

Reference numerals illustrate:

10-a circuit board assembly; 10 a-electronic components;

1-switching a circuit board; 11-a body portion; 11 a-a first surface; 11 b-a second surface; 111-a first connection; 112-a third connection; 113-fourth connection; 12-shielding part; 121-a second connection; 122-notch; 13-a first metallized hole; 14-a second metallized hole;

a 2-electrical connector; 21-a male seat; 22-a female seat;

3-a first component; 31-reinforcing plates;

4-a second component;

5-conducting cloth;

x-a first direction;

y-a second direction;

z-third direction.

Detailed Description

Features and exemplary embodiments of various aspects of the present application are described in detail below to make the objects, technical solutions and advantages of the present application more apparent, and to further describe the present application in conjunction with the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative of the application and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing examples thereof, and in the drawings and the following description, at least some well-known structures and techniques are not shown in order to avoid unnecessarily obscuring the present application; also, the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In this context, unless otherwise indicated, the meaning of "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present application. Moreover, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article or apparatus that comprises the element.

The directional terms appearing in the following description are all directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected. The specific meaning of the terms in the present application can be understood as appropriate by one of ordinary skill in the art.

In the related art, many electronic components are often affected by structural arrangements, so that an electrical connection between two electronic components is often required through an electrical connector. However, applicants have found that when two electronic components are connected by an electrical connector, for example, two circuit boards are connected by a BTB connector, if the electrical connector is positioned closer to the component having electromagnetic radiation, the electromagnetic radiation will interfere with SI quality between the electronic components.

In order to solve the technical problems, the application is provided. For a better understanding of the present application, the following describes in detail the interposer circuit board, the circuit board assembly, and the electronic device of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a schematic connection diagram of a patch circuit board 1 and an electronic component 10a according to some embodiments of the present application, fig. 2 is a schematic structural diagram of a patch circuit board 1 according to some embodiments of the present application, in which an X direction is a first direction X, a Y direction is a second direction Y, and a Z direction is a third direction Z.

As shown in fig. 1 and 2, the embodiment of the present application provides a patch circuit board 1, where the patch circuit board 1 includes a main body portion 11 and a shielding portion 12, the main body portion 11 has a first surface 11a and a second surface 11b opposite to each other in a first direction X, the first surface 11a is provided with a first connection portion 111, and the first connection portion 111 is used for electrically connecting with an electronic component 10 a; the shielding portion 12 is disposed on the first surface 11a and protrudes with respect to the first surface 11a, and the shielding portion 12 is disposed around at least a portion of the first connecting portion 111.

In the patch circuit board 1 provided in the present application, the patch circuit board 1 includes a main body portion 11 and a shielding portion 12, a first connection portion 111 is disposed on a first surface 11a of the main body portion 11, and the first connection portion 111 can be electrically connected with the electronic component 10a to transmit signals, for example, the first connection portion 111 can be electrically connected with the electrical connector 2 or the first component 3 to transmit signals. The shielding part 12 protrudes relative to the first surface 11a and surrounds at least part of the first connection part 111, so that when the first connection part 111 is electrically connected with the electronic component 10a, the shielding part 12 can shield at least part of electromagnetic radiation interference, so that the quality of signal transmission between the switching circuit board 1 and the electronic component 10a is improved, and the interference of the electromagnetic radiation on the operation of the electronic component 10a is reduced.

In this embodiment of the present application, the patch circuit board 1 may be a pcb (printed circuit board ) type circuit board, which can be used to implement electrical connection between electronic components in a circuit. In some embodiments, the interposer circuit board 1 may be a Multi-Layer board (Multi-Layer Boards) type circuit board, so as to provide a structure with a shielding portion 12 having a certain height in the first direction X, and also increase the area on the interposer circuit board 1 where wiring can be performed.

The present application does not limit the wiring structure of the specific circuit inside the interposer circuit board 1, and the wiring structure of the circuit inside the interposer circuit board 1 can be correspondingly set according to the electronic components 10a connected to the interposer circuit board 1 as needed.

