CN218831094U - Integrated circuit board with quick heat radiation structure - Google Patents
Integrated circuit board with quick heat radiation structure Download PDFInfo
- Publication number
- CN218831094U CN218831094U CN202222739244.4U CN202222739244U CN218831094U CN 218831094 U CN218831094 U CN 218831094U CN 202222739244 U CN202222739244 U CN 202222739244U CN 218831094 U CN218831094 U CN 218831094U
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- CN
- China
- Prior art keywords
- circuit board
- mounting groove
- heat dissipation
- erection column
- column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000005855 radiation Effects 0.000 title claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 238000009434 installation Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an integrated circuit board with quick heat radiation structure, including the circuit board main part, the four corners department at circuit board main part top all runs through and has seted up the mounting groove, every peg graft in the inside of mounting groove has the erection column, and every the top of erection column is run through and has been seted up the through-hole, the mounting groove is passed to the bottom of erection column, just the support column has been cup jointed on the outer wall that the erection column passed mounting groove one end, the beneficial effects of the utility model are that: through all installing a erection column in every mounting groove in the circuit board main part for there is certain clearance in the circuit board main part between the casing of installation back and mounted position, thereby make the heat of circuit board bottom can discharge, simultaneously, can be through mount installation heat dissipation fan between the support column, the heat dissipation fan can assist the emission to the heat, can effectually dispel the heat to the circuit board, thereby avoid the circuit board to be in under the high temperature environment for a long time and lead to the problem that circuit board life shortens.
Description
Technical Field
The utility model relates to a dust collecting circuit board technical field specifically is an integrated circuit board with quick heat radiation structure.
Background
The integrated circuit board is manufactured by a semiconductor manufacturing process, a plurality of transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, and the components are combined into a complete electronic circuit by a multilayer wiring or tunnel wiring method.
Its surface mounting's of integrated circuit board in the use electrical component can produce a large amount of heats at the during operation, however because current integrated circuit board is most when the installation directly passes the mounting hole of its top four corners department through the screw and is connected with the casing, lead to the inseparable casing with mounted position in bottom of circuit board to laminate for the heat of circuit board can't be discharged, and the circuit board is arranged in the environment of high temperature for a long time, can lead to the life of circuit board to shorten greatly.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an integrated circuit board with quick heat radiation structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an integrated circuit board with quick heat radiation structure, includes circuit board main part, the four corners department at circuit board main part top all runs through and has seted up the mounting groove, every the inside of mounting groove is pegged graft and is had the erection column, and every the top of erection column runs through and has seted up the through-hole, the mounting groove is passed to the bottom of erection column, just the erection column has cup jointed the support column, adjacent two on passing the outer wall of mounting groove one end equal fixedly connected with support frame on the outer wall of the adjacent one side of support column.
Preferably, the top of the mounting column is fixedly sleeved with a hoop.
Preferably, a fixing frame is arranged between two adjacent supporting frames, and a heat dissipation fan is fixedly installed inside the fixing frame.
Preferably, the outer walls at the two ends of the fixing frame are fixedly connected with clamping blocks, one end, far away from the supporting column, of the supporting frame is provided with a clamping groove matched with the clamping blocks, and the clamping blocks are inserted into the clamping grooves in a sliding mode.
Preferably, the heat dissipation fan is electrically connected with an external power supply.
Compared with the prior art, the beneficial effects of the utility model are that: through all installing a erection column in every mounting groove in the circuit board main part for there is certain clearance in the circuit board main part between the casing of installation back and mounted position, thereby make the heat of circuit board bottom can discharge, simultaneously, can be through mount installation heat dissipation fan between the support column, the heat dissipation fan can assist the emission to the heat, can effectually dispel the heat to the circuit board, thereby avoid the circuit board to be in under the high temperature environment for a long time and lead to the problem that circuit board life shortens.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of the present invention;
FIG. 3 is a split view of the present invention;
fig. 4 is a schematic structural view of the middle support column of the present invention.
