CN218767196U

CN218767196U - Semiconductor testing mechanism

Info

Publication number: CN218767196U
Application number: CN202222484867.1U
Authority: CN
Inventors: 丘劭晖; 蔡庆鑫; 顾燕红
Original assignee: Zhejiang Qingxin Technology Co ltd
Current assignee: Zhejiang Qingxin Technology Co ltd
Priority date: 2022-09-19
Filing date: 2022-09-19
Publication date: 2023-03-28
Anticipated expiration: 2032-09-19

Abstract

The utility model provides a semiconductor testing mechanism, including the module base, be provided with on the module base and place the seat, can dismantle the location fastener that is provided with and is used for fixing a position the semiconductor on placing the seat, a serial communication port, the horizontal slip is provided with two test needle bases on the module base, and two test needle bases place a symmetrical arrangement relatively, all install on the test needle base and be used for the test needle that switches on with the semiconductor side in the location fastener, the drive structure that enables two test needle bases and be close to each other or keep away from each other has on the module base.

Description

Semiconductor testing mechanism

Technical Field

The utility model belongs to the technical field of the semiconductor, a accredited testing organization is related to, especially a semiconductor accredited testing organization.

Background

A semiconductor test station (circuit) is a mechanism for contacting pins or pads of semiconductor components through test pins to connect them to a test in a test circuit.

The existing detection station is often fixed, for example, the semiconductor test module in patent No. 202122614778X contacts the lower surface of the semiconductor component to access the circuit by pressing down the semiconductor component, however, the contact mode has poor contact and inaccurate contact due to the small contact surface and the fixed test needle.

The pads on the side surfaces of the semiconductor components such as the chip capacitors and the chip resistors are exposed, and the conductive area on the side surfaces of the semiconductor components greatly exceeds that of the lower surface, so that a semiconductor testing mechanism can be designed, and the testing needles are utilized to contact the semiconductor components from the two side surfaces so as to solve the problem of poor contact of a testing station.

Disclosure of Invention

The utility model aims at having the above-mentioned problem to current technique, provided a semiconductor test mechanism.

The purpose of the utility model can be realized by the following technical proposal: the utility model provides a semiconductor testing mechanism, includes the module base, be provided with on the module base and place the seat, can dismantle on placing the seat and be provided with the location fastener that is used for fixing a position the semiconductor, its characterized in that, module base horizontal slip is provided with two test needle bases, and two test needle bases place a symmetrical arrangement relatively, all install on the test needle base and be used for the test needle that switches on with the semiconductor side in the location fastener, the drive structure that enables two test needle bases and be close to each other or keep away from each other has on the module base.

The driving structure comprises a guide rail and a driving block, the guide rail is horizontally fixed on the module base, sliding blocks are connected to two ends of the guide rail in a sliding mode, the testing needle base is connected with the sliding blocks through a connecting seat, guide wheels are installed on the connecting seat, the driving block is connected to the module base through a pushing piece capable of enabling the driving block to move up and down, the inclined plane of the driving block is connected with the two guide wheels, two spring supports are installed on the module base, and a reset spring is installed between each spring support and the connecting seat.

The driving block is a conical cylinder or an isosceles trapezoid block.

The pushing piece is a cylinder or an electric push rod.

The module comprises a module base and is characterized in that a connecting column is arranged on the module base, the connecting column is connected with a stand column in a sliding mode, a plurality of first strip-shaped holes are formed in the stand column, a plurality of first threaded holes are formed in the connecting column, bolts are arranged in the first strip-shaped holes and the first threaded holes in the first strip-shaped holes in a penetrating mode and are connected with the stand column and the connecting column, a first adjusting bolt is connected to the connecting column through a vertical thread, and the end portion of the first adjusting bolt abuts against the stand column.

And the connecting column is also provided with a pressing sheet for assisting in pressing the upright post.

A plurality of second bar-shaped holes are formed in the testing needle base, a plurality of second threaded holes are formed in the connecting seat, bolts are arranged in the second bar-shaped holes and the second threaded holes in a penetrating mode and are connected with the testing needle base and the connecting seat, the vertical threaded connection of the testing needle base is provided with a second adjusting bolt, and the end portion of the second adjusting bolt abuts against the connecting seat.

