CN218691801U - A chip welding machine - Google Patents

Abstract

The utility model relates to the technical field of welding machines, and discloses a chip welding machine, comprising a base, the top surface of the base is fixedly installed with a placing table, the top surface of the base is fixedly connected with a main frame, and the main frame The machine head and the welding head are arranged inside, and the two ends of the top surface of the base are provided with movable clamping grooves, and the inside of the movable clamping groove is provided with cleaning components, and both ends of the bottom surface of the base are fixedly installed with fixed mounting brackets. The inside of the fixed installation plate is provided with a collection component; by setting the cleaning component, by holding the handle and dragging the movable clamping column and the equipment rack to one side, the plate brush at the bottom of the equipment rack can be driven to place the platform and the top of the chip. Clean the solder joints on the top surface of the chip, so as to realize the purpose of cleaning the solder joints on the top surface of the placement platform and the chip conveniently and quickly, and avoid the problems of slow cleaning speed and poor effect of manual use of brushes.

Description

A chip welding machine

technical field

The utility model relates to the technical field of welding machines, in particular to a chip welding machine.

Background technique

A chip is an integrated circuit, which is composed of a large number of transistors. With the continuous development of society, smart objects that can be seen everywhere in people's lives cannot be separated from the clamping of the chip, and the status of the chip is becoming more and more important. In the chip In the production and maintenance process of the chip, it is necessary to weld the chip, so the welding machine needs to be used, but there are still some problems in the use of the existing chip welding machine.

For example, most of the existing chip welding machines use tin soldering, and most of them are intelligent equipment. However, after the chip is soldered, the redundant solder joints need to be manually removed, and the removed solder joint debris will remain on the chip and place it. On the stage, the debris still needs to be cleaned. The existing cleaning methods are generally manual cleaning with a brush. On the one hand, the cleaning efficiency is not high, and on the other hand, the cleaning effect is not ideal.

Utility model content

The utility model provides a chip welding machine, which has the beneficial effect of being able to clean the solder joints on the placement table and the top surface of the chip conveniently and quickly, and solves the problems mentioned in the background technology above and avoids the cleaning speed of the existing manual use of brushes. Slow, poor performance issues.

In order to achieve the above object, the utility model provides the following technical solutions: a chip welding machine, including a base, the top surface of the base is fixedly installed with a placement table, the top surface of the base is fixedly connected with a main frame, and the main frame The inside of the base is provided with a machine head and a welding head. Both ends of the top surface of the base are provided with movable clamping grooves. The inside of the movable clamping groove is provided with cleaning components. Both ends of the bottom surface of the base are fixedly installed with fixed The mounting plate, the inside of the fixed mounting plate is provided with a collection assembly.

As an optional solution of the utility model, the cleaning assembly includes a movable clamping column, and the movable clamping column is movably clamped inside the movable clamping groove, and the top of the movable clamping column is fixedly equipped with a device frame, the bottom of the equipment frame is provided with a movable clamping plate, the bottom surface of the movable clamping plate is fixedly equipped with a scrub brush, both ends of the front surface of the equipment rack are fixedly equipped with handles, and the installation height of the scrub brush is low at the height of the stand.

As a preferred solution of the utility model, an equipment cavity is provided inside the equipment rack, and a fixed connecting column is fixedly installed on the inner top surface of the equipment cavity, and the internal movable clamping connection of the fixed connecting column is limited. column.

As a preferred solution of the present utility model, the lower end of the fixed connection column is fixedly connected with a spring, and the spring is arranged on the outside of the limit clamping column, and the lower end of the limit clamping column and the spring are both connected The top surface of the movable clamping plate is fixedly connected.

As a preferred solution of the present utility model, the collection assembly includes a collection box, the surfaces of both sides of the collection box are fixedly mounted with cross clamping plates, and the inner surface of the fixed installation plate is provided with cross clamping grooves. The opening size of the cross clamping groove is adapted to the setting size of the cross clamping plate, and the collection box is movably clamped on the inner side of the fixed installation plate through the cross clamping groove and the cross clamping plate.