The type of the electronic component 10a that can be connected to the first connection portion 111 is not particularly limited in the present application. In some embodiments, the electronic component 10a connectable with the first connection portion 111 may include the electrical connector 2 and/or the first component 3. In some embodiments, the first connection 111 may be used to make an electrical connection directly with the first component 3. In other embodiments, as shown in fig. 1, the first connection portion 111 and the first component 3 may be electrically connected through the electrical connector 2.

For convenience of description, the following embodiment will be described taking an example of "the electronic component 10a includes the electrical connector 2 and the first component 3, and the first connection portion 111 is used for making electrical connection with the first component 3 through the electrical connector 2".

In some embodiments, the first connection 111 can be electrically connected to the first component 3 through the electrical connector 2 to transmit signals. The shielding part 12 protrudes relative to the first surface 11a and is arranged around at least part of the first connecting part 111, so that when the first connecting part 111 is electrically connected with the first component 3 through the electric connector 2, the shielding part 12 can shield at least part of electromagnetic radiation interference, thereby improving the quality of signal transmission between the special-shaped circuit board 1 and the first component 3 and reducing the interference of the electromagnetic radiation on the work of the first component 3.

The type of the first component 3 and the electrical connector 2 that can be connected to the first connection portion 111 is not limited in the present application. In some embodiments, the first component 3 may be a pcb-type circuit board, the electrical connector 2 may be a BTB connector, for example, the first component 3 may be a circuit board of a camera module, and the first component 3 is electrically connected with the first connection portion 111 of the interposer circuit board 1 through the BTB connector, and due to poor anti-interference capability of the camera module, the shielding portion 12 is configured in the interposer circuit board 1 to be raised relative to the first surface 11a and surround at least part of the first connection portion 111, so that the shielding portion 12 can shield at least part of electromagnetic radiation interference, so as to improve the working stability of the camera module.

The first connection portion 111 in the embodiment of the present application may be any structure for realizing electrical connection. In some embodiments, the first connection portion 111 may be a pad, so that the electrical connector 2 may be electrically connected to the first connection portion 111 by soldering, so that the electrical connector 2 has a relatively reliable electrical connection relationship with the first connection portion 111.

The specific shape of the shielding portion 12 is not limited in this application, and the cross-sectional shape of the shielding portion 12 on its surrounding path may be polygonal, semicircular, semi-elliptical, irregular, or the like. In some embodiments, as shown in fig. 2, the shape of the cross section of the shielding portion 12 on its circumferential path may be rectangular to facilitate the manufacturing process of the opposite circuit board.

In some embodiments, the height of the protrusion of the shielding portion 12 in the first direction X relative to the first surface 11a may be set according to the size of the electrical connector 2. In some embodiments, when the electrical connector 2 is connected to the first connection portion 111, the height of the protrusion of the shielding portion 12 in the first direction X relative to the first surface 11a may be greater than or equal to the height of the electrical connector 2 in the first direction X, so that the shielding portion 12 can have a better shielding effect on the electrical connector 2, so as to improve the shielding effect of the shielding portion 12 on electromagnetic radiation.

Fig. 3 is a schematic structural diagram of a transit circuit board 1 according to other embodiments of the present application.

As shown in fig. 3, the surrounding position of the shielding portion 12 with respect to the first connection portion 111 is not particularly limited, and the position of the shielding portion 12 may be set according to the actual electromagnetic radiation path around the patch circuit board 1. In some embodiments, the shielding portion 12 may be disposed around only an outer side of the first connecting portion 111 that is susceptible to receiving electromagnetic radiation.

In some embodiments, the shielding portion 12 surrounds one side of the first connection portion 111 in the second direction Y and two sides of the first connection portion 111 in the third direction Z, wherein the first direction X, the second direction Y and the third direction Z intersect each other. By arranging the shielding part 12 around one side of the first connecting part 111 in the second direction Y and two sides of the first connecting part 111 in the third direction Z, the shielding part 12 can be better arranged around the first connecting part 111, so as to improve the shielding effect of the shielding part 12 on electromagnetic radiation.

