CN218928265U - Base plate cutting equipment for semiconductor chip production - Google Patents
Base plate cutting equipment for semiconductor chip production Download PDFInfo
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- CN218928265U CN218928265U CN202223186611.9U CN202223186611U CN218928265U CN 218928265 U CN218928265 U CN 218928265U CN 202223186611 U CN202223186611 U CN 202223186611U CN 218928265 U CN218928265 U CN 218928265U
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- fixedly connected
- semiconductor chip
- movable frame
- chip production
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000009434 installation Methods 0.000 claims description 10
- 230000002457 bidirectional effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Abstract
The utility model relates to the technical field of semiconductor chip processing equipment and discloses base plate cutting equipment for semiconductor chip production, which comprises a workbench, wherein a first fixing groove is formed in the top end of the workbench, a first motor is fixedly connected to the left side of the front end of the first fixing groove, a two-way threaded rod is fixedly connected to the driving end of the first motor, movable plates are connected to the left side and the right side of the outer portion of the two-way threaded rod in a threaded manner, mounting grooves are formed in the rear sides of the top ends of the two movable plates, a first movable frame is connected to the inside of the mounting grooves in a sliding manner, a first rack plate is fixedly connected to the bottom end of the right side of the first movable frame, and a first sliding rod is fixedly connected to the bottom end of the left side of the first movable frame. According to the utility model, clamping and fixing of chip substrates of different types are realized, and the cutting head can cut different positions on the chip substrate, so that the trouble of mounting and fixing the chip again is avoided.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip processing equipment, in particular to substrate cutting equipment for semiconductor chip production.
Background
The utility model of semiconductor chip is an innovation in twentieth century, which starts the first place in information age, and the semiconductor chip is made by etching and wiring on semiconductor sheet material, and the semiconductor device capable of realizing certain function is not only silicon chip, but also semiconductor material such as gallium arsenide and germanium, and the like, and the chip needs to be cut at all times during processing, and a cutting device is needed.
However, the current cutting device for semiconductor chips is inconvenient in position adjustment after the chip is fixed in use, only one position direction can be cut, when the cutting direction of the chip needs to be changed, the position of the fixed chip needs to be changed, and other directions of the chip can be cut, so that the fixing time of the chip for cutting for many times is greatly increased, the speed of chip processing is reduced while the operation is too troublesome, the cutting position of the device for the chip is not good in fixing effect, and the device cannot be suitable for chip substrates of different types, so that the cutting device has certain limitation, and the substrate cutting device for semiconductor chip production is provided aiming at the defects.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides substrate cutting equipment for semiconductor chip production.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a base plate cutting equipment is used in semiconductor chip production, includes the workstation, the top of workstation is provided with fixed slot one, the front end left side fixedly connected with motor one of fixed slot one, the drive end fixedly connected with bi-directional threaded rod of motor one, the equal threaded connection in outside left and right sides of bi-directional threaded rod has the fly leaf, two the top rear side of fly leaf is provided with mounting groove one, the inside sliding connection of mounting groove one has fly leaf one, the right side bottom fixedly connected with rack board one of fly leaf one, the left side bottom fixedly connected with slide bar one of fly leaf one, two the top of fly leaf is provided with spout one from one side, two the top front end of fly leaf is provided with mounting groove two, the inside sliding connection of mounting groove two has fly leaf two, the left side bottom fixedly connected with rack board two, the right side bottom fixedly connected with second of fly leaf two the inside guide rail has two, the inside guide rail has two side fixedly connected with slide bars one, the inside guide rail has two, two inside guide rail fixedly connected with two.
As a further description of the above technical solution:
the rear ends of the two movable plates are connected to the outside of the guide rod in a sliding manner.
As a further description of the above technical solution:
the bottom sliding connection of slide bar one is in the inside of spout one, the right side of spout one sets up in the left side of mounting groove one.
As a further description of the above technical solution:
the bottom sliding connection of slide bar two is in the inside of spout two, the left side of spout two sets up the right side at mounting groove two.
As a further description of the above technical solution:
the rear side of the second sliding groove is arranged on the front side of the first installation groove, and the rear side of the second installation groove is arranged on the front side of the first sliding groove.
As a further description of the above technical solution:
the right side of the first rack plate is connected to the outside of the gear in a meshed mode, and the left side of the second rack plate is connected to the outside of the gear in a meshed mode.
