CN218601352U - Probe device of optical chip - Google Patents
Probe device of optical chip Download PDFInfo
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- CN218601352U CN218601352U CN202222595810.9U CN202222595810U CN218601352U CN 218601352 U CN218601352 U CN 218601352U CN 202222595810 U CN202222595810 U CN 202222595810U CN 218601352 U CN218601352 U CN 218601352U
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- probe
- heat dissipation
- power
- dissipation channel
- cover plate
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Abstract
The utility model discloses an optical chip's probe device, wherein, above-mentioned optical chip's probe device includes: the probe comprises a probe support, an electrifying probe and a heat conducting fin, wherein a heat dissipation channel is arranged in the probe support, and cooling liquid is filled in the heat dissipation channel; the power-up probe comprises a fixing part and a probe head part, wherein the fixing part is fixed in the probe bracket, the probe head part extends out of the probe bracket, and the probe head part is of a solid structure; the heat conducting fin is fixed between the power-up probe and the heat dissipation channel. By adopting the technical scheme, the problems that the heat dissipation efficiency of the probe device of the optical chip is low and the like in the related technology are solved.
Description
Technical Field
The utility model relates to a laser field particularly, relates to an optical chip's probe device.
Background
With the continuous increase of the power of semiconductor laser chips, in the process of testing the photoelectric performance of the laser chips, power is often required to be supplied to the chips through power-up probes. How to test a high-power laser chip through a power-on probe is a problem which needs to be solved currently.
In the prior art, the power-on probe is usually radiated by air convection and heat radiation in the testing process, which may cause the power-on probe to fail to radiate out heat generated in the testing process in time, so that the current born by the power-on probe is limited. In the case of using an increasing current, the heating value of the energized probe gradually increases, and when the energized probe is energized to above 40A, the probe may even be burnt directly.
In the related art, no effective solution has been proposed yet to solve the problems of low heat dissipation efficiency of the probe device of the optical chip, and the like.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an optical chip's probe device to at least, in solving the correlation technique, optical chip's probe device radiating efficiency is lower scheduling problem.
According to an embodiment of the present invention, there is provided a probe apparatus for an optical chip, including: a probe holder, an energizing probe, and a thermally conductive sheet, wherein,
a heat dissipation channel is arranged in the probe support, and cooling liquid is filled in the heat dissipation channel;
the power-up probe comprises a fixing part and a probe head part, wherein the fixing part is fixed in the probe bracket, the probe head part extends out of the probe bracket, and the probe head part is of a solid structure;
the heat conducting fin is fixed between the power-up probe and the heat dissipation channel.
In one exemplary embodiment, the probe holder is provided with a probe placement groove, the fixing portion is disposed in the probe placement groove, and the heat dissipation passage penetrates the probe holder from a region where the probe placement groove is not provided.
In one exemplary embodiment, the apparatus further comprises: a probe cover plate mated with the probe holder, wherein,
the probe cover plate is fixed on the probe support, and a vent hole is formed in the probe cover plate.
In one exemplary embodiment, the cooling liquid is water, or pentafluoropropane, or a liquid metal.
In one exemplary embodiment, it is characterized in that the heat-conducting sheet is fixed in the probe-placement groove by a heat-conducting adhesive.
In an exemplary embodiment, the thermal conductivity of the thermally conductive sheet is greater than or equal to 20W/m × K.
In an exemplary embodiment, the thermal conductivity of the thermally conductive paste is greater than or equal to 2W/m K.
In an exemplary embodiment, the thickness of the energized probe is less than or equal to 1.2mm.
In one exemplary embodiment, the current probing face of the probe head comprises a plurality of convex arcs.
In one exemplary embodiment, the power-on probe is connected with a power-on lead, and the probe cover plate is further provided with a lead through hole, wherein,
the energizing wire extends out of the probe cover plate from the wire through hole.
