CN218647952U - Film sticking device for welding strip and series welding machine - Google Patents
Film sticking device for welding strip and series welding machine Download PDFInfo
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- CN218647952U CN218647952U CN202222859874.5U CN202222859874U CN218647952U CN 218647952 U CN218647952 U CN 218647952U CN 202222859874 U CN202222859874 U CN 202222859874U CN 218647952 U CN218647952 U CN 218647952U
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- 238000003466 welding Methods 0.000 title claims abstract description 100
- 238000010438 heat treatment Methods 0.000 claims abstract description 78
- 239000012528 membrane Substances 0.000 claims abstract description 42
- 230000007246 mechanism Effects 0.000 claims description 70
- 229910000679 solder Inorganic materials 0.000 claims description 39
- 238000005520 cutting process Methods 0.000 claims description 29
- 238000001179 sorption measurement Methods 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 16
- 238000002788 crimping Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims 6
- 230000000694 effects Effects 0.000 abstract description 11
- 238000009963 fulling Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a weld and take pad pasting device and stringer, wherein weld and take the pad pasting device and include the pad pasting subassembly, the pad pasting subassembly includes bottom plate, backing plate and many heating strips, wherein: the heating strip is arranged on the bottom plate, and the backing plate covers the heating strip; the temperature of each heating strip is independently adjustable; the backing plate is used for bearing the welding strip and the film strip, and the heating strip is used for heating the welding strip and the film strip stacked on the welding strip when being electrified so as to apply the film strip on the welding strip. The utility model provides a weld area pad pasting device, weld area and membrane strip stack on the backing plate, and the backing plate below then is provided with the many heating strips that the temperature can be adjusted alone. The temperature of the heating strips is adjusted, so that the heating temperatures of the welding strips and the film strips at different positions are consistent, and the consistency of the film sticking effect is finally realized.
Description
Technical Field
The utility model belongs to the technical field of battery production and specifically relates to a weld and take pad pasting device and stringer.
Background
Traditional solder strip pad pasting mode does, will solder strip and membrane strip stack to the hot plate on, and the hot plate heating stacks good solder strip and membrane strip for the membrane strip adhesion is on the solder strip.
The problem that traditional solder strip pad pasting mode exists does: the heating uniformity of the heating plate is poor, and the consistency of the film sticking effect of each welding strip is difficult to ensure.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned defect that exists among the prior art, the utility model provides a weld and take pad pasting device, its detailed technical scheme as follows:
the utility model provides a solder strip pad pasting device, includes the pad pasting subassembly, the pad pasting subassembly includes bottom plate, backing plate and many heating strips, wherein:
the heating strips are arranged on the bottom plate, and the backing plate covers the heating strips;
the temperature of each heating strip is independently adjustable;
the backing plate is used for bearing the welding strip and the film strip, and the heating strip is used for heating the welding strip and the film strip stacked on the welding strip when being electrified so as to apply the film strip on the welding strip.
The utility model provides a weld area pad pasting device, weld area and membrane strip and stack on the backing plate, and the backing plate below then is provided with many temperature adjustable's heating strip alone. The temperature of the heating strips is adjusted, so that the heating temperatures of the welding strips and the film strips which are stacked at different positions of the base plate are consistent, and the consistency of the film sticking effect is finally guaranteed.
In some embodiments, a mounting slot is provided on the base plate, and the heating strip is disposed within the mounting slot.
Through setting up the heating strip in the mounting groove, realized the fixed position to the heating strip, prevent that the heating strip from removing. In addition, the backing plate can be tightly attached to the bottom plate, and heat loss is reduced.
In some embodiments, the width of the heating strip is greater than the width of the film strip.
The width of heating strip is greater than the width of membrane strip for the membrane strip can cover completely at the heating strip place region that corresponds, has increased the heated area of membrane strip, has promoted the pad pasting effect.
In some embodiments, the length direction of the heating strip is the same as the length direction of the solder ribbon. The film strip comprises an adhesion layer and a supporting layer for supporting the adhesion layer, and when the film strip is attached to the welding strip, the adhesion layer of the film strip is attached to the welding strip.
The part of the welding strip to be subjected to film pasting can cover the corresponding heating strip area, the heating area of the welding strip is increased, and the film pasting effect is improved. The film strips are arranged into the adhesion layer and the supporting layer, so that the welding strip can be firmly attached to the welding strip.
