CN218977137U

CN218977137U - Liquid cooling server and edge computing equipment

Info

Publication number: CN218977137U
Application number: CN202223004416.XU
Authority: CN
Inventors: 覃杰
Original assignee: China Mobile Communications Group Co Ltd; China Mobile Communications Ltd Research Institute
Current assignee: China Mobile Communications Group Co Ltd; China Mobile Communications Ltd Research Institute
Priority date: 2022-11-11
Filing date: 2022-11-11
Publication date: 2023-05-05
Anticipated expiration: 2032-11-11

Abstract

The utility model provides a liquid cooling server and edge computing equipment, relates to the technical field of communication, and solves the problems that the liquid cooling server is complex in structure, large in occupied area and difficult to deploy. The liquid cooling server includes: the shell is provided with a cavity, and the cavity contains liquid cooling working medium; the radiating fins are integrally formed with the shell and are arranged on the side wall of the shell; the server main board is fixed in the cavity and is immersed in the liquid cooling working medium. The scheme of the utility model has the advantages of small volume, simple structure, low manufacturing cost, low energy consumption, good heat dissipation effect and the like.

Description

Liquid cooling server and edge computing equipment

Technical Field

The utility model relates to the technical field of communication, in particular to a liquid cooling server and edge computing equipment.

Background

The current heat dissipation mode of the server mainly comprises air cooling and liquid cooling, the air cooling server takes away the heat of the server through wind power, a large amount of electric energy is needed for supporting the server, and the waterproof, dustproof, anticorrosion and electromagnetic ionizing radiation prevention capacities are poor; the liquid cooling server takes the liquid and the heating component in contact with each other to exchange heat and take away the heat of the server by taking the liquid as a transmission medium. Compared with the traditional air-cooled server, the liquid has the characteristics of high conduction efficiency, high specific heat capacity and the like, can realize the efficient refrigeration of IT equipment, realize the efficient energy conservation of a data center, and improve the reliability of the device.

At present, the liquid cooling server is mainly deployed in the field of data centers. The whole data center liquid cooling scheme is divided into three parts, namely an evaporation end, a heat exchange unit and an outdoor heat dissipation unit, and the structure is complex, the volume is large, and the occupied area is tens or even hundreds of square meters.

With the rapid development of networks in recent years, in order to generate faster network service response and meet the requirements of industry on real-time service, edge computing has been rapidly developed, but because the edge computing needs to be arranged close to a user side, the environments in which the edge computing servers are deployed are quite different, including places such as mines, ports, nuclear power, and some places with limited electric power, and the servers deployed in the places need to meet the requirements of simple structure, small volume, low energy consumption and good heat dissipation effect.

Disclosure of Invention

The utility model provides a liquid cooling server and edge computing equipment. The problems of complex structure, large occupied area and difficult deployment of the liquid cooling server are solved.

In order to solve the technical problems, the technical scheme of the utility model is as follows:

an embodiment of the present utility model provides a liquid-cooled server, including:

the shell is provided with a cavity, and the cavity contains liquid cooling working medium;

the radiating fins are integrally formed with the shell and are arranged on the side wall of the shell;

the server main board is fixed in the cavity and is immersed in the liquid cooling working medium.

Optionally, the heat dissipation fins are disposed on an inner surface and/or an outer surface of the side wall of the housing.

Optionally, the housing further comprises: and the inner surface and/or the outer surface of the side wall of the upper end face of the shell are/is provided with one radiating fin.

Optionally, the inner surface and/or the outer surface of the side wall are provided with a plurality of radiating fins which are arranged at intervals.

Optionally, the sidewall includes: a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall; at least one side wall of the first side wall, the second side wall, the third side wall and the fourth side wall is provided with a wire outlet hole; and a sealing ring is arranged at the periphery of the wire outlet hole.

Optionally, the server motherboard is fixed on the inner surface of the side wall by screwing.

Optionally, the shell is made of metal fiber.

Optionally, the length of the housing is in a first range, the width is in a second range, and the height is in a third range.

Optionally, the first range is 400 to 450 millimeters; the second range is 200 to 250 millimeters; the third range is 500 to 560 mm.

The embodiment of the utility model also provides edge computing equipment which comprises the liquid cooling server.

The scheme of the utility model at least comprises the following beneficial effects:

according to the scheme of the utility model, the liquid cooling server comprises: the shell is provided with a cavity, and the cavity contains liquid cooling working medium; the radiating fins are integrally formed with the shell and are arranged on the side wall of the shell; the server main board is fixed in the cavity and is immersed in the liquid cooling working medium. The liquid cooling server has the advantages of being small in size, simple in structure, low in manufacturing cost, low in energy consumption, good in heat dissipation effect and the like due to the design of the simple shell, the liquid cooling working medium and the heat dissipation fins.

Drawings

FIG. 1 is a schematic diagram of a liquid-cooled server according to the present utility model;

FIG. 2 is a schematic diagram of the external overall structure of the liquid-cooled server according to the present utility model;

FIG. 3 is a schematic diagram of a liquid cooling server according to the present utility model, wherein heat dissipation fins are provided on the inner surface of the side wall;

fig. 4 is a schematic diagram of a structure in which both inner and outer surfaces of a side wall of a liquid cooling server according to the present utility model are provided with heat radiating fins.