In an embodiment of the present invention, a probe apparatus for an optical chip includes: the probe comprises a probe support, an electrifying probe and a heat conducting fin, wherein a heat dissipation channel is arranged in the probe support, and cooling liquid is filled in the heat dissipation channel; the power-on probe comprises a fixing part and a probe head part, wherein the fixing part is fixed in the probe bracket, the probe head part extends out of the probe bracket, and the probe head part is of a solid structure; the heat-conducting strip is fixed between the power-on probe and the heat dissipation channel, namely, the fixing part of the power-on probe is fixed in the probe support, in the process of testing the optical chip, the heat-conducting strip fixed between the power-on probe and the heat dissipation channel can timely transfer heat generated by the power-on probe to the probe support, and then the heat generated by the power-on probe can be timely dissipated to the environment through cooling liquid filled in the heat dissipation channel arranged in the probe support. By adopting the technical scheme, the problems that the heat dissipation efficiency of the probe device of the optical chip is low and the like in the related technology are solved, and the technical effect of improving the heat dissipation efficiency of the probe device of the optical chip is realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. In the drawings:
fig. 1 is a block diagram of a probe apparatus of an optical chip according to an embodiment of the present invention;
FIG. 2 is a schematic view of a probe holder according to an embodiment of the present application;
FIG. 3 is a first schematic diagram of a heat dissipation channel according to an embodiment of the present application;
FIG. 4 is a second schematic diagram of a heat dissipation channel according to an embodiment of the present application;
FIG. 5 is a schematic view of a probe cover plate according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a current sensing plane according to an embodiment of the present application;
FIG. 7 is a schematic view of a powered wire extending out of a probe cover plate according to an embodiment of the present application;
FIG. 8 is a schematic diagram of a probe apparatus of an optical chip according to an embodiment of the present application.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in other sequences than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In the present embodiment, a probe apparatus of an optical chip is provided, and fig. 1 is a block diagram of a probe apparatus of an optical chip according to an embodiment of the present invention; as shown in fig. 1, includes: the probe comprises a probe support 102, an electrifying probe 104 and a heat conducting sheet 106, wherein a heat dissipation channel 102-1 is arranged in the probe support 102, and cooling liquid is filled in the heat dissipation channel 102-1; the powered probe 104 comprises a fixed part 104-1 and a probe head part 104-2, the fixed part 104-1 is fixed in the probe holder 102, the probe head part 104-2 extends out of the probe holder 102, and the probe head part 104-2 is of a solid structure; a thermally conductive sheet 106 is secured between the powered probe 104 and the heat dissipation channel 102-1.
Through the embodiment, the fixing part of the power-on probe is fixed in the probe support, in the process of testing the optical chip, the heat conducting sheet fixed between the power-on probe and the heat dissipation channel can timely transfer the heat generated by the power-on probe to the probe support, and then the heat generated by the power-on probe can be timely dissipated to the environment through the cooling liquid filled in the heat dissipation channel arranged in the probe support, and the probe head part of the power-on probe is of a solid structure, so that the cross sectional area of the power-on probe can be greatly increased, the contact resistance is reduced, and the heat generated in the process of testing the optical chip is further reduced. By adopting the technical scheme, the problems that the heat dissipation efficiency of the probe device of the optical chip is low and the like in the related technology are solved, and the technical effect of improving the heat dissipation efficiency of the probe device of the optical chip is realized.
In one exemplary embodiment, a probe placement groove is provided on the probe holder, the fixing portion is disposed in the probe placement groove, and the heat dissipation channel penetrates the probe holder from a region where the probe placement groove is not provided.
Alternatively, in this embodiment, the probe holder may be, but is not limited to, bakelite, ceramic, or other insulating material, and the heat dissipation channel may extend through the probe holder from a region where the probe placement groove is not located. FIG. 2 is a schematic view of a probe holder according to an embodiment of the present application, and as shown in FIG. 2, a probe placing groove 102-1 is provided in a probe holder 102, a fixing portion is disposed in the probe placing groove 102-1, and a heat dissipating passage 102-2 penetrates the probe holder 102 from a region where the probe placing groove 102-1 is not provided.
Optionally, in this embodiment, fig. 3 is a schematic diagram of a heat dissipation channel according to an embodiment of the present application, as shown in fig. 3, the left-right oriented heat dissipation channel 102-2 may, but is not limited to, penetrate through a region of the probe holder 102 where the probe placement groove 102-1 is not disposed, and the liquid inlet 102-2-1 of the heat dissipation channel may, but is not limited to, be located on the same side of the probe holder 102 as the liquid outlet 102-2-2 of the heat dissipation channel.
Optionally, in this embodiment, fig. 4 is a second schematic diagram of a heat dissipation channel according to an embodiment of the present application, as shown in fig. 4, the heat dissipation channel 102-2 running up and down may run through a region of the probe holder 102 where the probe placement groove 102-1 is not disposed, and the liquid inlet 102-2-1 of the heat dissipation channel may be located on the same side of the probe holder 102 as the liquid outlet 102-2-2 of the heat dissipation channel.