In some embodiments, a welding strip and a film strip are stacked on the backing plate at positions corresponding to the heating strips, and the heating strips heat the welding strip and the film strip at the corresponding positions respectively.
The heating strips can respectively heat the welding strips and the membrane strips at corresponding positions, and the heating uniformity of the welding strips and the membrane strips at different positions is further ensured.
In some embodiments, the upper surface of the backing plate is an insulating anti-sticking material.
The insulating anti-sticking material is arranged on the upper surface of the backing plate, so that the membrane strip can be prevented from being adhered to the backing plate.
In some embodiments, the welding strip film pasting device further comprises a pressing pin, the pressing pin is used for pressing and positioning the welding strip and the film strip onto the backing plate, and the pressing pin is an elastic pressing pin.
Through setting up the tucking for solder strip and membrane paste tightly on the backing plate, so, can promote the subsides of solder strip and membrane strip and apply the effect. The elastic pressing pin is used, so that the elastic pressing of the welding strip and the membrane strip is realized, and the welding strip is prevented from being damaged by pressing of the pressing pin.
In some embodiments, the welding strip film pasting device further comprises a welding strip feeding mechanism and a film strip feeding mechanism, wherein: the welding strip feeding mechanism is used for supplying welding strips and respectively placing the welding strips on the base plate, and the welding strips correspond to the heating strips below the base plate one by one; the film strip feeding mechanism is used for supplying the film strips and respectively stacking the film strips on the corresponding welding strips.
Through the cooperation of welding strip feeding mechanism and membrane strip feeding mechanism, realized overlapping welding strip and membrane strip to the backing plate of pad pasting subassembly automatically, promoted pad pasting efficiency.
In some embodiments, the film strip feeding mechanism comprises a film strip feeding mechanism, a cutting bearing mechanism, a cutting mechanism and a film strip carrying mechanism, wherein: the film belt feeding mechanism is arranged in the front of the cutting bearing mechanism and is configured to feed the film belt to be cut onto the cutting bearing mechanism along a first horizontal direction; the cutting and bearing mechanism comprises a plurality of film tape adsorption plates, wherein the film tape adsorption plates are arranged side by side and extend along a second horizontal direction perpendicular to the first horizontal direction; the film belt adsorption plates are used for adsorbing the film belts; the cutting mechanism is configured to cut the film strips along gaps between the adjacent film strip adsorption plates, and after the cutting mechanism finishes cutting the film strips, the film strip adsorption plates correspondingly adsorb the cut film strips; the film strip conveying mechanism is used for conveying the film strips on the film strip adsorption plate to the base plate of the welding strip film pasting assembly.
Through the cooperation of membrane area feed mechanism, cut and bear the weight of the mechanism, cut the mechanism, membrane strip feed mechanism cuts into the membrane strip with the membrane area automatically, has realized the automatic supply to the membrane area promptly. Through setting up membrane strip transport mechanism, then will realize the automatic feeding to the membrane strip.
The utility model also provides a stringer, it includes above-mentioned arbitrary any the weld and take pad pasting device, weld and take the shop to put device, battery piece shop to put device, conveyor and crimping device, wherein:
the battery piece laying device is used for placing battery pieces on the conveying device,
the welding strip laying device is used for picking up the welding strip with the film strips from the welding strip film pasting device, placing the picked-up welding strip on the conveying device and enabling the welding strip to be stacked on the corresponding battery piece;
the conveying device is used for conveying the stacked battery plates and the welding strips to the compression joint device;
the crimping device is used for crimping the stacked battery plates and the welding strips into a string.
Through the cooperation of the welding strip film sticking device, the welding strip laying device, the battery piece laying device, the conveying device and the crimping device, the series welding machine realizes the automatic stringing of the battery pieces and the welding strips.
Drawings
Fig. 1 is a schematic structural diagram of a film sticking assembly carrying a welding strip and a film strip in one view angle according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a film sticking assembly carrying a welding strip and a film strip in another view according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a film strip feeding mechanism in an embodiment of the present invention at a viewing angle;
fig. 1 to 3 include:
film pasting component 1:
a bottom plate 11, a backing plate 12 and a heating strip 13;
membrane strip feeding mechanism 2:
a film tape feeding mechanism 21, a cutting bearing mechanism 22 and a cutting mechanism 23;
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.
