CN218371487U - Lifting mechanism of silicon wafer basket and drying and curing furnace device - Google Patents
Lifting mechanism of silicon wafer basket and drying and curing furnace device Download PDFInfo
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- CN218371487U CN218371487U CN202222646271.7U CN202222646271U CN218371487U CN 218371487 U CN218371487 U CN 218371487U CN 202222646271 U CN202222646271 U CN 202222646271U CN 218371487 U CN218371487 U CN 218371487U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 285
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 284
- 239000010703 silicon Substances 0.000 title claims abstract description 284
- 230000007246 mechanism Effects 0.000 title claims description 46
- 238000001035 drying Methods 0.000 title claims description 25
- 230000003028 elevating effect Effects 0.000 claims abstract description 27
- 235000012431 wafers Nutrition 0.000 claims description 215
- 238000003825 pressing Methods 0.000 claims description 26
- 230000000903 blocking effect Effects 0.000 claims description 15
- 230000000087 stabilizing effect Effects 0.000 claims description 10
- 230000007306 turnover Effects 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008676 import Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000005571 horizontal transmission Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a elevating system and stoving curing oven device of silicon chip basket of flowers, wherein elevating system includes: fixing a bracket; the lifting assembly is connected with the fixed support in a sliding mode and can move along the vertical direction; the silicon wafer basket comprises a lifting assembly, a bearing assembly and a limiting assembly, wherein the lifting assembly is fixed on the lifting assembly and used for bearing a silicon wafer basket, the silicon wafer basket is provided with a limiting assembly for shielding an inlet and an outlet of a silicon wafer, the limiting assembly comprises a limiting state and a passing state which can be switched mutually, the silicon wafer cannot enter and exit the silicon wafer basket in the limiting state, and the silicon wafer can enter and exit the silicon wafer basket in the passing state; and the driving component is arranged on the bearing component or the lifting component, so that the silicon wafer basket is switched to a passing state from a limiting state. The utility model provides an elevating system both can drive silicon chip basket of flowers and reciprocate, can also switch the state of spacing subassembly on the silicon chip basket of flowers, makes the silicon chip freely advance the state of silicon chip basket of flowers from the state switching of unable business turn over silicon chip basket of flowers to the silicon chip.
Description
Technical Field
The utility model relates to a photovoltaic equipment field especially relates to a elevating system and stoving curing oven device of silicon chip basket of flowers.
Background
When the HIT solar photovoltaic cell is prepared, the surface of a silicon wafer is required to be dried and cured after the conductive paste is printed on the surface of the silicon wafer. Therefore, generally set up elevating gear in the stoving curing oven device, the silicon chip basket of flowers has been placed on elevating gear, the silicon chip that will print conductive paste inserts in the silicon chip basket of flowers on the elevating gear, elevating gear goes up and down the silicon chip basket of flowers to preset position again, then through conveyer, send into the stoving curing oven with the silicon chip basket of flowers from one side in the stoving curing oven, the silicon chip basket of flowers is horizontal transmission and stoving in the stoving curing oven, the back of finishing is shifted out and is sent into in another elevating gear from the opposite side in the stoving curing oven. Because only one side of the commonly used silicon wafer basket can enter and exit the silicon wafer, when one side of the silicon wafer basket, which can enter and exit the silicon wafer, back to the drying and curing furnace and enters the drying and curing furnace, and when the silicon wafer basket moves to another lifting device from the drying and curing furnace, one side of the silicon wafer basket, which can enter and exit the silicon wafer, can face to the drying and curing furnace, so that the silicon wafer is not convenient to take and place from the silicon wafer basket. Therefore, an additional rotating device is needed to be added to turn the silicon wafer basket, so that the silicon wafer can be conveniently taken and placed. The addition of the extra device can lead to the overall lengthening of the drying and curing furnace equipment, the stability of the equipment is reduced, and the productivity is lower.
Therefore, a silicon wafer basket capable of allowing silicon wafers to enter and exit from multiple sides appears in the market, but the silicon wafers are required to be prevented from falling off from the basket when the silicon wafer basket is used, so that the silicon wafer basket is provided with a shielding structure for shielding the silicon wafers from entering and exiting from the silicon wafer basket, and the shielding structure is required to be moved when the silicon wafers are taken and placed. However, the lifting device of the silicon wafer basket in the prior art has a single function, can only be used for lifting the silicon wafer basket, and cannot move the shielding structure. Therefore, when the silicon wafer basket with the shielding structure is used, the corresponding equipment moving shielding structure needs to be additionally added, so that the whole drying and curing furnace equipment is lengthened, the equipment stability is reduced, and the productivity is lower. In addition, in the prior art, a silicon wafer basket with a part of silicon wafers capable of entering and exiting from only one side is also provided with a shielding structure to prevent the silicon wafers from falling off. When the silicon wafer basket is used, the problem that the existing lifting device cannot move the shielding structure to pick and place the silicon wafer can be solved, and therefore the corresponding equipment moving shielding structure is also additionally required to be added when the silicon wafer basket is used.