It should be noted that the heat dissipation channel may include, but is not limited to, a cylindrical heat dissipation channel or a cubic (e.g., square, rectangular, etc.) heat dissipation channel, which is illustrated in fig. 2 and 3 as a cylindrical heat dissipation channel, and the shape of the heat dissipation channel is not limited in this application. The liquid inlet and the liquid outlet of the heat dissipation channel may be, but not limited to, located on the same side or different sides of the probe holder, etc., and in fig. 3 and 4, it is only explained that the liquid inlet and the liquid outlet of the heat dissipation channel are located on the same side of the region of the probe holder where no probe-placing grooves are located, and in fact, the liquid inlet and the liquid outlet of the heat dissipation channel may be distributed on any side of the region of the probe holder where no probe-placing grooves are located, which is not limited in this application. In addition, in fig. 3 and fig. 4, only the directions of the heat dissipation channels are described with respect to the heat dissipation channels that run left and right and the heat dissipation channels that run up and down, and actually, the directions of the heat dissipation channels may be any directions that meet the production requirements, which is not limited in the present application.
In one exemplary embodiment, the apparatus further comprises: and the probe cover plate is matched with the probe support, the probe cover plate is fixed on the probe support, and a vent hole is formed in the probe cover plate.
Alternatively, in this embodiment, the number of probe covers may be, but is not limited to, the same as the number of powered probes fixed in the probe holder, the probe covers may be, but is not limited to, fixed on the probe holder by screws, fig. 5 is a schematic diagram of a probe cover according to an embodiment of the present application, as shown in fig. 5, the probe cover 402 may be, but is not limited to, provided with square vent holes 402-1 and square vent holes 402-2, and the probe cover 402 may be, but is not limited to, connected with the probe holder by screws 404-1 to 404-4.
It should be noted that, in fig. 5, the structure of the probe cover plate is explained only by setting two square vent holes on the probe cover plate, and actually, any number of vent holes with any shape may be set on the probe cover plate.
In one exemplary embodiment, the cooling liquid is water, or pentafluoropropane, or a liquid metal.
Optionally, in this embodiment, the liquid metal may be, but is not limited to, gallium metal and the like, and heat generated by the power-up probe in the process of testing the optical chip may be dissipated in time through water, pentafluoropropane, or liquid metal and other cooling liquids, so that the temperature of the power-up probe is controlled, the power-up requirement of the high-power chip may be met, and the durability of the power-up probe is improved.
In one exemplary embodiment, the heat conductive sheet is fixed in the probe placement groove by a heat conductive adhesive.
In an exemplary embodiment, the thermal conductivity of the thermally conductive sheet is greater than or equal to 20W/m × K.
In one exemplary embodiment, the thickness of the energized probe is less than or equal to 1.2mm.
Alternatively, in this embodiment, the thickness of the energizing probe may be, but is not limited to, greater than or equal to 0.5mm, and less than or equal to 1.2mm.
In one exemplary embodiment, the current probing surface of the probe head includes a plurality of convex curved surfaces.
Optionally, in this embodiment, the current probing surface of the probe head may be in contact with, but not limited to, an energization region of the optical chip, and the current probing surface is a convex arc surface, which may increase a contact area between the probe head and the optical chip in a process of testing the optical chip, thereby reducing a contact resistance between the probe head and the optical chip, and reducing heat generated in the process of testing the optical chip.
FIG. 6 is a schematic view of a current probing surface according to an embodiment of the present application, as shown in FIG. 6, the powered probe 104 includes a fixing portion 104-1 and a probe head 104-2, a connecting segment 104-3 between the fixing portion 104-1 and the probe head 104-2 can be, but is not limited to, a solid spring-shaped structure, and the current probing surface 104-2-1 of the probe head 104-2 includes a plurality of segments of convex arcs.
In an exemplary embodiment, a power-on lead is connected to the power-on probe, and a lead through hole is further formed in the probe cover plate, wherein the power-on lead extends out of the probe cover plate from the lead through hole.
Alternatively, in this embodiment, the power-on wires may extend from the wire through holes through the probe cover plate, and fig. 7 is a schematic diagram of a power-on wire extending from the probe cover plate according to an embodiment of the present application, as shown in fig. 7, the power-on wires 104-4 may be connected to the power-on probes 104, the probe cover plate 402 may be connected to the probe holder by screws 404-1 to 404-4, but is not limited to, the probe cover plate 402 may be provided with wire through holes 702, and the power-on wires 104-4 extend from the probe cover plate 402 through the wire through holes 702.
