CN218694955U

CN218694955U - Positioning system for laser etching machine, laser etching machine and laser etching system

Info

Publication number: CN218694955U
Application number: CN202222723441.7U
Authority: CN
Inventors: 高杨
Original assignee: Deyi Technology Intelligence Shenzhen Co ltd
Current assignee: Deyi Technology Intelligence Shenzhen Co ltd
Priority date: 2022-10-14
Filing date: 2022-10-14
Publication date: 2023-03-24
Anticipated expiration: 2032-10-14

Abstract

The utility model discloses a positioning system, laser etching machine and laser etching system for laser etching machine, positioning system for laser etching machine, including transport unit and CCD unit, be equipped with the positioning unit on the transport unit, the CCD unit sets up on the side of transport unit, and the positioning unit is connected with CCD unit communication and is used for adjusting the position of laser tool. The laser etching machine comprises the positioning system for the laser etching machine. The laser etching system comprises a plurality of laser etching machines. The positioning system for the laser etching machine realizes quick positioning through linkage of the CCD unit and the positioning unit, the CCD unit shoots to determine the actual position of the positioning structure, the position of the positioning structure is also the position of the laser jig and the material, the position is compared with the position required by processing and fed back to the positioning unit, and the positioning unit moves quickly to adjust the position of the laser jig so as to achieve the effect of quick positioning.

Description

Positioning system for laser etching machine, laser etching machine and laser etching system

Technical Field

The utility model belongs to the technical field of laser beam machining equipment, concretely relates to laser etching machine positioning system, laser etching machine and laser etching system.

Background

The laser etching is a technology for etching a micro groove with the width of 10-505 mu m and the depth of 5-1001 mu m on the surface of a part by adopting a high-energy pulse laser beam so as to improve the surface lubrication characteristic of a material.

Due to the high precision requirement of the laser etching, in order to ensure the processing precision and accuracy, the laser etching needs to be accurately positioned to ensure that the material is positioned at the correct processing position. When the laser etching is used for processing the micro-wire cable, the diameter of the micro-wire cable is very small, and a new problem is provided for the quality of the laser etching.

When the existing laser etching equipment is used for processing a micro-wire cable, in order to ensure the processing precision, the positioning precision is improved by adopting a method of positioning for multiple times, but the time of processing for a single time is increased by positioning for multiple times, and the processing efficiency is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a positioning system, laser etching machine and laser etching system for laser etching machine for solve the above-mentioned problem that exists among the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

in a first aspect, the utility model provides a positioning system for laser etching machine, including carrying unit and CCD unit, the carrying unit is provided with a positioning unit, the CCD unit is arranged on the side edge of the carrying unit, the positioning unit is in communication connection with the CCD unit and is used for adjusting the position of the laser jig;

the carrying unit comprises a bottom rail, a connecting block arranged on the bottom rail in a sliding mode and a first drag chain arranged on the side face of the bottom rail, and the first drag chain is connected with the connecting block through a sheet metal part;

the positioning unit comprises a Y-axis adjusting module, an adjusting bottom plate, an XY leveling surface platform and an adjusting module bottom plate which are sequentially arranged from bottom to top, the adjusting module bottom plate is used for fixing the laser jig, and the bottom rail and the Y-axis adjusting module are respectively in communication connection with the CCD unit.

In a possible design, adjust the module bottom plate including fixing hypoplastron, the first stand of a plurality of and the upper plate on XY leveling level platform, first stand is used for connecting hypoplastron and upper plate, and the top surface of upper plate is equipped with the standing groove of adaptation in laser tool, and one side of standing groove is equipped with the fixed plate, and the bottom surface of upper plate is equipped with down the mounting, and the side of upper plate is equipped with the mounting, and lower mounting and last mounting cooperation are so that laser tool supports tight fixed plate.

In a possible design, the lower fixing part comprises a first air cylinder fixed on the bottom surface of the upper plate, a push plate connected with the first air cylinder and a push block fixed on the push plate, the push block is provided with two push blocks which are symmetrically arranged at two ends of the push plate, and correspondingly, the upper plate is provided with a push groove adaptive to the push block.

In one possible design, the upper fixing member includes a second cylinder fixed to a side surface of the upper plate and a pressing block connected to the second cylinder, and accordingly, the fixing plate is configured in an L-shape, in which one side surface is adapted to be engaged with the pushing block and the other side surface is adapted to be engaged with the pressing block.

In one possible embodiment, the fastening plate is L-shaped, wherein one side is intended to abut against the lower fastening element and the other side is intended to abut against the upper fastening element.

In a possible design, the CCD unit comprises a lower stand column, an upper stand column and a CCD camera, the lower stand column is fixed on the side edge of the carrying unit, a first fine adjustment platform is arranged between the lower stand column and the upper stand column, the CCD camera is connected with the upper stand column through a second fine adjustment platform, a light source sheet metal part is arranged on the side surface of the upper stand column, and the light source sheet metal part comprises a main body part fixed on the upper stand column and an aperture extending to the position below a lens of the CCD camera.

In a second aspect, the present invention provides a laser etching machine, including the positioning system for laser etching machine.

The third aspect, the utility model provides a laser etching system, it is including a plurality of laser etching machine, a plurality of laser etching machine link to each other in proper order in order to process the different positions of material respectively.