Therefore, the lifting device of the silicon wafer basket in the prior art needs to be upgraded so that the lifting device can open the shielding structure arranged on the silicon wafer basket and used for shielding the silicon wafer from entering and exiting, and then the silicon wafer can be smoothly taken and placed.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve among the above-mentioned prior art silicon chip basket of flowers elevating gear can't open the silicon chip basket on be used for sheltering from the silicon chip and import and export the technical problem who shelters from the structure, provide a silicon chip basket of flowers elevating system and stoving curing oven device.
The utility model adopts the technical proposal that:
the utility model provides a elevating system and stoving curing oven device of silicon chip basket of flowers, wherein elevating system includes:
fixing a bracket;
the lifting assembly is connected with the fixed support in a sliding mode and can move along the vertical direction;
the silicon wafer basket comprises a lifting assembly, a bearing assembly and a limiting assembly, wherein the lifting assembly is fixed on the lifting assembly and used for bearing a silicon wafer basket, the silicon wafer basket is provided with a limiting assembly for shielding an inlet and an outlet of a silicon wafer, the limiting assembly comprises a limiting state and a passing state which can be switched mutually, the silicon wafer cannot enter and exit the silicon wafer basket in the limiting state, and the silicon wafer can enter and exit the silicon wafer basket in the passing state;
and the driving component is arranged on the bearing component or the lifting component, so that the silicon wafer basket is switched to the passing state from the limiting state.
Furthermore, the silicon wafer basket fixing device further comprises a stabilizing assembly, wherein the stabilizing assembly is fixed on the lifting assembly, and the stabilizing assembly downwards extrudes the silicon wafer basket positioned on the bearing assembly.
In an embodiment, the carrying assembly comprises a carrying plate fixed at the bottom of the lifting assembly and a conveying belt arranged on the carrying plate, the carrying plate is horizontally arranged, the conveying direction of the conveying belt is the horizontal direction, a second end plate of the silicon wafer basket is placed on the conveying belt, and a plurality of anti-skidding grooves are formed in the second end plate.
In an embodiment, the driving assembly includes a first pushing cylinder and a second pushing cylinder fixed on the bearing plate, the first pushing cylinder and the second pushing cylinder are symmetrically disposed on two sides of the conveyor belt, and a moving direction of a push rod of the first pushing cylinder and a moving direction of a push rod of the second pushing cylinder are a horizontal direction and perpendicular to a conveying direction of the conveyor belt.
In one embodiment, the stabilizing assembly comprises a pressing cylinder fixed to the top of the lifting assembly and a pressing plate connected with a telescopic rod of the pressing cylinder, a positioning pin is arranged on the pressing plate, a positioning hole in plug-in connection with the positioning pin is formed in a first end plate of the silicon wafer basket, and the telescopic rod of the pressing cylinder drives the pressing plate to downwards extrude the first end plate.
In one embodiment, the silicon wafer basket comprises:
the end plate assembly comprises a first end plate and a second end plate which are oppositely arranged, a plurality of positioning holes are formed in the first end plate, and a plurality of anti-skidding grooves are formed in the surface, back to the first end plate, of the second end plate;
the connecting rod assembly comprises a plurality of first connecting rods which are connected with the first end plate and the second end plate, a plurality of basket teeth for bearing silicon wafers are arranged on the first connecting rods, a containing cavity for containing the silicon wafers is defined by the first connecting rods, and the containing cavity comprises two opposite silicon wafer inlets and two opposite silicon wafer outlets;
the limiting assembly comprises a blocking rod which is arranged in parallel to the first connecting rod, the blocking rod is switched between a first position which blocks the silicon wafer inlet and outlet and a second position which does not block the silicon wafer inlet and outlet, the limiting assembly is in the limiting state when the blocking rod is located at the first position, and the limiting assembly is in the passing state when the blocking rod is located at the second position.
In one embodiment, the position limiting assembly further comprises:
the two ends of the rotating rod are respectively and rotatably connected with the first end plate and the second end plate, the stop rod is connected with the rotating rod through a plurality of connecting rods, and a gap exists between the two ends of the stop rod and the first end plate as well as between the two ends of the stop rod and the second end plate;
the cam plate is connected with the rotating rod and the gear lever, the driving assembly drives the cam plate to rotate, and the rotating cam plate drives the gear lever to be switched from the first position to the second position;
and one end of the elastic piece is abutted against the cam plate, and the other end of the elastic piece is arranged on the second end plate.
The drying and curing oven device comprises an oven body for drying the silicon wafer and also comprises the lifting mechanism of the silicon wafer basket.