In some embodiments, the first connection portion 111 has a notch 122 on a side not surrounded by the shielding portion 12 in the second direction Y, and the notch 122 can allow the first component 3 to pass through, so that at least a portion of the first component 3 can extend above the first connection portion 111 to be electrically connected to the interposer circuit board 1 through the electrical connector 2. In some embodiments, the notch 122 may be disposed where electromagnetic radiation is less interfered, so as to reduce the influence of electromagnetic radiation on signal transmission through the notch 122.

Fig. 4 is a schematic cross-sectional view of a patch circuit board 1 according to some embodiments of the present application.

As shown in fig. 2 to 4, in some embodiments, a first metallized hole 13 is provided in the transit circuit board 1 extending from the shielding portion 12 toward the main body portion 11. In this embodiment, the hole wall of the circuit board substrate may be plated with a layer of conductive metal by punching, electroless plating and electroplating to form the first metallized hole 13, and the hole wall of the first metallized hole 13 is plated with metal, so that the shielding effect of the shielding portion 12 on electromagnetic radiation can be further improved by the first metallized hole 13 disposed in the shielding portion 12.

The specific extending direction of the first metallized hole 13 is not limited in this application, and in some embodiments, the first metallized hole 13 may be formed by extending only along the first direction X, so as to improve the shielding effect of the first metallized hole 13 on electromagnetic radiation, and also facilitate the manufacturing process of the first metallized hole 13.

As shown in fig. 2 and 3, the number of the first metallized holes 13 and the spacing between the adjacent first metallized holes 13 are not limited, and in some embodiments, the first metallized holes 13 may be provided in a plurality, and the plurality of first metallized holes 13 may be provided around at least a portion of the first connection portion 111. The first connecting portion 111 is surrounded by a plurality of first metallized holes 13, so that the first metallized holes 13 can play a role in better shielding electromagnetic radiation interference. By setting the spacing between the first metallized holes 13 smaller, the first metallized holes 13 can be arranged more closely around the first connection portion 111, so as to further improve the effect of shielding the first metallized holes 13 from electromagnetic radiation interference.

As shown in fig. 1 to 4, in some embodiments, the shielding portion 12 has a second connection portion 121 at a side remote from the main body portion 11 in the first direction X, and the first metallization hole 13 is connected to the second connection portion 121 so that the second connection portion 121 can be grounded through the first metallization hole 13. The second connection portion 121 may be used to connect with the first component 3, so that the first component 3 may be grounded through the second connection portion 121 to reduce interference effects of electromagnetic radiation on the first component 3.

The second connection portion 121 in the embodiment of the present application may be any structure for realizing electrical connection. In some embodiments, the second connection portion 121 may be manufactured by performing a copper leakage treatment on the surface of the circuit board substrate.

In some embodiments, the extension path of the second connection portion 121 may be the same as the extension path of at least part of the shielding portion 12, so that the second connection portion 121 has a relatively sufficient connectable area, and the connection effect between the second connection portion 121 and the first component 3 can be improved.

Fig. 5 is a schematic bottom view of the adapting circuit board 1 according to some embodiments of the present application.

As shown in fig. 4 and 5, in some embodiments, the third connection portion 112 is disposed on the second surface 11b of the main body 11, and the second metallized hole 14 extending from the first connection portion 111 to the third connection portion 112 is disposed in the main body 11, and the first connection portion 111 and the third connection portion 112 are electrically connected through the second metallized hole 14, and the third connection portion 112 is used for electrically connecting with the second component 4. Through setting up third connecting portion 112 and can be connected with first connecting portion 111 electricity through second metallization hole 14 for when second components 4 and third connecting portion 112 electricity are connected, and first components 3 are connected with first connecting portion 111 electricity through electric connector 2, first components 3 can be through switching circuit board 1 and second components 4 electricity be connected in order to realize signal transmission, make when having certain structure space setting demand including the electronic equipment inside of first components 3 and second components 4, the thickness of body portion in switching circuit board 1 in first direction X can provide the effect of local bed hedgehopping to first components 3, in order to satisfy the demand that electronic equipment structure space set up, the assembly between each electronic components in the electronic equipment of being convenient for.

