CN219038894U

CN219038894U - Copper billet heating structure

Info

Publication number: CN219038894U
Application number: CN202223565442.XU
Authority: CN
Inventors: 周宇峰; 牛志强; 殷玉婷; 庄珂
Original assignee: Suzhou Dongshan Precision Manufacturing Co Ltd
Current assignee: Suzhou Dongyue New Energy Technology Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-05-16
Anticipated expiration: 2032-12-30

Abstract

The utility model belongs to the technical field of chip thermal inspection, in particular to a copper block heating structure, which comprises a workbench and a low heat conduction block, wherein the lower end of the low heat conduction block is provided with a copper block, a fixing stud is arranged on the low heat conduction block, a heating film is arranged between the low heat conduction block and the copper block, the lower end of the heating film is provided with heat conduction silicone grease, a groove is formed in the middle part of the copper block, the heating film is used for replacing a heating rod, the heating film is placed in the groove and has smaller volume than the heating rod, the shape is more similar to that of a chip, a heating temperature field of the chip is better simulated, a U-shaped groove is formed in the contact surface between the upper end of the copper block and the low heat conduction block, and the heat conduction silicone grease is positioned on the bottom surface of a notch.

Description

Copper billet heating structure

Technical Field

The utility model belongs to the technical field of chip thermal inspection, and particularly relates to a copper block heating structure.

Background

In the chip industry, heat dissipation from high power chips is often required using a heat sink. In order to test the heat dissipation performance of a heat sink, a dummy heat source is usually required to simulate the chip heating. When the product heat dissipation test is carried out, a copper block is generally used for simulating a heat source, and then the product takes away the heat to realize the heat dissipation simulation capability

In the prior art, as shown in fig. 1, a hole is formed on the side surface of a copper seat 22, then a heating rod 55 is plugged into a heating hole to heat the whole copper seat 22, the copper seat 22 and a copper block 33 are of an integrated structure, thermocouple wires are embedded in the copper seat 22 or the copper block 33 to monitor the temperature of the copper block, the copper seat 22 and the copper block 33 are fixed on a cylinder through a fixing stud 44, and when the cylinder is pressed down, the chip simulation temperature below the copper block 33 is realized;

the prior art has the following defects:

1. the whole material is copper, the size of the heating rod is larger, so that the volume of the copper block is larger, the relative heat capacity is also larger, and the time for heating to the stable temperature of the copper block is longer;

2. because the contact area with the air is large, the heat exchange amount with the air is also large, so that part of heat is dissipated into the air, the heat dissipation amount of the radiator cannot be accurately simulated, and a certain degree of heat loss exists;

3. the heating rod is in simple contact fit with the copper block, and a certain gap is formed between the heating rod and the copper block, so that heat transfer is poor, the temperature of the copper block is high, and the service life of the copper block is influenced.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model provides a copper block heating structure, which has the characteristics of improving the heat conduction effect, reducing the heat loss, improving the inspection efficiency and reducing the energy consumption.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a copper billet heating structure, includes workstation and low heat conduction piece, low heat conduction piece lower extreme is provided with the copper billet, be provided with the fixed double-screw bolt on the low heat conduction piece, be equipped with the heating membrane between low heat conduction piece and the copper billet, the heating membrane lower extreme is equipped with heat conduction silicone grease.

As a preferable technical scheme of the copper block heating structure, a U-shaped groove is formed in the contact surface between the upper end of the copper block and the low heat conduction block, and the heat conduction silicone grease is located on the bottom surface of the notch.

As a preferable technical scheme of the copper block heating structure, the low heat conduction block is provided with the through hole for the fixing stud to penetrate, and the low heat conduction block, the copper block, the heating film between the low heat conduction block and the copper block and the heat conduction silicone grease are fixed on the air cylinder through the fixing stud.

As a preferable technical scheme of the copper block heating structure, the low-heat-conduction block and the copper block are positioned right above the workbench.

As a preferable technical scheme of the copper block heating structure, the heating film guides heat to the copper block through the heat-conducting silicone grease.

Compared with the prior art, the utility model has the beneficial effects that:

1. a groove is formed in the middle of the copper block, a heating film is used for replacing a heating rod, the heating film is placed in the groove, the heating film is smaller than the heating rod in volume and is more similar to a chip in shape, and a heating temperature field of the chip is better simulated;

2. the upper part of the copper block is connected by using a low heat conduction material (such as bakelite, FR4 and the like), so that the heat dissipation area of the copper block to the air is reduced, and the heat loss caused by heat dissipation of the air is reduced;

3. the heat conduction silicone grease is coated on the middle layer of the heating film, which is in contact with the copper block, so that the upper limit temperature of the heating film is reduced when the stable temperature of the copper block is reached, and the service life is prolonged;

4. the volume of the copper block is reduced, the heat capacity is reduced, and the heat transferred in the same time is more, which is equivalent to the reduction of the heat transfer time;

5. the copper block is connected with the low heat conduction material in a tight fit or interference fit mode, no heat conduction paste is added, heat transfer to the low heat conduction material is reduced, and heat loss is reduced.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a schematic diagram of the structure of the present utility model;

FIG. 3 is a schematic view of the enlarged cross-section of portion A of FIG. 2 according to the present utility model;

in fig. 1: 11. a work table; 22. a copper base; 33. copper blocks; 44. fixing a stud; 55. and (5) heating the rod.

