CN218570073U - Battery reverse connection prevention circuit and modular inverter - Google Patents
Battery reverse connection prevention circuit and modular inverter Download PDFInfo
- Publication number
- CN218570073U CN218570073U CN202222628875.9U CN202222628875U CN218570073U CN 218570073 U CN218570073 U CN 218570073U CN 202222628875 U CN202222628875 U CN 202222628875U CN 218570073 U CN218570073 U CN 218570073U
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- 230000002441 reversible effect Effects 0.000 title claims description 8
- 230000002265 prevention Effects 0.000 title abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 71
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- 238000001816 cooling Methods 0.000 claims abstract description 39
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 230000005669 field effect Effects 0.000 claims description 20
- 238000009413 insulation Methods 0.000 claims description 19
- 239000004519 grease Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims description 5
- 230000000087 stabilizing effect Effects 0.000 claims 3
- 239000003990 capacitor Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000005611 electricity Effects 0.000 description 10
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 7
- 239000006096 absorbing agent Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 241000883990 Flabellum Species 0.000 description 5
- 230000006378 damage Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of inverters, in particular to a battery reverse-connection prevention circuit and a modular inverter; the heat dissipation device comprises a shell, a mainboard installed in the shell, an air cooling assembly and a water cooling mechanism, the water cooling mechanism comprises a heat absorbing plate, a heat conduction column, heat dissipation fins, a water tank, a circulating pump and a heat dissipation pipeline, the heat generated by the mainboard is conveyed to the heat dissipation fins on the heat absorbing plate by the heat conduction column, a semiconductor refrigerator is started, water in the water tank is refrigerated, the circulating pump is started, cold water in the water tank is conveyed into the heat dissipation pipeline, the heat dissipation pipeline is embedded between gaps of the heat dissipation fins, the cold water in the heat dissipation pipeline and the heat dissipation fins can fully exchange heat, the heat dissipation fins can keep good heat dissipation performance, the structure is adopted, the air cooling assembly is matched for heat dissipation, and the heat dissipation effect is better.
Description
Technical Field
The utility model relates to an inverter technical field especially relates to a reverse-connection circuit and modularization dc-to-ac converter are prevented to battery.
Background
The modular inverter is composed of three basic structures through various power modules: redundancy, upgrading and expansion can be achieved through different selections and sizes, the modular inverter can generate heat when in use, and the modular inverter can be damaged due to overheating caused by heat accumulation.
Most set up the forced air cooling subassembly through the casing at the dc-to-ac converter among the prior art, set up the radiating groove on the casing of dc-to-ac converter, blow to the inside electronic component of casing through the forced air cooling subassembly to the cooperation radiating groove for the inside circulation of air speed with external environment of casing, the heat that produces when taking away electronic component operation, thereby avoid the modularization dc-to-ac converter in the use, overheated damage.
However, in the existing modular inverter, the heat dissipation groove is formed in the outer side of the shell, and the air cooling assembly is used for accelerating air circulation in the shell, so that the heat dissipation effect is not ideal.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a reverse connection circuit and modularization dc-to-ac converter are prevented to battery, and the modularization dc-to-ac converter of solving among the prior art utilizes the forced air cooling subassembly to accelerate the circulation of air in the casing through seting up the radiating groove in the outside of casing to carry out radiating mode to the inside of casing, the not ideal problem of radiating effect inadequately.
In order to achieve the purpose, the utility model provides a modularized inverter, which comprises a shell, a main board, an air cooling component and a water cooling mechanism, wherein the main board, the air cooling component and the water cooling mechanism are arranged in the shell;
the water cooling mechanism comprises a heat absorbing plate, a heat conducting column, heat radiating fins, a water tank, a circulating pump and a heat radiating pipeline, wherein the heat absorbing plate is installed on the outer side of the shell, the heat radiating fins are arranged on one side of the heat absorbing plate, the heat conducting column is arranged on the other side of the heat absorbing plate and penetrates through the shell, one end, far away from the heat absorbing plate, of the heat conducting column is attached to the mainboard, the water tank and the circulating pump are arranged on the outer portion of the shell, the input end of the circulating pump is located inside the water tank, the output end of the circulating pump is provided with the heat radiating pipeline, the heat radiating pipeline is embedded between gaps of the heat radiating fins, and a semiconductor refrigerator is arranged on the water tank.
