CN218631392U - Liquid cooling solid state mobile hard disk cartridge - Google Patents
Liquid cooling solid state mobile hard disk cartridge Download PDFInfo
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- CN218631392U CN218631392U CN202223040248.XU CN202223040248U CN218631392U CN 218631392 U CN218631392 U CN 218631392U CN 202223040248 U CN202223040248 U CN 202223040248U CN 218631392 U CN218631392 U CN 218631392U
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- hard disk
- circuit board
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A liquid-cooled solid state mobile hard disk box comprises a side frame, an upper cover plate, an integrated circuit board, a lower cover plate, heat conducting liquid, a main control chip and a data interface; the side frames, the upper cover plate and the lower cover plate form a shell of the solid-state mobile hard disk box, and the integrated circuit board is arranged in the shell; the main control chip is arranged on the integrated circuit board; the side frame is connected with the lower cover plate, and meanwhile, the side frame is also connected with the integrated circuit board to form a closed cooling chamber, and the cooling chamber contains the non-conductive heat-conducting liquid; the main control chip is arranged on one surface, facing the inside of the cooling chamber, of the integrated circuit board, so that the main control chip is immersed in the heat-conducting liquid. The utility model discloses directly put into circuit board and chip as power device in the heat conduction liquid as the refrigerant, radiating efficiency improves greatly, volume and cost reduce by a wide margin.
Description
Technical Field
The utility model belongs to the technical field of mobile memory, especially, relate to an use solid-state mobile hard disk cartridge of liquid cooling technique.
Background
With the popularization of solid state disk and the increasing demand of people for data transmission speed, solid state mobile hard disk is more and more widely used. However, the high transmission speed of the solid state disk also brings extremely high heat, and the excessively high heat can cause the reduction of the transmission speed, so that the probability of losing data and even losing the disk is improved. Therefore, the improvement of the heat dissipation efficiency of the solid state disk is a precondition for stable data transmission and is also a key index of the solid state disk. However, due to the requirements of portability and data security, the mobile solid state disk is required to be small in size, simple and firm in structure, and therefore the number and size of heat dissipation components should be minimized.
The most mainstream heat dissipation mode of the current solid state mobile hard disk box is that a heat conduction silica gel pad is combined with an all-metal shell. Such as 202111076000.6. The solid-state mobile hard disk box adopts a heat radiation mode to dissipate heat, and can indeed play a certain heat dissipation effect, but the heat dissipation efficiency is lower, and along with long-time transmission, the temperature of the shell is too high, so that a user can be burned, and the use is unsafe.
Therefore, heat dissipation technologies such as air cooling or cold plate type liquid cooling are generated.
The air cooling heat dissipation technology is provided with heat conducting pieces such as copper pipes, one end of each heat conducting piece is in contact with the surface of a power device, the other end of each heat conducting piece is in contact with a fan, heat is conducted to the fan in a heat convection mode and sent to a far place, and finally heat dissipation of the power device is completed. Such as "a new software engineering special storage device" with application number 201922438913.2, "a portable mobile hard disk" with application number 202220396949.8, etc. However, the air-cooled heat dissipation technology has various disadvantages: (1) the heat dissipation efficiency is still relatively low; (2) The air-cooled radiating object mainly aims at a mobile hard disk body in a mobile hard disk box, and the temperature of a main control chip additionally carried by the hard disk box cannot be effectively reduced; (3) Parts for heat conduction such as copper tubes and the like need to be additionally arranged, so that the size and the weight of the electronic product are not reduced; (4) The structure is complex, and the problem of heat conduction copper pipe arrangement needs to be considered; (5) In the pure air cooling mode, the fan needs to operate at high power to improve the heat dissipation efficiency, and thus, the fan generates a large noise.
