CN218767212U

CN218767212U - Integrated circuit packaging test device

Info

Publication number: CN218767212U
Application number: CN202223137729.2U
Authority: CN
Inventors: 严传滨
Original assignee: Shenzhen Konasan Electronic Co ltd
Current assignee: Shenzhen Konasan Electronic Co ltd
Priority date: 2022-11-25
Filing date: 2022-11-25
Publication date: 2023-03-28
Anticipated expiration: 2032-11-25

Abstract

The utility model relates to an integrated circuit technical field just discloses an integrated circuit package testing arrangement, including test platform and mounting panel, test platform's lower extreme fixedly connected with base, the mounting panel is located test platform's top, mounting panel lower extreme fixedly connected with connecting plate, the lower extreme of mounting panel is located the avris fixedly connected with division board of connecting plate. This integrated circuit encapsulates testing arrangement, interval through a plurality of division boards and connecting plate formation, make things convenient for integrated circuit participate in put into the interval, be convenient for to integrated circuit's location, utilize reset spring's elasticity simultaneously, carry on spacingly to electrically conductive briquetting, thereby integrated circuit participate in get into between the division board when, electrically conductive briquetting laminates with participating in each other, be convenient for to integrated circuit's test, and it is rotatory to utilize driving motor to drive the transfer line, thereby drive two movable block synchronous motion, conveniently adjust the position of both sides mounting panel, the different integrated circuit of adaptation, and the practicality is improved.

Description

Integrated circuit packaging test device

Technical Field

The utility model relates to an integrated circuit technical field specifically is an integrated circuit encapsulates testing arrangement.

Background

An integrated circuit is a miniature electronic device or component, and is made up through such technological steps as interconnection of transistor, resistor, capacitor and inductor and wiring in a circuit on a small semiconductor wafer or medium substrate, and packaging in a tube.

The search (CN 217112615U) discloses an integrated circuit packaging testing device, which mainly relates to the technical field of integrated circuit production. The utility model provides an integrated circuit encapsulation testing arrangement, includes the pedestal, the top surface of pedestal is seted up and is passed through the groove, the several recess is seted up respectively on the upper portion of passing through the groove both sides, the bottom surface of recess is fixed mounting conducting strip respectively, the lower part in the recess inner wall outside is respectively through the articulated clamp plate of connecting of torsional spring, the both sides of pedestal are equipped with the torsion mechanism that can drive corresponding clamp plate upset respectively. The beneficial effects of the utility model reside in that: this device can realize fixing the integrated circuit stitch through the mutually supporting between conducting strip and the clamp plate when using, and easy operation convenient to use is convenient to the fixed of integrated circuit stitch through conducting strip and clamp plate convenience.

When the existing integrated circuit packaging test device is used, pins of an integrated circuit and a tool need to be mutually butted for carrying out power-on test, so that the operation is complicated, and the working efficiency is low.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides an integrated circuit encapsulates testing arrangement to the current integrated circuit that proposes in solving above-mentioned background art when using, need participate in and the mutual butt joint of frock with integrated circuit, carries out the circular telegram test, leads to operating comparatively loaded down with trivial details, the lower problem of work efficiency.

(II) technical scheme

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides an integrated circuit encapsulates testing arrangement, includes test platform and mounting panel, test platform's lower extreme fixedly connected with base, the mounting panel is located test platform's top, mounting panel lower extreme fixedly connected with connecting plate, the lower extreme of mounting panel is located the avris fixedly connected with division board of connecting plate, be provided with the clamp plate subassembly on the mounting panel, mounting panel avris fixedly connected with baffle, test platform's inboard is provided with adjusting part.

Preferably, the side of the surface of the base is provided with fixing holes, the fixing holes are distributed at equal intervals, and the base is conveniently installed and fixed through the fixing holes.

Preferably, the mounting panel is provided with two about test platform's vertical central line symmetry, bilateral symmetry is provided with two around the connecting plate is located the mounting panel, the division board is equidistant distribution, and through the interval that a plurality of division boards and connecting plate formed, the interval is put into to convenient integrated circuit's participating in, is convenient for to integrated circuit's location.

Preferably, the clamp plate assembly is equidistant distribution, just clamp plate assembly and connecting plate, the mutual adaptation of division board, the clamp plate assembly includes locating hole, guide bar, stopper, reset spring and electrically conductive briquetting, the locating hole has been seted up on the surface of mounting panel, sliding connection has the guide bar in the locating hole, the upper end of guide bar extends to the top fixedly connected with stopper of mounting panel, the lower extreme of guide bar extends to the electrically conductive briquetting of below fixedly connected with of mounting panel, reset spring has been cup jointed in the outside of guide bar, reset spring's upper and lower both ends respectively with mounting panel, electrically conductive briquetting fixed connection, utilize reset spring's elasticity, carry on spacingly to electrically conductive briquetting to when participating in between the entering division board of integrated circuit, electrically conductive briquetting and participate in mutual laminating, the convenience is to integrated circuit's test.