In an embodiment, two sides of the furnace body are respectively provided with one of the lifting mechanisms, a feeding mechanism is arranged beside one of the lifting mechanisms, and a discharging mechanism is arranged beside the other lifting mechanism.
In one embodiment, a two-dimensional code icon is arranged on the first end plate of the silicon wafer flower basket, and a scanning gun is arranged at the top of the drying and curing furnace device.
Compared with the prior art, the utility model provides an elevating system both can drive the silicon chip basket of flowers and reciprocate, can also switch the state of spacing subassembly on the silicon chip basket of flowers, makes the silicon chip freely advance the state of silicon chip basket of flowers from the state switching of unable business turn over silicon chip basket of flowers to the silicon chip. Therefore, the lifting mechanism integrates multiple functions, can be suitable for different silicon wafer flower baskets, and does not need to add extra equipment to corresponding processing equipment of the silicon wafer, so that the production cost of the silicon wafer is reduced, and the stability of the production process of the silicon wafer is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a side view of a lifting mechanism in an embodiment of the present invention;
fig. 2 is a schematic perspective view of an embodiment of the lifting mechanism of the present invention;
fig. 3 is a schematic structural view of a first pushing cylinder in the embodiment of the present invention;
fig. 4 is a schematic structural view of a second push cylinder in the embodiment of the present invention;
FIG. 5 is a schematic structural view of an unloaded silicon wafer of the silicon wafer basket according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a silicon wafer loading structure of a silicon wafer basket according to an embodiment of the present invention;
fig. 7 is a schematic structural view of a cam plate in an embodiment of the present invention;
fig. 8 is a schematic structural view of a second end plate according to an embodiment of the present invention;
1. a silicon wafer basket; 11. a first end plate; 111. positioning holes; 12. a second end plate; 121. an anti-slip groove; 122. an adjustment hole; 13. a first link; 14. a second link; 15. rotating the rod; 16. a gear lever; 17. a cam plate; 18. an elastic member; 19. a stopper; 2. a lifting mechanism; 21. a fixed bracket; 22. a lifting plate; 23. a carrier plate; 231. a conveyor belt; 24. a pressing cylinder; 25. a compression plate; 251. positioning pins; 26. a first push cylinder; 27. a second push cylinder; 3. and (3) a silicon wafer.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
When the HIT solar photovoltaic cell is prepared, the conductive paste is printed on the surface of the silicon wafer and then is dried and cured. Therefore, generally set up elevating gear in the stoving curing oven device, the silicon chip basket of flowers has been placed on elevating gear, the silicon chip that will print conductive paste inserts in the silicon chip basket of flowers on the elevating gear, elevating gear goes up and down the silicon chip basket of flowers to preset position again, then through conveyer, send into the stoving curing oven with the silicon chip basket of flowers from one side in the stoving curing oven, the silicon chip basket of flowers is horizontal transmission and stoving in the stoving curing oven, the back of finishing is shifted out and is sent into in another elevating gear from the opposite side in the stoving curing oven. Because only one side of the commonly used silicon wafer basket can be used for feeding and discharging the silicon wafers, when one side of the silicon wafer basket capable of feeding and discharging the silicon wafers back to the drying and curing furnace enters the drying and curing furnace, and when the silicon wafer basket moves to another lifting device from the drying and curing furnace, one side of the silicon wafer basket capable of feeding and discharging the silicon wafers faces the drying and curing furnace, so that the silicon wafers are not convenient to take out and place from the silicon wafer basket. Therefore, an additional rotating device is needed to be added to turn the silicon wafer basket, so that the silicon wafer can be conveniently taken and placed. The addition of the extra device can lead to the overall lengthening of the drying and curing furnace equipment, the stability of the equipment is reduced, and the productivity is lower.
Therefore, a silicon wafer basket capable of allowing silicon wafers to enter and exit from multiple sides appears in the market, but the silicon wafers are required to be prevented from falling off from the basket when the silicon wafer basket is used, so that the silicon wafer basket is provided with a shielding structure for shielding the silicon wafers from entering and exiting from the silicon wafer basket, and the shielding structure is required to be moved when the silicon wafers are taken and placed. However, the lifting device of the silicon wafer basket in the prior art is single in function, can only be used for lifting the silicon wafer basket, and cannot move the shielding structure. Therefore, when the silicon wafer basket with the shielding structure is used, a corresponding equipment moving shielding structure needs to be additionally added, so that the whole drying and curing furnace equipment is lengthened, the equipment stability is reduced, and the productivity is low. In addition, in the prior art, a silicon wafer basket with a part of silicon wafers capable of entering and exiting from only one side is also provided with a shielding structure to prevent the silicon wafers from falling off. When the silicon wafer basket is used, the problem that the existing lifting device cannot move the shielding structure to pick and place the silicon wafer can be solved, and therefore the corresponding equipment moving shielding structure is also additionally required to be added when the silicon wafer basket is used.