Has the advantages that:

the positioning system for the laser etching machine realizes quick positioning through linkage of the CCD unit and the positioning unit, the CCD unit shoots to determine the actual position of the positioning structure, the position of the positioning structure is also the position of the laser jig and the material, the position is compared with the position required by processing and fed back to the positioning unit, and the positioning unit moves quickly to adjust the position of the laser jig so as to achieve the effect of quick positioning. The CCD unit can carry out comparison for many times, and different parts of the positioning structure are compared each time to obtain more accurate moving parameters, so that the moving precision of the positioning unit is improved, the positioning error is reduced, and the positioning precision is improved.

Drawings

FIG. 1 is a schematic structural diagram of a laser etching machine with a door panel removed.

Fig. 2 is a schematic structural view of the carrying unit.

Fig. 3 is a schematic structural diagram of the positioning unit.

Fig. 4 is a schematic bottom view of the bottom plate of the adjusting module.

Fig. 5 is a schematic top view of the bottom plate of the adjusting module.

Fig. 6 is a schematic structural diagram of the CCD unit.

Fig. 7 is a schematic structural diagram of a laser etching unit.

Fig. 8 is a schematic structural view of the lifting mechanism.

Fig. 9 is a schematic structural view of the discharging unit.

Fig. 10 is a schematic view of the structure of the discharging unit when the rotary cylinder is provided.

Fig. 11 is a schematic structural view of the front surface of the laser jig.

Fig. 12 is a schematic structural view of the back surface of the laser jig.

Fig. 13 is a schematic view of the positioning structure and the processing tank.

Fig. 14 is a schematic structural view of the back surface of the laser jig after the pressing plate and the partition plate are removed.

Fig. 15 is a schematic structural view of a laser etcher.

In the figure:

1. a material conveying unit; 101. feeding a material belt; 102. a return zone; 103. a support frame; 2. a discharging unit; 21. a third column; 22. blanking a main board; 23. a second guide rail; 24. unloading the material; 201. a second tow chain; 202. drag the link joint; 203. a rodless cylinder; 204. a sliding connection block; 205. moving the daughter board; 206. a third guide rail; 207. a discharging mounting plate; 208. a discharge cylinder; 209. mounting blocks; 210. a clamping jaw cylinder; 211. a jaw body; 212. a rotating cylinder; 213. a linear module; 214. A servo motor; 3. a carrying unit; 301. a bottom rail; 302. connecting blocks; 303. a first tow chain; 304. a sheet metal part; 4. A CCD unit; 401. a lower upright post; 402. an upper upright post; 403. a CCD camera; 404. a first fine tuning platform; 405. a second fine tuning platform; 406. a light source sheet metal part; 5. a laser etching unit; 51. a mounting frame; 52. a laser machine body; 53. a laser marking module; 54. a smoke guide member; 501. an upper mounting plate; 502. a lower mounting plate; 503. a second upright post; 504. mounting a bottom plate; 505. a side plate; 506. a lead screw; 507. rotating the handle; 508. a first guide rail; 509. a connecting plate; 510. a fixed seat; 511. A handle; 6. a laser jig; 61. a first plate body; 62. a second plate body; 63. unloading the material block; 64. positioning a plate; 65. an adjustment mechanism; 66. pressing a plate; 67. a partition plate; 601. a discharge opening; 602. a weight port; 603. a material coiling hole; 604. lightening holes; 605. Positioning holes; 606. machining a hole; 607. positioning a groove; 608. processing a tank; 609. a first stopper; 610. a second limiting block; 611. positioning blocks; 612. an adjusting block; 613. a cover plate; 7. a positioning unit; 71. a Y-axis adjusting module; 72. adjusting the bottom plate; 73. an XY leveling surface platform; 74. adjusting the module bottom plate; 741. a lower plate; 742. a first upright post; 743. an upper plate; 75. A lower fixing member; 76. an upper fixing member; 701. a placement groove; 702. a fixing plate; 703. a first cylinder; 704. pushing a plate; 705. a push block; 706. a second cylinder; 707. briquetting; 8. a lower frame; 9. and (4) mounting the hood.

Detailed Description

Example (b):

as shown in fig. 1-15, a laser etching machine includes a material transporting unit 1, an unloading unit 2, a carrying unit 3, a CCD unit 4 and a laser etching unit 5, wherein the material transporting unit 1 is provided with a laser jig 6 for carrying a material, the material transporting unit 1 and the carrying unit 3 are arranged in parallel, the unloading unit 2 is used for carrying the laser jig 6 from one of the material transporting unit 1 and the carrying unit 3 to the other, and the laser jig 6 is provided with a positioning structure; the carrying unit 3 is provided with a positioning unit 7, the CCD unit 4 and the laser etching unit 5 are sequentially arranged along the carrying unit 3, the positioning unit 7 is in communication connection with the CCD unit 4 and is used for adjusting the position of the laser jig 6, and the laser etching unit 5 is used for processing materials.

The laser etching machine utilizes the linkage of CCD unit 4 and positioning unit 7 to realize quick location, and CCD unit 4 shoots in order to confirm the actual position of location structure, and the position of location structure is also laser tool 6 and material position, compares this position and the required position of processing and feeds back to positioning unit 7, and positioning unit 7 moves fast in order to adjust the position of laser tool 6 to reach the effect of quick location. The CCD unit 4 can perform comparison for multiple times, and different parts of the positioning structure are compared each time to obtain more accurate moving parameters, so that the moving precision of the positioning unit 7 is improved, the positioning error is reduced, and the positioning precision is improved.