The number of second metallized holes 14 is not limited in this application. In this embodiment, the structure of the second metallized holes 14 may be similar to that of the first metallized holes 13, and the second metallized holes 14 may be formed by punching holes in the circuit board substrate and plating a conductive metal layer on the hole wall by electroless plating and electroplating.

The third connection portion 112 in the embodiment of the present application may be any structure for realizing electrical connection. In some embodiments, the third connection portion 112 may be a pad, so that the second component 4 may be electrically connected to the third connection portion 112 by soldering, so that the second component 4 and the third connection portion 112 have a relatively reliable electrical connection relationship.

In some embodiments, a fourth connection portion 113 is further disposed on the second surface 11b of the pair of main body portions 11, and the second connection portion 121 and the fourth connection portion 113 may be electrically connected through the first metallized hole 13, and the second connection portion 121 may be used to connect to a ground terminal of the second component 4 to achieve grounding.

The fourth connection portion 113 in the embodiment of the present application may be any structure for realizing electrical connection. In some embodiments, the fourth connection portion 113 may be a pad, so that the second component 4 may be electrically connected to the fourth connection portion 113 by soldering, so that the second component 4 and the fourth connection portion 113 may have a relatively reliable electrical connection relationship.

In some embodiments, the orthographic projection shape of the third connection portion 112 in the first direction X may be the same as the orthographic projection shape of the first connection portion 111 in the first direction X. In some embodiments, the orthographic projection of the third connection portion 112 in the first direction X may be disposed overlapping the orthographic projection of the first connection portion 111 in the first direction X. In some embodiments, the orthographic projection shape of the fourth connection portion 113 in the first direction X may be the same as the orthographic projection shape of the second connection portion 122 in the first direction X. In some embodiments, the orthographic projection of the fourth connection portion 113 in the first direction X may be disposed overlapping the orthographic projection of the second connection portion 122 in the first direction X.

Fig. 6 is a schematic structural diagram of a circuit board assembly 10 according to some embodiments of the present application.

As shown in fig. 6, the present application further provides a circuit board assembly 10, where the circuit board assembly 10 includes the interposer circuit board 1 and the electronic component 10a in any of the above embodiments, and the electronic component 10a includes the first component 3 and the electrical connector 2, and the electrical connector 2 is electrically connected between the interposer circuit board 1 and the first component 3.

As shown in fig. 6, when the electrical connector 2 is a BTB connector, the BTB connector includes a male seat 21 and a female seat 22 that are detachably connected, and the electrical connection of the electrical connector 2 can be achieved when the male seat 21 and the female seat 22 are connected to each other. In some embodiments, the male socket 21 of the BTB connector may be fixedly connected to the first component 3, and the female socket 22 of the BTB connector may be fixedly connected to the first connection portion 111. In other embodiments, the female socket 22 of the BTB connector may be fixedly connected to the first component 3, and the male socket 21 of the BTB connector may be fixedly connected to the first connection portion 111.

Fig. 7 is a schematic structural view of a circuit board assembly 10 according to other embodiments of the present application.

In some embodiments, the shielding portion 12 has a second connection portion 121 on a side far from the main body portion 11 in the first direction X, and a first metallization hole 13 extending from the second connection portion 121 to the main body portion 11 is provided in the interposer circuit board 1, so that the second connection portion 121 can be grounded through the first metallization hole 13; as shown in fig. 7, the first component 3 is provided with a reinforcing plate 31 on a side away from the electrical connector 2, and at least part of the reinforcing plate 31 is connected to the second connection portion 121. The reinforcing plate 31 located at one side of the first component 3 far away from the electric connector 2 can provide a certain structural strength for the first component 3, and the first component 3 can be grounded through the second connecting portion 121 by connecting the reinforcing plate 31 with the second connecting portion 121, so that the interference influence of electromagnetic radiation on the first component 3 is reduced.

In this embodiment, the height of the protrusion of the shielding portion 12 with respect to the first surface 11a in the first direction X may be equal to the distance between the first surface 11a and the surface of the reinforcing plate 31 on the side close to the main body portion 11, so that the reinforcing plate 31 is connected to the second connecting portion 121 of the shielding portion 12.

