CN218216604U - Efficient heat dissipation low-impedance intensive bus duct - Google Patents
Efficient heat dissipation low-impedance intensive bus duct Download PDFInfo
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- CN218216604U CN218216604U CN202222395478.1U CN202222395478U CN218216604U CN 218216604 U CN218216604 U CN 218216604U CN 202222395478 U CN202222395478 U CN 202222395478U CN 218216604 U CN218216604 U CN 218216604U
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Abstract
The utility model relates to a bus duct technical field just discloses a intensive bus duct of high-efficient heat dissipation low impedance, which comprises an outer shell, square chamber has been seted up to the inside of shell, the inside fixedly connected with conductor in square chamber, the inside in square chamber is provided with heat dissipation mechanism, the conductor extends to the both ends of shell and forms the connector, the both sides of connector are provided with the baffle fixed connection is in the outside of shell, through bus duct splicer and connector connection to make the bus duct can normal use, when the conductor produces heat when using, absorb the heat that the conductor produced through last heat-conducting plate, and transmit the inside of first main heat-conducting plate, absorb the heat that the conductor produced through lower heat-conducting plate to transmit the inside of second main heat-conducting plate, first heat-conducting plate and second main heat-conducting plate will lead heat transmission to the louvre, then through the heating panel effluvium, cooperate the radiating plate surface, can further improvement radiating speed.
Description
Technical Field
The utility model relates to a bus duct technical field specifically is a high-efficient heat dissipation low impedance intensive bus duct.
Background
With the rapid increase of power consumption in various industries, the traditional cable serving as a transmission conductor cannot meet the requirements in a current transmission system, and the bus duct is produced as a novel power distribution conductor, and has the advantages of short design and construction period, convenience in assembly and disassembly, long service life and the like, so that the bus duct is more and more widely used.
The bus duct is at the circular telegram operation in-process, can produce the heat, the heat transmits to the outside of equipment through the shell of bus duct, thereby the heat to inside is dispelled, but the radiating effect of shell is lower, and the generating line is at the inside of bus duct zonulae occludens in proper order, thereby the heat that makes the generating line of mid portion produce can't be dispelled fast, the inside temperature that leads to the bus duct risees, thereby the consumption to the energy has been improved, the high temperature can also accelerate the ageing degree of insulator, reduce its life, the whole practicality that leads to the bus duct descends.
SUMMERY OF THE UTILITY MODEL
The not enough to prior art, the utility model provides a low impedance intensive bus duct of high-efficient heat dissipation possesses high radiating advantage.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient heat dissipation low impedance intensive bus duct, includes the shell, square chamber has been seted up to the inside of shell, the inside fixedly connected with conductor in square chamber, the inside in square chamber is provided with heat dissipation mechanism, the conductor extends to the both ends of shell and forms the connector, the both sides of connector are provided with the baffle fixed connection is in the outside of shell.
Preferably, the heat dissipation mechanism comprises a first main heat conduction plate, the first main heat conduction plate is fixedly connected inside the square cavity, the second main heat conduction plate is fixedly connected inside the square cavity, the upper heat conduction plate is fixedly connected to the bottom end of the first main heat conduction plate, the lower heat conduction plate is fixedly connected to the top end of the second main heat conduction plate, the heat dissipation plates are fixedly connected to the two sides of the shell, and heat dissipation holes are formed in the surface of each heat dissipation plate.
Preferably, the shell includes an upper fixing plate, a lower fixing plate and side plates, the side plates are fixedly connected in the middle of the upper fixing plate and the lower fixing plate, the side plates are arranged into two groups, and the square cavity is formed in the middle of the upper fixing plate, the lower fixing plate and the two groups of side plates.
Preferably, the first main heat-conducting plate and the second main heat-conducting plate penetrate through the two groups of side plates and are fixedly connected with the heat-dissipating plates on the two sides, and the first main heat-conducting plate and the second main heat-conducting plate transmit the absorbed heat to the heat-dissipating plates and dissipate the heat through the heat-dissipating plates.
Preferably, go up the heat-conducting plate, the arrangement order of heat-conducting plate down does, goes up the heat-conducting plate, the order of heat-conducting plate is arranged in proper order down, go up the heat-conducting plate and contact with a set of conductor among them respectively with heat-conducting plate down, this settlement can effectually absorb the inside heat of conductor, and the settlement of arranging can carry out effectual reposition of redundant personnel to absorptive heat to avoided two sets of heat-conducting plates or two sets of heat-conducting plates adjacent down, leaded to the heat to pile up, the unable quick condition of dispelling the heat appears, thereby improved the radiating effect of equipment.