In fig. 2 and 3: 1. a work table; 2. a low thermal conductivity block; 3. copper blocks; 4. fixing a stud; 5. heating the film; 6. and (5) heat-conducting silicone grease.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 2-3, the present utility model provides the following technical solutions: the utility model provides a copper billet heating structure, includes workstation 1 and low heat conduction piece 2, and low heat conduction piece 2 lower extreme is provided with copper billet 3, is provided with fixed double-screw bolt 4 on the low heat conduction piece 2, is equipped with heating membrane 5 between low heat conduction piece 2 and the copper billet 3, and heating membrane 5 lower extreme is equipped with heat conduction silicone grease 6, through setting up low heat conduction piece 2 in this embodiment, low heat conduction piece 2 has reduced the outer surface area of copper, makes heat transfer reduce; the heat conduction silicone grease 6 is added between the heating film 5 and the copper block 3, and the heat conduction silicone grease 6 is not added above, so that more heat can be transferred downwards to the copper block 3; due to the reduced volume of copper, the thermal capacity is smaller, and the thermal equilibrium can be reached more quickly, reducing the detection time.

Specifically, the contact surface between the upper end of the copper block 3 and the low heat conduction block 2 is provided with a U-shaped groove, and the heat conduction silicone grease 6 is positioned on the bottom surface of the groove opening.

Specifically, a through hole for the penetration of the fixing stud 4 is formed in the low heat conduction block 2, and the low heat conduction block 2, the copper block 3, the heating film 5 and the heat conduction silicone grease 6 between the low heat conduction block and the copper block are fixed on the cylinder through the fixing stud 4.

Specifically, the low heat conduction block 2 and the copper block 3 are positioned right above the workbench 1.

Specifically, the heating film 5 guides heat to the copper block 3 through the heat conduction silicone grease 6, and in this embodiment, the heat conduction silicone grease 6 is added between the contact surface of the heating film 5 and the copper block 3, so that the temperature of the heating film 5 is lower under the same output power, and the service life is prolonged.

The working principle and the using flow of the utility model are as follows: forming a strip-shaped U-shaped groove at the upper end of the copper block 3, installing a heating film 5 and heat conduction silicone grease 6 in the groove, positioning the heat conduction silicone grease 6 below the heating film 5, fixing the low heat conduction block 2 at the upper end of the copper block 3, and fixing the fixed and formed low heat conduction block 2 and copper block 3 below the air cylinder through a fixing stud 4;

the heating film 5 heats and transmits heat to the copper block 3 through the heat-conducting silicone grease 6, then the copper block 3 passes through the cylinder to be pressed down to test the chip, the copper block 3 needs to be stabilized at 40 ℃, and the heating film 5 needs to be heated to 100 ℃ under the condition that the heat-conducting silicone grease 6 is not coated, so that the temperature of the copper block 3 can be stabilized at 40 ℃; if the heat conduction silicone grease 6 is added, the stable 40 ℃ of the copper block 3 can be achieved only at 80 ℃ under the condition of better heat transfer property.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A copper billet heating structure which characterized in that: including workstation (1) and low heat conduction piece (2), low heat conduction piece (2) lower extreme is provided with copper billet (3), be provided with fixed double-screw bolt (4) on low heat conduction piece (2), be equipped with heating membrane (5) between low heat conduction piece (2) and copper billet (3), heating membrane (5) lower extreme is equipped with heat conduction silicone grease (6).

2. A copper block heating structure according to claim 1, wherein: the contact surface between the upper end of the copper block (3) and the low heat conduction block (2) is provided with a U-shaped groove, and the heat conduction silicone grease (6) is positioned on the bottom surface of the notch.

3. A copper block heating structure according to claim 1, wherein: the low heat conduction block (2) is provided with a through hole for the penetration of the fixing stud (4), and the low heat conduction block (2), the copper block (3) and the heating film (5) and the heat conduction silicone grease (6) between the low heat conduction block and the copper block are fixed on the cylinder through the fixing stud (4).

4. A copper block heating structure according to claim 1, wherein: the low heat conduction block (2) and the copper block (3) are positioned right above the workbench (1).

5. A copper block heating structure according to claim 1, wherein: the heating film (5) guides heat to the copper block (3) through the heat-conducting silicone grease (6).