Meanwhile, the material conveying unit 1 is communicated with the outside and the laser etching machine and is used for conveying the laser jig 6, and particularly comprises the steps of inputting unprocessed materials into the laser etching machine and outputting processed materials out of the laser etching machine. The processing of the materials is realized at the position of the carrying unit 3, the materials are carried in and carried out through the material carrying unit 1, and the discharging unit 2 is used for carrying the laser jig 6 so as to realize the transfer of the material position. CCD unit 4 and laser etching unit 5 set up and set up in proper order at the transport unit 3 side to processing after location earlier ensures processingquality.

During operation, unprocessed materials are placed on the laser jig 6, the laser jig 6 is placed on the material conveying unit 1 at intervals, the materials are input into the laser etching machine one by one, and gaps among the laser jigs 6 are convenient to work in the discharging unit 2. The laser jig 6 transported to the discharging unit 2 is transported by the discharging unit 2, that is, the laser jig 6 is transported from the material transporting unit 1 to the transporting unit 3, specifically, is placed on the positioning unit 7. The positioning unit 7 moves under the driving of the carrying unit 3, the laser jig 6 moves along with the positioning unit 7 and sequentially passes through the CCD unit 4 and the laser etching unit 5, the laser jig 6 is positioned when moving to the lower part of the CCD unit 4, and the laser jig 6 is processed when moving to the lower part of the laser etching unit 5. And after the processing is finished, the laser etching machine is conveyed through the unloading unit 2, and the laser jigs 6 are conveyed to the conveying unit 1 from the conveying unit 3 and then output one by one.

In this embodiment, the carrying unit 3 comprises a bottom rail 301, a connecting block 302 slidably disposed on the bottom rail 301, and a first drag chain 303 disposed on the side of the bottom rail 301, wherein the first drag chain 303 is connected to the connecting block 302 through a sheet metal component 304. Based on the above design, the bottom rail 301 is slidably connected to the lower side of the connection block 302, and the upper side of the connection block 302 is configured as a plane for mounting the positioning unit 7. The first tow chain 303 serves to restrain and protect cables, wires, air pressure pipes and/or oil pressure pipes, and to facilitate the rotation and movement of the above-described pipes.

Optionally, the bottom rail 301 includes a bottom rail 301 body and a guide rail suspended above the bottom rail 301 body, the connection block 302 is sleeved on the guide rail, and the bottom rail 301 body is configured to drive the connection block 302 to reciprocate along the guide rail. Based on this, the stability of the connection between the bottom rail 301 and the connection block 302 is increased by means of the sleeving connection.

In this embodiment, the positioning unit 7 includes a Y-axis adjusting module 71, an adjusting bottom plate 72, an XY leveling surface platform 73, and an adjusting module bottom plate 74, which are sequentially disposed from bottom to top, where the adjusting module bottom plate 74 is used to fix the laser fixture 6, and the bottom rail 301 and the Y-axis adjusting module 71 are respectively connected to the CCD unit 4 in a communication manner. Based on above-mentioned technical scheme, make end rail 301 orientation be the X axle direction, Y axle adjusting module 71 moving direction perpendicular to X axle direction, Y axle adjusting module 71 moving direction is the Y axle direction promptly, laser jig 6 places on adjusting module bottom plate 74, adjust module bottom plate 74 and remove along the X axle direction under end rail 301 drive, remove along the Y axle direction under Y axle adjusting module 71 drive, the two can work alone, also can work jointly, the mode of regulation has been enriched, help improving the efficiency and the quality of regulation. The adjusting bottom plate 72 is used for separating the Y-axis adjusting module 71 from the XY leveling surface platform 73, the XY leveling surface platform 73 is used for adjusting the parallelism of the positioning unit 7, and the laser jig 6 is ensured to be in a parallel state.

During positioning, the laser jig 6 moves to the position below the CCD unit 4 along the X-axis direction, the CCD unit 4 photographs and compares the photographs, and the adjustment information is transmitted to the carrying unit 3 and the positioning unit 7, respectively, so that the bottom rail 301 and the Y-axis adjustment module 71 move, respectively, to complete the adjustment of the position. Meanwhile, as shown in fig. 2 and 3, manual adjustment rods are respectively arranged on the Y-axis adjustment module 71 and the XY-leveling surface platform 73, so as to facilitate manual adjustment, and the adjustment modes are more various.

Optionally, a high-precision linear motor is arranged on the bottom rail 301, and the Y-axis adjusting module 71 selects a jun river delicacy machine positioning module to control the positioning precision within 0.001mm, and the two modules are fast in operation speed, so that the purposes of high positioning precision and fast positioning are achieved.

As shown in fig. 3-5, the adjusting module bottom plate 74 includes a lower plate 741 fixed on the XY leveling surface platform 73, a plurality of first uprights 742 and an upper plate 743, the first uprights 742 are used for connecting the lower plate 741 and the upper plate 743, a placing groove 701 adapted to the laser fixture 6 is disposed on the top surface of the upper plate 743, a fixing plate 702 is disposed on one side of the placing groove 701, a lower fixing member 75 is disposed on the bottom surface of the upper plate 743, an upper fixing member 76 is disposed on the side surface of the upper plate 743, and the lower fixing member 75 and the upper fixing member 76 cooperate to enable the laser fixture 6 to abut against the fixing plate 702.