Preferably, the upper heat conducting plate is not in contact with the second main heat conducting plate, the lower heat conducting plate is not in contact with the first main heat conducting plate, the heat absorbed by the upper heat conducting plate can be led out through the first main heat conducting plate, the heat absorbed by the lower heat conducting plate is led out from the second main heat conducting plate, and the led-out heat is shunted, so that the heat dissipation speed is ensured, and the heat dissipation effect is improved.
Preferably, the material of heat dissipation mechanism is aluminium, the material of conductor is copper, because the aluminium material has good heat conductivity to can derive fast the inside temperature of bus duct, the copper material has good electric conductivity, thereby can reduce the impedance, spreads out the temperature of conductor fast through the aluminium material, thereby has guaranteed the stability of conductor temperature, makes the conductor keep lower impendance.
Has the advantages that:
1. this intensive bus duct of high-efficient heat dissipation low impedance because go up the heat-conducting plate and with the various ingenious structural design of heat-conducting plate down, can make and go up the heat-conducting plate and absorb and shunt effluvium fast with lower heat-conducting plate to can carry out effluvium fast to the inside heat of bus duct, temperature greatly reduced when making the bus duct operation process has improved the practicality of bus duct.
2. This intensive bus duct of high-efficient heat dissipation low impedance because the aluminium material has good heat conductivity, can derive fast the inside temperature of bus duct, because the decline of the inside temperature of bus duct can reduce the impedance, cooperates the good electric conductivity of copper material, reduction impedance that can be once more to when having guaranteed carrying out quick radiating to the inside temperature of bus duct, guaranteed the electric conductive property of conductor.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
fig. 3 is a schematic view of the local structure of the present invention.
In the figure: 1. a housing; 11. an upper fixing plate; 12. a lower fixing plate; 13. a side plate; 2. a square cavity; 3. a conductor; 4. a heat dissipation mechanism; 41. a first main heat-transfer plate; 42. a second main heat-conducting plate; 43. an upper heat conducting plate; 44. a lower heat conducting plate; 45. a heat dissipation plate; 46. heat dissipation holes; 5. a connecting port; 6. and a baffle plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example one
Referring to fig. 1-3, a high-efficiency heat dissipation low-impedance compact bus duct includes a housing 1, a square cavity 2 is formed inside the housing 1, a conductor 3 is fixedly connected inside the square cavity 2, a heat dissipation mechanism 4 is arranged inside the square cavity 2, the conductor 3 extends to two ends of the housing 1 to form a connection port 5, baffles 6 are arranged on two sides of the connection port 5, and the baffles 6 are fixedly connected to the outer side of the housing 1.
The heat dissipation mechanism 4 comprises a first main heat conducting plate 41, the first main heat conducting plate 41 is fixedly connected inside the square cavity 2, a second main heat conducting plate 42 is fixedly connected inside the square cavity 2, an upper heat conducting plate 43 is fixedly connected to the bottom end of the first main heat conducting plate 41, a lower heat conducting plate 44 is fixedly connected to the top end of the second main heat conducting plate 42, heat dissipation plates 45 are fixedly connected to the two sides of the shell 1, and heat dissipation holes 46 are formed in the surfaces of the heat dissipation plates 45.
The shell 1 comprises an upper fixing plate 11, a lower fixing plate 12 and side plates 13, wherein the side plates 13 are fixedly connected between the upper fixing plate 11 and the lower fixing plate 12, the side plates 13 are arranged into two groups, and a square cavity 2 is formed in the middle of the upper fixing plate 11, the lower fixing plate 12 and the two groups of side plates 13.
The first main heat-conducting plate 41 and the second main heat-conducting plate 42 penetrate through the two sets of side plates 13 and are fixedly connected with the heat-dissipating plates 45 on both sides, and the first main heat-conducting plate 41 and the second main heat-conducting plate 42 transmit the absorbed heat to the heat-dissipating plates 45 and dissipate the heat through the heat-dissipating plates 45.
Go up the heat-conducting plate 43, the arrangement order of lower heat-conducting plate 44 does, go up the heat-conducting plate 43, the order of lower heat-conducting plate 44 is arranged in proper order, go up the heat-conducting plate 43 and contact with one of them group conductor 3 respectively with lower heat-conducting plate 44, this settlement can effectually absorb the inside heat of conductor 3, the settlement of arranging can carry out effectual reposition of redundant personnel to absorptive heat, thereby avoided two sets of heat-conducting plates 43 or two sets of heat-conducting plates 44 adjacent down, lead to the heat to pile up, the unable quick condition of dispelling the heat appears, thereby the radiating effect of equipment has been improved.
The upper heat conducting plate 43 is not in contact with the second main heat conducting plate 42, and the lower heat conducting plate 44 is not in contact with the first main heat conducting plate 41, so that the heat absorbed by the upper heat conducting plate 43 can be led out through the first main heat conducting plate 41, and the heat absorbed by the lower heat conducting plate 44 can be led out from the second main heat conducting plate 42, so that the led-out heat can be shunted, the heat dissipation speed can be ensured, and the heat dissipation effect can be improved.