In addition, the liquid cooling heat dissipation technology applied to the field of mobile hard disks at present is a cold plate type heat dissipation mode in which a chip is tightly attached to a liquid cooling heat dissipation module, namely, the chip is in close contact with the heat dissipation module, and the generated heat is finally conducted to an external space through the heat dissipation module. Such as "a mobile hard disk with high heat dissipation efficiency" with application number 201811186222.1, and "a solid state disk device" with application number 202020623187.1. However, in cold plate heat dissipation, the working fluid is separated from the cooled object and does not directly contact with the electronic device, and the heat transfer process is to transfer the heat of the cooled object to the refrigerant through heat transfer components such as a liquid cooling plate, and the refrigerant transfers the heat to the air. Cold plate liquid cooling has the following disadvantages: (1) A heat conduction component is required to be used as an intermediate medium, and the heat dissipation efficiency is low due to a plurality of heat conduction links; (2) The direct way of improving heat conduction by cold plate heat dissipation is to improve the heat conduction area, so enough contact area needs to be ensured between the power device and the heat conduction component (such as a heat conduction sheet and a partition plate) and between the heat conduction component and the heat dissipation module, so that a larger assembly space needs to be reserved for the heat conduction component and the heat dissipation module, and the reduction of the volume of the solid state disk, especially the volume of the mobile hard disk, is not facilitated; (3) More metal materials such as copper, aluminum-magnesium alloy and the like are adopted, so that the cost is higher and the weight is heavier; (4) The structure is relatively complex, the arrangement and assembly schemes of a plurality of parts need to be comprehensively considered, and the requirements on process design and die machining are high.
In a word, the prior art is all indirect cooling mode, and has the defects of low heat dissipation efficiency, complex structure, large volume and the like.
SUMMERY OF THE UTILITY MODEL
Compare in prior art's indirect cooling mode, the utility model discloses a direct cooling mode, directly put into the circuit board as power device and chip as the heat conduction liquid of refrigerant, consequently the utility model discloses the radiating efficiency of submergence formula liquid cooling technique improves greatly. Furthermore, the utility model discloses overall structure has been optimized for its spare part reduces, has simplified assembly and manufacturing process, the cost is reduced. Meanwhile, the volume is greatly reduced and the portability is greatly improved by integrating the immersion type liquid cooling and the optimized integral structure.
The specific technical scheme is as follows:
a liquid-cooled solid state mobile hard disk box comprises a side frame, an upper cover plate, an integrated circuit board, a lower cover plate, heat conducting liquid, a main control chip and a data interface; the side frames, the upper cover plate and the lower cover plate form a shell of the solid-state mobile hard disk box, and the integrated circuit board is arranged in the shell; the main control chip is arranged on the integrated circuit board; the side frame is connected with the lower cover plate, and meanwhile, the side frame is also connected with the integrated circuit board to form a closed cooling chamber, and the cooling chamber contains the non-conductive heat-conducting liquid; the main control chip is arranged on one surface, facing the inside of the cooling chamber, of the integrated circuit board, so that the main control chip is immersed in the heat-conducting liquid. Through the liquid cooling mode that makes power component submergence in heat conduction liquid, can improve the radiating efficiency, reduce spare part and volume, reduce cost.
Furthermore, the integrated circuit board is used as a dividing point, one side of the side frame, which is close to the upper cover plate, is an upper side frame, and one side of the side frame, which is close to the lower cover plate, is a lower side frame.
Furthermore, be provided with one or more fresh air inlets on the side frame of upside for reinforcing convection current efficiency improves the radiating effect.
Furthermore, the space that the upper cover plate and the upside frame constitute forms the fan room, be provided with the fan in the fan room for further reinforcing convection current efficiency improves the radiating effect.
Furthermore, a fan chamber is further arranged in a space formed by the lower cover plate and the lower side frame, and a fan is arranged in the fan chamber.
Furthermore, a clapboard is arranged on the lower side frame to divide the lower side frame into a left part and a right part; the partition plate, the integrated circuit board and one side part of the lower side frame form a closed cooling chamber, and the heat-conducting liquid is contained in the cooling chamber; the partition plate and the other side part of the lower side frame form a fan chamber, and a fan is arranged in the fan chamber. Therefore, the position of the fan can be flexibly adjusted to be positioned in the upper side space or the lower side space according to actual requirements.
Furthermore, one or more air outlet holes are formed in the lower side frame or the lower cover plate corresponding to the fan chamber, so that the convection efficiency is further enhanced by matching with the air inlet holes, and the heat dissipation effect is improved.
Furthermore, the integrated circuit board is also provided with a heat-conducting liquid pouring hole, and the heat-conducting liquid pouring hole is formed in the position, corresponding to the cooling chamber, of the integrated circuit board.