Consequently, in order to solve the technical problem that the elevating gear of silicon chip basket of flowers can't open the structure that shelters from that is used for sheltering from silicon chip import and export that sets up on the silicon chip basket of flowers among the prior art, the utility model provides an elevating system of silicon chip basket of flowers, include:
a fixed bracket;
the lifting assembly is connected with the fixed support in a sliding mode and can move along the vertical direction;
the silicon wafer basket comprises a lifting assembly, a bearing assembly and a limiting assembly, wherein the lifting assembly is fixed on the lifting assembly and used for bearing the silicon wafer basket, the silicon wafer basket is provided with a limiting assembly for shielding an inlet and an outlet of a silicon wafer, the limiting assembly comprises a limiting state and a passing state which can be mutually switched, the silicon wafer cannot enter or exit the silicon wafer basket from the inlet and the outlet of the silicon wafer when the limiting assembly is in the limiting state, and the silicon wafer can enter or exit the silicon wafer basket from the inlet and the outlet of the silicon wafer when the limiting assembly is in the passing state;
and the driving assembly is arranged on the bearing assembly or the lifting assembly, so that the limiting assembly is switched to a passing state from a limiting state.
To sum up, the utility model provides an elevating system both can drive the silicon chip basket of flowers and reciprocate, can also switch the state of spacing subassembly on the silicon chip basket of flowers, makes the silicon chip freely advance the state of silicon chip basket of flowers from the state switching of unable business turn over silicon chip basket of flowers. Therefore, the lifting mechanism integrates multiple functions, can be suitable for different silicon wafer flower baskets, and does not need to add extra equipment to corresponding processing equipment of the silicon wafers, so that the production cost of the silicon wafers is reduced, and the stability of the production process of the silicon wafers is improved.
The lifting mechanism 2 according to the present invention will be further explained with reference to the drawings and the embodiments.
As shown in fig. 1 and 2, the fixing bracket 21 is vertically disposed, and the fixing bracket 21 is provided with an electric slide rail, which is also vertically fixed on the fixing bracket 21. The lifting assembly comprises a lifting plate 22 which is vertically arranged, and the lifting plate 22 is fixed on the electric sliding rail and can move up and down along with the electric sliding rail. The bearing assembly comprises a bearing plate 23 and a conveyor belt 231, the bearing plate 23 is horizontally arranged, the conveyor belt 231 is arranged on the bearing plate 23, the bearing plate 23 is vertically connected and fixed with the lifting plate 22, the bearing plate 23 is fixed at the bottom of the lifting plate 22, and the transmission direction of the conveyor belt 231 is the horizontal direction. Silicon chip basket of flowers passes through the conveyer belt and moves to elevating system's preset position department, and during silicon chip basket of flowers also moved to next process device from elevating system through the conveyer belt simultaneously, when silicon chip basket of flowers was placed on the conveyer belt, second end plate 12 of silicon chip basket of flowers 1 and the one side that is equipped with multichannel antiskid groove 121 laminated with conveyer belt 231, and be equipped with multichannel antiskid groove 121 on second end plate 12 of silicon chip basket of flowers 1, antiskid groove 121 prevents that silicon chip basket of flowers from skidding at the in-process that removes.
Further, in order to enable the silicon wafer basket to keep a vertical state (the second end plate 12 of the silicon wafer basket 1 is attached to the conveyor belt 231) in the process of moving up and down along with the lifting mechanism, the lifting mechanism 2 further comprises a stabilizing component, and the stabilizing component extrudes the silicon wafer basket placed on the conveyor belt downwards. Specifically, the stabilizing assembly includes: a pressing cylinder 24 fixed on the top of the lifting plate 22, and a pressing plate 25 connected with the telescopic rod of the pressing cylinder 24. The telescopic link that compresses tightly cylinder 24 sets up vertically downwards, and the telescopic link that compresses tightly cylinder 24 can reciprocate, and pressure strip 25 is connected perpendicularly with the telescopic link that compresses tightly cylinder 24 to the telescopic link that compresses tightly cylinder 24 drives pressure strip 25 and reciprocates. The pressing plate 25 is flat, the pressing plate 25 is horizontally arranged, a positioning pin 251 is arranged on the surface of the pressing plate 25, which is opposite to the bearing plate 23, and the positioning pin 251 is inserted into the positioning hole 111 on the first end plate 11 of the silicon wafer basket 1. When the conveying belt conveys the silicon wafer basket to the preset position, the pressing cylinder works to drive the pressing plate to move downwards, the positioning pin on the pressing plate can be inserted into the positioning hole in the first end plate, and the pressing plate downwards extrudes the first end plate to enable the whole silicon wafer basket to be firmly fixed on the bearing plate, so that the silicon wafer basket is prevented from toppling over.
