CN218385722U - High-frequency universal electronic tag antenna assembly and electronic tag - Google Patents

Abstract

The utility model relates to an electronic tags field relates to a general electronic tags antenna module of high frequency and electronic tags very much. The utility model discloses a general electronic tags antenna module of high frequency and electronic tags, wherein, the electronic tags antenna module includes the base plate, spiral helicine antenna body in plane, a plurality of chip bonding pad subassemblies and a plurality of intercommunication unit, spiral helicine antenna body in plane and a plurality of chip bonding pad subassemblies set up the front at the base plate, a plurality of intercommunication units set up the back of base plate, a plurality of intercommunication units respectively with a plurality of chip bonding pad subassemblies one-to-one, be used for being connected to the different positions of antenna body respectively with a plurality of chip bonding pad subassemblies, intercommunication unit and chip bonding pad subassembly are separated and the accessible is perforated and mutual conduction connection by the base plate insulation. The utility model discloses an electronic tags antenna module can compatible multiple high frequency tag chip, uses portably, is convenient for produce and management, and is with low costs, and simple structure, easily realizes.

Description

High-frequency universal electronic tag antenna assembly and electronic tag

Technical Field

The utility model belongs to the electronic tags field specifically relates to a general electronic tags antenna module of high frequency and electronic tags.

Background

The electronic tag can play the roles of identification, article tracking and information acquisition. At present, an electronic tag serving as an information carrier of the internet of things is widely applied to various fields, such as supermarkets, logistics and other fields, so as to facilitate intelligent management of articles.

However, the antenna assembly of the existing high-frequency electronic tag has poor compatibility, one tag chip can only be used for one antenna assembly of the electronic tag, and when the tag chip is replaced, the electronic tag antenna needs to be redesigned, so that the use is inconvenient, the cost is high, the types of the antenna assemblies of the electronic tag are large, and the production and management are inconvenient.

Disclosure of Invention

An object of the utility model is to provide a general electronic tags antenna module of high frequency is used for solving the technical problem that above-mentioned exists.

In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a general electronic tags antenna module of high frequency, which comprises a substrate, the spiral antenna body of plane, a plurality of chip bonding pad subassemblies and a plurality of intercommunication unit, spiral antenna body of plane and a plurality of chip bonding pad subassemblies set up the front at the base plate, a plurality of intercommunication units set up the back of base plate, a plurality of intercommunication units respectively with a plurality of chip bonding pad subassemblies one-to-one, be used for being connected to the different positions of antenna body respectively with a plurality of chip bonding pad subassemblies, intercommunication unit and chip bonding pad subassembly are separated by the base plate is insulating and accessible perforation and mutual conduction connection.

Furthermore, the chip bonding pad assembly comprises a first sub-bonding pad and a second sub-bonding pad, the first sub-bonding pad is electrically connected with the antenna body, the second sub-bonding pad is provided with a first connecting portion, the antenna body is provided with a second connecting portion, the first connecting portion and the second connecting portion are disconnected, the communicating unit is provided with a third connecting portion and a fourth connecting portion which are electrically connected, and the third connecting portion and the fourth connecting portion respectively face the first connecting portion and the second connecting portion.

Furthermore, the first connecting portion, the second connecting portion, the third connecting portion and the fourth connecting portion are all of a disc structure.

Further, the antenna body is of a square spiral structure or a circular spiral structure.

Furthermore, the antenna further comprises an additional capacitor, and two pole plates of the additional capacitor are respectively arranged on the front surface and the back surface of the substrate and are respectively electrically connected with the antenna body and the communication unit.

Furthermore, two electrode plates of the additional capacitor are in a square structure.

Further, a plurality of chip pad assemblies are disposed inside the antenna body.

Furthermore, the antenna body, the chip pad assembly and the communication unit are all made of aluminum materials or copper materials.

Further, the substrate is made of a PET material.

The utility model also discloses an electronic tags, including foretell high frequency general electronic tags antenna module.

The utility model has the advantages of that:

the utility model discloses an electronic tags antenna module can compatible multiple high frequency label chip, and it is convenient to use, and the integrated level is high, is convenient for produce and manage, and is with low costs, and simple structure, easily realizes.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a front view of a high frequency universal electronic tag antenna assembly in accordance with an embodiment of the present invention;

fig. 2 is a rear view of a high frequency universal electronic tag antenna assembly in accordance with an embodiment of the present invention;

FIG. 3 is a schematic perspective view of a high frequency universal electronic tag antenna assembly according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an electronic tag according to an embodiment of the present invention.