Further, an adhesive is used for bonding and sealing the side frame and the integrated circuit board; and the side frame and the lower cover plate are bonded and sealed by adopting an adhesive.
Further, the adhesive is a two-component epoxy adhesive or an acrylate UV adhesive.
Furthermore, the side frame is a metal side frame to improve the heat dissipation efficiency.
Further, the heat-conducting liquid is heat-conducting white oil or transformer oil.
The utility model has the advantages of:
(1) The heat dissipation efficiency is greatly improved. Through the experiment, adopt submergence formula liquid cooling the utility model discloses technological radiating efficiency compares and improves about 1.5 ~ 2 times in traditional solid state hard drives.
(2) Because the integral structure is simplified, the cost is greatly reduced, the product volume is greatly reduced, and the portability is greatly improved.
(3) Because a plurality of parts are reduced, the failure rate is reduced to a certain extent, and the data safety is improved.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present disclosure will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the present disclosure are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar or corresponding parts and in which:
FIG. 1 is a bottom view of a liquid-cooled solid state mobile hard disk cartridge of embodiment 1 shown without a lower cover plate;
FIG. 2 showsbase:Sub>A cross-sectional view A-A of FIG. 1 after assembly of the lower deck;
FIG. 3 is a bottom view of the liquid-cooled solid state mobile hard disk cartridge of embodiment 2 shown without the lower cover plate;
FIG. 4 showsbase:Sub>A cross-sectional view A-A of FIG. 3 with the lower cover plate assembled;
FIG. 5 is a bottom plan view of the liquid-cooled solid state mobile hard disk cartridge of embodiment 3 shown without the lower cover plate;
FIG. 6 showsbase:Sub>A cross-sectional view A-A of FIG. 5 after assembly of the lower cover plate;
FIG. 7 is a plan view showing the embodiment 3 without the upper cover plate;
FIG. 8 is a front view showing embodiment 3;
FIG. 9 is a top view of the assembled embodiments 1-3
Fig. 10 shows a right side view of the assembled embodiment 1-3.
Description of reference numerals: 1. a side frame; 2. an upper cover plate; 3, integrating a circuit board; 4. a lower cover plate; 5. a cooling chamber; 6. a heat-conducting liquid; 7. a main control chip; 8. an upper side frame; 9. a lower side frame; 10. an air inlet hole; 11. an air outlet; 12. a fan chamber; 13. a fan; 14. a data interface; 15. a partition plate; 16. a heat-conducting liquid filling hole; 17. a circuit board fixing hole; 18. and an upper cover plate fixing hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1-10, the main body of the liquid-cooled solid mobile hard disk cartridge of the present invention is composed of a side frame 1, an upper cover plate 2, an integrated circuit board 3 provided with a main control chip 7, a lower cover plate 4, a heat conducting liquid 6, a data interface 14, etc. The side frame 1, the upper cover plate 2 and the lower cover plate 4 form a shell of the mobile hard disk box.
The side frame 1 is configured into a rectangular hollow frame structure, and can also be configured into a circular, square, polygonal or irregular hollow frame structure according to requirements. Preferably, the side frame 1 is made of a metal material, such as aluminum alloy, stainless steel, magnesium alloy, cast iron, brass, or red copper.
The side frame 1 can be divided into an upper side frame 8 and a lower side frame 9 in the vertical direction with the integrated circuit board 3 mounted on the side frame 1 as a dividing point. The upper side frame 8 corresponds to the side of the upper cover plate 2, and the lower side frame 9 corresponds to the side of the lower cover plate 4. The upper side frame 8 and the lower side frame 9 can be integrally formed, and can also be fixed into a whole by gluing, welding, buckling, riveting and other modes after being formed in a split mode.
The inner peripheries of the upper side frame 8 and the lower side frame 9 are respectively provided with a side frame clamping groove for clamping the upper cover plate 2 and the lower cover plate 4.
The upper cover plate 2 is arranged into a thin plate structure matched with the side frame 1, and the material of the upper cover plate can be organic glass (PMMA), polycarbonate (PC), ABS, PVC, PET, PBT, PC-ABS, aluminum alloy, stainless steel, magnesium alloy, brass, red copper and the like.