Based on the above design scheme, the adjusting module bottom plate 74 is used for placing the laser jig 6, i.e., the placing groove 701 adapted to the laser jig 6 is provided on the upper plate 743. In order to ensure that the laser jig 6 can be accurately placed in the placing groove 701, the placing groove 701 is enlarged by 1-2 times in an equal ratio relative to the laser jig 6, a certain gap is formed between the laser jig 6 and the placing groove 701, the laser jig 6 is easy to move due to inertia in the positioning process, and therefore the laser jig 6 needs to be clamped, namely, a fixing plate 702 serving as a reference is arranged on the side edge of the placing groove 701, and a lower fixing piece 75 and an upper fixing piece 76 are respectively arranged on the upper plate 743 to apply thrust from two different directions so as to tightly press the laser jig 6 against the fixing plate 702. Therefore, a gap is formed between the upper plate 743 and the lower plate 741 through the first upright 742 for installing the lower fixing piece 75, so that the top surface of the upper plate 743 has no shielding object, and the laser jig 6 is ensured to smoothly enter the placing groove 701.

In a possible implementation manner, the lower fixing member 75 includes a first cylinder 703 fixed on the bottom surface of the upper plate 743, a push plate 704 connected to the first cylinder 703, and a push block 705 fixed on the push plate 704, the push block 705 is provided with two push grooves symmetrically arranged at two ends of the push plate 704, and accordingly, the upper plate 743 is provided with a push groove adapted to the push block 705.

In a possible implementation, the upper fixing member 76 includes a second cylinder 706 fixed to a side of the upper plate 743 and a pressing block 707 connected to the second cylinder 706, and accordingly, the fixing plate 702 is configured in an L-shape, in which one side is configured to cooperate with the pushing block 705 and the other side is configured to cooperate with the pressing block 707.

Based on the above design, the lower fixture 75 and the upper fixture 76 have substantially the same structure, i.e. the cylinder is used as a driving member to drive the push plate 704 or the pressing block 707 to reciprocate, so as to achieve the compression. As shown in fig. 4 and 5, the difference between them is that: the contact part of the lower fixing member 75 and the laser jig 6 is located at the neck of the laser jig 6, so that two pushing blocks 705 are arranged to ensure stress balance, and the contact part of the upper fixing member 76 and the laser jig 6 is located at the side of the laser jig 6, so that a structure similar to the pushing blocks 705 is not required.

In this embodiment, the CCD (Charge Coupled Device) unit includes a lower column 401, an upper column 402 and a CCD camera 403, the lower column 401 is fixed at the side of the carrying unit 3, a first fine tuning platform 404 is disposed between the lower column 401 and the upper column 402, the CCD camera 403 is connected to the upper column 402 through a second fine tuning platform 405, a light source sheet metal part 406 is disposed on the side of the upper column 402, and the light source sheet metal part 406 includes a main body portion fixed on the upper column 402 and an aperture extending to the lower portion of the lens of the CCD camera 403.

Based on the above design, a first fine adjustment platform 404 is disposed between the lower column 401 and the upper column 402, and the first fine adjustment platform 404 preferably moves along the Y-axis direction to adjust the CCD camera 403 along the Y-axis direction. A second fine adjustment platform 405 is arranged between the upper upright post 402 and the CCD camera 403, and the second fine adjustment platform 405 is used for adjusting the height of the CCD camera 403. Based on this, the photographing position and the photographing quality of the CCD camera 403 are adjusted. Meanwhile, supplementary lighting is performed by the aid of the light source sheet metal part 406, and imaging quality of the CCD camera 403 is further improved.

Optionally, manual adjustment rods are also provided on the first fine adjustment platform 404 and the second fine adjustment platform 405, respectively, to facilitate manual adjustment. And first fine tuning stage 404 and second fine tuning stage 405 may be any suitable commercially available model.

The orientation of the CCD camera 403 may be set in advance, and photographing may be repeated during operation. When the orientation of the CCD camera 403 needs to be adjusted, at least one of the first fine adjustment stage 404 and the second fine adjustment stage 405 is activated to move the CCD camera 403.

In this embodiment, the laser etching unit 5 includes a mounting frame 51, a laser machine body 52 and a laser marking module 53, the mounting frame 51 is fixed on the side of the carrying unit 3, and the mounting frame 51 includes an upper mounting plate 501 and a lower mounting plate 502, the laser machine body 52 is fixed on the upper mounting plate 501, and the laser marking module 53 is connected with the laser machine body 52 and is fixed on the lower mounting plate 502.

Based on the above design scheme, the mounting frame 51 is used for mounting the laser machine body 52 and the laser marking module 53, and the laser machine is electrically connected to the control equipment to adjust the etching parameters. The laser marking module 53 may be of any suitable commercially available type. In a possible implementation manner, when each laser jig 6 passes through the laser etching unit 5, the laser etching unit 5 works twice, the first time is used for removing glue, and the second time is used for etching materials, so that adjacent micro cables are electrically connected.

As shown in fig. 7, the mounting frame 51 includes a plurality of second vertical columns 503 arranged in parallel with each other, a mounting bottom plate 504 fixed above the second vertical columns 503, and a side plate 505 fixed on the mounting bottom plate 504, wherein two side plates 505 are arranged oppositely, and the upper mounting plate 501 and the lower mounting plate 502 are located between the two side plates 505. Based on the above design scheme, the height of the bottom plate is raised by the plurality of second upright posts 503, a gap is formed by the two opposite side plates 505, and the upper mounting plate 501, the lower mounting plate 502, the laser machine body 52 and the laser marking module 53 are all mounted in the gap.

