CN218350808U - Heat dissipation computer motherboard with temperature regulation subassembly - Google Patents

Abstract

The utility model discloses a heat dissipation computer motherboard with temperature regulation assembly, which comprises a bottom plate and a motherboard arranged on the bottom plate, wherein a heat dissipation cavity positioned under the motherboard is arranged on the bottom plate, heat dissipation holes which are communicated with the heat dissipation cavity and are in a matrix are arranged on the bottom plate, and an air inlet communicated with the heat dissipation cavity is arranged on the front surface of the bottom plate; the utility model discloses the heat on the mainboard enters into the inside heat dissipation intracavity of bottom plate through seting up the louvre that is the matrix on the bottom plate, the air current that heat dissipation fan work produced takes away the heat of heat dissipation intracavity portion from the air outlet of bottom plate both sides, be convenient for to the heat discharge on the mainboard, the normal use of electronic components on the temperature influence mainboard on the mainboard has been avoided, and then the condition that the high temperature caused the component damage on the mainboard, and the air deflector can make the air current that heat dissipation fan produced discharge from the air outlet of both sides fast, the thermal diffusivity has further been improved.

Description

A heat dissipation computer motherboard with a temperature regulating component

technical field

The utility model relates to a heat dissipation computer mainboard, in particular to a heat dissipation computer mainboard with a temperature regulating component.

Background technique

The motherboard, also called the motherboard, is installed in the main computer box and is one of the most basic and important components of the computer. It plays a pivotal role in the entire computer system. The largest piece of printed circuit board.

At present, when the components on the mainboard of the computer generate heat during operation, the temperature on the mainboard will rise, which will affect the normal use of electronic components on the mainboard, and in severe cases will damage the components on the mainboard, so we will do something about it An improvement is made, and a heat dissipation computer motherboard with a temperature regulating component is proposed.

Utility model content

In order to solve the defects in the prior art, the utility model provides a heat dissipation computer main board with a temperature regulating component.

In order to solve the above technical problems, the utility model provides the following technical solutions:

The utility model discloses a heat dissipation computer main board with a temperature regulating component, comprising a bottom plate and a main board arranged on the bottom plate. A matrix of heat dissipation holes, the front of the bottom plate is provided with an air inlet connected to the heat dissipation chamber, and a heat dissipation fan for cooling the main board is installed at the air inlet, and both sides of the bottom plate are provided with air outlets connected with the heat dissipation chamber. There are multiple wind deflectors arranged at an angle.

As a preferred technical solution of the present invention, the air inlet is provided with a first screen filter plate located outside the cooling fan, and the air outlet is provided with a second filter screen plate.

As a preferred technical solution of the present invention, the air inlet is provided with a fixing piece for fixing the cooling fan and the first filter screen.

As a preferred technical solution of the present invention, the fixing member includes a positioning baffle located at the air inlet to position the cooling fan, and both sides of the air inlet move linearly to clamp the first filter screen plate and U-shaped plate for limiting the cooling fan.

As a preferred technical solution of the present utility model, the air inlet is provided with a housing cavity for the movement of the U-shaped plate, the interior of the housing cavity is provided with a return spring connected with the U-shaped plate, and the bottom plate is provided with a Connected to the opening, the U-shaped plate is provided with a push plate protruding from the opening.

As a preferred technical solution of the utility model, the main board is fixed and installed at the heat dissipation hole at the top of the bottom plate through bolts.

The beneficial effects of the utility model are:

1. This kind of heat dissipation computer mainboard with temperature regulating components, the heat on the mainboard enters the heat dissipation cavity inside the bottom plate through the heat dissipation holes in a matrix on the bottom plate, and the airflow generated by the cooling fan will transfer the heat inside the heat dissipation cavity from the bottom plate The air outlets on both sides are brought out, which is convenient to discharge the heat on the main board, avoiding the temperature on the main board from affecting the normal use of electronic components on the main board, thereby avoiding the damage of the components on the main board caused by excessive temperature, and the air guide The plate can quickly discharge the airflow generated by the cooling fan from the air outlets on both sides, further improving the heat dissipation.