As a further description of the above technical solution:
and the outer part of the second linear guide rail is connected with a cutting head in a sliding way.
As a further description of the above technical solution:
the bottom fixedly connected with piece case of workstation.
The utility model has the following beneficial effects:
1. according to the utility model, the first motor is started, and the chip substrates of different types are clamped and fixed under the cooperation of the bidirectional threaded rod, the movable plate, the first mounting groove, the first movable frame, the first rack plate, the first slide bar, the first slide groove, the second mounting groove, the second movable frame, the second rack plate, the second slide bar, the second slide groove, the second motor and the gear, so that the chip substrates of different types are more convenient to use, the limitation is eliminated, the application range is enlarged, and the use requirements are more met.
2. According to the utility model, the first linear guide rail and the second linear guide rail are matched with each other, so that the cutting head can cut different positions on the chip substrate, the trouble of mounting and fixing the chip again is avoided, the chip processing time is shortened, and the chip processing speed is greatly improved.
Drawings
Fig. 1 is a perspective front view of a substrate cutting apparatus for semiconductor chip production according to the present utility model;
fig. 2 is a schematic diagram of a workbench of a substrate cutting apparatus for semiconductor chip production according to the present utility model;
fig. 3 is a schematic view showing the internal structure of a movable plate of a substrate cutting apparatus for semiconductor chip production according to the present utility model;
fig. 4 is a schematic diagram of an internal structure of a fixing slot of a substrate cutting apparatus for semiconductor chip production according to the present utility model.
Legend description:
1. a work table; 2. a first fixing groove; 3. a first motor; 4. a two-way threaded rod; 5. a movable plate; 6. a first mounting groove; 7. a movable frame I; 8. rack plate I; 9. a first slide bar; 10. a first chute; 11. a second mounting groove; 12. a second movable frame; 13. a second slide bar; 14. a second chute; 15. a second motor; 16. a gear; 17. a guide rod; 18. a mounting frame; 19. a second fixing groove; 20. a first linear guide rail; 21. a second linear guide rail; 22. a cutting head; 23. rack plate II; 24. and a chip box.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, one embodiment provided by the present utility model is: the substrate cutting equipment for semiconductor chip production comprises a workbench 1, wherein the top end of the workbench 1 is provided with a first fixing groove 2, the left side of the front end of the first fixing groove 2 is fixedly connected with a first motor 3, the first motor 3 drives a two-way threaded rod 4 to rotate so as to drive movable plates 5 on two sides to move relatively, thus the two-way threaded rod 4 can be adjusted according to substrates of different types, the driving end of the first motor 3 is fixedly connected with the two-way threaded rod 4, the left side and the right side of the outer part of the two-way threaded rod 4 are both in threaded connection with the movable plates 5, the rear sides of the top ends of the two movable plates 5 are provided with a first mounting groove 6, the first mounting groove 6 is used for the first movable frame 7 to slide inside so as to be matched with the second movable frame 12, the substrates are clamped and fixed, the chip substrates of different types are clamped and fixed, the use is more convenient, the limitation is eliminated, the application range is enlarged, the use requirement is more satisfied, the inside sliding connection of the installation groove I6 has the movable frame I7, the movable frame I7 and the movable frame II 12 mutually cooperate, thereby the base plate can be fixed, the right side bottom fixedly connected with the rack board I8 of the movable frame I7, the rack board I8 moves under the drive of the gear 16, thereby the movable frame I7 is driven to move in the installation groove I6, the left side bottom fixedly connected with the slide bar I9 of the movable frame I7, the top of the two movable plates 5 is provided with the slide groove I10 on one side apart from, the slide groove I10 is used for the slide bar I9 to slide in the interior, thereby the movable frame I7 can keep steady when moving, the top front end of the two movable plates 5 is provided with the installation groove II 11, the installation groove II 11 is used for the movable frame II 12 to move in the interior, and then mutually cooperate with the movable frame I7, so that the substrates with different types are clamped and fixed mutually, the use is more convenient, the limitation is eliminated, the application range is enlarged, the use requirement is more satisfied, the inside of the installation groove II 11 is connected with the movable frame II 12 in a sliding way, the