Optionally, a smoke guide piece 54 is arranged below the laser marking module 53, and smoke generated by laser processing is collected by the smoke guide piece 54, so that pollution is reduced, and the accuracy of subsequent processing is also guaranteed. Specifically, the smoke guiding member 54 includes a smoke receiving ring, a smoke guiding pipe and a storage bin which are connected in sequence, the smoke receiving ring is located below the laser marking module 53, the smoke guiding pipe extends to the lower mounting plate 502, and the storage bin is fixed on the lower mounting plate 502.

In a possible implementation manner, one of the side plates 505 is provided with a lifting mechanism, and the other side plate is provided with a driven structure, the lifting mechanism comprises a vertically arranged screw 506, a rotating handle 507 fixed at the upper end of the screw 506, first guide rails 508 positioned at two sides of the screw 506, and a connecting plate 509 for connecting the screw 506 and the first guide rails 508, wherein the screw 506 is positioned in the side plate 505, the upper part and the lower part of the screw 506 are respectively provided with a fixed seat 510, the connecting plate 509 extends out of the side plate 505 and is connected with the lower mounting plate 502, and a handle 511 for locking the screw 506 is arranged outside the side plate 505; accordingly, the side plate 505 is provided with a lifting groove adapted to a lifting mechanism or a driven structure.

Based on this, adjust the height of laser machine body 52 and laser marking module 53 through elevating system, the follower structure follow-up to make laser machine body 52 and laser marking module 53 wholly go up and down, guarantee that the sculpture is vertical and perpendicular the effect on the material with the laser, in order to guarantee that the processing position is correct.

Specifically, the side plate 505 is internally configured as a hollow structure for accommodating a lifting mechanism or a driven structure. For the lifting mechanism, the rotating handle 507 drives the screw 506 to rotate, the screw 506 is connected with a connecting plate 509 through threads, and the connecting plate 509 is lifted along the screw 506. Meanwhile, the connecting plate 509 is guided by the first guide rail 508, and the stable lifting is kept. The handle 511 is used for locking the lead screw 506 so as to keep the laser machine body 52 and the laser marking module 53 at a certain height, and the probability that the lead screw 506 descends due to the gravity of the laser machine body 52 and the laser marking module 53 is reduced. As can be readily appreciated, the handle 511 is threaded through the side plate 505 and is locked or moved away from the lead screw 506 by rotating the handle 511.

Correspondingly, the driven structure comprises a secondary first guide rail 508 and a secondary connecting plate 509, wherein the secondary first guide rail 508 is vertically arranged, one end of the secondary connecting plate 509 is slidably arranged on the primary guide rail 508, and the other end of the secondary connecting plate 509 is connected with the lower mounting plate 502. That is, the driven structure lacks a rotating handle 507 for input power and a lead screw 506 for transmission, compared to the elevating mechanism.

In this embodiment, the material transporting unit 1 includes a material loading belt 101 and a material return belt 102, a discharging position of the material loading belt 101 is parallel to and aligned with a feeding end of the material transporting unit 3, a code scanning unit is disposed at the discharging position of the material loading belt 101, and a feeding position of the material return belt 102 is parallel to and aligned with a discharging end of the material transporting unit 3. Based on the technical scheme, the material conveying unit 1 is divided into a feeding belt 101 and a return belt 102, wherein the feeding belt is used for inputting unprocessed materials, and the return belt is used for outputting processed materials. Sweep a yard unit and carry out the record to the material to the processing condition of convenient control material, optionally, sweep a yard unit and can choose for use arbitrary suitable unit on the market.

Since the material input and output are performed by the material feeding belt 101 and the material return belt 102, respectively, the discharging unit 2 is also divided into two parts, that is, the discharging unit 2 is provided with two parts, one of which is located between the discharging position of the material feeding belt 101 and the feeding end of the carrying unit 3, and the other is located between the feeding position of the material return belt 102 and the discharging end of the carrying unit 3.

Preferably, as shown in fig. 1, a support frame 103 is arranged below the upper material belt 101, the upper material belt 101 is fixed on the support frame 103 to be suspended, and the return belt 102 is arranged below the upper material belt 101 and passes through the support frame 103. Based on this, the utilization of the space in the vertical direction is realized through the support frame 103, which is beneficial to reducing the plane area occupied by the material conveying unit 1 and reducing the volume of the laser etching machine.

In this embodiment, the discharging unit 2 includes a plurality of third vertical columns 21, a discharging main plate 22 fixed above the third vertical columns 21, a second guide rail 23 fixed on a side surface of the discharging main plate 22, and a discharging member 24 slidably disposed on the second guide rail 23, wherein a second drag chain 201 is disposed on a top surface of the discharging main plate 22, the second drag chain 201 is connected to the discharging member 24 through a drag chain plate 202, and a rodless cylinder 203 parallel to the second guide rail 23 is disposed above the second guide rail 23.