1, a shell; 11. a first sidewall; 12. a second sidewall; 13. a third sidewall; 14. a fourth sidewall; 15. an upper end surface; 2. a heat radiation fin; 3. liquid cooling working medium; 4. a server motherboard; 5. a cavity; 6. and a wire outlet hole.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

As shown in fig. 1 and 2, an embodiment of the present utility model proposes a liquid cooling server including:

a housing 1 having a cavity 5, the cavity 5 accommodating a liquid cooling medium 3 therein;

a heat radiation fin 2 integrally formed with the housing 1, the heat radiation fin 2 being provided on a side wall of the housing 1;

and the server main board 4 is fixed in the cavity 5, and the server main board 4 is immersed in the liquid cooling working medium 3.

In this embodiment, the liquid cooling working medium 3 is a non-conductive liquid such as a fluorinated liquid or a mineral oil, and when the server motherboard 4 immersed in the liquid cooling working medium 3 generates heat during operation (the immersion refers to that the server motherboard 4 is completely immersed by the liquid cooling working medium 3), the liquid cooling working medium 3 absorbs and transfers the heat to the heat dissipation fins 2, and dissipates the heat to the air through the heat dissipation fins 2, thereby achieving heat dissipation to the server motherboard 4; the liquid cooling server has the advantages of simple structure, low energy consumption, low manufacturing cost and good heat dissipation effect through the simple design of the shell 1, the liquid cooling working medium 3 and the heat dissipation fins 2.

In an alternative embodiment of the present utility model, the heat dissipating fins 2 are provided on the inner surface and/or the outer surface of the side wall of the housing 1.

In this embodiment, the heat dissipation fins 2 are disposed on the inner surface of the side wall of the housing 1 to increase the contact area between the liquid cooling working medium 3 in the cavity 5 and the heat dissipation fins 2, so as to accelerate heat dissipation, and the heat dissipation fins 2 are disposed on the outer surface of the side wall of the heat dissipation fins 2 of the housing 1 to increase the contact area between the heat dissipation fins 2 and the outside air, so as to accelerate heat dissipation in the air. In an alternative embodiment of the present utility model, the housing 1 further comprises: the upper end face 15, and the inner surface and/or the outer surface of the side wall of the upper end face 15 of the shell 1 are/is provided with one radiating fin 2.

In this embodiment, symmetrical heat dissipation fins 2 are disposed on the inner surface and the outer surface of the upper end surface 15, and the heat dissipation fins 2 on the inner surface of the upper end surface 15 are designed to enlarge the contact area with the liquid cooling working medium 3 in the cavity 5, so as to accelerate the transmission speed of heat to the external heat dissipation fins 2, or may be disposed only on the inner surface of the side wall of the upper end surface 15 or on the outer surface of the side wall of the upper end surface 15.

In an optional embodiment of the present utility model, the inner surface and/or the outer surface of the side wall are provided with a plurality of heat dissipation fins 2 arranged at intervals, the intervals between the heat dissipation fins 2 can be correspondingly increased or decreased according to the size of a specific device, and the number of the heat dissipation fins 2 can be determined according to the power consumption of the device so as to meet the heat dissipation requirement of the device; the plurality of radiating fins 2 can be staggered and arranged side by side so as to meet the requirement of equipment for radiating; the plurality of heat dissipation fins 2 are arranged at intervals to increase the overall heat dissipation effect of the liquid cooling server.

In this embodiment, as shown in fig. 2, in a preferred implementation manner, the outer surfaces of the side walls are all provided with a plurality of heat dissipation fins 2 arranged at intervals, and the inner surfaces of the side walls are free of the heat dissipation fins 2.

As shown in fig. 3, in a preferred implementation manner, a plurality of heat dissipation fins 2 are arranged on the inner surface of the side wall of the shell 1 at intervals, and the heat dissipation fins 2 are not arranged on the outer surface of the side wall.

In a preferred implementation, as shown in fig. 4, both the inner and outer surfaces of the side wall of the housing 1 are provided with heat dissipating fins 2.

In an alternative embodiment of the present utility model, as shown in fig. 1, the sidewall includes: a first side wall 11, a second side wall 12, a third side wall 13, a fourth side wall 14;

at least one of the first side wall 11, the second side wall 12, the third side wall 13 and the fourth side wall 14 is provided with a wire outlet hole 6; and a sealing ring is arranged at the periphery of the wire outlet hole 6.

In this embodiment, the wire outlet hole 6 is used for connecting a power line and a network line of a server, and the periphery of the wire outlet hole 6 is sealed by a sealing ring, so that leakage of the liquid cooling working medium 3 in the cavity 5 is prevented, and the size of the sealing ring is determined according to the number of the power lines and the network lines, so that sealing of the wire outlet hole 6 is satisfied.