As a preferred solution of the utility model, the front surface of the base is fixedly installed with a mounting column, and the outer surface of the mounting column is movably socketed with a movable socket ring, and the bottom end of the movable socket ring is fixedly connected with a limited A position baffle, one side surface of the limit baffle is attached to the money surface of the collection box.

As a preferred solution of the present invention, both ends of the bottom surface of the fixed mounting plate are provided with suction cups, and the suction cups are fixedly connected to the bottom surface of the fixed mounting plate.

As a preferred solution of the present invention, the outer surface of the handle is frosted, and the inner surface of the handle is provided with an anti-slip groove.

The utility model has the following beneficial effects:

1. The chip welding machine can drive the brush at the bottom of the equipment rack to clean the solder joints on the placement table and the top surface of the chip by setting the cleaning component and dragging the movable clamping column and the equipment rack to one side by holding the handle , thereby achieving the purpose of cleaning the solder joints on the placement table and the top surface of the chip conveniently and quickly, and avoiding the problems of slow cleaning speed and poor effect of manual use of brushes in the prior art.

2. In this chip welding machine, the collection box is pulled out from the bottom of the base by setting the collection component, and the collection box will not be overturned through the mutual engagement between the cross clamping board and the cross clamping groove, and finally the board brush will The solder joints on the top surface of the placement platform and the chip are cleaned to the inside of the collection box for unified collection, thereby achieving the purpose of uniformly collecting the cleaned solder joints and avoiding the difficulty of cleaning the solder joints directly to the ground in the prior art. cleaning problem.

Description of drawings

Figure 1 is a schematic diagram of the overall structure of the utility model.

Fig. 2 is a structural schematic diagram of the cleaning assembly of the present invention.

Fig. 3 is a schematic diagram of the front section structure of the equipment rack of the present invention.

Fig. 4 is a schematic diagram of the enlarged structure at A in Fig. 3 of the present utility model.

Fig. 5 is a schematic structural diagram of the collection assembly of the present invention.

Fig. 6 is a schematic diagram of the enlarged structure at B in Fig. 2 of the present utility model.

In the figure: 1. Base; 2. Placement platform; 3. Main frame; 4. Machine head; 5. Welding head; 6. Fixed mounting plate; 7. Suction cup; ;10. Equipment frame; 11. Movable clamping plate; 12. Brush; 13. Handle; 14. Equipment chamber; 15. Fixed connection column; 16. Limit clamping column; 17. Spring; 1. Cross clamping groove; 20. Cross clamping plate; 21. Mounting column; 22. Movable sleeve ring; 23. Limiting baffle.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Example:

Please refer to Figure 1-6, a chip welding machine, including a base 1, a placement table 2 is fixedly installed on the top surface of the base 1, a main frame 3 is fixedly connected to the top surface of the base 1, and a machine head 4 is arranged inside the main frame 3 With the welding head 5, both ends of the top surface of the base 1 are provided with movable snap-in slots 8, and the inside of the movable snap-in slots 8 is provided with cleaning components, and both ends of the bottom surface of the base 1 are fixedly installed with fixed mounting plates 6, fixedly installed The inside of the plate 6 is provided with a collecting assembly.