The test needle is arranged on the test needle base through the mounting block; a plurality of strip-shaped holes III are formed in the mounting block, a threaded hole III is formed in the testing needle base, bolts penetrate through the strip-shaped holes III and the threaded hole III, and the mounting block is connected with the testing needle base.

The test needle base is also provided with a stop block; the dog is provided with a plurality of four bar-shaped holes, the test needle base is provided with four threaded holes, bolts are arranged in the four bar-shaped holes and the four threaded holes in a penetrating manner, and the dog is connected with the test needle base

The testing needle base is provided with a guide groove for installation and guiding, and the third threaded hole and the fourth threaded hole are located in the guide groove.

The module is characterized in that the module base is further provided with a fixed block, the fixed block is provided with a guide block, the placing seat is vertically connected to the guide block in a sliding mode, and a buffer spring is further arranged between the placing seat and the fixed block.

The upright post is connected with the base through the supporting seat.

The base is a fine-tuning universal base.

Compared with the prior art, the semiconductor testing mechanism has the advantages that:

1. the testing needle is adopted to contact with the semiconductor from two sides, so that the contact surface is larger, and poor contact is not easy to occur;

2. the test needle can be adjusted in two directions, so that the test needle can be better aligned with a semiconductor;

3. the positioning clamping piece for testing the semiconductor can be replaced, and various semiconductors can be tested;

4. the test needle is easy to replace, so that the service life of the whole mechanism is long.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a schematic plan view of the present invention;

FIG. 3 is an exploded view of the present invention;

FIG. 4 is a schematic perspective view of the present invention with portions broken away;

FIG. 5 is a schematic plan view of the present invention with portions broken away;

FIG. 6 is an exploded view of the invention with portions broken away;

fig. 7 is a schematic perspective view of the placement seat of the present invention;

in the figure, 1, a base; 2. a supporting seat; 3. a sensor module; 4. tabletting; 5. connecting columns; 5a, a first threaded hole; 6. a pusher member; 7. a module base; 8. adjusting a first bolt; 9. a column; 9a, a strip-shaped hole I; 10. a drive block; 11. a fixed block; 12. a guide block; 13. a placing seat; 14. positioning the clamping piece; 15. adjusting a second bolt; 16. mounting blocks; 16a and a strip-shaped hole III; 17. a test pin; 18. a test pin base; 18a and a threaded hole III; 18b, a threaded hole IV; 18c, a strip-shaped hole II; 18d, a guide groove; 19. a connecting seat; 19a and a second threaded hole; 20. a return spring; 21. a guide rail; 22. a spring support; 23. a slider; 24. a guide wheel; 25. a stopper; 25a and a strip-shaped hole IV; 26. a buffer spring.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1-7, the semiconductor testing mechanism comprises a module base 7, a placing seat 13 is arranged on the module base 7, a positioning clamping piece 14 for positioning a semiconductor is detachably arranged on the placing seat 13, and the semiconductor is pressed downwards into the positioning clamping piece 14 by the prior art; by adopting the structure, the corresponding positioning clamping piece 14 can be replaced according to the requirement, so that various semiconductors can be tested; two testing needle bases 18 are horizontally and slidably arranged on the module base 7, the two testing needle bases 18 are symmetrically arranged relative to the placing base 13, testing needles 17 used for being communicated with the side faces of the semiconductors in the positioning clamping pieces 14 are mounted on the testing needle bases 18, and in the embodiment, the existing structure is adopted for connecting the testing needles 17 with an external testing structure; the module base 7 is provided with a driving structure which can enable the two test pin bases 18 to approach or depart from each other.