Based on above-mentioned technical scheme, the height is raised through third stand 21 to the unit of unloading 2 to in snatching laser jig 6. The blanking main plate 22 is used for installing the second guide rail 23 and the second drag chain 201, and limits the sliding direction of the discharging member 24 to a certain extent. The second guide rail 23 drives the discharging member 24 to slide reciprocally along the second guide rail 23 by the rodless cylinder 203, thereby restricting the moving direction of the discharging member 24. The function of the second tow chain 201 is identical to that of the first tow chain 303, and will not be described in detail here.

When the laser tool lifting device works, one end of the second guide rail 23 is close to the material conveying unit 1, the other end of the second guide rail is close to the material conveying unit 3, the rodless cylinder 203 drives the unloading piece 24 to slide to one of the positions, and the unloading piece 24 can grab the laser tool 6 and has a lifting function, so that the laser tool 6 is separated from the material conveying unit 1 or the material conveying unit 3.

As shown in fig. 9 and 10, the discharging member 24 includes a sliding connection block 204 slidably disposed on the second guide rail 23, a movable sub-plate 205 fixedly connected to the sliding connection block 204, a sliding structure on the fixed movable sub-plate 205, and a clamping jaw connected to the sliding structure;

the sliding structure comprises a third guide rail 206 fixed on the side surface of the movable sub-plate 205, a discharging mounting plate 207 arranged on the third guide rail 206 in a sliding manner and a discharging cylinder 208 for driving the discharging mounting plate 207 to move, wherein 1-2 third guide rails 206 are arranged, the top surface of the movable sub-plate 205 is provided with a mounting block 209, and the discharging cylinder 208 and the drag chain plate 202 are both fixedly connected with the mounting block 209;

the clamping jaw comprises a clamping jaw air cylinder 210 fixed below the discharging mounting plate 207 and a clamping jaw body 211 connected with the output end of the clamping jaw air cylinder 210, or a rotary air cylinder 212 is arranged between the discharging mounting plate 207 and the clamping jaw air cylinder 210, the top surface of the rotary air cylinder 212 is connected with the discharging mounting plate 207, and the bottom surface of the rotary air cylinder 212 is connected with the clamping jaw air cylinder 210 through the rotary mounting plate.

Based on above-mentioned design, sliding connection piece 204 is used for connecting second guide rail 23, and removal daughter board 205 is used for installing sliding structure and clamping jaw, and sliding structure is used for realizing elevating function, and the clamping jaw is used for realizing snatching the function. Specifically, the sliding structure is powered by the discharge cylinder 208 to drive the discharge mounting plate 207 to rise and fall along the third rail 206; meanwhile, the discharging mounting plate 207 is connected with the clamping jaw, so that the lifting of the clamping jaw is realized. The clamping jaw comprises a clamping jaw air cylinder 210 and a clamping jaw body 211, the clamping jaw bodies 211 are driven to mutually approach or depart from each other through the clamping jaw air cylinder 210, and when the clamping jaw bodies 211 approach each other, the clamping jaw grabs the laser jig 6; when the clamping jaw bodies 211 are far away from each other, the clamping jaws release the laser jig 6.

Further, the gripper body 211 is provided with a rotation function through the rotation cylinder 212 for adjusting the orientation of the laser jig 6. However, the weight of the clamping jaw is increased by the arrangement of the rotary air cylinder 212, so when the rotary air cylinder 212 is arranged on the clamping jaw, the linear module 213 is used for replacing the discharging air cylinder 208, the servo motor 214 is arranged on the side surface of the linear module 213, correspondingly, two third guide rails 206 are arranged, and one third guide rail 206 is respectively arranged above and below the discharging air cylinder 208. Based on this, the linear module 213 with better load-bearing performance is selected as the component, and the two third guide rails 206 also contribute to increase the load-bearing capacity, so as to ensure the stability of the operation of the discharging unit 2.

In this embodiment, the laser jig 6 includes a first plate body 61 and a second plate body 62 that are detachably connected, a discharge hole 601 and a plurality of weight holes 602 that are uniformly distributed around the discharge hole 601 are formed in the top surface of the first plate body 61, and a material-checking hole 603 that is communicated with the discharge hole 601 is formed in the bottom surface of the first plate body 61;

one end of the second plate body 62, which is adjacent to the first plate body 61, is provided with a lightening hole 604, one end of the second plate body 62, which is far away from the first plate body 61, is provided with a positioning hole 605, two sides of the second plate body 62 are respectively provided with a discharging block 63 which is adapted to the discharging unit 2, and the discharging block 63 is provided with a cross slot for discharging; the bottom surface of the second plate 62 is detachably provided with a positioning plate 64, and the positioning plate 64 is provided with a plurality of positioning structures and a plurality of processing grooves 608 for placing materials.

For the processing of the fine cable, a special laser jig 6 is proposed herein, the laser jig 6 includes a detachable first plate 61 and a detachable second plate 62, the former is used for receiving the fine cable without the need of processing, and the latter is used for fixing the portion of the fine cable to be processed. With the aid of the positioning structure, the positioning structure can be used for adjusting the position of the laser jig 6 and limiting and guiding the movement line of the etching laser so as to prevent other parts from being damaged. The machining groove 608 is used for placing the micro wires to prevent the micro wires from falling off, and the arrangement of the micro wires is guided by the shape of the machining groove 608 to prevent the micro wires from being machined by laser without machining the part.

Meanwhile, a weight port 602 is formed in the first plate body 61, a weight block can be detachably arranged on the weight port 602, and the weight block is matched with a lightening hole 604 in the second plate body 62, so that the flatness of the laser jig 6 can be adjusted, the laser for processing the laser jig 6 perpendicular to the laser can be guaranteed, and the quality of laser processing can be improved.