Wherein, the heat dissipation pipeline includes connecting pipe, serpentine coil and wet return, serpentine coil inlays to be established between heat radiation fins's the clearance, serpentine coil's one end is provided with the connecting pipe, serpentine coil's another singly is provided with the wet return, the connecting pipe is kept away from serpentine coil's one end with the output of circulating pump is corresponding, the wet return is kept away from serpentine coil's one end with the return water mouth of water tank is corresponding, the return water mouth is located the upper surface of water tank.
The heat absorbing plate comprises a plate body, two vertical plates and two fixing plates, wherein the vertical plates are arranged on two sections of the plate body, each vertical plate is perpendicular to the plate body, one ends, far away from the plate body, of the vertical plates are provided with the fixing plates, and the fixing plates are detachably connected with the shell.
The heat-conducting columns are multiple in number, each heat-conducting column comprises a column body and silicone grease, the column bodies are arranged in a hollow structure, and the silicone grease is coated on the inner walls of the column bodies.
The modularized inverter further comprises a heat dissipation assembly, the heat dissipation assembly comprises a heat insulation frame and an exhaust fan, the heat insulation frame is detachably connected with the water tank and covers the outer portion of the hot end of the semiconductor refrigerator, the exhaust fan is arranged inside the heat insulation frame, and the exhaust fan is located at one end, far away from the water tank, of the heat insulation frame.
The heat dissipation assembly further comprises a protective cover, the protective cover is detachably connected with the heat insulation frame and is located at one end, far away from the water tank, of the heat insulation frame.
Wherein, the forced air cooling subassembly includes mounting plate and a plurality of forced air cooling flabellum, mounting plate installs on the inside wall of casing, and be located the casing is kept away from one side of radiating groove, the last a plurality of mounting grooves that are provided with of mounting plate, every the inside of mounting groove all is provided with the forced air cooling flabellum.
The utility model provides a battery prevents reverse connection circuit, be applied to as above the modularization dc-to-ac converter, the battery prevents reverse connection circuit includes fuse F1, diode D2, zener diode DZ1, field effect transistor Q1, resistance R2, resistance R3 and resistance R6, electric capacity C2, battery wiring terminal BAT +, BAT-, fuse F1's one end is connected with battery wiring terminal BAT + electricity, power end VCC is drawn forth to fuse F1's the other end, diode D2's positive pole is connected with battery wiring terminal BAT + electricity, be connected with field effect transistor Q1's grid electricity behind diode D2's the negative pole series resistance R2, ground connection behind field effect transistor Q1's the grid series resistance R3, zener diode DZ 1's negative pole is connected with field effect transistor Q1's grid electricity, zener diode DZ 1's positive pole ground connection, field effect transistor Q1's source electrode and battery BAT-electricity are connected, field effect transistor Q1's drain electrode ground connection, resistance R6's one end ground connection, be connected with battery BAT + electricity behind resistance C2.
The utility model discloses a reverse-connection preventing circuit of battery and modularization dc-to-ac converter, include the casing, install mainboard, air-cooled subassembly and the water-cooling mechanism in the casing, water-cooling mechanism includes absorber plate, heat conduction post, heat radiation fins, water tank, circulating pump and heat dissipation pipeline, utilizes the heat conduction post will the heat that the mainboard produced is carried extremely on the absorber plate on the heat radiation fins, start the semiconductor refrigerator, it is right water in the water tank refrigerates the back, starts the circulating pump, will cold water in the water tank carry extremely in the heat dissipation pipeline, because the heat dissipation pipeline inlays to be established between heat radiation fins's the clearance, make cold water in the heat dissipation pipeline with heat radiation fins fully exchanges heat, makes heat radiation fins keeps good heat dispersion, adopts above-mentioned structure, and cooperates the air-cooled subassembly dispels the heat, and the radiating effect is better.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a modular inverter according to a first embodiment of the present invention.