Preferably, the adjusting assemblies are arranged on the front side and the rear side of the testing platform, each adjusting assembly comprises a driving motor, a transmission rod, a moving block and a sliding groove, the driving motor is fixedly mounted at the left end of the inner side of the testing platform, the output end of the driving motor is fixedly connected with the transmission rod, the moving block is arranged on the surface of the transmission rod, the sliding grooves are formed in the left side and the right side of the surface of the testing platform, the integrated circuit can be conveniently clamped, and fixation is achieved.

Preferably, one end of the transmission rod, which is far away from the driving motor, is rotatably connected with the test platform through a bearing, a first thread groove and a second thread groove are respectively formed in the left side and the right side of the surface of the transmission rod, two movable blocks are symmetrically arranged and are respectively in threaded connection with the first thread groove and the second thread groove, the upper ends of the movable blocks extend to the outer side of the sliding groove and are fixedly connected with the connecting plate, the transmission rod is driven to rotate through the driving motor, so that the two movable blocks are driven to synchronously move, the positions of the mounting plates on the two sides can be conveniently adjusted, and the integrated circuits are adaptive to different integrated circuits.

Compared with the prior art, the utility model provides an integrated circuit encapsulates testing arrangement possesses following beneficial effect:

1. this integrated circuit encapsulates testing arrangement, through the interval that a plurality of division boards and connecting plate formed, makes things convenient for integrated circuit's participating in to put into the interval, is convenient for to integrated circuit's location, utilizes reset spring's elasticity simultaneously, carries on spacingly to electrically conductive briquetting to integrated circuit participate in get into between the division board when, electrically conductive briquetting with participate in and laminate each other, be convenient for to integrated circuit's test.

2. This integrated circuit encapsulates testing arrangement utilizes driving motor to drive the transfer line rotation to drive two movable blocks synchronous motion, the position of convenient adjustment both sides mounting panel, the different integrated circuit of adaptation has improved the practicality.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic side view of the mounting plate of the present invention;

FIG. 3 is a schematic view of a partial three-dimensional structure of the conductive pressing block of the present invention;

fig. 4 is a schematic diagram of the cross-sectional structure of the testing platform of the present invention.

In the figure: 1. a test platform; 2. a base; 21. a fixing hole; 3. mounting a plate; 4. a connecting plate; 5. a partition plate; 6. a platen assembly; 61. positioning holes; 62. a guide bar; 63. a limiting block; 64. a return spring; 65. a conductive compact; 7. a baffle plate; 8. an adjustment assembly; 81. a drive motor; 82. a transmission rod; 821. a first thread groove; 822. a second thread groove; 83. a moving block; 84. a chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: an integrated circuit packaging test device comprises a test platform 1 and a mounting plate 3, wherein the lower end of the test platform 1 is fixedly connected with a base 2, fixing holes 21 are formed in the side edge of the surface of the base 2, the fixing holes 21 are distributed at equal intervals, the mounting plate 3 is positioned above the test platform 1, the lower end of the mounting plate 3 is fixedly connected with a connecting plate 4, the lower end of the mounting plate 3 is positioned on the side edge of the connecting plate 4 and is fixedly connected with a partition plate 5, the mounting plate 3 is symmetrically provided with two parts about the vertical central line of the test platform 1, the connecting plate 4 is symmetrically provided with two parts at the front side and the rear side of the mounting plate 3, the partition plates 5 are distributed at equal intervals, and the pins of an integrated circuit can be conveniently placed into the intervals so as to be positioned;

the mounting plate 3 is provided with a pressing plate assembly 6, the pressing plate assembly 6 is distributed at equal intervals, the pressing plate assembly 6, the connecting plate 4 and the partition plate 5 are matched with each other, the pressing plate assembly 6 comprises a positioning hole 61, a guide rod 62, a limiting block 63, a reset spring 64 and a conductive pressing block 65, the surface of the mounting plate 3 is provided with the positioning hole 61, the positioning hole 61 is connected with the guide rod 62 in the positioning hole 61 in a sliding manner, the upper end of the guide rod 62 extends to the upper side of the mounting plate 3 and is fixedly connected with the limiting block 63, the lower end of the guide rod 62 extends to the lower side of the mounting plate 3 and is fixedly connected with the conductive pressing block 65, the reset spring 64 is sleeved on the outer side of the guide rod 62, the upper end and the lower end of the reset spring 64 are respectively fixedly connected with the mounting plate 3 and the conductive pressing block 65, the conductive pressing block 65 is limited by the elasticity of the reset spring 64, and therefore when pins of the integrated circuit enter between the partition plates 5, the conductive pressing block 65 and the pins are mutually attached to facilitate the test of the integrated circuit;