The upper cover plate 2 can be provided with an upper cover plate fixing hole 18, and a bolt mounting hole is correspondingly arranged on the main structure of the box. During assembly, the upper cover plate 2 is inserted into the side frame clamping groove, and then the upper cover plate 2 and the hard disk cartridge main body structure are fixed together through the upper cover plate fixing holes 18 by using M2 screws.
An integrated circuit board fixing vacancy is reserved near the middle of the inner side of the side frame 1 in the vertical direction. The outer edge of the integrated circuit board 3 is set to be in a shape matched with the inner periphery of the side frame 1 and is connected with the side frame 1 through the integrated circuit board fixing hole positions.
Specifically, the integrated circuit board 3 is mounted on the integrated circuit board fixing hole site reserved on the inner periphery of the side frame 1, so that the two are preliminarily fixed. Then, a gap between the integrated circuit board 3 and the side frame 1 is brushed with two-component epoxy glue or acrylate UV glue, and the integrated circuit board 3 and the side frame 1 are bonded and sealed. After the glue is coated, the glue needs to be kept still for several hours, and the glue is waited for generating strength. The adhesive can be two-component epoxy adhesive, acrylate UV adhesive and the like. When the acrylate UV adhesive is adopted, the curing can be completed within 10-60 seconds through UV light, so that the next operation can be immediately carried out, the standing time is 4-6 hours compared with that of other adhesives, and the production and assembly efficiency is greatly improved when the acrylate UV adhesive is adopted.
The lower cover plate 4 is provided with a thin plate-shaped structure matched with the side frame 1, and can be made of organic or inorganic materials such as plastics, metals and the like. Preferably, the lower cover plate 4 is made of a wear-resistant and drop-resistant transparent material, such as organic glass (PMMA), polycarbonate (PC), tempered glass and the like, so that the internal condition of the mobile hard disk box can be observed conveniently.
And after the lower cover plate 4 is buckled with the lower side frame 9 of the side frame 1, the lower cover plate is hermetically connected in an adhesive bonding mode. The adhesive can be double-component epoxy adhesive or acrylate UV adhesive. The adhesive can be two-component epoxy adhesive, acrylate UV adhesive and the like. When the acrylate UV adhesive is adopted, the curing can be completed within 10-60 seconds through UV light, so that the next operation can be immediately carried out, the standing time is 4-6 hours compared with that of other adhesives, and the production and assembly efficiency is greatly improved when the acrylate UV adhesive is adopted.
After the whole solid state mobile hard disk cartridge is assembled, when the mobile hard disk cartridge is required to be used for data transmission, a solid state mobile hard disk (not shown in the figure) is inserted into an accommodating space formed by the upper side frame 8 of the side frame 1, the upper cover plate 2 and the integrated circuit board 3, and is connected to an external reading device through the data interface 14.
Detailed description of the preferred embodiment 1
As shown in fig. 1-2, the lower side frame 9 of the side frame 1, the integrated circuit board 3, and the lower cover plate 4 form an accommodating space, which is totally closed, and thus serves as a cooling chamber 5 for accommodating the heat conducting liquid 6 for liquid cooling.
The heat-conducting liquid 6 is a non-conducting liquid and can be heat-conducting white oil, transformer oil or the like.
Because the integrated circuit board 3 is directly used as the cavity wall of the cooling chamber 5, one surface of the integrated circuit board 3 can be directly immersed in the heat-conducting liquid 6, so that the integrated circuit board directly contacts with the heat-conducting liquid 6 without an intermediate heat-conducting piece for heat conduction, and the heat conduction efficiency is greatly improved; in addition, the immersion liquid cooling eliminates the middle heat conducting parts of the prior cold plate type liquid cooling, such as a partition plate, a heat conducting plate and the like, so that the whole structure is simplified, the weight is reduced and the cost is reduced.
Since the chip on the mobile solid-state hard disk cartridge is one of the largest heat sources, the side of the integrated circuit board 3 provided with the main control chip 7 can also face the inside of the cooling chamber 5, so that the main control chip 7 can also be immersed in the heat-conducting liquid 6. In a similar way, the immersion type liquid cooling mode is adopted for the main control chip 7, so that the beneficial technical effects of improving the heat conduction efficiency, simplifying the structure, reducing the weight and reducing the cost are achieved.