Fig. 2 isbase:Sub>A sectional view of the internal structure taken along linebase:Sub>A-base:Sub>A of fig. 1 according to the present invention.
Fig. 3 is a schematic structural view of a water cooling mechanism according to a first embodiment of the present invention.
Fig. 4 is a partial structure enlarged view of B of fig. 3 provided by the present invention.
Fig. 5 is a schematic structural diagram of a modular inverter according to a second embodiment of the present invention.
Fig. 6 is a partial structure enlarged view of C of fig. 5 according to the present invention.
Fig. 7 is a schematic circuit diagram of a battery reverse connection prevention circuit provided by the present invention.
101-shell, 102-main board, 103-absorber plate, 104-heat-conducting column, 105-heat-radiating fin, 106-water tank, 107-circulating pump, 108-heat-radiating pipeline, 109-connecting pipe, 110-serpentine coil pipe, 111-water return pipe, 112-plate body, 113-vertical plate, 114-fixing plate, 115-installation bottom plate, 116-air-cooled fan blade, 117-heat-radiating groove, 118-installation groove, 119-semiconductor refrigerator, 120-column body, 121-silicone grease, 201-heat-insulating frame, 202-exhaust fan and 203-protective cover.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
The first embodiment:
referring to fig. 1 to 4, fig. 1 isbase:Sub>A schematic structural diagram ofbase:Sub>A modular inverter, fig. 2 isbase:Sub>A sectional view of an internal structure taken along linebase:Sub>A-base:Sub>A of fig. 1, fig. 3 isbase:Sub>A schematic structural diagram ofbase:Sub>A water cooling mechanism inbase:Sub>A first embodiment, and fig. 4 is an enlarged view ofbase:Sub>A portion of the structure at B of fig. 3. The utility model provides a modularization inverter, include casing 101, install mainboard 102, air-cooled subassembly and the water-cooling mechanism in casing 101, the water-cooling mechanism includes absorber plate 103, heat conduction post 104, heat radiation fins 105, water tank 106, circulating pump 107 and heat dissipation pipeline 108, heat dissipation pipeline 108 includes connecting pipe 109, serpentine coil 110 and wet return 111, absorber plate 103 includes plate body 112, two risers 113 and two fixed plates 114, the air-cooled subassembly includes mounting plate 115 and a plurality of forced air cooling flabellum 116.
To this embodiment, the inside of casing 101 is provided with the forced air cooling subassembly, the output of forced air cooling subassembly with mainboard 102 is corresponding, the outer wall of casing 101 still is provided with radiating groove 117, mounting plate 115 installs on the inside wall of casing 101, and be located casing 101 is kept away from one side of radiating groove 117, be provided with a plurality of mounting grooves 118 on mounting plate 115, every the inside of mounting groove 118 all is provided with forced air cooling flabellum 116, through be provided with drive circuit on mounting plate 115, drive forced air cooling flabellum 116 is in the inside of mounting groove 118 rotates, thereby the cooperation radiating groove 117 accelerates the inside circulation of air speed with external environment of casing 101 takes away the heat that produces when electronic component moves to avoid the modularization inverter in the use, overheated damage.
The heat absorbing plate 103 is installed outside the housing 101, the heat dissipating fins 105 are disposed on one side of the heat absorbing plate 103, the heat conducting column 104 is disposed on the other side of the heat absorbing plate 103, the heat conducting column 104 penetrates through the housing 101, one end of the heat conducting column 104, which is far away from the heat absorbing plate 103, is attached to the main board 102, the water tank 106 and the circulating pump 107 are further disposed outside the housing 101, an input end of the circulating pump 107 is located inside the water tank 106, an output end of the circulating pump 107 is provided with the heat dissipating pipelines 108, the heat dissipating pipelines 108 are embedded between gaps of the heat dissipating fins 105, the water tank 106 is provided with the semiconductor refrigerator 119, heat generated by the main board 102 is transferred to the heat dissipating fins 105 on the heat absorbing plate 103 by the heat conducting column 104, the semiconductor refrigerator 119 is started, the circulating pump 107 is started after water in the water tank 106 is cooled, cold water in the water tank 106 is transferred to the heat dissipating pipelines 108, the heat dissipating pipelines 108 are embedded between gaps of the heat dissipating fins 105, so that the cold water in the heat dissipating pipeline 108 is fully matched with the heat dissipating fins 105, and the heat dissipating structure has a good heat dissipating effect, and the heat dissipating structure is further adopted.
Secondly, serpentine 110 inlays to be established between cooling fin 105's the clearance, serpentine 110's one end is provided with connecting pipe 109, serpentine 110's another singly is provided with wet return 111, connecting pipe 109 is kept away from serpentine 110's one end with circulating pump 107's output is corresponding, wet return 111 is kept away from serpentine 110's one end with water return 106's return mouth is corresponding, the return mouth is located the upper surface of water tank 106, cold water in the water tank 106 is through connecting pipe 109 carries to serpentine 110's inside, utilizes serpentine 110 with cooling fin 105 fully exchanges the back, wet return 111 passes through the water return mouth carries to the inside of water tank 106 to accomplish the circulation refrigeration, because the return mouth is located the upper surface of water tank 106, thereby make whole radiating pipeline 108 is one-way circulation, avoids cold water in the water tank 106, through cooling pipe 111 circulates.
Simultaneously, two sections of plate body 112 all are provided with riser 113, every riser 113 all with plate body 112 is mutually perpendicular, every riser 113 is kept away from the one end of plate body 112 all is provided with fixed plate 114, fixed plate 114 with casing 101 is dismantled and is connected, two riser 113 all with plate body 112 fixed connection, fixed plate 114 with riser 113 fixed connection adopts integrated into one piece technique to make during the manufacturing, and the structure is more firm, utilizes the screw will fixed plate 114 is installed on the casing 101 to accomplish the installation of absorber plate 103.
In addition, the number of the heat conduction columns 104 is multiple, each heat conduction column 104 comprises a column 120 and silicone grease 121, the column 120 is arranged in a hollow structure, the silicone grease 121 is coated on the inner wall of the column 120, and heat on the main plate 102 is transmitted to the heat absorption plate 103 through the column 120 and the silicone grease 121.
When the modular inverter of this embodiment is used, the driving circuit is disposed on the mounting base plate 115 to drive the air-cooled fan blades 116 to rotate inside the mounting groove 118, so as to cooperate with the heat dissipation groove 117 to accelerate the air circulation rate between the inside of the housing 101 and the external environment, and to take away the heat generated when the electronic component operates, so as to prevent the modular inverter from being damaged by overheating during use, and the heat generated by the motherboard 102 is transferred to the heat dissipation fins 105 on the heat absorption plate 103 by the heat conduction post 104, the semiconductor refrigerator 119 is started, after the water in the water tank 106 is cooled, the circulation pump 107 is started to transfer the cold water in the water tank 106 to the heat dissipation pipeline 108, and since the heat dissipation pipeline 108 is embedded between the gaps of the heat dissipation fins 105, the cold water in the heat dissipation pipeline 108 and the heat dissipation fins 105 exchange heat sufficiently, so that the heat dissipation fins 105 maintain good heat dissipation performance, and the heat dissipation effect is better.
The second embodiment:
referring to fig. 5 and 6 based on the first embodiment, fig. 5 is a schematic structural diagram of a modular inverter in the second embodiment, and fig. 6 is an enlarged view of a partial structure at C of fig. 5. The utility model provides a modularization inverter still includes radiator unit, radiator unit includes thermal-insulated frame 201, exhaust fan 202 and safety cover 203.