In some embodiments, to facilitate the manufacture and processing of the first component 3 and the stiffener 31, the size of the stiffener 31 is often set smaller, and therefore, the shielding portion 12 of the interposer circuit board 1 may be disposed around only the outer side of the first connection portion 111 that is susceptible to electromagnetic radiation, so that the stiffener 31 does not need to be provided with an excessive size for connection with the second connection portion 121 on the shielding portion 12.

In some embodiments, the stiffener 31 may be connected to the second connecting portion 121 by a conductive double sided adhesive, which may limit the relative movement between the stiffener 31 and the second connecting portion 121, so as to improve the connection stability between the stiffener 31 and the second connecting portion 121.

Fig. 8 is a schematic structural view of a circuit board assembly 10 according to still other embodiments of the present application.

In some embodiments, the shielding portion 12 has a second connection portion 121 on a side far from the main body portion 11 in the first direction X, and a first metallization hole 13 extending from the second connection portion 121 to the main body portion 11 is provided in the interposer circuit board 1, so that the second connection portion 121 can be grounded through the first metallization hole 13; as shown in fig. 8, the first component 3 is provided with a reinforcing plate 31 and a conductive cloth 5 on a side away from the electrical connector 2, the conductive cloth 5 is connected to the reinforcing plate 31 on the side away from the electrical connector 2, and at least part of the conductive cloth 5 is connected to the second connection portion 121. By connecting the conductive cloth 5 on the side of the reinforcing plate 31 away from the electrical connector 2 and connecting the conductive cloth 5 with the second connection portion 121, the first component 3 can be grounded through the second connection portion 121, so as to reduce the interference influence of electromagnetic radiation on the first component 3.

In the present embodiment, the height of the protrusion of the shielding portion 12 with respect to the first surface 11a in the first direction X may be equal to the distance between the first surface 11a and the surface of the reinforcing plate 31 on the side away from the main body portion 11, so that the conductive cloth 5 is connected to the reinforcing plate 31 and the second connection portion 121 of the shielding portion 12 at the same time.

In some embodiments, since the conductive cloth 5 is easy to manufacture, the conductive cloth 5 can have a larger size to completely cover the shielding portion 12, the first component 3, and a side of the electrical connector 2 away from the main body portion 11, that is, the orthographic projection of the shielding portion 12, the first component 3, and the electrical connector 2 in the first direction X is located in the orthographic projection of the conductive cloth 5 in the first direction X, so that the conductive portion can have a better shielding effect, and also the conductive portion can have a larger area that can be connected with the second connection portion 121, so that the shielding portion 12 can be better disposed around the first connection portion 111, so as to improve the shielding effect of the shielding portion 12 on electromagnetic radiation.

In some embodiments, the conductive cloth 5 has a certain viscosity, so as to limit the relative movement between the reinforcing plate 31 and the second connecting portion 121, and improve the connection stability between the reinforcing plate 31 and the second connecting portion 121.

In some embodiments, the third connecting portion 112 is disposed on the second surface 11b of the main body 11, and the second metallized hole 14 extending from the first connecting portion 111 to the third connecting portion 112 is disposed in the main body 11, and the first connecting portion 111 and the third connecting portion 112 are electrically connected through the second metallized hole 14; the circuit board assembly 10 further comprises a second component 4, the second component 4 is electrically connected with the third connecting portion 112, so that the first component 3 can be electrically connected with the second component 4 through the switching circuit board 1 to realize signal transmission, and when a certain structural space setting requirement exists in electronic equipment comprising the first component 3 and the second component 4, the thickness of the body portion of the switching circuit board 1 in the first direction X can provide a local heightening effect for the first component 3, so that the requirement of the structural space setting of the electronic equipment is met, and assembly among all electronic components in the electronic equipment is facilitated.

In some embodiments, the second component 4 may be a pcb type circuit board, for example, when the first component 3 is a circuit board of a camera module in an electronic device and the electrical connector 2 is a BTB connector, the second component 4 may be a motherboard of the electronic device, and the first component 3 may be electrically connected with the second component 4 through the switching circuit board 1 to realize signal transmission.

The present application also provides an electronic device comprising a circuit board assembly 10 as in any of the embodiments described above.