2. This kind of heat dissipation computer motherboard with temperature adjustment components, the cooling fan is positioned by the positioning baffle, and then the cooling fan is limited by the U-shaped plate, the cooling fan is fixed in the air inlet, and the U-shaped plate is clamped There is a first filter screen, the first filter screen can be taken out by moving the push plate, and cleaned or replaced in time, after the first filter screen is taken out, the cooling fan has no limit to it, and can be disassembled at will , so that the cooling fan can be replaced in time after it is damaged.

Description of drawings

The accompanying drawings are used to provide a further understanding of the utility model, and constitute a part of the description, and are used to explain the utility model together with the embodiments of the utility model, and do not constitute a limitation to the utility model. In the attached picture:

Fig. 1 is a structural representation of a heat dissipation computer motherboard with a temperature regulating assembly of the present invention;

Fig. 2 is a structural schematic diagram of a heat dissipation hole of a heat dissipation computer main board with a temperature regulating component of the utility model;

Fig. 3 is a sectional view of a heat-dissipating computer motherboard bottom plate with a temperature-regulating component of the present invention;

Fig. 4 is an enlarged view of an air inlet of a heat dissipation computer motherboard with a temperature regulating component of the present invention.

In the figure: 1. Base plate; 2. Main board; 3. Cooling cavity; 4. Cooling hole; 5. Air inlet; 6. Cooling fan; 7. Air outlet; 8. Air deflector; 9. First filter screen plate; 10. The second filter screen plate; 11. The positioning baffle; 12. The U-shaped plate; 13. The accommodation cavity; 14. The return spring; 15. The push plate.

Detailed ways

The preferred embodiments of the present utility model are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present utility model, and are not intended to limit the present utility model.

Embodiment: as shown in Fig. 1, Fig. 2, Fig. 3 and Fig. 4, a kind of heat dissipation computer mainboard of the present utility model has temperature-regulating assembly, comprises base plate 1 and the main board 2 that is arranged on base plate 1, and base plate 1 is provided with There is a heat dissipation chamber 3 located directly below the main board 2, and the bottom plate 1 is provided with heat dissipation holes 4 connected with the heat dissipation chamber 3 and formed in a matrix. A heat dissipation fan 6 for dissipating heat from the main board 2 is installed at the place, and both sides of the base plate 1 are provided with an air outlet 7 communicating with the heat dissipation chamber 3, and the inside of the heat dissipation chamber 3 is provided with a plurality of obliquely arranged air deflectors 8, and the main board The heat on 2 enters the cooling cavity 3 inside the bottom plate 1 through the heat dissipation holes 4 formed in a matrix on the bottom plate 1, and the airflow generated by the cooling fan 6 takes the heat inside the cooling cavity 3 from the air outlets 7 on both sides of the bottom plate 1. It is convenient to discharge the heat on the main board 2, avoiding the temperature on the main board 2 from affecting the normal use of the electronic components on the main board 2, thereby avoiding the damage of the components on the main board 2 caused by the high temperature, and the wind deflector 8 The airflow generated by the cooling fan 6 can be quickly discharged from the air outlets 7 on both sides, further improving the heat dissipation.

Wherein, the air inlet 5 is provided with a first filter screen 9 positioned at the outside of the cooling fan 6, and the air outlet 7 is provided with a second filter screen 10, through the first filter screen 9 and the second filter screen 10, to The air entering the air inlet 5 and the air outlet 7 is filtered to prevent dust in the air from entering the heat dissipation cavity 3 and affecting the normal operation of the main board 2 .

Wherein, the air inlet 5 is provided with a fixing member for fixing the cooling fan 6 and the first filter screen plate 9, and the fixing member includes a positioning baffle 11 located at the air inlet 5 to position the cooling fan 6, and the positioning baffle 11 at the air inlet 5. The U-shaped plate 12 that is used to clamp the first filter screen plate 9 and limit the cooling fan 6 is arranged on both sides in a straight line. The air inlet 5 is provided with an accommodation chamber 13 for the U-shaped plate 12 to move. There is a return spring 14 connected to the U-shaped plate 12 inside, an opening communicating with the accommodating cavity 13 is provided on the base plate 1, and a push plate 15 protruding from the opening is provided on the U-shaped plate 12, and the positioning baffle plate 11 pairs The heat dissipation fan 6 is positioned, and then the heat dissipation fan 6 is limited by the U-shaped plate 12, and the heat dissipation fan 6 is fixed in the air inlet 5. The first filter screen plate 9 is clamped in the U-shaped plate 12. By moving the push plate 15 The first filter screen plate 9 can be taken out, and cleaned or replaced in time. After the first filter screen plate 9 is taken out, the heat dissipation fan 6 has no limit to it, and can also be disassembled at will, so that the heat dissipation fan 6 can be damaged. Replace it in time.