Traditional solder strip pad pasting mode, the heating homogeneity of hot plate is relatively poor, consequently is difficult to guarantee the uniformity of the pad pasting effect of each solder strip.
Therefore, the utility model provides a solder strip pad pasting device, it includes pad pasting subassembly 1 at least, as shown in fig. 1 and fig. 2, this pad pasting subassembly includes bottom plate 11, backing plate 12 and many heating strips 13, wherein:
the heating strips 13 are arranged on the base plate, and the backing plate 12 covers the heating strips 13. The two ends of the heating strip 13 are provided with joints which extend out of the backing plate 12, and the heating strip 13 is connected with a power supply end through the joints at the two ends.
In particular, the temperature of each heating strip 13 is individually adjustable.
As shown in fig. 1 and 2, a solder strip 100 is placed onto the backing plate 12 and a strip of film is laid over the solder strip 100. The power is turned on, and the heating strip 13 heats the welding strip 100 and the film strip 200, so that the film strip 200 is melted and applied to the welding strip 100.
Since the temperature of each heating strip 13 can be adjusted individually. Therefore, the temperature of each heating strip 13 is adjusted, so that the heating uniformity of the welding strips and the film strips at different positions can be ensured, and the film sticking effect of all the welding strips is finally consistent.
For example, because the heat dissipation rate at the edge of the backing plate 2 is faster than the heat dissipation rate at the center of the backing plate 2, the temperature of each heating strip 13 can be set in a gradient manner according to the distance from the center of the backing plate 12, so that the temperature of the heating strip 13 away from the center of the backing plate 12 is higher than the temperature of the heating strip 13 close to the center of the backing plate 12 by a predetermined value in two adjacent heating strips 13, thereby finally ensuring the heating uniformity of the solder strips and the film strips at different positions. As for the specific temperature difference between the different heating strips 13, it can be set as appropriate according to the specific situation.
Optionally, a mounting groove is formed in the bottom plate 11, and the heating strip 13 is disposed in the mounting groove. Through setting up heating strip 13 in the mounting groove, realized the fixed positioning to heating strip 13, prevent that heating strip 13 from removing. In addition, the pad 12 is allowed to closely adhere to the base plate 11, thereby reducing heat loss.
Optionally, in order to further improve the heating effect, a welding strip 100 and a film strip 200 are stacked on the backing plate 12 at positions corresponding to the heating strips 13, and the heating strips 13 heat the welding strip 100 and the film strip 200 at the corresponding positions, respectively.
Optionally, the width of the heating strip 13 is greater than the width of the film strip 200. Therefore, the film strip 200 can completely cover the corresponding area where the heating strip 13 is located, so that the heating area of the film strip is increased, and the film sticking effect is improved.
In order to prevent the film strip 200 from adhering to the backing plate 12 after being melted by heat, the upper surface of the backing plate 12 is optionally made of an insulating and anti-sticking material. For example, the backing plate 12 is made of an insulating and anti-sticking material as a whole. Of course, the insulating anti-sticking layer may be formed on the upper surface of the backing plate 12 by coating, plating, or the like.
Optionally, the embodiment of the utility model provides a solder strip pad pasting device still includes the tucking, with solder strip 100 and membrane strip 200 fold to backing plate 12 on the back, pushes down through the control tucking, can compress tightly the location to backing plate 12 with the solder strip 100 and the membrane strip 200 that stack, so, can promote solder strip 100 and membrane strip 200 and paste the effect of applying. In order to prevent the pressing pin from damaging the welding strip, the pressing pin is an elastic pressing pin.
Optionally, the embodiment of the utility model provides an in weld and take pad pasting device still including welding and taking feed mechanism and membrane strip feed mechanism, wherein: the solder strip feeding mechanism is used for supplying solder strips and for placing the solder strips 100 on the backing plate 12 respectively, and the solder strips correspond to the heating strips 13 under the backing plate 12 one by one. The film strip feeding mechanism is used for supplying the film strips 200 and respectively stacking the film strips 200 on the corresponding welding strips.
Therefore, the welding strip feeding mechanism and the film strip feeding mechanism are matched, so that the welding strip 100 and the film strip 200 are automatically stacked, and the film sticking efficiency is improved.