the inboard fixedly connected with baffle 7 of mounting panel 3 avris, testing platform 1's inboard is provided with adjusting part 8, adjusting part 8 is located testing platform 1's front and back both sides and is provided with two, adjusting part 8 includes driving motor 81, transfer line 82, movable block 83 and spout 84, testing platform 1 inboard left end fixed mounting has driving motor 81, driving motor 81's output fixedly connected with transfer line 82, the surface of transfer line 82 is provided with movable block 83, spout 84 has all been seted up to the left and right sides on testing platform 1 surface, driving motor 81's one end and testing platform 1 are kept away from to transfer line 82 pass through the bearing rotation and are connected, first thread groove 821 and second thread groove 822 have been seted up respectively to the left and right sides on transfer line 82 surface, the movable block 83 symmetry is provided with two, and two movable blocks 83 respectively with first thread groove 821, second thread groove 822 threaded connection, the upper end of movable block 83 extends to the outside and connecting plate 4 fixed connection of spout 84, utilize driving motor 81 to drive driving motor 82 to rotate the transfer line, thereby drive two movable block 83 synchronous motion, conveniently adjust the position of both sides mounting panel 3, the different integrated circuit of adaptation, the practicality has been improved.

The working principle is as follows: firstly, when using, place integrated circuit on test platform 1, and with one side of integrated circuit and the mutual adaptation of mounting panel 3, make one side participate in getting into between the division board 5, and the interval that forms through a plurality of division boards 5 and connecting plate 4, make things convenient for integrated circuit to participate in putting into the interval, be convenient for the location to integrated circuit, and utilize reset spring 64's elasticity, it is spacing to carry out electrically conductive briquetting 65, thereby when integrated circuit participates in getting into between the division board 5, electrically conductive briquetting 65 is participated in and is laminated each other, be convenient for the test to integrated circuit, utilize driving motor 81 to drive transfer line 82 at last and rotate, thereby drive two movable block 83 synchronous motion, conveniently adjust the position of both sides mounting panel 3, the integrated circuit that the adaptation is different, the practicality has been improved, be convenient for the centre gripping of integrated circuit is fixed, integrated circuit fixes the back, electrically conductive briquetting 65 circular telegram, realize the test to integrated circuit.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An integrated circuit package testing device comprises a testing platform (1) and a mounting plate (3), and is characterized in that: lower extreme fixedly connected with base (2) of test platform (1), mounting panel (3) are located the top of test platform (1), mounting panel (3) lower extreme fixedly connected with connecting plate (4), the lower extreme of mounting panel (3) is located avris fixedly connected with division board (5) of connecting plate (4), be provided with clamp plate subassembly (6) on mounting panel (3), mounting panel (3) avris fixedly connected with baffle (7), the inboard of test platform (1) is provided with adjusting part (8).

2. The integrated circuit package testing device of claim 1, wherein: fixing holes (21) are formed in the side edge of the surface of the base (2), and the fixing holes (21) are distributed at equal intervals.

3. The integrated circuit package testing device of claim 1, wherein: the mounting panel (3) are provided with two about the vertical centerline symmetry of test platform (1), the bilateral symmetry is provided with two around connecting plate (4) are located mounting panel (3), division board (5) are equidistant distribution.

4. The integrated circuit package testing device of claim 1, wherein: the utility model discloses a mounting panel, including clamp plate subassembly (6), locating hole (61), guide bar (62), stopper (63), reset spring (64) and electrically conductive briquetting (65), clamp plate subassembly (6) are equidistant distribution, just clamp plate subassembly (6) and connecting plate (4), division board (5) mutual adaptation, locating hole (61) have been seted up on the surface of mounting panel (3), sliding connection has guide bar (62) in locating hole (61), the upper end of guide bar (62) extends to top fixedly connected with stopper (63) of mounting panel (3), the lower extreme of guide bar (62) extends to the electrically conductive briquetting (65) of below fixedly connected with of mounting panel (3), reset spring (64) have been cup jointed in the outside of guide bar (62), the upper and lower both ends of reset spring (64) respectively with mounting panel (3), electrically conductive briquetting (65) fixed connection.

5. The integrated circuit package testing device of claim 1, wherein: the testing device is characterized in that two adjusting components (8) are arranged on the front side and the rear side of the testing platform (1), each adjusting component (8) comprises a driving motor (81), a transmission rod (82), a moving block (83) and a sliding groove (84), the driving motor (81) is fixedly mounted at the left end of the inner side of the testing platform (1), the transmission rod (82) is fixedly connected to the output end of the driving motor (81), the moving block (83) is arranged on the surface of the transmission rod (82), and the sliding grooves (84) are formed in the left side and the right side of the surface of the testing platform (1).

6. The integrated circuit package testing device of claim 5, wherein: one end, far away from a driving motor (81), of the transmission rod (82) is rotatably connected with the testing platform (1) through a bearing, a first thread groove (821) and a second thread groove (822) are formed in the left side and the right side of the surface of the transmission rod (82) respectively, two moving blocks (83) are symmetrically arranged, the two moving blocks (83) are in threaded connection with the first thread groove (821) and the second thread groove (822) respectively, and the upper ends of the moving blocks (83) extend to the outer side of the sliding groove (84) and are fixedly connected with the connecting plate (4).