CN218857632U - Cooling device for semiconductor module packaging - Google Patents
Cooling device for semiconductor module packaging Download PDFInfo
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- CN218857632U CN218857632U CN202223586849.0U CN202223586849U CN218857632U CN 218857632 U CN218857632 U CN 218857632U CN 202223586849 U CN202223586849 U CN 202223586849U CN 218857632 U CN218857632 U CN 218857632U
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Abstract
The utility model discloses a cooling device for semiconductor module encapsulation relates to semiconductor package cooling technology field, divide into eight processes for solving the semiconductor module encapsulation among the prior art, and wherein the process of plastic envelope needs cooling device to cool off epoxy rapidly, and the cooling water flow that adopts the normal atmospheric temperature at present mostly realizes the cooling through the mould, and the heat absorption effect is relatively poor, problem that cooling efficiency is low. First cooling water tank is installed to the top of upper die base, and first cooling water tank passes through fastening screw fixed connection with the upper die base, first cooling body is installed to first cooling water tank's top, and first cooling body passes through fastening screw fixed connection with first cooling water tank, second cooling water tank is installed to the below of die holder, and second cooling water tank passes through fastening screw fixed connection with the die holder, second cooling body is installed to second cooling water tank's below, and second cooling body passes through fastening screw fixed connection with second cooling water tank.
Description
Technical Field
The utility model relates to a semiconductor package cooling technology field specifically is a cooling device is used in semiconductor module encapsulation.
Background
The semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by adopting the semiconductor, and the semiconductor module packaging needs to use a cooling device to cool the plastic-packaged epoxy resin;
for example, application publication No. CN 106469696B, printed circuit boards and semiconductor modules. The semiconductor module has a manifold member and a semiconductor member composed of a power semiconductor device, a heat conductive plate material, and a serpentine fin member. The semiconductor device and the serpentine fin element are bonded to opposite sides of the thermally conductive sheet material to form a sheet material assembly. The sheet assembly is mounted in the window of the manifold element to form a semiconductor module, which allows heat to be removed from each power semiconductor device, the terminals of the semiconductor module being received in the holes in the circuit board and soldered to the traces;
the packaging and cooling device of the above application can be filled with resin to prevent the leakage of the coolant or can be sealed by using a clamped O-ring, but the cooling structure adopted by the packaging and cooling device still adopts the coolant of normal temperature to flow through the die to realize cooling, the heat absorption effect is poor, and the cooling efficiency is low, so that the market urgently needs to develop a cooling device for packaging the semiconductor module to help people to solve the existing problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cooling device for semiconductor module encapsulation to the semiconductor module encapsulation of proposing is divided into eight processes in solving above-mentioned background art, and wherein the process of plastic envelope needs cooling device to cool off epoxy rapidly, and the cooling water flow that mostly adopts the normal atmospheric temperature at present flows through the mould and realizes the cooling, and the heat absorption effect is relatively poor, problem that cooling efficiency is low.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a cooling device for semiconductor module encapsulation, includes die holder and upper die base, first cooling water tank is installed to the top of upper die base, and first cooling water tank passes through fastening screw fixed connection with the upper die base, first cooling body is installed to first cooling water tank's top, and first cooling body passes through fastening screw fixed connection with first cooling water tank, second cooling water tank is installed to the below of die holder, and second cooling water tank passes through fastening screw fixed connection with the die holder, second cooling body is installed to second cooling water tank's below, and second cooling body passes through fastening screw fixed connection with second cooling water tank, first cooling body includes heating panel, semiconductor refrigeration board and radiator fan, second cooling body is the same with first cooling body structure.
Preferably, the upper die is installed to the below of upper die base, the first head of intaking is installed to one side of upper die, and first head and last mould threaded connection of intaking, first conveyer pipe is installed to the one end of first head of intaking, and first conveyer pipe and first head of intaking pass through fastening screw fixed connection.
Preferably, the lower die is installed above the lower die holder, a second water inlet head is installed on one side of the lower die, the second water inlet head is in threaded connection with the lower die, a second conveying pipe is installed at one end of the second water inlet head, and the second conveying pipe is fixedly connected with the second water inlet head through a fastening screw.
Preferably, first connecting pipe is installed to one side of first cooling water tank, and first connecting pipe passes through fastening screw fixed connection with first cooling water tank, the second connecting pipe is installed to one side of second cooling water tank, and the second connecting pipe passes through fastening screw fixed connection with second cooling water tank.
Preferably, the cylinder is installed above the upper die base, the support leg is installed below the lower die base, the base is installed below the support leg, the injection molding pipe is installed below the lower die base, and the electric valve is installed on the outer side of the injection molding pipe.
