CN219145835U - Cooling device for network information exchange - Google Patents

Abstract

The utility model discloses a network information exchanger cooling device which comprises a closed shell, wherein the shell consists of an upper cover (1) and a lower cover (2), the upper cover (1) is made of an aluminum alloy material, a top plate (3) with a U-shaped section is arranged at the top of the upper cover (1), a first air channel (4) is formed between the top plate (3) and the upper cover (1), a through hole is formed in the middle of the top plate (3), a first fan (5) is arranged at the through hole, a box body (6) made of the aluminum alloy material is arranged below the upper cover (1), a plurality of semiconductor refrigerating sheets (7) are arranged between the box body (6) and the upper cover (1), the cold ends of the semiconductor refrigerating sheets (7) are connected with the box body (6), an air inlet (8) and an air outlet (9) are formed in the box body (6), and a second fan (10) is arranged at the air outlet (9). The exchanger cooled by the utility model has the advantage of lower failure rate.

Description

Cooling device for network information exchange

technical field

The utility model belongs to the field of network information switches of hydropower stations, in particular to a cooling device for network information switches used in hydropower stations.

Background technique

Network information switches (referred to as switches) are used in all walks of life, such as routers used in homes are actually a type of switches. Different from most industries, the switches in hydropower stations are characterized by the fact that each switch is connected to many network nodes, the data flow is large, the corresponding power consumption is also greater, the heat generation will be more serious, and the requirements for heat dissipation are even higher. High, need to be equipped with a cooling device.

The cooling device on the existing switch includes an air inlet and an air outlet arranged on the shell of the switch, and a fan is arranged on the air inlet or the air outlet, and the fan is used to make the external cold air pass through the shell to forcibly cool the components in the switch. The heat generated by the switch is relatively large, the speed of the fan is relatively high, and the air flow is large, which will cause the following two problems. First, a large amount of dust enters the switch with the airflow and covers the surface of the components, which will lead to poor heat dissipation of the components. , the switch is prone to failure; second, some small mosquitoes will enter the switch through the air inlet and outlet, die inside the switch, rot and corrode the components, especially the corrosion of the contacts, resulting in poor contact and cause the switch to fail. Although the cost of repairing the switch or replacing the switch itself is not high, the indirect loss caused by the failure of the switch is still relatively large.

Therefore, switches that are cooled by existing cooling devices have the disadvantage of being prone to failure.

Utility model content

The purpose of the utility model is to provide a cooling device for a network information exchange. The cooling switch of the utility model has the advantage of low failure rate.

The technical scheme of the utility model: a cooling device for network information exchange, including a closed shell, the shell is composed of an upper cover and a lower cover, the upper cover is made of aluminum alloy, the top of the upper cover is provided with a U-shaped top plate, the top plate The first air channel is formed between the upper cover and the middle part of the top plate. There is a first fan at the through hole. There is an aluminum alloy box under the upper cover. Between the box and the upper cover is A plurality of semiconductor cooling chips, the cold end of the semiconductor cooling chip is connected to the box body, the hot end of the semiconductor cooling chip is connected to the upper cover, the box body is provided with an air inlet and an air exhaust port, and a second fan is arranged at the air exhaust port.

In the aforementioned cooling device for network information exchange, the box body is connected to the upper cover through an annular shroud, and a plurality of semiconductor refrigeration chips are located inside the shroud.

In the aforementioned cooling device for the network information exchange, the box is provided with a plurality of side-by-side fins, and second air ducts are formed between the fins, and both ends of all the second air ducts are connected to air inlets and air outlets.

In the aforementioned cooling device for network information exchange, the air inlet is located on the side wall at one end of the box, and the air outlet is located at the bottom of the other end of the box.

In the aforementioned cooling device for network information exchange, the upper cover and the lower cover are connected by screws.

In the cooling device for the aforementioned network information exchange, heat insulating material is filled between the top plate and the upper cover.

In the aforementioned cooling device for network information exchange, the bottom of the lower cover is provided with a plurality of foot pads.

Compared with the prior art, the utility model is an improvement on the basis of the existing switchboard. It adopts a closed shell, and a semiconductor refrigeration sheet is arranged in the casing, and the cold end of the semiconductor refrigeration sheet is used to cool the inside of the switchboard. , and use the second fan to form a circulating air inside the switch, which has a good cooling effect, and further set a U-shaped top plate on the outside of the shell, and set the first fan on the top plate to accelerate the heat dissipation of the hot end of the semiconductor cooling sheet, so that the semiconductor cooling sheet Always maintain a high working efficiency range to further increase the cooling effect. Since the utility model does not need to introduce outside air into the inside of the switch during the cooling process, and does not need to open holes on the shell, dust and small mosquitoes will not be introduced during the cooling process, which reduces the failure rate of the switch. Therefore, the cooling switch of the utility model has the advantage of low failure rate.

Description of drawings

Fig. 1 is the front view structure diagram of the utility model.

Fig. 2 is a top view structural schematic diagram of the box body.

Fig. 3 is a top structural schematic diagram of the top plate.

The marks in the drawings are: 1-upper cover, 2-lower cover, 3-top plate, 4-first air duct, 5-first fan, 6-box, 7-semiconductor cooling plate, 8-air inlet, 9-exhaust air outlet, 10-second fan, 11-shroud, 12-fin, 13-second air duct, 14-insulation material, 15-foot pad.

Detailed ways

The utility model will be further described below in conjunction with the accompanying drawings and embodiments, but it is not used as a basis for limiting the utility model.