The cleaning assembly includes a movable clamping column 9, which is movably clamped in the inside of the movable clamping groove 8, an equipment rack 10 is fixedly installed on the top of the movable clamping column 9, and a movable clamping joint is arranged below the equipment rack 10. plate 11, the bottom surface of the movable clamping plate 11 is fixedly equipped with a scrub brush 12, both ends of the front surface of the equipment rack 10 are fixedly equipped with handles 13, and the setting height of the scrub brush 12 is lower than the height of the placement table 2; the interior of the equipment rack 10 is provided with There is an equipment cavity 14, and the inner top surface of the equipment cavity 14 is fixedly installed with a fixed connection column 15, and the internal activities of the fixed connection column 15 are clamped with a limited clamping column 16, and the lower end of the fixed connection column 15 is fixedly connected with a spring 17, and the spring 17 is arranged on the outer side of the limit clamping column 16, the lower end of the limit clamping column 16 and the spring 17 is fixedly connected with the top surface of the movable clamping plate 11, the outer surface of the handle 13 is a frosted surface, and the handle 13 The inner surface is provided with an anti-slip groove, and when the handle 13 is held with both hands and then dragged backward, the movable clamping column 9 will be moved in the direction of pulling in the movable clamping groove 8, and the equipment rack 10 can be moved along with the movable clamping groove 8. The movement of the post 9 moves, and finally the board brush 12 at the bottom of the equipment rack 10 contacts the top surface of the placement table 2 and the chip, and the solder joints removed from the placement table 2 and the top surface of the chip are removed. When the board brush 12 moves to the placement table After the top surface of the platform 2, the plate brush 12 can be placed on the top surface of the platform 2 through the contraction of the limit clamping column 16 to the inside of the fixed connecting column 15, and at the same time, under the reaction force of the spring 17, the plate brush 12 can be connected to the top surface of the platform 2. The top surface of the placing table 2 fits more tightly, thereby improving the effect of cleaning. Because the outer surface and the frosted surface of the handle 13 and the inner surface are provided with anti-slip grooves, it can prevent the gap between the palm and the handle 13 when holding the handle 13. If there is a problem of slipping in between, it is more convenient to hold the handle 13 to drag the movable clamping column 9 and the equipment rack 10.

Collection assembly comprises collection box 18, and the both sides surface of collection box 18 is all fixedly installed with cross clamping plate 20, and the inboard surface of fixed installation plate 6 is provided with cross clamping groove 19, and the opening dimension of cross clamping groove 19 is the same as that of cross clamping plate. The setting size of the connecting plate 20 is suitable, and the collection box 18 is movably clamped on the inner side of the fixed mounting plate 6 through the cross clamping groove 19 and the cross clamping plate 20, and the solder joints can be cleaned by the plate brush 12 through the set collecting assembly To the inside of the collection box 18 for unified collection, and after the collection is completed, because the collection box 18 is movably clamped on the inside of the fixed mounting plate 6 through the cross clamping groove 19 and the cross clamping plate 20, the collection box can be conveniently and quickly 18 is drawn out from the inboard of fixed mounting plate 6 and goes into unified cleaning.

The front surface of the base 1 is fixedly equipped with a mounting column 21, and the outer surface of the mounting column 21 is movably socketed with a movable socket ring 22, and the bottom end of the movable socket ring 22 is fixedly connected with a limit baffle 23, and the limit baffle 23 One side surface fits with the money surface of the collection box 18, and by rotating the limit baffle 23, when the limit baffle 23 rotates, the movable sleeve ring 22 is driven to rotate on the outer surface of the mounting column 21 until the limit stop When the plate 23 is parallel to the base 1 , the collection box 18 can be pulled out from the bottom of the base 1 , which plays a good role in limiting the collection box 18 .

Both ends of the bottom surface of the fixed mounting plate 6 are provided with suction cups 7, and the suction cups 7 are fixedly connected to the bottom surface of the fixed mounting plate 6. By setting the suction cups 7, when the device is placed as a whole, the suction cups 7 and the placement surface can be used to absorb and ensure the overall stability of the device. Stability in use.

Working principle: When in use, first place the chip to be soldered on the top surface of the placement table 2, then start the machine head 4, and the machine head 4 drives the welding head 5 to move to a suitable position for the chip placed on the top surface of the placement table 2 Carry out the welding operation. After the welding is completed, manually remove the redundant solder joints. The removed solder joints will stay on the top surface of the placement table 2 and the chip. At this time, just hold the handle 13 with both hands and drag it backward , it will drive the movable clamping column 9 to move in the direction of pulling in the inside of the movable clamping groove 8, and the equipment rack 10 can move along with the movement of the movable clamping column 9, and finally pass through the scrub brush 12 at the bottom of the equipment rack 10. Contacting the top surface of the placing table 2 and the chip, the solder joints removed on the placing table 2 and the top surface of the chip are removed, which greatly increases the cleaning efficiency and quality.

At the same time, through the fixed connecting column 15, the limit clamping column 16 and the spring 17, when the scrub brush 12 moves to the top surface of the placement table 2, the limit clamping column 16 shrinks to the inside of the fixed connecting column 15 to The scrub brush 12 can pass through the top surface of the placing platform 2, and under the reaction force of the spring 17, the scrub brush 12 can fit more closely with the top surface of the placing platform 2, thereby improving the cleaning effect.