Wherein, the main board 2 is fixedly installed on the cooling holes 4 at the top of the base plate 1 through bolts.

When working, the heat on the main board 2 enters the heat dissipation cavity 3 inside the bottom plate 1 through the heat dissipation holes 4 formed on the bottom plate 1 in a matrix, and the airflow generated by the cooling fan 6 dissipates the heat inside the heat dissipation cavity 3 from the heat dissipation holes on both sides of the bottom plate 1. The air outlet 7 is brought out to facilitate the discharge of heat on the main board 2, avoiding that the temperature on the main board 2 affects the normal use of electronic components on the main board 2, and then avoiding the situation that the components on the main board 2 are damaged due to excessive temperature. The air deflector 8 can quickly discharge the airflow generated by the cooling fan 6 from the air outlets 7 on both sides, thereby further improving the heat dissipation. Position limit, the cooling fan 6 is fixed in the air inlet 5, the first filter screen plate 9 is clamped in the U-shaped plate 12, the first filter screen plate 9 can be taken out by moving the push plate 15, and cleaned or replaced in time, After the first filter screen plate 9 is taken out, the heat dissipation fan 6 has no limit to it, and can also be disassembled at will, so that the heat dissipation fan 6 can be replaced in time after being damaged.

Finally, it should be noted that: the above is only a preferred embodiment of the utility model, and is not intended to limit the utility model, although the utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art , it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (6)

1. The utility model provides a heat dissipation computer motherboard with temperature regulation subassembly, includes bottom plate (1) and establishes mainboard (2) on bottom plate (1), a serial communication port, set up heat dissipation chamber (3) that are located mainboard (2) under on bottom plate (1), set up louvre (4) that are linked together and are the matrix with heat dissipation chamber (3) on bottom plate (1), air intake (5) that are linked together with heat dissipation chamber (3) are seted up in the front of bottom plate (1), air intake (5) department installs and is used for heat dissipation fan (6) to mainboard (2) radiating, air outlet (7) that are linked together with heat dissipation chamber (3) are all seted up to the both sides of bottom plate (1), the inside in heat dissipation chamber (3) is equipped with aviation baffle (8) that a plurality of slopes set up.

2. The heat dissipation computer motherboard with temperature regulation subassembly of claim 1, characterized in that, air intake (5) department is equipped with the first filter screen board (9) that is located the outside of cooling fan (6), and air outlet (7) department is equipped with second filter screen board (10).

3. The computer motherboard with the function of adjusting the temperature of claim 1, wherein the air inlet (5) is provided with a fixing member for fixing the heat dissipation fan (6) and the first filter screen (9).

4. The heat dissipation computer motherboard with temperature regulation subassembly of claim 3, characterized in that, the mounting includes establishing at air intake (5) to the location baffle (11) of heat dissipation fan (6) location, and the both sides at air intake (5) both linear motion have be used for pressing from both sides tight first filter plate (9) and to the spacing U-shaped board (12) of heat dissipation fan (6).

5. The heat dissipation computer motherboard with temperature regulation assembly according to claim 4, wherein the air inlet (5) is provided with a containing cavity (13) for the U-shaped plate (12) to move, a return spring (14) connected with the U-shaped plate (12) is arranged inside the containing cavity (13), the bottom plate (1) is provided with an opening communicated with the containing cavity (13), and the U-shaped plate (12) is provided with a push plate (15) extending out of the opening.

6. The computer motherboard with the function of adjusting the temperature of claim 1, wherein the motherboard (2) is fixedly installed at the heat dissipation hole (4) at the top end of the bottom plate (1) through bolts.

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