Example 1. A cooling device for a network information exchange, as shown in Figure 1, includes a closed casing, the casing is in the shape of a cuboid, the casing is composed of an upper cover 1 and a lower cover 2, the upper cover 1 and the lower cover 2 are connected by screws, and the upper and lower covers are made of aluminum Alloy material, the top of the upper cover 1 is provided with a top plate 3 with a U-shaped cross section, the first air channel 4 is formed between the top plate 3 and the upper cover 1, the height of the first air channel 4 is 1-2 cm, and the middle part of the top plate 3 is provided with A through hole, a first fan 5 is provided at the through hole, a box body 6 made of aluminum alloy is provided under the upper cover 1, and a plurality of semiconductor refrigeration sheets 7 are arranged between the box body 6 and the upper cover 1, and a plurality of semiconductor refrigeration sheets The sheets 7 are connected in parallel, the cold end of the semiconductor refrigeration sheet 7 is connected to the box body 6, the hot end of the semiconductor refrigeration sheet 7 is connected to the upper cover 1, the box body 6 is provided with an air inlet 8 and an air outlet 9, and the air outlet 9 is provided with There is a second fan 10 . Both the first fan 5 and the second fan 10 are silent cooling fans.

The box body 6 is connected to the upper cover 1 through an annular shroud 11 , and a plurality of semiconductor cooling fins 7 are located inside the shroud 11 .

The box body 6 is provided with a plurality of side-by-side fins 12, and the fins 12 play the role of increasing the air contact area between the box body 6 and the switchboard, and a second air duct 13 is formed between the fins 12, and all the second air ducts Both ends of the channel 13 are connected to the air inlet 8 and the air outlet 9 .

The air inlet 8 is located on the side wall at one end of the box body 6 , and the air exhaust port 9 is located at the bottom of the other end of the box body 6 . The air inlet 8 and the air outlet 9 are respectively located at two ends of the box body 6, so that the airflow generated by the second fan 10 can flow in a larger range and have a better cooling effect on the inside of the switch.

An insulating material 14 is filled between the top plate 3 and the upper cover 1, and the insulating material 14 is a foaming material. The function of the heat insulating material 14 is to insulate the heat between the casing 6 and the loam cake 1, so as to avoid the radiation temperature rise of the casing 6 times the loam cake 1.

The bottom of the lower cover 2 is provided with four foot pads 15 , and the four foot pads 15 are respectively close to the four corners of the lower cover 2 . The effect of the foot pad 15 is to make the bottom of the housing suspended in the air, so as to facilitate air circulation and heat dissipation.

Working principle: the electrical components in the original switch are installed in the lower cover 2, and corresponding holes are opened on the lower cover 2 according to the specific conditions, so that the wire harness drawn by the electrical components can pass through the shell, that is, the shell of the utility model replaces the shell of the original switch .

When the semiconductor cooling chip 7 is energized, the temperature of the hot end increases and the temperature of the cold end decreases, so that the temperature of the upper cover 1 increases and the temperature of the box body 6 decreases. The first fan 5 blows air to the upper cover 1 to cool the upper cover 1, which is convenient for the efficient heat dissipation of the hot end of the semiconductor cooling chip 7, so that the semiconductor cooling chip 7 maintains efficient work. The second fan 10 blows air downwards, and under the action of negative pressure, the hot air in the casing passes through the air inlet 8, passes through each second air duct 13, and is discharged from the air outlet 9, forming a circulation, and the hot air passes through the box body 6 In the process, the cooling is completed.

Claims (7)

1. A cooling device for a network information exchange, characterized in that: it comprises a closed shell, the shell is made up of an upper cover (1) and a lower cover (2), the upper cover (1) is made of aluminum alloy, and the upper cover (1) The top is provided with a top plate (3) with a U-shaped cross-section, the first air duct (4) is formed between the top plate (3) and the upper cover (1), and a through hole is provided in the middle of the top plate (3). The first fan (5), the box body (6) of aluminum alloy material is provided under the upper cover (1), and a plurality of semiconductor cooling chips (7) are arranged between the box body (6) and the upper cover (1), The cold end of the semiconductor refrigerating sheet (7) is connected to the casing (6), the hot end of the semiconductor refrigerating sheet (7) is connected to the upper cover (1), and the casing (6) is provided with an air inlet (8) and an air outlet ( 9), the air outlet (9) is provided with a second fan (10). 2. The cooling device for network information exchange according to claim 1, characterized in that: the box (6) is connected to the upper cover (1) through an annular shroud (11), and a plurality of semiconductor refrigeration chips (7) are Located on the inner side of the hoarding (11). 3. The cooling device for network information exchange according to claim 1, characterized in that: the box (6) is provided with a plurality of side-by-side fins (12), and the second wind is formed between the fins (12). Road (13), all the two ends of the second air duct (13) are connected to the air inlet (8) and the air outlet (9). 4. The cooling device for network information exchange according to claim 3, characterized in that: the air inlet (8) is located on the side wall at one end of the box body (6), and the air exhaust port (9) is located at the box body ( 6) The bottom of the other end. 5. The cooling device for network information exchange according to claim 1, characterized in that: the upper cover (1) and the lower cover (2) are connected by screws. 6. The cooling device for network information exchange according to claim 2, characterized in that: insulation material (14) is filled between the top plate (3) and the upper cover (1). 7. The cooling device for network information exchange according to claim 1, characterized in that: the bottom of the lower cover (2) is provided with a plurality of foot pads (15).

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