The driving structure comprises a guide rail 21 and a driving block 10, the guide rail 21 is horizontally fixed on a module base 7, two ends of the guide rail 21 are respectively connected with a sliding block 23 in a sliding manner, a testing needle base 18 is connected with the sliding blocks 23 through connecting seats 19, guide wheels 24 are respectively installed on the connecting seats 19, the driving block 10 is connected on the module base 7 through a pushing piece 6 capable of enabling the driving block to move up and down, the inclined surface of the driving block 10 is connected with the two guide wheels 24, two spring supports 22 are installed on the module base 7, and a return spring 20 is installed between each spring support 22 and the connecting seat 19; the driving block 10 is a tapered cylinder or an isosceles trapezoid block, and in this embodiment, the driving block 10 is a tapered cylinder; the pushing piece 6 is a cylinder or an electric push rod, and in the embodiment, the pushing piece 6 is a cylinder; by adopting the structure, before a semiconductor is put in, the driving block 10 is driven by the cylinder to move upwards, the two testing needle bases 18 are mutually far away under the matching of the inclined surface of the driving block 10 and the guide wheel 24, the semiconductor is pressed into the positioning clamping piece 14 from top to bottom, the driving block 10 is driven by the cylinder to reset downwards, the two testing needle bases 18 are mutually close under the action of the reset spring 20, and thus the testing needle 17 is in conductive communication with the connecting part of the side surfaces in the positioning clamping piece 14; that is, the contact area between the test pin 17 and the semiconductor is increased by opening and closing the contact side surface, so that the possibility of poor contact is greatly reduced.

The module base 7 is provided with a connecting column 5, the connecting column 5 is in sliding connection with an upright column 9, the upright column 9 is provided with a plurality of strip-shaped holes I9 a, the connecting column 5 is provided with a plurality of threaded holes I5 a, bolts penetrate through the strip-shaped holes I9 a and the threaded holes I5 a and connect the upright column 9 with the connecting column 5, the connecting column 5 is also vertically in threaded connection with an adjusting bolt I8, and the end part of the adjusting bolt I8 abuts against the upright column 9; the connecting column 5 is also provided with a pressing sheet 4 for assisting in pressing the upright post 9; the pressing sheet 4 presses the upright post 9 on the connecting post 5, and the adjusting bolt I8 can integrally control the Z-axis position of the module base 7; the upright post 9 is connected with the base 1 through the supporting seat 2; the base 1 is a fine adjustment universal base which is a commercially available existing product, and the base 1 can adjust the XY axis position of the module base 7; in conclusion, the module base 7 can be adjusted to a precise position; according to actual needs, the module base 7 and the connecting column 5 can adopt an integrated structure.

A plurality of strip-shaped holes II 18c are formed in the testing needle base 18, a plurality of threaded holes II 19a are formed in the connecting seat 19, bolts penetrate through the strip-shaped holes II 18c and the threaded holes II 19a and connect the testing needle base 18 with the connecting seat 19, the testing needle base 18 is vertically in threaded connection with an adjusting bolt II 15, and the end part of the adjusting bolt II 15 abuts against the connecting seat 19; the second strip-shaped hole 18c is matched with the second threaded hole 19a, and the Z-axis position of the test needle 17 can be adjusted under the action of the second adjusting bolt 15.

The test needle 17 is arranged on a test needle base 18 through a mounting block 16; a plurality of strip-shaped holes III 16a are formed in the mounting block 16, threaded holes III 18a are formed in the testing needle base 18, and bolts penetrate through the strip-shaped holes III 16a and the threaded holes III 18a to connect the mounting block 16 with the testing needle base 18; the position of the mounting block 16 can be adjusted through the matching of the strip-shaped hole three 16a and the threaded hole three 18a, so that the X-axis position of the test needle 17 can be adjusted.

The test needle base 18 is also provided with a stop block 25; a plurality of strip-shaped holes four 25a are formed in the stop block 25, threaded holes four 18b are formed in the test needle base 18, and bolts penetrate through the strip-shaped holes four 25a and the threaded holes four 18b to connect the stop block 25 with the test needle base 18; after the position of the X axis of the mounting block 16 is adjusted, the stop 25 can mark the position of the testing needle 17, so that the next adjustment is facilitated.

The Z-axis position and the X-axis position of the test needle 17 can be accurately adjusted, and the test needle 17 is ensured to accurately contact with a semiconductor.

The test pin base 18 is provided with a guide groove 18d for mounting and guiding, and a threaded hole three 18a and a threaded hole four 18b are positioned in the guide groove 18 d.

Still install fixed block 11 on the module base 7, install guide block 12 on the fixed block 11, place the vertical sliding connection of seat 13 on guide block 12, place and still install buffer spring 26 between seat 13 and the fixed block 11, adopt this structure, when impressing the semiconductor downwards in the location fastener 14, play the buffering effect of removal, avoid the semiconductor impaired.

According to actual needs, the sensor module 3 is also arranged in the prior art, and whether the base 1 is in place or not can be determined through the sensor module 3.