In the figure: 1. a circuit board main body; 2. mounting grooves; 3. mounting a column; 4. a hoop; 5. a support pillar; 6. a support frame; 7. a card slot; 8. a fixed mount; 9. a heat dissipation fan; 10. and (6) clamping blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides an integrated circuit board with quick heat radiation structure, includes circuit board main part 1, the four corners department at 1 top of circuit board main part all runs through and has seted up mounting groove 2, every the inside of mounting groove 2 is pegged graft and is had erection column 3, and every the top of erection column 3 runs through and has seted up the through-hole, mounting groove 2 is passed to the bottom of erection column 3, just erection column 3 has cup jointed support column 5, adjacent two on passing the outer wall of 2 one ends of mounting groove equal fixedly connected with support frame 6 on the outer wall of the adjacent one side of support column 5.
The top of erection column 3 is fixed to be cup jointed hoop 4, and hoop 4 can effectually avoid erection column 3 and circuit board main part 1 to separate.
Two adjacent be provided with mount 8 between the support frame 6, the inside fixed mounting of mount 8 has heat dissipation fan 9, and heat dissipation fan 9 can assist the heat dissipation to circuit board main part 1.
The outer walls of the two ends of the fixing frame 8 are fixedly connected with fixture blocks 10, one end, far away from the supporting column 5, of the supporting frame 6 is provided with a clamping groove 7 matched with the fixture blocks 10, the fixture blocks 10 are inserted into the clamping groove 7 in a sliding mode, and the fixing frame 8 can be conveniently and fast installed between the supporting column 5 in the clamping groove 7 in the inserting mode of the fixture blocks 10.
The heat dissipation fan 9 is electrically connected with an external power supply, so that the heat dissipation fan 9 can be effectively started.
It is specific, all insert erection column 3 in mounting groove 2 of 1 top four corners department of circuit board main part, and lock erection column 3 through hoop 4, thereby avoid erection column 3 and circuit board main part 1 to drop, support column 5 is cup jointed in the one end that erection column 3 passed circuit board main part 1, the rethread bolt passes erection column 3 and support column 5 and is connected with the casing, make circuit board main part 1 have certain clearance after the installation between the casing of mounted position, thereby make the heat of circuit board bottom can discharge, through 8 installation heat dissipation fans 9 of mount 8 between support column 3, heat dissipation fans 9 can assist the heat to discharge, can effectually dispel the heat to the circuit board, thereby avoid the circuit board to be in under the high temperature environment for a long time and lead to the problem that circuit board life shortens.
In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides an integrated circuit board with quick heat radiation structure, its characterized in that, includes circuit board main part (1), the four corners department at circuit board main part (1) top all runs through and has seted up mounting groove (2), every the inside of mounting groove (2) is pegged graft and is had erection column (3), and every the top of erection column (3) is run through and has been seted up the through-hole, mounting groove (2) are passed to the bottom of erection column (3), just support column (5), adjacent two have cup jointed on the outer wall that erection column (3) passed mounting groove (2) one end equal fixedly connected with support frame (6) on the outer wall of the adjacent one side of support column (5).
2. The integrated circuit board with the rapid heat dissipation structure of claim 1, wherein: and the top of the mounting column (3) is fixedly sleeved with a hoop (4).
3. The integrated circuit board with the rapid heat dissipation structure of claim 1, wherein: two adjacent are provided with mount (8) between support frame (6), the inside fixed mounting of mount (8) has heat dissipation fan (9).
4. The integrated circuit board with the rapid heat dissipation structure of claim 3, wherein: the supporting frame is characterized in that clamping blocks (10) are fixedly connected to the outer walls of the two ends of the fixing frame (8), one end, far away from the supporting column (5), of the supporting frame (6) corresponds to the clamping blocks (10) and is provided with clamping grooves (7) matched with the clamping blocks (10), and the clamping blocks (10) are inserted into the clamping grooves (7) in a sliding mode.
5. The integrated circuit board with the rapid heat dissipation structure of claim 3, wherein: the heat dissipation fan (9) is electrically connected with an external power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222739244.4U CN218831094U (en) | 2022-10-18 | 2022-10-18 | Integrated circuit board with quick heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222739244.4U CN218831094U (en) | 2022-10-18 | 2022-10-18 | Integrated circuit board with quick heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218831094U true CN218831094U (en) | 2023-04-07 |
Family
ID=87251839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222739244.4U Active CN218831094U (en) | 2022-10-18 | 2022-10-18 | Integrated circuit board with quick heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218831094U (en) |
-
2022
- 2022-10-18 CN CN202222739244.4U patent/CN218831094U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |