CN218424099U - Make things convenient for vibration grader that semiconductor material of ejection of compact used - Google Patents

Abstract

The utility model relates to the field of oscillating classifiers, in particular to an oscillating classifying machine for semiconductor materials that are convenient for discharging materials, comprising an oscillating classifying machine body, a feeding pipe is arranged at the top of the oscillating classifying machine body, and the oscillating classifying machine body One side of the main body is respectively provided with discharge pipes, and the inside of the vibration classifying machine body is evenly provided with an inner engaging plate, and the inside of the inner engaging plate is inserted and engaged with a sub-sieve plate, and the number of the sub-sieve plates is Three groups. The utility model is provided with an outer clamping plate, a concave clamp, an inner clamping plate and a sub-sieve plate. After the concave clamp is opened, the outer clamping plate is sequentially taken out, and the arc-shaped clamping block is squeezed, so that the arc-shaped clamping block squeezes the internal The spring piece is used to leave the card slot of the oscillating and grading chassis body, so that the sub-sieve plates can be taken out one by one, and the blocked apertures on the sub-sieve plates can be completely cleaned, and the disassembly and maintenance are convenient.

Description

A vibrating classifier for semiconductor materials that is convenient for discharging

technical field

The utility model relates to the field of oscillating classifiers, in particular to an oscillating classifier for semiconductor materials that is convenient for discharging.

Background technique

High-purity quartz glass powder is characterized by high temperature resistance, non-conductivity, and electric leakage prevention. It is mainly used in the semiconductor industry. The classifier is widely used to screen out high-purity quartz glass powder due to uneven particle size due to ball milling, resulting in uneven particle size. Coarse particles after screening can be reworked and used again. The machine has the characteristics of simple structure, reliable operation and convenient operation.

However, when the existing oscillating classifier screens and classifies materials through repeated vibrations, because there are multi-layer grading filter plates inside, when people take out the classified materials, some of them are located at the corners of the filter plates. The material is inconvenient to take out, easy to accumulate and clogged, and the multi-layer grading filter plate is inconvenient for people to disassemble and clean. Therefore, it is necessary to design a vibration classifier for semiconductor materials that is convenient for discharging to solve the above problems.

Utility model content

In view of the existing vibrating classifier existing in the background technology, when the materials are screened and classified through repeated vibrations, because there are multi-layer grading filter plates inside, when people take out the classified materials, some of them are located on the filter plate. The material at the corners of the filter is inconvenient to take out, easy to accumulate and block, and the multi-layer grading filter plate is inconvenient for people to disassemble and clean. A vibration classifier for semiconductor materials that is convenient for discharging is proposed.

The utility model proposes an oscillating classifier for semiconductor materials that is convenient for discharging, which includes a oscillating grading box body, a feeding pipe is arranged on the top of the oscillating grading box body, and one side of the oscillating grading box body is respectively provided with Outlet pipe, the interior of the vibration classifying machine body is uniformly provided with an inner engaging plate, and the interior of the inner engaging plate is inserted and engaged with a sub-sieve plate, the number of the sub-sieve plates is three groups, and the vibration classifying The bottom end of the chassis body is provided with spring assemblies at four corners, the bottom end of the spring assembly is provided with a support rod, the bottom end of the shock grading cabinet body is provided with a vibration motor, and the bottom end of the support rod is provided with a dumping mechanism , so that the remaining material inside the oscillating grading chassis body can be quickly discharged from the discharge pipe.

Preferably, the internal apertures of the three sieve plates decrease sequentially from top to bottom.

Preferably, the number of the discharge pipes is four groups, and the discharge pipes are distributed in a staggered manner, and the outlets are not on the same horizontal line.

Preferably, concave clips are installed on the front thread of the vibration and classification cabinet body, and an outer clip is installed on the inside of the vibration and classification cabinet body for uniform engagement.

Preferably, the inner sides of the outer engaging plate and the inner engaging plate are provided with concave clips, hollow grooves are evenly opened on both sides of the outer engaging plate, and a spring leaf is arranged inside the hollow groove, and the spring leaf One end is provided with an arc-shaped block.

Preferably, the dumping mechanism includes a base bottom plate, one end of the base bottom plate is symmetrically provided with side poles, and an upper top plate is installed on the inner rotation of the two side poles, and the top end of the base bottom plate is provided with A hydraulic cylinder, the top of the hydraulic cylinder is rotatably connected to the bottom of the upper top plate.