In order to better understand the probe device of the optical chip, the following explains the manufacturing process of the probe device of the optical chip, fig. 8 is a schematic diagram of the probe device of the optical chip according to the embodiment of the present application, and as shown in fig. 8 (a), the outline of the first part 802-1 and the second part 802-2 of the probe holder 802 can be completed by, but not limited to, machining, and the spring probe placing groove 802-3 (i.e. the probe placing groove mentioned above) and the guiding groove 802-4, and the first part and the second part of the built-in water channel 802-5 (i.e. the heat dissipation channel mentioned above) are machined. The copper foil with a thickness of 0.5mm can be machined into the spring probe 804 (i.e., the powered probe described above) and the probe head 804-1 can be machined to be continuously convex (i.e., the current-probing surface of the probe head described above includes a plurality of convex curved surfaces). The probe cover 806 may be, but is not limited to being, machined to complete the wire vias 806-1 and the air vias 806-2. The first portion 802-1 of the probe carrier 802 and the second portion 802-2 of the probe carrier may be welded together by, but are not limited to, a brazing process to provide a complete probe carrier 802, and the first portion and the second portion of the internal water channel 802-5 may be welded together to provide a complete water channel 802-5 (i.e., the heat sink channel described above). A water tube may be inserted into the water channel 802-5 (i.e., the heat sink channel described above) of the probe holder 802, but is not limited thereto. The high thermal conductivity spacer 808 (i.e., the above-mentioned thermal conductive sheet) may be, but is not limited to, fixed to the probe holder 802 by a thermal conductive adhesive. The energized leads 810 may be, but are not limited to being, soldered to the spring probes 804 (i.e., the energized probes described above) via a soldering process. The spring probes 804 may be placed, but not limited to, in the placement grooves 802-3 (i.e., the probe placement grooves described above) of the probe holder 802 to which the high thermal conductivity pads 808 are fixed, and the probe heads are protruded from the guide grooves 802-4. The probe cover plate 806 may be, but is not limited to, screwed to the probe holder 802 and the power-up leads 810 may be extended from the lead through holes 806-1, as shown in fig. 8 (b), resulting in a packaged probe device.
It should be noted that, only the cylindrical heat dissipation channel is illustrated in fig. 8, in fact, the heat dissipation channel may include, but is not limited to, a cylindrical heat dissipation channel or a cubic (such as a square, a rectangular parallelepiped, etc.) shape, and the shape of the heat dissipation channel is not limited in this application. In fig. 8, only the case where the wire through hole and the vent hole are different holes and one vent hole is provided on the probe cover plate is illustrated as an example, the wire through hole and the vent hole may be, but are not limited to, the same hole, or different holes, and may be, but are not limited to, any number of vent holes provided on the probe cover plate, which is not limited in the present application.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A probe apparatus of an optical chip, comprising: a probe holder, an energizing probe, and a heat-conducting sheet, wherein,
a heat dissipation channel is arranged in the probe support, and cooling liquid is filled in the heat dissipation channel;
the power-up probe comprises a fixing part and a probe head part, wherein the fixing part is fixed in the probe bracket, the probe head part extends out of the probe bracket, and the probe head part is of a solid structure;
the heat conducting fin is fixed between the power-up probe and the heat dissipation channel.
2. The apparatus according to claim 1, wherein a probe placement groove is provided on the probe holder, the fixing portion is disposed in the probe placement groove, and the heat dissipation passage penetrates the probe holder from a region where the probe placement groove is not provided.
3. The apparatus of claim 2, further comprising: a probe cover plate mated with the probe holder, wherein,
the probe cover plate is fixed on the probe support, and a vent hole is formed in the probe cover plate.
4. The apparatus of claim 1, wherein the cooling fluid is water, or pentafluoropropane, or a liquid metal.
5. The apparatus according to claim 1, wherein the heat-conducting sheet is fixed in the probe placement groove by a heat-conducting adhesive.
6. The device of claim 5, wherein the thermally conductive sheet has a thermal conductivity greater than or equal to 20W/m K.
7. The apparatus of claim 6, wherein the thermal conductivity of the thermally conductive paste is greater than or equal to 2W/m K.
8. The apparatus of claim 1, wherein the thickness of the powered probe is less than or equal to 1.2mm.
9. The apparatus of claim 1, wherein the current probing surface of the probe head comprises a plurality of convex curved surfaces.
10. The apparatus of claim 9, wherein the power probe is connected with a power wire, and the probe cover plate is further provided with a wire through hole, wherein,
the power-up wire extends out of the probe cover plate from the wire through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222595810.9U CN218601352U (en) | 2022-09-29 | 2022-09-29 | Probe device of optical chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222595810.9U CN218601352U (en) | 2022-09-29 | 2022-09-29 | Probe device of optical chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218601352U true CN218601352U (en) | 2023-03-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222595810.9U Active CN218601352U (en) | 2022-09-29 | 2022-09-29 | Probe device of optical chip |
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|---|---|
| CN (1) | CN218601352U (en) |
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- 2022-09-29 CN CN202222595810.9U patent/CN218601352U/en active Active
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