For the present specific embodiment, the heat insulation frame 201 is detachably connected to the water tank 106, and is covered on the outside of the hot end of the semiconductor refrigerator 119, the exhaust fan 202 is disposed inside the heat insulation frame 201, the exhaust fan 202 is located at one end of the heat insulation frame 201 far away from the water tank 106, the heat insulation frame 201 is disposed outside the hot end of the semiconductor refrigerator 119, and the exhaust fan 202 is utilized to take away heat in the heat insulation frame 201, so as to reduce the temperature of the hot end of the semiconductor refrigerator 119, and further to correspondingly reduce the temperature of the cold end of the semiconductor refrigerator 119, thereby achieving a lower temperature.
Wherein, the safety cover 203 with thermal-insulated frame 201 is dismantled and is connected, and is located thermal-insulated frame 201 is kept away from the one end of water tank 106, through the safety cover 203 is right exhaust fan 202 shields, avoids user of service miscontact exhaust fan 202 causes the injury to user of service.
When the modular inverter of the embodiment is used, the heat insulation frame 201 is arranged outside the hot end of the semiconductor refrigerator 119, the exhaust fan 202 is used for taking away heat in the heat insulation frame 201, so that the temperature of the hot end of the semiconductor refrigerator 119 is reduced, the temperature of the cold end of the semiconductor refrigerator 119 is correspondingly reduced, a lower temperature is reached, the exhaust fan 202 is shielded by the protective cover 203, and the condition that a user mistakenly contacts the exhaust fan 202 to hurt the user is avoided.
Please refer to fig. 7, the utility model provides a battery anti-reverse connection circuit, be applied to the modularization dc-to-ac converter as described above, the battery is prevented reverse connection circuit and is included fuse F1, diode D2, zener diode DZ1, field effect transistor Q1, resistance R2, resistance R3 and resistance R6, electric capacity C2, battery terminal BAT +, BAT-, fuse F1's one end is connected with battery terminal BAT + electricity, power end VCC is drawn forth to fuse F1's the other end, diode D2's positive pole is connected with battery terminal BAT + electricity, be connected with field effect transistor Q1's grid electricity behind diode D2's the negative pole series resistance R2, ground connection behind field effect transistor Q1's the grid series resistance R3, zener diode DZ 1's negative pole is connected with field effect transistor Q1's grid electricity, zener diode DZ 1's positive pole ground connection, field effect transistor Q1's source and battery terminal BAT-electricity are connected, field effect transistor Q1's ground connection, resistance R6's one end drain electrode is grounded, be connected with battery terminal BAT + electricity behind resistance R6 the other end series capacitance C2.
In the embodiment, when the circuit is used and the storage battery is reversely connected, the field effect tube inside the circuit cannot be conducted, so that the protection of a post-stage circuit can be realized, the fuse inside the circuit does not need to be replaced, and in addition, because the field effect tube cannot be conducted, after the storage battery is reversely connected, no current is generated in the circuit, so that the storage battery can be prevented from being damaged.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention.
Claims (8)
1. A modularized inverter comprises a shell, a main board and an air cooling component, wherein the main board and the air cooling component are arranged in the shell, the air cooling component is arranged in the shell, the output end of the air cooling component corresponds to the main board, the outer wall of the shell is also provided with a heat dissipation groove, and the modularized inverter is characterized in that,
the device also comprises a water cooling mechanism;
the water cooling mechanism comprises a heat absorbing plate, a heat conducting column, heat radiating fins, a water tank, a circulating pump and a heat radiating pipeline, wherein the heat absorbing plate is installed on the outer side of the shell, the heat radiating fins are arranged on one side of the heat absorbing plate, the heat conducting column is arranged on the other side of the heat absorbing plate and penetrates through the shell, one end, far away from the heat absorbing plate, of the heat conducting column is attached to the mainboard, the water tank and the circulating pump are arranged on the outer portion of the shell, the input end of the circulating pump is located inside the water tank, the output end of the circulating pump is provided with the heat radiating pipeline, the heat radiating pipeline is embedded between gaps of the heat radiating fins, and a semiconductor refrigerator is arranged on the water tank.