Specifically, as shown in fig. 1 to 4, the driving assembly includes a first pushing cylinder 26 and a second pushing cylinder 27, the first pushing cylinder 26 is disposed on the bearing plate 23, the second pushing cylinder 27 is disposed on the lifting plate 22, and the first pushing cylinder 26 and the second pushing cylinder 27 are symmetrically disposed on both sides of the conveying direction of the conveyor belt 231. The push rod of the first push cylinder 26 can move towards a direction close to the conveyor belt 231 or away from the conveyor belt 231, the moving direction of the push rod of the first push cylinder 26 is a horizontal direction, and the moving direction of the push rod of the first push cylinder 26 is perpendicular to the conveying direction of the conveyor belt 231. Similarly, the push rod of the second push cylinder 27 can move toward the direction close to the conveyor belt 231 or away from the conveyor belt 231, the moving direction of the push rod of the second push cylinder 27 is the horizontal direction, and the moving direction of the push rod of the second push cylinder 27 is perpendicular to the conveying direction of the conveyor belt 231. Therefore, when the silicon wafer basket is placed on the conveying belt (the silicon wafer inlet and outlet of the silicon wafer basket 1 faces the two ends of the conveying belt) and is transferred to the preset position by the conveying belt, the pressing cylinder drives the pressing plate to downwards extrude the silicon wafer basket, and after the silicon wafer basket is stable, the push rods of the first pushing cylinder and the second pushing cylinder move towards the direction close to the conveying belt, so that the limiting component on the silicon wafer basket 1 is driven to be switched to a passing state from a limiting state.
Specifically, how the pushing cylinder in the driving assembly drives the limiting assembly on the silicon wafer basket 1 to be switched from the limiting state to the passing state is explained below by combining the specific structure of the silicon wafer basket, and in this embodiment, the silicon wafer basket comprises:
the end plate assembly comprises a first end plate and a second end plate which are oppositely arranged, a plurality of positioning holes are formed in the first end plate, and a plurality of anti-skidding grooves are formed in the surface, back to the first end plate, of the second end plate;
the connecting rod assembly comprises a plurality of first connecting rods which are connected with the first end plate and the second end plate, a plurality of basket teeth for bearing silicon wafers are arranged on the first connecting rods, a containing cavity for containing the silicon wafers is defined by the first connecting rods, and the containing cavity comprises two silicon wafer inlets and two silicon wafer outlets which are oppositely arranged;
the limiting assembly is used for shielding the silicon wafer inlet and outlet and comprises a blocking rod arranged in parallel with the first connecting rod, the blocking rod is arranged on the outer side of the two silicon wafer inlet and outlet, the blocking rod is switched back and forth between a first position for shielding the silicon wafer inlet and outlet and a second position for not shielding the silicon wafer inlet and outlet, the limiting assembly is in a limiting state when the blocking rod is located at the first position, the limiting assembly is in a passing state when the blocking rod is located at the second position, the silicon wafer cannot enter and exit the containing cavity from the silicon wafer inlet and outlet when the limiting assembly is in the limiting state, and the silicon wafer can enter and exit the containing cavity from the silicon wafer inlet and outlet when the limiting assembly is in the passing state.
Specifically, as shown in fig. 2, fig. 5, fig. 6 and fig. 8, the utility model provides an end plate assembly among silicon chip basket of flowers 1 includes two square forms, the unanimous first end plate 11 of size and second end plate 12, first end plate 11 and second end plate 12 set up relatively, be equipped with a plurality of locating holes 111 on the first end plate 11, locating hole 111 makes silicon chip basket of flowers and the accurate location of the elevating system that drives silicon chip basket of flowers and remove, and still be equipped with a plurality of fretwork holes that are used for the heat dissipation and alleviate the dead weight on first end plate 11 and the second end plate 12, be equipped with multichannel antiskid groove 121 on the second end plate 12 face opposite to first end plate 11, antiskid groove 121 prevents that silicon chip basket of flowers from skidding in transportation process.
Further, the first end plate 11 and the second end plate 12 are connected by a link assembly. Preferably, the connecting rod assembly comprises a plurality of first connecting rods 13, the first connecting rods 13 are perpendicularly connected with the first end plate 11 and the second end plate 12, a plurality of flower basket teeth for bearing silicon wafers are arranged on the first connecting rods 13, the first connecting rods 13 are arranged in a matrix form to form a containing cavity for containing the silicon wafers 3, the containing cavity comprises two oppositely arranged silicon wafer inlets and two oppositely arranged silicon wafer outlets, and the silicon wafers can be received in and out of the containing cavity from the two silicon wafer inlets and the two silicon wafer outlets. Specifically, as shown in fig. 5 and 6, four first connecting rods 13 are arranged in a square shape, the four first connecting rods 13 enclose a containing cavity capable of containing a whole silicon wafer, a plurality of basket teeth are uniformly arranged along the length direction of the first connecting rods 13 at intervals, one ends of the basket teeth are fixed on the first connecting rods 13, and the other ends of the basket teeth horizontally face the central line of the containing cavity (the direction in which the central line of the containing cavity is perpendicular to the silicon wafer to pass in and out).