As shown in fig. 1-2, a heat-conducting liquid pouring hole 16 is formed in a portion of the integrated circuit board 3 that constitutes the cooling chamber 5 and in which the integrated circuit is not disposed. The heat conductive liquid 6 is poured into the cooling chamber 5 through the heat conductive liquid pouring hole 16 using a syringe or a dispensing device or the like. After the filling, the heat conducting liquid filling hole 16 is closed by using a screw and thread locking glue.
Preferably, an air inlet 10 can be arranged on the upper side frame 8, so that air convection is enhanced, and the heat dissipation efficiency is improved.
Specific example 2
As shown in fig. 3-4, a compound cooling method combining immersion liquid cooling and air cooling can be adopted to further improve the heat dissipation efficiency.
Specifically, in the accommodating space formed by the upper side frame 8 of the side frame 1, the upper cover plate 2 and the integrated circuit board 3, in addition to being used for accommodating the solid state mobile hard disk, a redundant part of the accommodating space can be used as a fan chamber 12, and a fan 13 is arranged in the redundant space, so that the air convection efficiency is enhanced, and the heat dissipation effect is improved.
Other parts of this embodiment are the same as those of embodiment 1, and are not described again.
Specific example 3
As shown in fig. 5 to 8, the position of the fan chamber 12 can be adjusted to the accommodating space corresponding to the lower side frame 9 to meet different shape requirements or assembly requirements, so as to adapt to different application scenarios.
Specifically, by providing the partition plate 15 somewhere in the middle of the lower side frame 9, the space formed by the lower side frame 9 of the side frame 1, the integrated circuit board 3, and the lower cover plate 4 is divided into two parts, i.e., a left part and a right part, wherein one part still forms a closed space to serve as the cooling chamber 5 for accommodating the heat conductive liquid 6, and the main control chip 7 is immersed in the heat conductive liquid 6. And the other part of the space is used as a fan chamber 12 for installing a fan 13 for air cooling.
The volume ratio of the two spaces separated by the partition 15 may be any ratio as long as the heat dissipation requirement can be satisfied and the size of the fan chamber 12 is large enough to accommodate the fan 13.
Preferably, an air outlet 11 is provided on one side of the lower side frame 9 forming the fan chamber 12 to match with the air inlet 10 on the upper side frame 8, so as to further enhance convection and increase heat dissipation efficiency.
In the present embodiment, the integrated circuit board 3 may extend only up to the partition 15, i.e., the area of the integrated circuit board 3 covers only the cooling chamber 5. In this case, the partition plate 15, one side portion of the lower frame 9, and the entire surface of the integrated circuit board 3 form a closed cooling chamber 5. The fan chamber 12 on the other side of the partition 15 is directly communicated with the accommodation space formed by the upper side frame 8 and the upper cover plate 2 because it is not blocked by the integrated circuit board 3.
Of course, it is also possible to still make the area of the integrated circuit board 3 equivalent to the entire inner peripheral area of the side frame 1, i.e., the area of the integrated circuit board 3 covers the entire cooling chamber 5 and the fan chamber 12. In this case, only a part of the board surface of the integrated circuit board 3 forms the closed cooling chamber 5, and the other part of the board surface extends above the fan chamber 12 on the other side of the partition 15, so that the fan chamber 12 is separated from the accommodating space formed by the upper side frame 8 and the upper cover plate 2. At this time, it is necessary to provide fan mounting holes for mounting the fans 13 and to allow the upper and lower accommodating spaces to communicate with each other for convection on the integrated circuit board 3.
Table 1 is when using samsung 980 1TB m.2nvme solid state hard disk, JMS 583 main control chip, the utility model discloses compare with the temperature rise of prior art along with time.
TABLE 1 temperature contrast of the present invention
Time- |
5 |
10 minutes | 20 minutes | 30 minutes |
Immersion liquid cooling | 32℃ | 35℃ | 37℃ | 37℃ |
Non-immersion liquid cooling | 45℃ | 50℃ | 60℃ | 61℃ |
The above description of the preferred embodiments of the present invention is intended to make the spirit of the present invention clearer and more comprehensible, and is not intended to limit the present invention, and all modifications, replacements, and improvements made within the spirit and principles of the present invention should be included within the scope of protection outlined in the claims appended hereto.