Preferably, the inside of the upper die is provided with a first cooling water channel, the first cooling water channel and the upper die are arranged into an integral structure, the inside of the lower die is provided with a second cooling water channel, and the second cooling water channel and the lower die are arranged into an integral structure.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a further cool off carrying last mould and bed die internal cooling water through first cooling body and second cooling body, first cooling body is the same with second cooling body structure, by the heating panel, semiconductor refrigeration board and cooling fan, the semiconductor refrigeration board can cool off cooling water to 2 ℃, thereby make the cooling water temperature extremely low, thereby make cooling water flow when inside the mould, can absorb heat fast, improve cooling efficiency, make this cooling device for semiconductor module encapsulation use more high-efficient.
2. The utility model discloses a through the pipe of moulding plastics can make progress the space between mould and the bed die and pour into epoxy into, the semiconductor will be placed between last mould and bed die, utilizes epoxy to carry out the plastic envelope to the semiconductor, can wrap up the semiconductor is whole to the realization is to the plastic envelope encapsulation work of semiconductor, and the outside of the pipe of moulding plastics simultaneously has set up the motorised valve, can realize opening and stopping up the intraductal passageway of moulding plastics, convenience convenient to use.
Drawings
Fig. 1 is a front view of a cooling device for semiconductor module packaging according to the present invention;
fig. 2 is an enlarged schematic view of the utility model at a;
fig. 3 is a front view of a first cooling mechanism of the present invention;
fig. 4 is a cross-sectional view of the lower mold and the upper mold of the present invention.
In the figure: 1. a base; 2. a support leg; 3. a lower die holder; 4. a lower die; 5. an upper die holder; 6. an upper die; 7. a cylinder; 8. injection molding a tube; 9. an electrically operated valve; 10. a first water inlet head; 11. a first delivery pipe; 12. a first cooling water tank; 13. a first connecting pipe; 14. a first cooling mechanism; 15. a second water inlet head; 16. a second delivery pipe; 17. a second cooling water tank; 18. a second connecting pipe; 19. a second cooling mechanism; 20. a heat dissipation plate; 21. a semiconductor refrigeration plate; 22. a heat radiation fan; 23. a first cooling channel; 24. a second cooling flume.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides a cooling device for semiconductor module encapsulation, including die holder 3 and upper die holder 5, first cooling water tank 12 is installed to the top of upper die holder 5, and first cooling water tank 12 passes through fastening screw fixed connection with upper die holder 5, first cooling mechanism 14 is installed to the top of first cooling water tank 12, and first cooling mechanism 14 passes through fastening screw fixed connection with first cooling water tank 12, second cooling water tank 17 is installed to the below of die holder 3, and second cooling water tank 17 passes through fastening screw fixed connection with die holder 3, second cooling mechanism 19 is installed to the below of second cooling water tank 17, and second cooling mechanism 19 passes through fastening screw fixed connection with second cooling water tank 17, first cooling mechanism 14 includes heating panel 20, semiconductor refrigeration board 21 and cooling fan 22, second cooling mechanism 19 is the same with first cooling mechanism 14 structure.
During the use, further cool off the inside cooling water of last mould 6 and bed die 4 of carrying through first cooling body 14 and second cooling body 19, first cooling body 14 is the same with second cooling body 19 structure, by heating panel 20, semiconductor refrigeration board 21 and cooling blower 22, semiconductor refrigeration board 21 can be with cooling water to 2 ℃, thereby make cooling water temperature extremely low, thereby make cooling water flow when the mould is inside, can absorb heat fast, and the cooling efficiency is improved, make this cooling device for semiconductor module encapsulation use more high-efficient.
Further, an upper die 6 is installed below the upper die base 5, a first water inlet head 10 is installed on one side of the upper die 6, the first water inlet head 10 is in threaded connection with the upper die 6, a first conveying pipe 11 is installed at one end of the first water inlet head 10, the first conveying pipe 11 is fixedly connected with the first water inlet head 10 through a fastening screw, and the upper die 6 is fixedly connected with the upper die base 5 through a bolt.
Further, bed die 4 is installed to the top of die holder 3, and the second is installed in one side of bed die 4 and is intake head 15, and the second is intake head 15 and 4 threaded connection of bed die, and second conveyer pipe 16 is installed to the one end that the second was intake head 15, and second conveyer pipe 16 and second are intake head 15 and pass through fastening screw fixed connection, and bed die 4 passes through bolt fixed connection with die holder 3.
Further, first connecting pipe 13 is installed on one side of first cooling water tank 12, and first connecting pipe 13 passes through fastening screw fixed connection with first cooling water tank 12, and second connecting pipe 18 is installed on one side of second cooling water tank 17, and second connecting pipe 18 passes through fastening screw fixed connection with second cooling water tank 17, and first conveyer pipe 11 passes through fastening screw fixed connection with first cooling water tank 12, and second conveyer pipe 16 passes through fastening screw fixed connection with second cooling water tank 17.