Preferably, a support column is provided on the top of the base bottom plate.

Compared with the prior art, the beneficial effects of the utility model are:

1. By setting the outer clamping plate, the concave clamp, the inner clamping plate and the sub-sieve plate, after opening the concave clamp, take out the outer clamping plate one by one, squeeze the arc-shaped block, so that the arc-shaped block squeezes the inner spring It is easy to take out the sub-sieve plates one by one, and can completely clean the blocked apertures on the sub-sieve plates, which is convenient for disassembly and maintenance.

2. The glass semiconductor material is poured into the material tube by setting a discharge pipe and a dumping mechanism. By starting the vibration motor, the body of the oscillating grading box vibrates, and the spring assembly increases the amplitude of the vibration, so that the material advances in a straight line and sieves , the materials of different particles enter the corresponding track through the sieve plate, and finally are directly discharged through the discharge pipe, which makes the discharge convenient, and the hydraulic cylinder is activated to make the upper top plate tilt, so that the remaining materials inside the oscillating grading machine body can be removed. The discharge pipe is quickly discharged.

Description of drawings

Fig. 1 is the structural front view schematic diagram of the present utility model;

Fig. 2 is a schematic diagram of a side view section structure of the vibration classification chassis body of the present invention;

Fig. 3 is a schematic diagram of the side view structure of the outer engaging plate of the present invention;

Fig. 4 is a front structural schematic view of the dumping mechanism of the present invention.

In the figure: 110, the body of the oscillating and grading chassis; 120, the feeding pipe; 121, the arc block; 122, the inner engaging plate; 123, the sub-sieve plate; 124, the discharge pipe; 125, the outer engaging plate; Clip; 127, hollow groove; 128, spring sheet; 130, vibration motor; 131, support rod; 140, spring assembly; 200, dumping mechanism; 210, support column; 211, hydraulic cylinder; Pole; 214, the base plate.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Embodiment one

Please refer to Fig. 1-4, an embodiment provided by the utility model: a vibrating classifier for semiconductor materials that is convenient to discharge, including a vibrating classifying case body 110, and a feeding pipe is arranged on the top of the vibrating classifying case body 110 120, one side of the oscillating and grading cabinet body 110 is respectively provided with discharge pipes 124, and the inside of the oscillating and grading cabinet body 110 is evenly provided with an inner engaging plate 122, and the inside of the inner engaging plate 122 is inserted and engaged with a sub-sieve plate 123, which is divided into The number of sieve plates 123 is three groups, the bottom end of the vibration classification chassis body 110 is provided with spring assemblies 140 at four corners, the bottom end of the spring assembly 140 is provided with a support rod 131, and the bottom end of the vibration classification chassis body 110 is provided with a vibration motor 130 , the bottom end of the support rod 131 is provided with a tilting mechanism 200 . The tipping mechanism 200 includes a base bottom plate 214, one end of the base bottom plate 214 is symmetrically provided with side poles 213, the inner rotation of the two side poles 213 is equipped with an upper top plate 212, and the top of the base bottom plate 214 is provided with a hydraulic cylinder 211, The top of the hydraulic cylinder 211 is rotatably connected to the bottom of the upper top plate 212; the top of the base bottom plate 214 is provided with a support column 210, the glass semiconductor material is poured into the feeding pipe 120, and the vibrating motor 130 is started to vibrate the grading cabinet body 110 vibrates, and the spring assembly 140 increases the amplitude of the vibration, so that the material advances in a straight line to be sieved, and the materials of different particles enter the corresponding track through the sieve plate 123, and finally are directly discharged through the discharge pipe 124, making the discharge convenient. The hydraulic cylinder 211 is activated, so that the upper top plate 212 is tilted, so that the remaining material inside the oscillating and grading cabinet body 110 can be quickly discharged from the discharge pipe 124 .

Furthermore, the internal apertures of the three sieve plates 123 become smaller from top to bottom; the materials can be rapidly screened differently through the sieve plates 123 .

Further, the quantity of the discharge pipes 124 is four groups, and the discharge pipes 124 are distributed in a staggered manner, and the outlets are not on the same horizontal line. The distribution of the discharge pipes 124 is different to facilitate the separate collection of materials.