In addition, the second plate body 62 is provided with a discharge hole 601, the diameter of the discharge hole 601 can be used for workers to insert 1-3 fingers, the workers can conveniently take and place the laser jig 6, the discharge hole 601 is communicated with the material tray hole 603, the fingers of the workers can extend into the material tray hole 603, fine cables can be detached in a finger ejecting mode, and the use convenience is improved. The unloading block 63 is matched with the unloading unit 2 for use so as to facilitate clamping of the clamping jaw to the laser jig 6, and in order to guarantee stability of clamping of the clamping jaw, a cross groove is formed in the unloading block 63 so as to increase contact area of the unloading block and the clamping jaw, and meanwhile, the probability of dropping is further avoided through butt of the groove wall.

In this embodiment, the positioning structure includes a plurality of processing holes 606 and a plurality of positioning grooves 607, one end of each positioning groove 607 is communicated with one processing hole 606, the other end extends to the processing groove 608, the corresponding positioning groove 607 and the processing hole 606 constitute a positioning group, and two sides of each processing groove 608 are respectively provided with one positioning group. Based on the above design scheme, the positioning groove 607 cooperates with the CCD unit 4 to perform positioning, that is, at least a part of the positioning groove 607 is used as a reference, the CCD unit 4 compares the actual position of the positioning groove 607 with the preset position after taking a picture to obtain the adjustment parameter, and the adjustment parameter is transmitted to the carrying unit 3 and the positioning unit 7 to realize the position adjustment. The machining hole 606 is used for machining to facilitate laser injection, and may be used to cooperate with the positioning groove 607 for positioning.

Alternatively, as shown in fig. 13, six machining holes 606 and six positioning grooves 607 are provided, respectively, to constitute six positioning groups. And every three positioning groups are arranged on the same row at intervals so as to arrange the positioning groups into two rows. Correspondingly, three processing tanks 608 are provided, and the adjacent processing tanks 608 are parallel to each other, and two positioning sets are provided on two sides of each processing tank 608.

In this embodiment, the bottom surface of the first plate 61 and the bottom surface of the second plate 62 are respectively provided with a slider for connecting the material conveying unit 1 to raise the processing tank 608. On this basis, because the material is placed on the bottom surface of laser tool 6, so raise through the slider, further ensure the integrality of material to avoid the material wearing and tearing, with play the guard action to the material.

In this embodiment, an adjusting mechanism 65 for adjusting the position of the center of gravity is disposed on the bottom surface of the second plate 62, the adjusting mechanism 65 is located outside the lightening hole 604, a pressing plate 66 is disposed between the adjusting mechanism 65 and the positioning plate 64, one end of the pressing plate 66 is a rotating end connected to the second plate 62, and the other end of the pressing plate 66 is a clamping end clamped to the second plate 62; based on above-mentioned design, adjust through adjustment mechanism 65 the focus of laser tool 6 for cooperate weight port 602, provide abundant regulation mode, help improving the effect of adjusting.

The pressing plate 66 is used for pressing the fine cables, namely the fine cables fall under the action of gravity after being separated from the processing groove 608, the fine cables are located on the bottom surface of the laser jig 6 and are easily damaged in the movement process of the laser jig 6, so that the fine cables are pressed through the pressing plate 66, the fine cables passing through the pressing plate 66 are placed in the material coiling hole 603, and the fine cables are clamped in the material coiling hole 603 after being coiled so as to be protected.

In the embodiment, the table body part, the positioning structure and the processing groove 608 which are protruded downwards on the positioning plate 64 are all located on the table body part, correspondingly, the partition plate 67 is arranged below the positioning plate 64, the partition plate 67 is provided with a sleeving hole which is matched with the table body part, and the partition plate 67 extends from the positioning plate 64 to the lightening hole 604 and covers part of the lightening hole 604. Based on above-mentioned design, baffle 67 is used for compressing tightly locating plate 64, and covers the protection of locating plate 64 through baffle 67 and realize locating plate 64, helps reducing the wearing and tearing of locating plate 64 to improve locating plate 64's life.

In a possible implementation manner, the adjusting mechanism 65 includes a first limiting block 609, a second limiting block 610, a positioning block 611, an adjusting block 612, and a cover plate 613, the first limiting block 609 and the second limiting block 610 are oppositely disposed to enclose an adjusting groove, the positioning block 611 is fixed at one end of the adjusting groove and penetrates through the first limiting block 609, the adjusting block 612 is slidably disposed on the adjusting groove, one side of the cover plate 613 is detachably connected to the second limiting block 610, and the other side of the cover plate 613 extends to the positioning block 611 and the adjusting block 612 to limit the minimum distance between the two.

Based on the above design scheme, the positioning block 611 is clamped on the first limiting block 609 and keeps relatively fixed, and the adjusting block 612 is slidably disposed in the adjusting groove. The cover plate 613 limits the minimum distance between the positioning block 611 and the adjusting block 612, and the cover plate 613 shields part of the adjusting groove, and at least part of the adjusting block 612 is always overlapped on the cover plate 613, so as to prevent the adjusting block 612 from falling out of the adjusting groove. During adjustment, the adjusting block 612 is not partially blocked by the cover plate 613, and the adjusting block 612 is pulled by the portion to move. Optionally, the portion of the adjusting block 612 not covered by the cover plate 613 is provided with an external boss for the convenience of the worker.