In an alternative embodiment of the present utility model, the server motherboard 4 is fixed on the inner surface of the side wall by screws, and the server motherboard 4 may be fixed on any surface of the inner surface of the side wall, so long as the server motherboard 4 is completely immersed in the liquid cooling medium 3, so as to enable all heat on the server motherboard 4 to be introduced into the liquid cooling medium 3.

In an alternative embodiment of the present utility model, the material of the housing 1 is metal fiber.

In this embodiment, the metal fiber is mainly made of stainless steel and iron-chromium-aluminum, and has good electrical conductivity, heat conductivity, magnetic conductivity, high temperature resistance, and corrosion resistance, and the cost price is low, and when the metal fiber is used as the shell 1, the shell 1 needs to be insulated, so that the shell 1 has the advantages of dust prevention, water prevention, corrosion prevention, and electromagnetic ionizing radiation prevention.

In an alternative embodiment of the utility model, the length of the housing 1 is in a first range, the width is in a second range, and the height is in a third range.

The first range is 400 to 450 millimeters; the second range is 200 to 250 millimeters; the third range is 500 to 560 mm.

In this embodiment, the liquid cooling server transfers heat to the heat dissipation fins 2 through the liquid cooling working medium 3, and then dissipates heat to the air through the heat dissipation fins 2, and this simple structural design makes the liquid cooling server have the characteristic of small volume, and can satisfy the use in a narrow space, and preferably the length of the shell 1 is 430 mm, the width is 230 mm, and the height is 550 mm.

In a preferred embodiment of the present utility model, the casing 1 may further be provided with a hanging member, through which the liquid cooling server may be hung on an indoor and an outdoor wall or a pillar, so as to save a floor space occupied by the server.

The embodiment of the utility model also provides edge computing equipment, which comprises the liquid cooling server in any embodiment.

The specific working principle of the liquid cooling server according to the embodiment of the utility model is as follows: when the server main board 4 immersed in the liquid cooling working medium 3 works to generate heat, the liquid cooling working medium 3 absorbs the heat, the liquid cooling working medium 3 absorbing the heat is influenced by heat conduction and the temperature difference between the inside and the outside of the shell 1, so that the liquid cooling working medium 3 absorbing the heat flows around the cavity 5, and then the heat is transferred to the heat dissipation fins 2 arranged on the outer surfaces of the first side wall 11, the second side wall 12, the third side wall 13, the fourth side wall 14 and the upper end face 15 outside the shell 1 through the heat dissipation fins 2 on the outer surfaces to dissipate the heat into the air, thereby realizing heat dissipation on the server main board 4.

The liquid cooling server is suitable for being used on edge single-node computing equipment, and meets the requirements of special scenes such as mines, ports, nuclear power, insufficient power and the like on the edge single-node computing equipment, such as simple structure, small occupied space and low energy consumption, and meanwhile, the liquid cooling server has the advantages of dust prevention, water prevention, corrosion prevention, electromagnetic ionization radiation prevention, easiness in installation and deployment and plug and play.

While the foregoing is directed to the preferred embodiments of the present utility model, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present utility model, and such modifications and adaptations are intended to be comprehended within the scope of the present utility model.

Claims

1. A liquid-cooled server, comprising:

a shell (1) with a cavity (5), wherein the cavity (5) contains a liquid cooling working medium (3);

a radiating fin (2) integrally formed with the housing (1), the radiating fin (2) being disposed on a side wall of the housing (1);

and the server main board (4) is fixed in the cavity (5), and the server main board (4) is immersed in the liquid cooling working medium (3).

2. The liquid cooling server according to claim 1, wherein the heat radiating fins (2) are provided on an inner surface and/or an outer surface of a side wall of the housing (1).

3. The liquid-cooled server according to claim 2, wherein the housing (1) further comprises: an upper end surface (15), wherein one radiating fin (2) is arranged on the inner surface and/or the outer surface of the side wall of the upper end surface (15) of the shell (1).

4. The liquid-cooled server of claim 1, wherein the inner surface of the sidewall

The surface and/or the outer surface is provided with a plurality of radiating fins (2) which are arranged at intervals.

5. The liquid-cooled server of claim 1, wherein the side wall comprises: a first side wall (11), a second side wall (12), a third side wall (13) and a fourth side wall (14); at least one side wall of the first side wall (11), the second side wall (12), the third side wall (13) and the fourth side wall (14) is provided with a wire outlet hole (6); and a sealing ring is arranged at the periphery of the wire outlet hole (6).

6. The liquid cooling server according to claim 1, wherein the server motherboard (4) is screwed to the inner surface of the side wall.

7. The liquid cooling server according to claim 1, wherein the material of the housing (1) is metal fiber.

8. The liquid cooling server according to claim 1, wherein the length of the housing (1) is in a first range, the width is in a second range, and the height is in a third range.

9. The liquid-cooled server of claim 8, wherein the first range is 400 to 450 millimeters; the second range is 200 to 250 millimeters; the third range is 500 to 560 mm.

10. An edge computing device, comprising: the liquid-cooled server of any one of claims 1 to 9.