Further, in order to bear half silicon chips, the connecting rod assembly further comprises a plurality of second connecting rods 14, the second connecting rods 14 are arranged on the containing cavity center line, and the containing cavity containing the whole silicon chip is divided into two containing cavities containing half silicon chips by the second connecting rods 14. Specifically, as shown in fig. 5 and 6, two second connecting rods 14 are arranged on the central line of the accommodating cavity, the first connecting rod 13 is located on two sides of the second connecting rod 14, basket teeth are arranged on two sides of the second connecting rod 14, which are opposite to the first connecting rod 13, one ends of the basket teeth are fixed on the second connecting rod, and the other ends of the basket teeth horizontally face the direction of the first connecting rod 13, so that the first connecting rod and the second connecting rod can be matched to receive a half silicon wafer. The first connecting rod and the second connecting rod are detachably connected with the first end plate and the second end plate, so that the second connecting rod can be installed and detached as required during use, and half silicon wafers or the whole silicon wafer can be selectively borne.
Furthermore, in order to prevent the silicon wafers in the accommodating cavity from falling off in the processing process, limiting assemblies are arranged at the inlet and outlet of the silicon wafer basket and are arranged at the inlet and outlet of the two silicon wafers, so that the silicon wafers are prevented from falling from the inlet and outlet of the silicon wafers. Specifically, as shown in fig. 5 and 6, the silicon wafer basket 1 includes two accommodating cavities capable of bearing half silicon wafers, each accommodating cavity has two opposite silicon wafer inlets and outlets, and the limiting component is provided with a limiting component at the side of each silicon wafer inlet and outlet of the accommodating cavity, so that four limiting components are provided in the silicon wafer basket 1.
Preferably, the spacing subassembly includes: the rotating rod 15 is cylindrical, the rotating rod 15 is perpendicularly connected with the first end plate 11 and the second end plate 12, the rotating rod 15 is rotatably connected with the first end plate 11 and the second end plate 12, and the rotating rod 15 can rotate. Meanwhile, in order to prevent the rotating rod 15 from influencing the silicon wafer to enter and exit the accommodating cavity, the distance from the rotating rod 15 to the central line of the accommodating cavity is greater than the distance from the first connecting rod 13 to the central line of the accommodating cavity. The stop lever 16 is connected with the rotating lever 15 through a plurality of connecting rods, the stop lever 16 is parallel to the rotating lever 15, and gaps exist between two ends of the stop lever 16 and the first end plate 11 and the second end plate 12. As shown in fig. 7, the cam plate 17 has a right triangle shape, the right end of the cam plate 17 is fixed to the rotating lever 15, and one chamfered end of the cam plate 17 is fixed to the stopper lever 16. One end of the elastic member 18 abuts against the cam plate 17, and the other end of the elastic member 18 is disposed on the surface of the second end plate 12 facing the first end plate 11, so that when the cam plate 17 is pushed, the rotating rod 15 is driven to rotate, the elastic member 18 is deformed, and the stopper rod 16 is driven to rotate around the rotating column. And when the elastic part 18, the stop lever 16, the cam plate 17 and the rotating lever 15 are arranged, the stop lever is initially located at the first position, the stop lever is stopped outside the silicon wafer inlet and outlet, and the limiting component is in a limiting state, namely the stop lever 16 is located on a path for the silicon wafer to enter and exit in the limiting state, so that the silicon wafer is prevented from entering and exiting the accommodating cavity from the silicon wafer inlet and outlet. When the gear lever is switched from the first position to the second position, the cam plate is required to be pushed to drive the gear lever to rotate to the side of the silicon wafer inlet and outlet, namely, the gear lever is not positioned on a path for silicon wafer inlet and outlet when positioned at the second position, the silicon wafer can freely enter and exit from the silicon wafer inlet and outlet, and the limiting assembly is in a passing state at the moment. A push rod of a push cylinder in the lifting mechanism realizes the switching of the limiting component from a limiting state to a passing state by pushing a cam plate to rotate, the push cylinder pushes the cam plate to rotate, and the rotating cam plate drives a stop lever to switch from a first position to a second position.