Detailed Description

To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

As shown in fig. 1-3, a high-frequency universal electronic tag antenna assembly includes a substrate 1, a planar spiral antenna body 2, a plurality of chip pad assemblies 3 and a plurality of communication units 4, the planar spiral antenna body 2 and the plurality of chip pad assemblies 3 are disposed on the front surface of the substrate 1, the plurality of communication units 4 are disposed on the back surface of the substrate 1, the plurality of communication units 4 are respectively in one-to-one correspondence with the plurality of chip pad assemblies 3 for respectively connecting the plurality of chip pad assemblies 3 to different positions of the antenna body 2, so that the antenna bodies 2 connected to different chip pad assemblies 3 have different structures, and thus correspond to different tag chips, the communication units 4 are insulated from the chip pad assemblies 3 by the substrate 1 and can be conductively connected to each other by punching the substrate 1 when needed, so that the chip pad assemblies 3 are connected to corresponding positions of the antenna body 2.

In this embodiment, the number of the chip pad assemblies 3 is 3, which corresponds to three different tag chips, and correspondingly, the number of the communication units 4 is also 3, but not limited thereto, in some embodiments, the number of the chip pad assemblies 3 may be 2, 4, 5, and the like, and specifically may be set according to the number of the types of the tag chips compatible with the needs.

Specifically, in this embodiment, the chip pad assembly 3 includes a first sub-pad 31 and a second sub-pad 32, the first sub-pad 31 and the second sub-pad 32 are disposed at an interval, the first sub-pad 31 is directly electrically connected to the antenna body 3, the second sub-pad 32 is provided with a first connection portion 321, the antenna body 2 is provided with a second connection portion 21, the first connection portion 321 and the second connection portion 21 are disposed in a disconnected manner, the connection unit 4 is provided with a third connection portion 41 and a fourth connection portion 42 that are electrically connected, the third connection portion 41 and the fourth connection portion 42 respectively face the first connection portion 321 and the second connection portion 21, when necessary, the first connection portion 321 and the third connection portion 41 can be electrically connected by conducting through the substrate 1, and the fourth connection portion 42 and the second connection portion 21 can be electrically connected by conducting through the substrate 1, so that the second sub-pad 32 is electrically connected to the second connection portion 21 on the antenna body 2 through the connection unit 4. In this embodiment, there are 3 second connecting portions 21 of the antenna body 2,3 second connecting portions 21 are located at different positions of the antenna body 2, and correspond to the second sub-pads 32 of the 3 chip pad assemblies 3 through the 3 communicating units 4, respectively, and the first sub-pads 31 of the 3 chip pad assemblies 3 are directly electrically connected to different positions of the antenna body 3, as shown in fig. 3. By adopting the structure, the structure is simple, the use is easy, the number of the through holes is reduced, and certainly, in some embodiments, the first sub-pad 31 can also be disconnected from the antenna body 2, and then is communicated with the antenna body 2 by arranging the communication unit 4, namely, the structure is the same as that of the second sub-pad 32.

In this embodiment, the first connection portion 321, the second connection portion 21, the third connection portion 41, and the fourth connection portion 42 are all disc structures, which are compact in structure and easy to implement, and are convenient to distinguish from the square first sub-pad 31 and the square second sub-pad 32, thereby avoiding errors during punching. But not limited thereto, in some embodiments, the first connection portion 321, the second connection portion 21, the third connection portion 41 and the fourth connection portion 42 may also be in other shapes such as square, oval, prism, etc.

In this embodiment, the antenna body 2 has a square spiral structure, more specifically, a square ring structure, which is reasonable and compact in structure and easy to process, but not limited thereto, and in some embodiments, the antenna body 2 may also have other shapes such as a circle, a triangle, a hexagon, and the like.

Preferably, in the present embodiment, the communication unit 4 is a straight strip structure, and the third connection portion 41 and the fourth connection portion 42 are disposed at two ends, so that the structure is simple, the implementation is easy, and the cost is low, but not limited thereto, and in some embodiments, the communication unit 4 may also be implemented by using other structures.

Further, in the present embodiment, an additional capacitor 5 is further included, and two electrode plates 51 of the additional capacitor 5 are respectively disposed on the front surface and the back surface of the substrate 1, and are respectively electrically connected to the antenna body 2 and the communication unit 4, so as to adjust the frequency.

In this embodiment, the two plates 51 of the additional capacitor 5 have a square structure, which is reasonable and compact in structure and easy to implement, but not limited to this, and in some embodiments, the plates 51 may also have other structures such as a prism, a circle, and the like.