In some embodiments, the electronic device may be a cell phone, a computer, VR glasses, etc.

In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the present application, which are intended to be included in the scope of the present application.

Claims (11)

1. A transfer circuit board, characterized in that the transfer circuit board (1) comprises:

a main body portion (11), wherein the main body portion (11) has a first surface (11 a) and a second surface (11 b) opposite to each other in a first direction (X), a first connection portion (111) is provided on the first surface (11 a), and the first connection portion (111) is used for electrically connecting with an electronic component (10 a);

and a shielding part (12) which is arranged on the first surface (11 a) and protrudes relative to the first surface (11 a), wherein the shielding part (12) is arranged around at least part of the first connecting part (111).

2. The transit circuit board (1) according to claim 1, characterized in that the shielding part (12) surrounds one side of the first connection part (111) in a second direction (Y) and two sides of the first connection part (111) in a third direction (Z), wherein the first direction (X), the second direction (Y) and the third direction (Z) intersect two by two.

3. The transit circuit board (1) according to claim 1, characterized in that a first metallized hole (13) extending from the shielding portion (12) to the main body portion (11) is provided in the transit circuit board (1).

4. A transfer circuit board (1) according to claim 3, wherein the first metallized holes (13) are a plurality, and the first metallized holes (13) are arranged around at least part of the first connection portion (111).

5. A transit circuit board (1) according to claim 3, characterized in that the shielding part (12) has a second connection part (121) at a side remote from the main body part (11) in the first direction (X), the first metallized hole (13) being connected with the second connection part (121) so that the second connection part (121) can be grounded through the first metallized hole (13).

6. The transfer circuit board (1) according to any one of claims 1 to 5, characterized in that a third connection portion (112) is provided on the second surface (11 b) of the main body portion (11), a second metallization hole (14) extending from the first connection portion (111) to the third connection portion (112) is provided in the main body portion (11), the first connection portion (111) and the third connection portion (112) are electrically connected through the second metallization hole (14), and the third connection portion (112) is used for being electrically connected with a second component (4).

7. A circuit board assembly, characterized in that the circuit board assembly (10) comprises:

the interposer circuit board (1) of any one of claims 1 to 6;

the electronic component (10 a), the electronic component (10 a) comprises a first component (3) and an electric connector (2), and the electric connector (2) is electrically connected with the switching circuit board (1) and the first component (3).

8. The circuit board assembly (10) according to claim 7, wherein,

the shielding part (12) is provided with a second connecting part (121) at one side far away from the main body part (11) in the first direction (X), and a first metallized hole (13) extending from the second connecting part (121) to the main body part (11) is arranged in the switching circuit board (1) so that the second connecting part (121) can be grounded through the first metallized hole (13);

the first component (3) is provided with a stiffening plate (31) at a side far away from the electric connector (2), and at least part of the stiffening plate (31) is connected with the second connecting part (121).

9. The circuit board assembly (10) according to claim 7, wherein,

the shielding part (12) is provided with a second connecting part (121) at one side far away from the main body part (11) in the first direction (X), and a first metallized hole (13) extending from the second connecting part (121) to the main body part (11) is arranged in the switching circuit board (1) so that the second connecting part (121) can be grounded through the first metallized hole (13);

the first component (3) is provided with a reinforcing plate (31) and conductive cloth (5) on one side far away from the electric connector (2), the conductive cloth (5) is connected to one side far away from the electric connector (2) of the reinforcing plate (31), and at least part of the conductive cloth (5) is connected with the second connecting part (121).

10. The circuit board assembly (10) according to any of claims 7 to 9, wherein,

a third connecting portion (112) is arranged on the second surface (11 b) of the main body portion (11), a second metallized hole (14) extending from the first connecting portion (111) to the third connecting portion (112) is arranged in the main body portion (11), and the first connecting portion (111) and the third connecting portion (112) are electrically connected through the second metallized hole (14);

the circuit board assembly (10) further comprises a second component (4), the second component (4) being electrically connected to the third connection (112).

11. An electronic device, characterized in that it comprises a circuit board assembly (10) according to any one of claims 7 to 10.