CN219073756U - Cleaning machine is used in monocrystalline silicon piece production - Google Patents

Abstract

The utility model relates to a cleaning machine for producing monocrystalline silicon pieces, which comprises an ultrasonic cleaning bin, a clamping mechanism and a lifting mechanism, wherein the monocrystalline silicon pieces are arranged in the ultrasonic cleaning bin, the clamping mechanism is positioned in the ultrasonic cleaning bin, the clamping mechanism comprises a placing plate movably arranged in the ultrasonic cleaning bin, the lifting plate positioned above the placing plate is movably arranged in the ultrasonic cleaning bin, and the top of the placing plate is fixedly connected with a stud with one end penetrating through and extending to the top of the lifting plate. This cleaning machine is used in monocrystalline silicon piece production plays centre gripping fixed effect to monocrystalline silicon piece through being provided with clamping mechanism and lifting mechanism, is convenient for protect it, and can adjust the monocrystalline silicon piece of equidimension not, convenient to use, and when clearing up monocrystalline silicon piece, lifting mechanism makes it can go up and down to operate, has solved traditional manual handheld abluent problem.

Description

A washing machine for monocrystalline silicon wafer production

technical field

The utility model relates to the technical field of single crystal silicon chip cleaning, in particular to a cleaning machine for single crystal silicon chip production.

Background technique

Monocrystalline silicon is a relatively active non-metallic element and an important part of crystalline materials. It is at the forefront of the development of new materials. Its main uses are as semiconductor materials and the use of solar photovoltaic power generation and heating. , environmental protection and convenience, and many other advantages. In the past 30 years, solar energy utilization technology has made great progress in research and development, commercial production, and market development, and has become one of the world's fast and stable emerging industries.

The existing monocrystalline silicon wafer needs to be cleaned by a cleaning machine during the production process, and most of the existing cleaning machines use ultrasonic cleaning. When using ultrasonic cleaning, the structure of the ultrasonic cleaning box is single and lacks fixed functions. , resulting in more inconvenience in use, so a cleaning machine for monocrystalline silicon wafer production is proposed to solve the above problems.

Utility model content

Aiming at the deficiencies of the prior art, the utility model provides a washing machine for the production of single crystal silicon wafers, which has the advantage of being convenient to use, and solves the problem that most of the existing washing machines use ultrasonic cleaning. The ultrasonic cleaning box has a single structure and lacks a fixed function, which leads to inconvenient use.

In order to achieve the above purpose, the utility model provides the following technical solutions: a cleaning machine for the production of monocrystalline silicon wafers, including an ultrasonic cleaning chamber, a clamping mechanism and a lifting mechanism, and the interior of the ultrasonic cleaning chamber is provided with monocrystalline silicon wafers;

The clamping mechanism is located inside the ultrasonic cleaning chamber;

The clamping mechanism includes a placement plate that is movably installed inside the ultrasonic cleaning chamber, and a lifting plate that is located above the placement plate is movably installed inside the ultrasonic cleaning chamber, and the top of the placement plate is fixedly connected with one end that runs through and extends to The studs on the top of the lifting plate, the outer surface of the studs are threaded with two nuts, the top of the lifting plate is fixedly connected with a cap bin that runs through and extends to the inside, and the inside of the cap bin is provided with As for the clamping assembly, a storage bin is fixedly installed on the top of the placement board.

Further, the lifting mechanism includes a cover plate located above the ultrasonic cleaning chamber, the bottom of the cover plate is fixedly connected with a connecting rod fixedly connected to the top of the cap chamber, and two installation chambers are provided inside the ultrasonic cleaning chamber, The bottom of the cover plate is fixedly connected with an insertion rod with one end penetrating and extending to the inside of the installation chamber. Hinges are fixedly installed on the left and right sides of the bottom of the cover plate and the left and right sides of the ultrasonic cleaning chamber. A cylinder is hinged between the opposite sides of the hinge.

Further, the clamping assembly includes two vertical plates that are fixedly connected to the inner top wall of the hat bin, and backing plates are movably installed on the opposite sides of the two vertical plates. Springs are fixedly installed between the sides and the opposite sides of the two vertical plates respectively.

Further, a movable hole is opened inside the lifting plate, and the inner surface of the movable hole is movably connected with the outer surface of the stud.

Further, sliders are fixedly installed on the backs of the two insertion rods, and slide grooves are provided on the rear side walls of the inner chambers of the two installation bins, and the outer surfaces of the sliders are slidably connected to the inner surfaces of the slide grooves. .

Further, the top of the ultrasonic cleaning chamber is provided with a socket communicating with the installation chamber.