In this embodiment, the elastic member 18 is a spring wound around the side surface of the rotating rod 15, one end of the spring abuts against the cam plate 17, the second end plate 12 is provided with a plurality of adjusting holes 122, and the other end of the spring is connected with a bolt which can be inserted and fixed in any one of the adjusting holes, and different adjusting holes can enable the cam plate 17 to generate different elastic forces when rotating at the same angle, i.e. the rotating force of the driving lever can be different.
Furthermore, a stop 19 is further arranged on the surface of the second end plate 12 facing the first end plate 11, and the stop 19 is used for limiting the rotation angle of the stop lever 16, so as to prevent the stop lever 16 from rotating excessively to collide with a silicon wafer placed in the accommodating cavity, and damage to the silicon wafer is avoided. The stopper 19 is provided near the outer side of the first link 13, and when the lever 16 is rotated to the limit state, the lever 16 abuts against the stopper, and the lever 16 stops rotating.
In other embodiments, the number of the pushing cylinders can be set according to the number of the limiting assemblies on the silicon wafer basket, for example, if only one limiting assembly is arranged at the silicon wafer inlet and outlet of the silicon wafer basket, only one pushing cylinder can be arranged. In this embodiment, the silicon wafer basket includes two silicon wafer inlets and outlets arranged oppositely, two sides of each silicon wafer inlet and outlet are respectively provided with a limiting component, and two pushing cylinders are arranged on the corresponding lifting mechanisms.
To sum up, the utility model provides an elevating system can transmit silicon chip basket of flowers steadily and drive silicon chip basket of flowers lift steadily, can drive simultaneously and set up the spacing subassembly that is used for sheltering from silicon chip import and export on silicon chip basket of flowers and switch over to current state from spacing state, and the silicon chip that shelters from silicon chip basket of flowers according to the spacing subassembly of demand control is imported and exported or is controlled spacing subassembly and no longer shelters from the silicon chip and import and export.
Further, the utility model discloses still provide a stoving curing oven device, include: a furnace body for drying the silicon wafers (the silicon wafers enter the furnace body along with the silicon wafer basket), a feeding mechanism, a discharging mechanism and the lifting mechanism. Specifically, the two sides of the furnace body are respectively provided with a lifting mechanism, one side of the furnace body is provided with a first lifting mechanism, the other side of the furnace body is provided with a second lifting mechanism, the feeding mechanism is arranged at the side of the first lifting mechanism and is used for loading silicon wafers for the silicon wafer baskets on the first lifting mechanism, the silicon wafer baskets loaded with the silicon wafers are driven to an inlet of the furnace body by the first lifting mechanism, the silicon wafer baskets on the first lifting mechanism are conveyed to the furnace body for drying, the dried silicon wafer baskets are conveyed to the second lifting mechanism from an outlet of the furnace body, the discharging mechanism is arranged at the side of the second lifting mechanism, and the discharging mechanism takes out the silicon wafers in the silicon wafer baskets on the second lifting mechanism. Furthermore, when a plurality of identical silicon wafer flower baskets are used simultaneously, in order to achieve orderly management, a two-dimensional code icon 20 is arranged on the surface of the first end plate 11 opposite to the second end plate 12, and the corresponding two-dimensional code icon represents the corresponding silicon wafer flower basket, which is equivalent to that the two-dimensional code icon carries out orderly numbering on the plurality of identical silicon wafer flower baskets. Correspondingly, a scanning gun fixed on the top rack is further arranged in the drying and curing furnace device and used for scanning the two-dimensional code icons on the silicon wafer flower basket.
It is noted that the terminology used above is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of protection of the present application is not to be construed as being limited.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. Elevating system of silicon chip basket of flowers, its characterized in that includes:
fixing a bracket;
the lifting assembly is connected with the fixed support in a sliding mode and can move along the vertical direction;
the silicon wafer basket comprises a lifting assembly, a bearing assembly and a limiting assembly, wherein the lifting assembly is fixed on the lifting assembly and used for bearing a silicon wafer basket, the silicon wafer basket is provided with a limiting assembly for shielding an inlet and an outlet of a silicon wafer, the limiting assembly comprises a limiting state and a passing state which can be switched mutually, the silicon wafer cannot enter and exit the silicon wafer basket in the limiting state, and the silicon wafer can enter and exit the silicon wafer basket in the passing state;
and the driving component is arranged on the bearing component or the lifting component, so that the silicon wafer basket is switched to the passing state from the limiting state.
2. The lift mechanism of claim 1, further comprising a stabilizing assembly secured to the lift assembly, the stabilizing assembly pressing the silicon wafer basket on the carrier assembly downward.
3. The lifting mechanism as claimed in claim 1, wherein the carrier assembly comprises a carrier plate fixed to the bottom of the lifting assembly, a conveyor belt disposed on the carrier plate, the carrier plate being disposed horizontally, the conveyor belt having a horizontal direction, the second end plate of the silicon wafer basket being disposed on the conveyor belt, the second end plate having a plurality of anti-slip grooves.