In this embodiment, the number of the additional capacitors 5 is two, and the two additional capacitors correspond to the two chip pad assemblies 3, but the invention is not limited thereto, and in some embodiments, the additional capacitors 5 may be set according to actual situations.

Preferably, in the present embodiment, 3 chip pad assemblies 3 and two additional capacitors 5 are disposed on the inner side of the antenna body 2, so that the overall structure is more compact and reasonable, but not limited thereto.

In this embodiment, the antenna body 2, the chip pad assembly 3, the communication unit 4 and the additional capacitor 5 are made of aluminum material, which has good electrical conductivity, easy processing and low cost, but not limited thereto, in some embodiments, the antenna body 2, the chip pad assembly 3, the communication unit 4 and the additional capacitor 5 may also be made of other conductive metal materials such as copper and silver.

In this embodiment, the substrate 1 is made of a PET material, and has good flexibility, stable performance, low cost, and easy implementation, but not limited thereto, and in some embodiments, the substrate 1 may also be implemented by using an existing PCB substrate or the like.

The utility model also discloses an electronic tags, as shown in fig. 4, including foretell general electronic tags antenna module of high frequency and label chip 6, label chip 6 welds on rather than corresponding chip bonding pad subassembly 3, and the first connecting portion 321 of the second sub-pad 32 of this chip bonding pad subassembly 3 and corresponding third connecting portion 41 punch a hole 7 and switch on the electricity and connect, and fourth connecting portion 42 and second connecting portion 21 also punch a hole 7 and switch on the electricity and connect to make the second sub-pad 32 of this chip bonding pad subassembly 3 be connected through communicating unit 4 and the second connecting portion 21 electricity that corresponds on the antenna body 2.

The utility model discloses an electronic tags antenna module is equipped with a plurality of chip bonding pad subassemblies 3, and different chip bonding pad subassemblies 3 can be connected to antenna body 2's different positions and corresponding to different label chip 6 through different intercommunication unit 4 as required to can compatible multiple high frequency label chip, be convenient for production and management, with low costs, and simple structure easily realizes.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A high frequency universal electronic tag antenna assembly, characterized by: the antenna comprises a substrate, a spiral antenna body, a plurality of chip welding disc assemblies and a plurality of communication units, wherein the spiral antenna body and the chip welding disc assemblies are arranged on the front surface of the substrate, the communication units are arranged on the back surface of the substrate, the communication units are in one-to-one correspondence with the chip welding disc assemblies respectively and are used for connecting the chip welding disc assemblies to different positions of the antenna body respectively, and the communication units and the chip welding disc assemblies are isolated by substrate insulation and can be connected with each other in a conduction mode through perforation.

2. The high frequency universal electronic tag antenna assembly of claim 1, characterized by: the chip bonding pad assembly comprises a first sub-bonding pad and a second sub-bonding pad, the first sub-bonding pad is electrically connected with the antenna body, the second sub-bonding pad is provided with a first connecting portion, the antenna body is provided with a second connecting portion, the first connecting portion and the second connecting portion are arranged in a disconnecting mode, the communicating unit is provided with a third connecting portion and a fourth connecting portion which are electrically connected, and the third connecting portion and the fourth connecting portion respectively face the first connecting portion and the second connecting portion.

3. The high frequency universal electronic tag antenna assembly of claim 2, characterized in that: the first connecting portion, the second connecting portion, the third connecting portion and the fourth connecting portion are all disc structures.

4. The high frequency universal electronic tag antenna assembly of claim 2, characterized in that: the antenna body is of a square spiral structure or a circular spiral structure.

5. The high frequency universal electronic tag antenna assembly of claim 2, characterized by: the antenna further comprises an additional capacitor, and two pole plates of the additional capacitor are respectively arranged on the front surface and the back surface of the substrate and are respectively electrically connected with the antenna body and the communication unit.

6. The high frequency universal electronic tag antenna assembly of claim 5, characterized by: two polar plates of the additional capacitor are of a square structure.

7. The high frequency universal electronic tag antenna assembly of claim 2, characterized by: a plurality of chip pad assemblies are disposed inside the antenna body.

8. The high frequency universal electronic tag antenna assembly of claim 2, characterized by: the antenna body, the chip welding disc component and the communication unit are all made of aluminum materials or copper materials.

9. The high frequency universal electronic tag antenna assembly of claim 2, characterized by: the substrate is made of PET materials.

10. An electronic tag, characterized in that: a high frequency universal electronic tag antenna assembly comprising any one of claims 1-9.

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