Claims (13)
1. The utility model provides a liquid cooling solid state mobile hard disk box which characterized in that: the liquid-cooled solid mobile hard disk box comprises a side frame (1), an upper cover plate (2), an integrated circuit board (3), a lower cover plate (4), a cooling chamber (5), heat-conducting liquid (6), a main control chip (7) and a data interface (14);
the side frame (1), the upper cover plate (2) and the lower cover plate (4) form a shell of the solid-state mobile hard disk cartridge, and the integrated circuit board (3) is arranged in the shell; the main control chip (7) is arranged on the integrated circuit board (3);
the side frame (1) is connected with the lower cover plate (4), meanwhile, the side frame (1) is also connected with the integrated circuit board (3), the side frame, the lower cover plate and the integrated circuit board form a closed cooling chamber (5), and the cooling chamber (5) contains the non-conductive heat-conducting liquid (6);
the main control chip (7) is arranged on one surface of the integrated circuit board (3) facing the inner side of the cooling chamber (5), so that the main control chip (7) is immersed in the heat-conducting liquid (6).
2. The liquid-cooled solid state mobile hard disk cartridge of claim 1, wherein: the integrated circuit board (3) is used as a dividing point, one side of the side frame, which is close to the upper cover plate (2), is an upper side frame (8), and one side of the side frame, which is close to the lower cover plate (4), is a lower side frame (9).
3. The liquid-cooled solid state mobile hard disk cartridge of claim 2, wherein: one or more air inlet holes (10) are formed in the upper side frame (8).
4. The liquid-cooled solid state mobile hard disk cartridge of claim 3, wherein: the space that upper cover plate (2) and upside frame (8) are constituteed forms fan chamber (12), be provided with fan (13) in fan chamber (12).
5. The liquid-cooled solid state mobile hard disk cartridge of claim 3, wherein: a fan chamber (12) is further arranged in a space formed by the lower cover plate (4) and the lower side frame (9), and a fan (13) is arranged in the fan chamber (12).
6. The liquid-cooled solid state mobile hard disk cartridge of claim 5, wherein: the lower side frame (9) is also provided with a clapboard (15) which divides the lower side frame (9) into a left part and a right part;
the partition plate (15), the integrated circuit board (3) and one side part of the lower side frame (9) form a closed cooling chamber (5), and the heat-conducting liquid (6) is contained in the cooling chamber (5);
the partition plate (15) and the other side part of the lower side frame (9) form a fan chamber (12), and a fan (13) is arranged in the fan chamber (12).
7. The liquid-cooled solid state mobile hard disk cartridge of claim 5, wherein: one or more air outlet holes (11) are further formed in the lower side frame (9) or the lower cover plate (4).
8. The liquid-cooled solid state mobile hard disk cartridge of claim 1, 5 or 6, wherein: the integrated circuit board is also provided with heat-conducting liquid pouring holes (16), and the heat-conducting liquid pouring holes (16) are formed in the integrated circuit board (3).
9. The liquid-cooled solid state mobile hard disk cartridge of claim 1, wherein: the side frame (1) and the integrated circuit board (3) are bonded and sealed by adopting an adhesive; and the side frame (1) and the lower cover plate (4) are bonded and sealed by adopting an adhesive.
10. The liquid-cooled solid state mobile hard disk cartridge of claim 9, wherein: the adhesive is double-component epoxy adhesive or acrylate UV adhesive.
11. The liquid-cooled solid state mobile hard disk cartridge of claim 1, wherein: the lower cover plate (4) is a wear-resistant and drop-resistant transparent cover plate.
12. The liquid-cooled solid state mobile hard disk cartridge of claim 1, wherein: the side frame (1) is a metal side frame.
13. The liquid-cooled solid state mobile hard disk cartridge of claim 1, wherein: the heat-conducting liquid (6) is heat-conducting white oil or transformer oil.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202223040248.XU CN218631392U (en) | 2022-11-16 | 2022-11-16 | Liquid cooling solid state mobile hard disk cartridge |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202223040248.XU CN218631392U (en) | 2022-11-16 | 2022-11-16 | Liquid cooling solid state mobile hard disk cartridge |
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