Further, the storage compartment is a rectangular shape with a missing top and a hollow interior, and the two air cylinders form a triangle with the cover plate and the ultrasonic cleaning compartment respectively.

Compared with the prior art, the technical solution of the present application has the following beneficial effects:

The cleaning machine for monocrystalline silicon wafer production is equipped with a clamping mechanism and a lifting mechanism to clamp and fix the monocrystalline silicon wafer, which is convenient for its protection, and can clean monocrystalline silicon wafers of different sizes. It can be adjusted and placed for easy use, and when cleaning monocrystalline silicon wafers, the lifting mechanism enables it to perform lifting operations, which solves the problem of traditional manual cleaning and achieves the purpose of saving labor.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is the enlarged view of the A place in the structure Fig. 1 of the utility model;

Fig. 3 is a front view of the structure of the utility model.

In the figure: 1 ultrasonic cleaning compartment, 21 placing plate, 22 lifting plate, 23 stud, 24 nut, 25 cap compartment, 26 clamping component, 2601 vertical plate, 2602 backing plate, 2603 spring, 27 storage compartment, 31 cover Plate, 32 plungers, 33 installation bins, 34 hinges, 35 cylinders, 36 connecting rods.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Please refer to Figures 1-3, a cleaning machine for producing single crystal silicon wafers in this embodiment includes an ultrasonic cleaning chamber 1, a clamping mechanism and a lifting mechanism. The clamping mechanism is located inside the ultrasonic cleaning chamber 1, and the lifting mechanism is located in the Above the ultrasonic cleaning chamber 1 , a single crystal silicon wafer 4 is arranged inside the ultrasonic cleaning chamber 1 .

Specifically, by being provided with a clamping mechanism and a lifting mechanism, the monocrystalline silicon wafer 4 can be clamped and fixed, which is convenient for its protection, and when the single crystal silicon wafer is cleaned, the lifting mechanism enables it to be cleaned. The lifting operation solves the problem of traditional hand-held cleaning and achieves the purpose of saving labor.

In this embodiment, the clamping mechanism includes a placing plate 21 that is movably installed inside the ultrasonic cleaning chamber 1, and a lifting plate 22 above the placing plate 21 is movably installed inside the ultrasonic cleaning chamber 1, and the top of the placing plate 21 is fixedly connected with a One end runs through and extends to the stud 23 on the top of the lifting plate 22, and the outer surface of the stud 23 is threaded with two nuts 24, and the top of the lifting plate 22 is fixedly connected with a cap warehouse 25 with one end passing through and extending to the inside. A clamping assembly 26 is provided inside the bin 25, and a storage bin 27 is fixedly installed on the top of the placement plate 21. The storage bin 27 is a rectangle with a missing top and a hollow interior, which is convenient for placing the monocrystalline silicon wafer 4.

Wherein, the clamping assembly 26 includes two vertical boards 2601 fixedly connected with the inner top wall of the hat bin 25, the opposite sides of the two vertical boards 2601 are all movably installed with backing plates 2602, and the opposite sides of the two backing plates are Springs 2603 are fixedly installed between 2602 and opposite sides of the two vertical plates 2601, which facilitates the clamping of the monocrystalline silicon wafer.

It should be noted that the number of clamping components 26 is no less than three groups and they are equidistantly distributed.

Wherein, the inside of the lifting plate 22 is provided with a movable hole, and the inner surface of the movable hole is movably connected with the outer surface of the stud 23, so that the lifting plate 22 can move up and down.

Specifically, by being provided with nuts 24 and studs 23, the monocrystalline silicon wafer 4 of different sizes can be adjusted and used to achieve the effect of multi-size application; The clamping has a certain stability to prevent displacement during cleaning.

In this embodiment, the lifting mechanism includes a cover plate 31 located above the ultrasonic cleaning chamber 1, the bottom of the cover plate 31 is fixedly connected with a connecting rod 36 fixedly connected to the top of the cap chamber 25, and the inside of the ultrasonic cleaning chamber 1 is provided with two The installation chamber 33, the top of the ultrasonic cleaning chamber 1 is provided with a jack that communicates with the installation chamber 33 to facilitate the movement of the insertion rod 32, and the bottom of the cover plate 31 is fixedly connected with an insertion rod 32 that runs through and extends to the inside of the installation chamber 33 , the left and right sides of the bottom of the cover plate 31 and the left and right sides of the ultrasonic cleaning chamber 1 are fixedly equipped with hinges 34, and a cylinder 35 is hinged between the opposite sides of the two hinges 34 on the same side.