Embodiment two

The utility model proposes a vibrating classifier for convenient discharge of semiconductor materials. Compared with Embodiment 1, please refer to FIG. The inside of the outside is uniformly engaged with an outer engaging plate 125; the inner sides of the outer engaging plate 125 and the inner engaging plate 122 are provided with concave clips 126, and both sides of the outer engaging plate 125 are evenly provided with hollow grooves 127, and the hollow grooves 127 A spring piece 128 is arranged inside, and one end of the spring piece 128 is provided with an arc-shaped block 121; after the concave clip 126 is opened, the outer engaging plate 125 is taken out in sequence, and the arc-shaped block 121 is squeezed, so that the arc-shaped block 121 squeezes Press the inner spring piece 128, so as to leave the card slot of the oscillating and classifying chassis body 110, so that the sub-sieve plate 123 can be taken out in sequence, and the blocked apertures on the sub-sieve plate 123 can be completely cleaned, and the disassembly and maintenance are convenient.

The working principle of the utility model is as follows: the glass semiconductor material is poured into the material pipe 120, and the vibrating motor 130 is started to make the vibration classification cabinet body 110 vibrate, and the spring assembly 140 increases the amplitude of the vibration, so that the material advances in a straight line for sieving The materials of different particles enter the corresponding tracks through the sieve plate 123, and finally are directly discharged through the discharge pipe 124, which makes the discharge convenient. The remaining materials can be quickly discharged from the discharge pipe 124 .

After the concave clip 126 is opened, the outer engaging plate 125 is taken out sequentially, and the arc-shaped clamping block 121 is squeezed, so that the arc-shaped clamping block 121 squeezes the inner spring piece 128, thereby leaving the clamping groove of the shock grading chassis body 110, so that the The sub-sieve plates 123 are taken out sequentially, which can completely clean up the clogged apertures on the sub-sieve plates 123, and are convenient for disassembly and maintenance.

Above, the embodiment of the present utility model has been described in detail in conjunction with the accompanying drawings, but the present utility model is not limited thereto. Make various changes.

Claims (7)

1. An oscillating classifier for semiconductor materials that is convenient for discharging, it is characterized in that it includes a oscillating grading machine body (110), and the top of the oscillating grading machine body (110) is provided with a feed pipe (120), so One side of the oscillating and grading cabinet body (110) is respectively provided with discharge pipes (124), and the inside of the oscillating and grading cabinet body (110) is uniformly provided with an inner engaging plate (122), and the inner engaging plate (122 ) is inserted and engaged with a sub-sieve plate (123), the number of the sub-sieve plates (123) is three groups, and the bottom of the vibration and classification chassis body (110) is provided with spring assemblies (140) at four corners , the bottom end of the spring assembly (140) is provided with a support rod (131), the bottom end of the vibration classification chassis body (110) is provided with a vibration motor (130), and the bottom end of the support rod (131) is provided with There is a dumping mechanism (200). 2. The vibrating classifier for conveniently discharging semiconductor materials according to claim 1, characterized in that the internal apertures of the three sieving plates (123) become smaller sequentially from top to bottom. 3. The oscillating classifier for semiconductor materials that is convenient for discharging according to claim 1, characterized in that, the number of the discharge pipes (124) is four groups, and the discharge pipes (124) are staggered , their exports are no longer on the same horizontal line. 4. The vibration classifier for semiconductor materials that is convenient for discharging according to claim 1, characterized in that, a concave clip (126) is installed on the front thread of the vibration classifier box body (110), and the vibration classifier The inside of the grading chassis body (110) is uniformly engaged with an outer engaging plate (125). 5. The vibration classifier for semiconductor materials that is convenient for discharging according to claim 4, characterized in that, both the inner side of the outer engaging plate (125) and the inner engaging plate (122) are provided with concave clips ( 126), the two sides of the outer engaging plate (125) are uniformly provided with hollow grooves (127), the inside of the hollow groove (127) is provided with a spring piece (128), and one end of the spring piece (128) An arc-shaped block (121) is provided. 6. The vibration classifier for semiconductor materials that is convenient for discharging according to claim 1, characterized in that, the dumping mechanism (200) includes a base bottom plate (214), and the base bottom plate (214) One end of the side pole (213) is symmetrically arranged, the inner rotation of the two side poles (213) is installed with the upper top plate (212), and the top of the base bottom plate (214) is equipped with a hydraulic cylinder (211) , the top end of the hydraulic cylinder (211) is rotatably connected to the bottom end of the upper top plate (212). 7. The vibrating classifier for conveniently discharging semiconductor materials according to claim 6, characterized in that, a support column (210) is provided on the top of the base bottom plate (214).

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