In this embodiment, a semiconductor is simply referred to as a semiconductor device.

The above components are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experiments.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims

1. The utility model provides a semiconductor testing mechanism, includes module base (7), be provided with on module base (7) and place seat (13), it can dismantle on seat (13) and be provided with location fastener (14) that are used for fixing a position the semiconductor to place, a serial communication port, module base (7) are improved level and are slided and are provided with two test needle bases (18), and two test needle bases (18) place seat (13) symmetrical arrangement relatively, all install on test needle base (18) and be used for with the test needle (17) that switch on of the semiconductor side in location fastener (14), the drive structure that enables two test needle bases (18) and be close to each other or keep away from each other has on module base (7).

2. The semiconductor testing mechanism according to claim 1, wherein the driving structure comprises a guide rail (21) and a driving block (10), the guide rail (21) is horizontally fixed on the module base (7), two ends of the guide rail (21) are both connected with sliding blocks (23) in a sliding manner, the testing needle base (18) is connected with the sliding blocks (23) through connecting seats (19), guide wheels (24) are mounted on the connecting seats (19), the driving block (10) is connected on the module base (7) through a pushing piece (6) capable of enabling the driving block to move up and down, an inclined surface of the driving block (10) is connected with the two guide wheels (24), two spring supports (22) are mounted on the module base (7), and a return spring (20) is mounted between the spring supports (22) and the connecting seats (19).

3. The semiconductor testing mechanism according to claim 1, wherein the module base (7) is provided with a connecting column (5), the connecting column (5) is connected with the stand column (9) in a sliding manner, the stand column (9) is provided with a plurality of first bar-shaped holes (9 a), the connecting column (5) is provided with a plurality of first screw holes (5 a), bolts are arranged in the first bar-shaped holes (9 a) and the first screw holes (5 a) in a penetrating manner and connect the stand column (9) with the connecting column (5), the connecting column (5) is further vertically connected with a first adjusting bolt (8) in a threaded manner, and the end part of the first adjusting bolt (8) abuts against the stand column (9).

4. A semiconductor test mechanism according to claim 3, characterized in that the connecting column (5) is further provided with a pressing piece (4) for assisting in pressing the upright (9).

5. The semiconductor testing mechanism according to claim 2, wherein the testing pin base (18) is provided with a plurality of second bar-shaped holes (18 c), the connecting seat (19) is provided with a plurality of second threaded holes (19 a), bolts penetrate through the second bar-shaped holes (18 c) and the second threaded holes (19 a) and connect the testing pin base (18) with the connecting seat (19), the testing pin base (18) is vertically and threadedly connected with the second adjusting bolt (15), and the end of the second adjusting bolt (15) abuts against the connecting seat (19).

6. A semiconductor test mechanism as claimed in claim 1, characterized in that the test pins (17) are mounted on a test pin base (18) by means of mounting blocks (16); a plurality of strip-shaped holes III (16 a) are formed in the mounting block (16), a threaded hole III (18 a) is formed in the testing needle base (18), bolts penetrate through the strip-shaped holes III (16 a) and the threaded hole III (18 a), and the mounting block (16) is connected with the testing needle base (18).

7. The semiconductor test mechanism of claim 6, wherein a stopper (25) is further mounted on the test pin base (18); a plurality of strip-shaped holes four (25 a) are formed in the check block (25), threaded holes four (18 b) are formed in the test needle base (18), bolts are arranged in the strip-shaped holes four (25 a) and the threaded holes four (18 b) in a penetrating mode, and the check block (25) is connected with the test needle base (18).

8. The semiconductor test mechanism according to claim 7, wherein the test pin base (18) is provided with a guide groove (18 d) for mounting and guiding, and the threaded hole three (18 a) and the threaded hole four (18 b) are positioned in the guide groove (18 d).

9. The semiconductor testing mechanism according to claim 1, wherein a fixing block (11) is further installed on the module base (7), a guide block (12) is installed on the fixing block (11), the placing seat (13) is vertically and slidably connected to the guide block (12), and a buffer spring (26) is further installed between the placing seat (13) and the fixing block (11).

10. A semiconductor test mechanism according to claim 3, characterized in that the column (9) is connected to the base (1) via a support (2); the base (1) is a fine-tuning universal base.