In this embodiment, the laser etching machine further includes a lower frame 8 and an upper cover 9, the material transporting unit 1, the unloading unit 2, the carrying unit 3, the CCD unit 4, and the laser etching unit 5 are all installed on the top surface of the lower frame 8, the upper cover 9 covers the lower frame 8, and an entrance and an exit adapted to the material transporting unit 1, an observation port for observation, and a plurality of operating devices are provided on the side surface of the upper cover 9.

Based on the above design scheme, the operation equipment is respectively used for controlling the work of the material conveying unit 1, the material discharging unit 2, the carrying unit 3, the CCD unit 4 and the laser etching unit 5, and the work of each part inside can be controlled by the outer side of the laser etching machine by a worker. Operating devices include, but are not limited to, buttons, knobs, and touch screens.

Go up still to be equipped with the door plant towards the equidirectional on the aircraft bonnet 9, on the door plant is rotatable to be set up aircraft bonnet 9, when the door plant was opened, the staff can directly look over, operation, maintenance work etc. has improved the convenience of using.

This embodiment introduces a laser etching system on the basis of laser etching machine, laser etching system include a plurality of laser etching machine, a plurality of laser etching machine link to each other in proper order in order to process different positions of material respectively. When the material has a plurality of processing positions, each laser etching machine is used for processing one of the processing positions, and the plurality of laser etching machines are matched to complete the processing of all the processing positions, so that the processing efficiency is effectively improved.

Finally, it should be noted that: the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The positioning system for the laser etching machine is characterized by comprising a carrying unit (3) and a CCD unit (4), wherein the carrying unit (3) is provided with a positioning unit (7), the CCD unit (4) is arranged on the side edge of the carrying unit (3), and the positioning unit (7) is in communication connection with the CCD unit (4) and is used for adjusting the position of a laser jig (6);

the carrying unit (3) comprises a bottom rail (301), a connecting block (302) arranged on the bottom rail (301) in a sliding mode and a first drag chain (303) arranged on the side face of the bottom rail (301), and the first drag chain (303) is connected with the connecting block (302) through a sheet metal part (304);

the positioning unit (7) comprises a Y-axis adjusting module (71), an adjusting bottom plate (72), an XY leveling surface platform (73) and an adjusting module bottom plate (74), the Y-axis adjusting module (71), the adjusting bottom plate (72), the XY leveling surface platform and the adjusting module bottom plate (74) are sequentially arranged from bottom to top, the adjusting module bottom plate (74) is used for fixing the laser jig (6), and the bottom rail (301) and the Y-axis adjusting module (71) are respectively in communication connection with the CCD unit (4).

2. The positioning system for the laser etching machine according to claim 1, wherein the adjusting module base plate (74) comprises a lower plate (741) fixed on the XY leveling surface platform (73), a plurality of first pillars (742) and an upper plate (743), the first pillars (742) are used for connecting the lower plate (741) and the upper plate (743), a placing groove (701) adapted to the laser jig (6) is formed in the top surface of the upper plate (743), a fixing plate (702) is arranged on one side of the placing groove (701), a lower fixing member (75) is arranged on the bottom surface of the upper plate (743), an upper fixing member (76) is arranged on the side surface of the upper plate (743), and the lower fixing member (75) and the upper fixing member (76) are matched to enable the laser jig (6) to abut against the fixing plate (702).

3. The positioning system for the laser etching machine according to claim 2, wherein the lower fixture (75) comprises a first cylinder (703) fixed on the bottom surface of the upper plate (743), a push plate (704) connected with the first cylinder (703), and a push block (705) fixed on the push plate (704), the push block (705) is provided with two push grooves symmetrically arranged at two ends of the push plate (704), and correspondingly, the upper plate (743) is provided with a push groove adapted to the push block (705).

4. The positioning system for a laser etcher as set forth in claim 2, wherein the upper fixture (76) includes a second cylinder (706) fixed to a side of the upper plate (743) and a pressing block (707) connected to the second cylinder (706), and accordingly, the fixing plate (702) is configured in an L-shape in which one side is adapted to be engaged with the push block (705) and the other side is adapted to be engaged with the pressing block (707).

5. The positioning system for a laser etching machine according to any one of claims 2 to 4, wherein the fixing plate (702) is configured in an L-shape, one side of which is used for abutting against the lower fixing member (75) and the other side of which is used for abutting against the upper fixing member (76).

6. The positioning system for the laser etching machine as claimed in claim 1, wherein the CCD unit (4) comprises a lower upright (401), an upper upright (402) and a CCD camera (403), the lower upright (401) is fixed to the side of the carrying unit (3), a first fine-tuning platform (404) is arranged between the lower upright (401) and the upper upright (402), the CCD camera (403) is connected with the upper upright (402) through a second fine-tuning platform (405), a light source sheet metal part (406) is arranged on the side surface of the upper upright (402), and the light source sheet metal part (406) comprises a main body part fixed on the upper upright (402) and an aperture extending to the lower part of a lens of the CCD camera (403).

7. A laser etching machine, characterized by comprising the positioning system for a laser etching machine according to any one of claims 1 to 6.

8. A laser etching system, comprising a plurality of laser etching machines according to claim 7, wherein the plurality of laser etching machines are connected in sequence to process different parts of the material respectively.