4. The lifting mechanism as claimed in claim 3, wherein the driving assembly includes a first pushing cylinder and a second pushing cylinder fixed on the bearing plate, the first pushing cylinder and the second pushing cylinder are symmetrically disposed at both sides of the conveyor belt, and the moving directions of the push rod of the first pushing cylinder and the push rod of the second pushing cylinder are horizontal and perpendicular to the conveying direction of the conveyor belt.
5. The lifting mechanism according to claim 2, wherein the stabilizing assembly comprises a pressing cylinder fixed on the top of the lifting assembly, and a pressing plate connected with a telescopic rod of the pressing cylinder, the pressing plate is provided with a positioning pin, a first end plate of the silicon wafer basket is provided with a positioning hole inserted with the positioning pin, and the telescopic rod of the pressing cylinder drives the pressing plate to press the first end plate downwards.
6. The lift mechanism of claim 1, wherein the silicon wafer basket comprises:
the end plate assembly comprises a first end plate and a second end plate which are oppositely arranged, a plurality of positioning holes are formed in the first end plate, and a plurality of anti-skidding grooves are formed in the surface, back to the first end plate, of the second end plate;
the connecting rod assembly comprises a plurality of first connecting rods which are connected with the first end plate and the second end plate, a plurality of basket teeth for bearing silicon wafers are arranged on the first connecting rods, a containing cavity for containing the silicon wafers is defined by the plurality of first connecting rods, and the containing cavity comprises two silicon wafer inlets and two silicon wafer outlets which are oppositely arranged;
the limiting assembly comprises a blocking rod which is parallel to the first connecting rod, the blocking rod is used for blocking the silicon wafer inlet and outlet and not blocking the silicon wafer inlet and outlet, the blocking rod is located at the first position, the limiting assembly is located at the limiting state, and the blocking rod is located at the second position, the limiting assembly is located at the passing state.
7. The lift mechanism of claim 6, wherein the stop assembly further comprises:
the two ends of the rotating rod are respectively and rotatably connected with the first end plate and the second end plate, the stop rod is connected with the rotating rod through a plurality of connecting rods, and a gap exists between the two ends of the stop rod and the first end plate as well as between the two ends of the stop rod and the second end plate;
the cam plate is connected with the rotating rod and the gear lever, the driving assembly drives the cam plate to rotate, and the rotating cam plate drives the gear lever to be switched from the first position to the second position;
and one end of the elastic piece is abutted against the cam plate, and the other end of the elastic piece is arranged on the second end plate.
8. The drying and curing oven device comprises an oven body for drying silicon wafers, and is characterized by further comprising a lifting mechanism of the silicon wafer basket according to any one of claims 1 to 7.
9. The drying and curing oven device as recited in claim 8, wherein said lifting mechanisms are respectively disposed on two sides of said oven body, a loading mechanism is disposed beside one of said lifting mechanisms, and a unloading mechanism is disposed beside the other of said lifting mechanisms.
10. The drying and curing oven device of claim 8, wherein the first end plate of the silicon wafer basket is provided with a two-dimensional code icon, and the top of the drying and curing oven device is provided with a scanning gun.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222646271.7U CN218371487U (en) | 2022-10-09 | 2022-10-09 | Lifting mechanism of silicon wafer basket and drying and curing furnace device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222646271.7U CN218371487U (en) | 2022-10-09 | 2022-10-09 | Lifting mechanism of silicon wafer basket and drying and curing furnace device |
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| CN218371487U true CN218371487U (en) | 2023-01-24 |
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| CN202222646271.7U Active CN218371487U (en) | 2022-10-09 | 2022-10-09 | Lifting mechanism of silicon wafer basket and drying and curing furnace device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117712017A (en) * | 2023-12-25 | 2024-03-15 | 南京卓胜自动化设备有限公司 | A new type of flower basket lifting mechanism |
| CN118009647A (en) * | 2024-04-09 | 2024-05-10 | 常州比太科技有限公司 | Silicon wafer production drying device and drying method thereof |
-
2022
- 2022-10-09 CN CN202222646271.7U patent/CN218371487U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117712017A (en) * | 2023-12-25 | 2024-03-15 | 南京卓胜自动化设备有限公司 | A new type of flower basket lifting mechanism |
| CN117712017B (en) * | 2023-12-25 | 2024-11-15 | 南京卓胜自动化设备有限公司 | Novel basket of flowers hoist mechanism |
| CN118009647A (en) * | 2024-04-09 | 2024-05-10 | 常州比太科技有限公司 | Silicon wafer production drying device and drying method thereof |
| CN118009647B (en) * | 2024-04-09 | 2024-06-07 | 常州比太科技有限公司 | Silicon wafer production drying device and drying method thereof |
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