2. A modular inverter as claimed in claim 1,
the heat dissipation pipeline includes connecting pipe, serpentine coil and wet return, serpentine coil inlays to be established between heat radiation fins's the clearance, serpentine coil's one end is provided with the connecting pipe, serpentine coil's another list is provided with the wet return, the connecting pipe is kept away from serpentine coil's one end with the output of circulating pump is corresponding, the wet return is kept away from serpentine coil's one end with the return water mouth of water tank is corresponding, the return water mouth is located the upper surface of water tank.
3. A modular inverter as claimed in claim 1,
the heat absorbing plate comprises a plate body, two vertical plates and two fixing plates, the vertical plates are arranged on two sections of the plate body, each vertical plate is perpendicular to the plate body, the fixing plates are arranged at the ends, far away from the plate body, of the vertical plates, and the fixing plates are detachably connected with the shell.
4. A modular inverter as claimed in claim 1,
the quantity of heat conduction post is a plurality of, every the heat conduction post all includes cylinder and silicone grease, the cylinder is hollow structure setting, scribble on the inner wall of cylinder and be equipped with the silicone grease.
5. A modular inverter as claimed in claim 1,
the modularized inverter further comprises a heat dissipation assembly, the heat dissipation assembly comprises a heat insulation frame and an exhaust fan, the heat insulation frame is detachably connected with the water tank and covers the outer portion of the hot end of the semiconductor refrigerator, the exhaust fan is arranged inside the heat insulation frame, and the exhaust fan is located at one end, away from the water tank, of the heat insulation frame.
6. A modular inverter as claimed in claim 5,
the heat dissipation assembly further comprises a protective cover, and the protective cover is detachably connected with the heat insulation frame and is located at one end, away from the water tank, of the heat insulation frame.
7. A modular inverter as claimed in claim 1,
the air cooling assembly comprises a mounting base plate and a plurality of air cooling fan blades, the mounting base plate is mounted on the inner side wall of the shell and located on one side of the radiating groove, a plurality of mounting grooves are formed in the mounting base plate, and each mounting groove is internally provided with the air cooling fan blades.
8. A battery anti-reverse connection circuit applied to the modular inverter of claim 1,
the battery reverse connection preventing circuit comprises a fuse F1, a diode D2, a voltage stabilizing diode DZ1, a field effect transistor Q1, a resistor R2, a resistor R3, a resistor R6, a capacitor C2, a battery wiring terminal BAT + and BAT-, one end of the fuse F1 is electrically connected with the battery wiring terminal BAT +, a power supply terminal VCC is led out from the other end of the fuse F1, the anode of the diode D2 is electrically connected with the battery wiring terminal BAT +, the cathode of the diode D2 is electrically connected with the grid of the field effect transistor Q1 after being connected with the resistor R2 in series, the grid of the field effect transistor Q1 is grounded after being connected with the resistor R3 in series, the cathode of the voltage stabilizing diode DZ1 is electrically connected with the grid of the field effect transistor Q1, the anode of the voltage stabilizing diode DZ1 is grounded, the source of the field effect transistor Q1 is electrically connected with the battery wiring terminal BAT-, the drain of the field effect transistor Q1 is grounded, one end of the resistor R6 is grounded, and the other end of the resistor R6 is electrically connected with the battery wiring terminal BAT + after being connected with the capacitor C2 in series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222628875.9U CN218570073U (en) | 2022-10-08 | 2022-10-08 | Battery reverse connection prevention circuit and modular inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222628875.9U CN218570073U (en) | 2022-10-08 | 2022-10-08 | Battery reverse connection prevention circuit and modular inverter |
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| Publication Number | Publication Date |
|---|---|
| CN218570073U true CN218570073U (en) | 2023-03-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222628875.9U Active CN218570073U (en) | 2022-10-08 | 2022-10-08 | Battery reverse connection prevention circuit and modular inverter |
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| CN (1) | CN218570073U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118739083A (en) * | 2024-04-05 | 2024-10-01 | 广州玖星科技有限公司 | An intelligent heat dissipation system for power cabinet |
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2022
- 2022-10-08 CN CN202222628875.9U patent/CN218570073U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118739083A (en) * | 2024-04-05 | 2024-10-01 | 广州玖星科技有限公司 | An intelligent heat dissipation system for power cabinet |
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