movable frame II 12 is matched with the movable frame I7 to clamp and fix the substrates, the left bottom end of the movable frame II 12 is fixedly connected with the rack plate II 23, the rack plate II 23 is driven by the gear 16 to enable the movable frame II 12 to slide in the installation groove II 11, the right bottom end of the movable frame II 12 is fixedly connected with the slide bar II 13, the slide bar II 13 is driven by the movable frame II 12 to slide in the slide groove II 14, the stability of the movable frame II 12 is ensured, the slide groove II 14 is arranged on one side close to the top ends of the two movable plates 5, the middle parts of the bottom ends of the two movable plates 5 are fixedly connected with the motor II 15, the motor II 15 drives the gear 16 to rotate, thereby driving the rack plate I8 and the rack plate II 23 to relatively move, further driving the movable frame I7 and the movable frame II 12 to relatively move, further completing the fixation of the base plate, the driving end of the motor II 15 is fixedly connected with the gear 16, the inner rear side of the fixed slot I2 is fixedly connected with the guide rod 17, the guide rod 17 is used for placing the movable plate 5 to rotationally move under the driving of the bidirectional threaded rod 4, the top rear side of the workbench 1 is fixedly connected with the mounting frame 18, the mounting frame 18 is used for mounting the cutting device, the top and bottom sides of the mounting frame 18 are provided with the fixed slot II 19, the left and right sides of the inner part of the fixed slot II 19 are respectively provided with the linear guide rails I20, the linear guide rails I20 are used for moving back and forth to the bottom cutting head 22, the outer parts of the two linear guide rails I20 are slidingly connected with the linear guide rails II 21, the second linear guide rail 21 is used for driving the cutting head 22 to move left and right, and is matched with the first linear guide rail 20, so that the cutting head 22 can cut different positions on the chip substrate, the trouble that the chip needs to be installed and fixed again is avoided, the chip processing time is shortened, and the chip processing speed is greatly improved.
The rear end sliding connection of two fly leaves 5 is in the outside of guide bar 17 to restrict the direction of movement of fly leaf 5, the bottom sliding connection of slide bar one 9 is in the inside of spout one 10, slide bar one 9 is used for guaranteeing the stationarity that fly frame one 7 moved, the right side of spout one 10 sets up in the left side of mounting groove one 6, the bottom sliding connection of slide bar two 13 is in the inside of spout two 14, slide bar two 13 is used for guaranteeing the stationarity that fly frame two 12 moved, the left side of spout two 14 sets up on the right side of mounting groove two 11, the rear side of spout two 14 sets up the front side at mounting groove one 6, the rear side of mounting groove two 11 sets up the front side at spout one 10, the right side meshing connection of rack board one 8 is in the outside of gear 16, gear 16 and rack board one 8 cooperate, thereby drive fly frame one 7 in the inside of mounting groove one 6, the left side meshing connection of rack board two 23 is in the outside of gear 16, gear 16 carries out relative cooperation with rack board two 23, thereby drive fly frame two 12 in the inside mounting groove two 11 slide rail two 21, the straight line connection has the base plate 22 to carry out cutting head 24 to cut the base plate 24, the base plate is connected with the base plate 24 is used for cutting the base plate is fixed to the bottom, the base plate is cut for producing the base plate is cut to the base plate is used for cutting the base plate.
Working principle: according to the signal of the chip, the first motor 3 is started, the first motor 3 drives the bidirectional threaded rod 4 to rotate, the bidirectional threaded rod 4 rotates to drive the movable plates 5 on the left side and the right side to move relatively along the guide rod 17, so that the distance between the two movable plates 5 is adjusted, then the substrate of the semiconductor chip is placed on the top ends of the two movable plates 5, the second motor 15 can be started at this time, the second motor 15 drives the gear 16 to rotate, the gear 16 rotates to drive the rack plate 8 and the rack plate 23 to move relatively, so that the first movable frame 7 and the second movable frame 12 in the lower movable frames 8 and the rack plate 23 slide in the first mounting groove 6 and the second mounting groove 11, the first slide rod 9 and the second slide rod 13 are driven to move in the first slide groove 10 and the second slide groove 14, the substrate of the semiconductor chip on the movable plates 5 is clamped and fixed, and after the fixed mounting is finished, the first linear guide rail 20 and the second linear guide rail 21 can be started to drive the cutting head 22 to move up and down and left and right, so that different semiconductor chip parts on the substrate can be cut.
Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.
Claims (8)
1. Substrate cutting equipment for semiconductor chip production, including workstation (1), its characterized in that: the utility model discloses a workbench, which is characterized in that a first fixed slot (2) is arranged at the top of the workbench (1), a first motor (3) is fixedly connected to the left side of the front end of the first fixed slot (2), a two-way threaded rod (4) is fixedly connected to the driving end of the first motor (3), a movable plate (5) is arranged at the left and right sides of the outer part of the two-way threaded rod (4), a first mounting slot (6) is arranged at the rear side of the top of the movable plate (5), a first movable frame (7) is slidably connected to the inside of the first mounting slot (6), a first rack plate (8) is fixedly connected to the bottom of the right side of the first movable frame (7), a first slide rod (9) is fixedly connected to the bottom of the left side of the first movable frame (7), a first slide groove (10) is arranged at the top of the first movable plate (5), a second mounting slot (11) is arranged at the front end of the top of the movable plate (5), a second movable frame (12) is slidably connected to the inside of the movable plate (11), a second slide rod (12) is fixedly connected to the bottom of the second movable frame (12), a second slide rod (13) is fixedly connected to the bottom of the second movable frame (5), a second slide rod (13) is fixedly connected to the bottom of the second slide rod (13), drive end fixedly connected with gear (16) of motor two (15), the inside rear side fixedly connected with guide bar (17) of fixed slot one (2), the top rear side fixedly connected with mounting bracket (18) of workstation (1), the top bottom side of mounting bracket (18) is provided with fixed slot two (19), the inside left and right sides of fixed slot two (19) all is provided with linear guide one (20), two the outside sliding connection of linear guide one (20) has linear guide two (21).
2. The substrate cutting apparatus for semiconductor chip production according to claim 1, wherein: the rear ends of the two movable plates (5) are connected with the outside of the guide rod (17) in a sliding way.
3. The substrate cutting apparatus for semiconductor chip production according to claim 1, wherein: the bottom of the first sliding rod (9) is slidably connected inside the first sliding groove (10), and the right side of the first sliding groove (10) is arranged on the left side of the first mounting groove (6).
4. The substrate cutting apparatus for semiconductor chip production according to claim 1, wherein: the bottom of the second sliding rod (13) is slidably connected to the inside of the second sliding groove (14), and the left side of the second sliding groove (14) is arranged on the right side of the second mounting groove (11).
5. The substrate cutting apparatus for semiconductor chip production according to claim 1, wherein: the rear side of the second sliding groove (14) is arranged on the front side of the first installation groove (6), and the rear side of the second installation groove (11) is arranged on the front side of the first sliding groove (10).
6. The substrate cutting apparatus for semiconductor chip production according to claim 1, wherein: the right side of the first rack plate (8) is connected with the outside of the gear (16) in a meshed mode, and the left side of the second rack plate (23) is connected with the outside of the gear (16) in a meshed mode.
7. The substrate cutting apparatus for semiconductor chip production according to claim 1, wherein: and a cutting head (22) is connected to the outer part of the second linear guide rail (21) in a sliding manner.
8. The substrate cutting apparatus for semiconductor chip production according to claim 1, wherein: the bottom end of the workbench (1) is fixedly connected with a chip box (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223186611.9U CN218928265U (en) | 2022-11-29 | 2022-11-29 | Base plate cutting equipment for semiconductor chip production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223186611.9U CN218928265U (en) | 2022-11-29 | 2022-11-29 | Base plate cutting equipment for semiconductor chip production |
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| Publication Number | Publication Date |
|---|---|
| CN218928265U true CN218928265U (en) | 2023-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223186611.9U Active CN218928265U (en) | 2022-11-29 | 2022-11-29 | Base plate cutting equipment for semiconductor chip production |
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| Country | Link |
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| CN (1) | CN218928265U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117428948A (en) * | 2023-10-19 | 2024-01-23 | 日荣半导体(上海)有限公司 | A new type of eccentric cutting device for packaged chips |
-
2022
- 2022-11-29 CN CN202223186611.9U patent/CN218928265U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117428948A (en) * | 2023-10-19 | 2024-01-23 | 日荣半导体(上海)有限公司 | A new type of eccentric cutting device for packaged chips |
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