When the board brush 12 cleans the solder joints on the placement table 2 and the top surface of the chip, by rotating the limit baffle 23, when the limit baffle 23 rotates, the movable sleeve ring 22 is driven to rotate on the outer surface of the mounting column 21 , until the limit baffle 23 is parallel to the base 1, the collection box 18 can be pulled out from the bottom of the base 1, and then the cross clamping plate 20 and the cross clamping groove 19 are locked together so that the collection box 18 There will be no overturning problem. Finally, the solder joints on the placement table 2 and the top surface of the chip are cleaned to the inside of the collection box 18 by the brush 12 for unified collection. When the interior of the collection box 18 is full, it is only necessary to pass the collection box 18 through The cross clamping plate 20 and the cross clamping groove 19 are taken out from the bottom of the base 1, and finally the solder joints inside the collection box 18 are dumped.

The above is only the preferred embodiment of the utility model, and it should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the utility model, some improvements and modifications can also be made. And retouching should also be regarded as the protection scope of the present utility model.

Claims (8)

1. The utility model provides a chip welding machine, includes base (1), the top surface fixed mounting of base (1) has places platform (2), the top surface fixedly connected with main frame (3) of base (1), the inside of main frame (3) is provided with aircraft nose (4) and soldered connection (5), its characterized in that: activity joint groove (8) have all been seted up at the top surface both ends of base (1), the inside in activity joint groove (8) is provided with cleans the subassembly, the equal fixed mounting in bottom surface both ends of base (1) has fixed mounting board (6), the inside of fixed mounting board (6) is provided with the collection subassembly.

2. The die bonder of claim 1, wherein: clean the subassembly and include activity joint post (9), activity joint post (9) activity joint is in the inside of activity joint groove (8), the top fixed mounting of activity joint post (9) has equipment rack (10), the below of equipment rack (10) is provided with activity joint board (11), the bottom surface fixed mounting of activity joint board (11) has scrubbing brush (12), the equal fixed mounting in front surface both ends of equipment rack (10) has handle (13), the setting height that highly is less than placing platform (2) of scrubbing brush (12).

3. The die bonder of claim 2, wherein: equipment chamber (14) have been seted up to the inside of equipment frame (10), the inside top surface fixed mounting in equipment chamber (14) has fixed connection post (15), the inside activity joint of fixed connection post (15) has spacing joint post (16).

4. The die bonder of claim 3, wherein: the lower end fixedly connected with spring (17) of fixed connection post (15), spring (17) set up in the outside of spacing joint post (16), the low side of spacing joint post (16) and spring (17) all with the top surface fixed connection of activity joint board (11).

5. A die bonder as claimed in claim 1, characterized in that: the collecting assembly comprises a collecting box (18), cross clamping plates (20) are fixedly mounted on the surfaces of the two sides of the collecting box (18), a cross clamping groove (19) is formed in the inner side surface of the fixed mounting plate (6), the size of the cross clamping groove (19) is matched with the size of the cross clamping plates (20), and the collecting box (18) is movably clamped on the inner side of the fixed mounting plate (6) through the cross clamping groove (19) and the cross clamping plates (20).

6. The die bonder of claim 1, wherein: the movable sleeve type collecting box is characterized in that a mounting column (21) is fixedly mounted on the front surface of the base (1), a movable sleeve connecting ring (22) is movably sleeved on the outer surface of the mounting column (21), a limiting baffle (23) is fixedly connected to the bottom end of the movable sleeve connecting ring (22), and the surface of one side of the limiting baffle (23) is attached to the surface of money of the collecting box (18).

7. The die bonder of claim 1, wherein: the bottom surface both ends of fixed mounting panel (6) all are provided with sucking disc (7), sucking disc (7) fixed connection is in the bottom surface of fixed mounting panel (6).

8. The die bonder of claim 2, wherein: the outer surface of the handle (13) is a frosted surface, and the inner surface of the handle (13) is provided with an anti-skidding groove.

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