As shown in fig. 3, the film strip feeding mechanism 2 provided by an optional embodiment of the present invention includes a film strip feeding mechanism 21, a cutting bearing mechanism 22, a cutting mechanism 23, and a film strip carrying mechanism (not shown), wherein:
a film tape feed mechanism 21 is provided in front of the cutting support mechanism 22, and the film tape feed mechanism 21 is configured to feed a film tape to be cut onto the cutting support mechanism 2 in a first horizontal direction (X-axis direction in fig. 3).
The cutting and carrying mechanism 22 includes a plurality of film tape suction plates, wherein the film tape suction plates are arranged side by side and extend in a second horizontal direction (e.g., a Y-axis direction in fig. 3) perpendicular to the first horizontal direction. The film belt adsorption plates are used for adsorbing the film belts.
The cutting mechanism 23 is configured to cut the film strips along the gaps between the adjacent film strip adsorption plates, and after the cutting mechanism 23 finishes cutting the film strips, each film strip adsorption plate correspondingly adsorbs one cut film strip. The film strip conveying mechanism is used for conveying the film strips on the film strip adsorption plate to the backing plate 12 of the welding strip film sticking assembly.
The film strip feeding mechanism 2 automatically cuts the film strip into the film strip through the cooperation of the film strip feeding mechanism 21, the cutting bearing mechanism 22 and the cutting mechanism 23, namely, the automatic strip supply is realized. And through setting up membrane strip transport mechanism, then will realize the automatic feeding to the membrane strip.
In an implementation mode, the film strip feeding mechanism feeds a group of film strips in a first direction, the cutting and bearing mechanism comprises a plurality of film strip adsorption plates, and the film strip adsorption plates are arranged side by side and extend in a first horizontal direction. The film strip is adsorbed and positioned on the film strip adsorption plates after passing through the film strip adsorption plates, and each film strip adsorption plate is used for adsorbing a group of film strips. Every group's membrane area includes along the many membrane strips that the second direction set up side by side, cuts the mechanism and is configured as along the gap between the adjacent membrane area adsorption plate and cuts the membrane area, cuts the mechanism and accomplishes the back that cuts the membrane area, all corresponds on each membrane area adsorption plate and adsorbs a set of membrane strip section that is downcut. The film strip adsorption plate is arranged above the welding strip, the film strip adsorption plate adsorbs the cut film strip and then descends to the welding strip, and the bottom plate can be close to the film strip adsorption plate to attach the film strip to the welding strip.
Alternatively, the length direction of the heating strip 3 is the same as the length direction of the solder strip 100. The film strip 200 includes an adhesion layer and a support layer for supporting the adhesion layer, and when the film strip 200 is attached to the welding band, the adhesion layer of the film strip 200 is attached to the welding band.
The utility model also provides a stringer, it includes that any of the above-mentioned embodiments provides welds and takes pad pasting device, welds that the area is put the device, the battery piece is put and is put device, conveyor and crimping device, wherein: the battery piece laying device is used for placing battery pieces on the conveying device, and the welding strip laying device is used for picking up the welding strips with the film strips from the welding strip film pasting device, placing the picked welding strips on the conveying device and enabling the welding strips to be stacked on the corresponding battery pieces; the conveying device is used for conveying the stacked battery plates and the welding strips to the compression joint device; the crimping device is used for crimping the stacked battery plates and the welding strips into a string. Through the cooperation of the welding strip film pasting device, the welding strip laying device, the battery piece laying device, the conveying device and the crimping device, the series welding machine realizes the automatic stringing of the battery pieces and the welding strips.
The invention has been described above with a certain degree of particularity and detail. It will be understood by those of ordinary skill in the art that the descriptions of the embodiments are merely exemplary and that all changes and modifications made without departing from the true spirit and scope of the present invention are intended to be covered by the present invention. The scope of the invention is defined by the appended claims rather than by the foregoing description of the embodiments.
Claims (10)
1. The utility model provides a weld and take pad pasting device, its characterized in that, weld and take pad pasting device includes the pad pasting subassembly, the pad pasting subassembly includes bottom plate, backing plate and many heating strips, wherein:
the heating strips are arranged on the bottom plate, and the backing plate covers the heating strips;
the temperature of each heating strip is independently adjustable;
the backing plate is used for bearing a welding strip and film strips, and the heating strip is used for heating the welding strip and the film strips stacked on the welding strip when the welding strip is electrified so as to attach the film strips to the welding strip.