Further, cylinder 7 is installed to the top of upper die base 5, and landing leg 2 is installed to the below of lower die base 3, and base 1 is installed to the below of landing leg 2, and injection molding pipe 8 is installed to the below of lower die base 3, and motorised valve 9 is installed to the outside of injection molding pipe 8, and the jacking end of cylinder 7 passes through bolt fixed connection with upper die base 5, and injection molding pipe 8 and 3 threaded connection of lower die base, and lower die base 3 and base 1 all pass through bolt and landing leg 2 fixed connection.
Further, the inside of going up mould 6 is provided with first cooling water course 23, and first cooling water course 23 sets up structure as an organic whole with last mould 6, and the inside of bed die 4 is provided with second cooling water course 24, and second cooling water course 24 sets up structure as an organic whole with bed die 4, and first cooling water course 23 and first head 10 intercommunication of intaking, second cooling water course 24 and second intake head 15 intercommunication, go up the opposite side of mould 6 and bed die 4 and all installed the faucet.
The working principle is as follows: during the use, order about upper die 6 and the laminating of bed die 4 through cylinder 7, the semiconductor will be placed between upper die 6 and bed die 4, pour into epoxy into the mould through injection molding pipe 8 inside, after the completion of moulding plastics, connect the water pump through first connecting pipe 13 and second connecting pipe 18, carry the cooling water to first cooling water course 23 and second cooling water course 24, when the cooling water flows through first cooling water tank 12 and second cooling water tank 17, will further cool off through first cooling mechanism 14 and second cooling mechanism 19, thereby make epoxy can cool off fast.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a cooling device for semiconductor module encapsulation, includes die holder (3) and upper die base (5), its characterized in that: first coolant tank (12) are installed to the top of upper die base (5), and first coolant tank (12) pass through fastening screw fixed connection with upper die base (5), first cooling body (14) are installed to the top of first coolant tank (12), and pass through fastening screw fixed connection with first coolant tank (12) first cooling body (14), second coolant tank (17) are installed to the below of die holder (3), and pass through fastening screw fixed connection with die holder (3) second coolant tank (17), second cooling body (19) are installed to the below of second coolant tank (17), and second cooling body (19) pass through fastening screw fixed connection with second coolant tank (17), first cooling body (14) are including heating panel (20), semiconductor refrigeration board (21) and cooling fan (22), second cooling body (19) are the same with first cooling body (14) structure.
2. The cooling device for semiconductor module package according to claim 1, wherein: mould (6) are installed to the below of upper die base (5), go up one side of mould (6) and install first head (10) of intaking, and first head (10) of intaking and last mould (6) threaded connection, first conveyer pipe (11) is installed to the one end of first head (10) of intaking, and first conveyer pipe (11) and first head (10) of intaking pass through fastening screw fixed connection.
3. The cooling device for semiconductor module packaging according to claim 2, wherein: lower mould (4) are installed to the top of die holder (3), first (15) are intake to the second is installed to one side of lower mould (4), and second intake head (15) and lower mould (4) threaded connection, second conveyer pipe (16) are installed to the one end of first (15) are intake to the second, and second conveyer pipe (16) and second intake head (15) are through fastening screw fixed connection.
4. A cooling device for semiconductor module package according to claim 3, wherein: first connecting pipe (13) is installed to one side of first coolant tank (12), and just first connecting pipe (13) passes through fastening screw fixed connection with first coolant tank (12), second connecting pipe (18) are installed to one side of second coolant tank (17), and pass through fastening screw fixed connection with second coolant tank (17) second connecting pipe (18).
5. The cooling device for semiconductor module packaging according to claim 1, wherein: the improved die is characterized in that a cylinder (7) is installed above the upper die base (5), supporting legs (2) are installed below the lower die base (3), a base (1) is installed below the supporting legs (2), an injection molding pipe (8) is installed below the lower die base (3), and an electric valve (9) is installed on the outer side of the injection molding pipe (8).
6. The cooling device for semiconductor module packaging according to claim 4, wherein: go up the inside of mould (6) and be provided with first cooling water course (23), and first cooling water course (23) sets up structure as an organic whole with last mould (6), the inside of bed die (4) is provided with second cooling water course (24), and second cooling water course (24) sets up structure as an organic whole with bed die (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223586849.0U CN218857632U (en) | 2022-12-30 | 2022-12-30 | Cooling device for semiconductor module packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223586849.0U CN218857632U (en) | 2022-12-30 | 2022-12-30 | Cooling device for semiconductor module packaging |
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| Publication Number | Publication Date |
|---|---|
| CN218857632U true CN218857632U (en) | 2023-04-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202223586849.0U Active CN218857632U (en) | 2022-12-30 | 2022-12-30 | Cooling device for semiconductor module packaging |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119815810A (en) * | 2025-03-13 | 2025-04-11 | 深圳市新创源精密智造有限公司 | Packaging and cooling device for semiconductor |
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2022
- 2022-12-30 CN CN202223586849.0U patent/CN218857632U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119815810A (en) * | 2025-03-13 | 2025-04-11 | 深圳市新创源精密智造有限公司 | Packaging and cooling device for semiconductor |
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