Wherein, the back sides of two insertion rods 32 are all fixedly installed with sliders, and the inner cavity rear side walls of the two installation bins 33 are all provided with chute, and the outer surface of the slider is slidably connected with the inner surface of the chute, and the cover plate The lifting of 31 plays the function of auxiliary stability.

Wherein, the two air cylinders 35 form a triangle with the cover plate 31 and the ultrasonic cleaning chamber 1 respectively, and play a stabilizing effect on the lifting of the cover plate 31 .

Specifically, the air cylinder 35 is provided to drive the cover plate 31 , thereby adjusting the height of the cap bin 25 , and effectively avoiding the problem of cleaning liquid splashing.

The working principle of the above-mentioned embodiment is:

(1) When cleaning the monocrystalline silicon wafer 4 with ultrasonic waves, start the cylinder 35, and the cylinder 35 drives the cover plate 31 to lift, and then the cap bin 25 drives the placement plate 21 to carry out the lifting operation. When the cap bin 25 and the storage bin need to be When the distance between 27 needs to be adjusted, by turning the nut 24, the distance between the two nuts 24 in the vertical direction will be opened, so that the cap bin 25 can be moved up and down to adjust to a suitable position. After the position adjustment is completed, the nut 24 can be rotated on the stud 23 until it fits tightly with the lifting plate 22 to complete the distance adjustment between the cap bin 25 and the storage bin 27 .

(2) By providing the backing plates 2602 , the monocrystalline silicon wafer 4 can be clamped between the two backing plates 2602 , and clamped and fixed by the spring 2603 .

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or order between them. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (7)

1. A cleaning machine for monocrystalline silicon wafer production, comprising an ultrasonic cleaning bin (1), a clamping mechanism and a lifting mechanism, characterized in that: the inside of the ultrasonic cleaning bin (1) is provided with a monocrystalline silicon wafer (4 ); The clamping mechanism is located inside the ultrasonic cleaning chamber (1); The clamping mechanism includes a placement plate (21) movably installed inside the ultrasonic cleaning chamber (1), and a lifting plate (22) above the placement plate (21) is movably installed inside the ultrasonic cleaning chamber (1) , the top of the placement plate (21) is fixedly connected with a stud (23) that one end penetrates and extends to the top of the lifting plate (22), and the outer surface of the stud (23) is threaded with two nuts (24 ), the top of the lifting plate (22) is fixedly connected with a hat warehouse (25) that one end penetrates and extends to its inside, the inside of the hat warehouse (25) is provided with a clamping assembly (26), and the placement plate The top of (21) is fixedly equipped with storage bin (27). 2. A washing machine for monocrystalline silicon wafer production according to claim 1, characterized in that: the lifting mechanism includes a cover plate (31) located above the ultrasonic cleaning chamber (1), and the cover plate ( The bottom of 31) is fixedly connected with the connecting rod (36) that is fixedly connected with the top of the cap bin (25), and the inside of the ultrasonic cleaning bin (1) is provided with two installation bins (33), and the cover plate (31) The bottom of the bottom is fixedly connected with an insertion rod (32) with one end running through and extending to the inside of the installation chamber (33), and the left and right sides of the bottom of the cover plate (31) are fixedly installed with A hinge (34), an air cylinder (35) is hinged between the opposite sides of the two hinges (34) on the same side. 3. A washing machine for monocrystalline silicon wafer production according to claim 1, characterized in that: the clamping assembly (26) includes two vertical plates fixedly connected to the inner top wall of the hat bin (25) (2601), the opposite sides of the two vertical plates (2601) are all movably installed with backing plates (2602), and the opposite sides of the two backing plates (2602) are connected with the two vertical plates (2601) respectively. A spring (2603) is fixedly installed between the opposite sides. 4. A washing machine for monocrystalline silicon wafer production according to claim 1, characterized in that: the inside of the lifting plate (22) is provided with a movable hole, and the inner surface of the movable hole is in contact with the stud (23 ) on the outer surface of the active connection. 5. A cleaning machine for monocrystalline silicon wafer production according to claim 2, characterized in that: sliders are fixedly installed on the back sides of the two insertion rods (32), and the two installation bins (33 ) are provided with chute on the rear side wall of the inner cavity, and the outer surface of the slider is slidably connected with the inner surface of the chute. 6. A cleaning machine for producing single crystal silicon wafers according to claim 2, characterized in that: the top of the ultrasonic cleaning chamber (1) is provided with a socket communicating with the installation chamber (33). 7. A washing machine for monocrystalline silicon wafer production according to claim 2, characterized in that: the storage bin (27) is a rectangular shape with a missing top and a hollow interior, and the two cylinders (35) are respectively connected to A triangle is formed between the cover plate (31) and the ultrasonic cleaning chamber (1).

Images