2. The solder strip film laminating device of claim 1, wherein a mounting groove is formed in the base plate, and the heating strip is disposed in the mounting groove.
3. The solder strip pasting device of claim 1, wherein the width of said heating strip is greater than the width of the membrane strip.
4. The solder strip film adhering apparatus according to claim 1, wherein the heating strip has a longitudinal direction identical to a longitudinal direction of the solder strip;
the membrane strip comprises an adhesion layer and a supporting layer for supporting the adhesion layer, and when the membrane strip is attached to a welding strip, the adhesion layer of the membrane strip is attached to the welding strip.
5. A solder ribbon laminating apparatus according to claim 1, wherein a solder ribbon and a film strip are stacked on said backing plate at positions corresponding to said respective heating strips, and said respective heating strips heat the solder ribbon and the film strip at the corresponding positions.
6. A solder ribbon laminating apparatus according to claim 1 wherein the upper surface of the backing plate is of an insulating and non-stick material.
7. The solder strip laminating apparatus according to claim 1, further comprising a pressing pin for pressing and positioning the solder strip and the film strip onto the backing plate,
the pressing needle is an elastic pressing needle.
8. The solder strip laminating apparatus according to claim 1, further comprising a solder strip feeding mechanism and a film strip feeding mechanism, wherein:
the welding strip feeding mechanism is used for supplying welding strips and respectively placing the welding strips on the base plate, and the welding strips correspond to the heating strips below the base plate one by one;
the film strip feeding mechanism is used for supplying film strips and stacking the film strips on corresponding welding strips respectively.
9. The solder strip laminating apparatus according to claim 8, wherein the film strip feeding mechanism comprises a film strip feeding mechanism, a cutting and carrying mechanism, a cutting mechanism and a film strip carrying mechanism, wherein:
the film tape feeding mechanism is arranged in the front of the cutting bearing mechanism and is configured to feed the film tape to be cut onto the cutting bearing mechanism along a first horizontal direction;
the cutting and bearing mechanism comprises a plurality of film tape adsorption plates, wherein the film tape adsorption plates are arranged side by side and extend along a second horizontal direction perpendicular to the first horizontal direction; the film belt adsorption plates are used for adsorbing the film belts;
the cutting mechanism is configured to cut the film strips along gaps between adjacent film strip adsorption plates, and after the cutting mechanism finishes cutting the film strips, each film strip adsorption plate correspondingly adsorbs the cut film strips;
the film strip carrying mechanism is used for carrying the film strips on the film strip adsorption plate to the base plate of the welding strip film pasting assembly.
10. A stringer comprising a solder ribbon filming device, a solder ribbon laying device, a cell sheet laying device, a conveying device and a crimping device according to any one of claims 1 to 9, wherein:
the battery piece laying device is used for placing battery pieces on the conveying device,
the welding strip laying device is used for picking up the welding strip with the film strips from the welding strip film pasting device, placing the picked-up welding strip on the conveying device and enabling the welding strip to be stacked on the corresponding battery piece;
the conveying device is used for conveying the stacked battery plates and the welding strips to the crimping device;
the crimping device is used for crimping the stacked battery plates and the welding strips into a string.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222859874.5U CN218647952U (en) | 2022-10-28 | 2022-10-28 | Film sticking device for welding strip and series welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222859874.5U CN218647952U (en) | 2022-10-28 | 2022-10-28 | Film sticking device for welding strip and series welding machine |
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| Publication Number | Publication Date |
|---|---|
| CN218647952U true CN218647952U (en) | 2023-03-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222859874.5U Active CN218647952U (en) | 2022-10-28 | 2022-10-28 | Film sticking device for welding strip and series welding machine |
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| CN (1) | CN218647952U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119767870A (en) * | 2025-03-07 | 2025-04-04 | 浙江晶科能源有限公司 | Photovoltaic module manufacturing process |
-
2022
- 2022-10-28 CN CN202222859874.5U patent/CN218647952U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119767870A (en) * | 2025-03-07 | 2025-04-04 | 浙江晶科能源有限公司 | Photovoltaic module manufacturing process |
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