The material of heat dissipation mechanism 4 is aluminium, and the material of conductor 3 is copper, because the aluminium material has good heat conductivity to can derive fast the inside temperature of bus duct, the copper material has good electric conductivity, thereby can reduce the impedance, spreads out conductor 3's temperature fast through the aluminium material, thereby has guaranteed conductor 3 temperature's stability, makes conductor 3 keep lower impendance.
The working principle is as follows: the bus duct can be normally used by connecting the bus duct splicer with the connector 5, when the conductor 3 generates heat during use, the heat generated by the conductor 3 is absorbed by the upper heat-conducting plate 43 and is transmitted to the inside of the first main heat-conducting plate 41, the heat generated by the conductor 3 is absorbed by the lower heat-conducting plate 44 and is transmitted to the inside of the second main heat-conducting plate 42, the heat is transmitted to the heat-radiating plate 45 by the first main heat-conducting plate 41 and the second main heat-conducting plate 42 and is then dissipated out by the heat-radiating plate 45, and the heat is further increased in the heat dissipation speed by matching with the heat dissipation holes 46 on the surface of the heat-radiating plate 45.
Example two
Referring to fig. 1-3, the heat dissipation mechanism 4 is made of aluminum, the conductor 3 is made of copper, the aluminum has good thermal conductivity, so that the temperature inside the bus duct can be quickly derived, the copper has good electrical conductivity, so that the impedance can be reduced, and the temperature of the conductor 3 is quickly transferred out through the aluminum, so that the stability of the temperature of the conductor 3 is ensured, and the conductor 3 keeps low impedance.
The working principle is as follows: because the aluminium material has good heat conductivity, can derive the inside temperature of bus duct fast, because the decline of the inside temperature of bus duct can reduce the impedance, and the good electric conductivity of cooperation copper product matter, the reduction impedance that can be once more to when having guaranteed to carry out quick radiating to the inside temperature of bus duct, guaranteed conductor 3's electric conductive property.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a low impedance intensive bus duct of high-efficient heat dissipation, includes shell (1), its characterized in that: square chamber (2) have been seted up to the inside of shell (1), the inside fixedly connected with conductor (3) in square chamber (2), the inside in square chamber (2) is provided with heat dissipation mechanism (4), conductor (3) extend to the both ends of shell (1) and form connector (5), the both sides of connector (5) are provided with baffle (6) fixed connection is in the outside of shell (1).
2. The high efficiency heat dissipation low impedance compact busway of claim 1, wherein: heat dissipation mechanism (4) are including first leading hot plate (41), first leading hot plate (41) fixed connection is in the inside of square chamber (2), hot plate (42) are led to the inside fixedly connected with second of square chamber (2), heat-conducting plate (43) are gone up to the bottom fixedly connected with of first leading hot plate (41), heat-conducting plate (44) under the top fixedly connected with of second leading hot plate (42), both sides fixedly connected with heating panel (45) of shell (1), louvre (46) have been seted up on the surface of heating panel (45).
3. The high efficiency heat dissipation low impedance compact busway of claim 2, wherein: the shell (1) comprises an upper fixing plate (11), a lower fixing plate (12) and side plates (13), wherein the side plates (13) are fixedly connected between the upper fixing plate (11) and the lower fixing plate (12), the side plates (13) are arranged into two groups, and a square cavity (2) is formed in the middle of the upper fixing plate (11), the lower fixing plate (12) and the two groups of side plates (13).
4. The high-efficiency heat-dissipation low-impedance dense bus duct of claim 3, wherein: the first main heat-conducting plate (41) and the second main heat-conducting plate (42) penetrate through the two groups of side plates (13) and are fixedly connected with the heat-radiating plates (45) on the two sides.
5. The high efficiency heat dissipation low impedance compact busway of claim 2, wherein: the upper heat-conducting plate (43) and the lower heat-conducting plate (44) are sequentially arranged in the order of the upper heat-conducting plate (43) and the lower heat-conducting plate (44), and the upper heat-conducting plate (43) and the lower heat-conducting plate (44) are respectively contacted with one group of conductors (3).
6. The high efficiency heat dissipation low impedance compact busway of claim 2, wherein: the upper heat-conducting plate (43) is not in contact with the second main heat-conducting plate (42), and the lower heat-conducting plate (44) is not in contact with the first main heat-conducting plate (41).
7. The high efficiency heat dissipation low impedance compact busway of claim 1, wherein: the heat dissipation mechanism (4) is made of aluminum, and the conductor (3) is made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222395478.1U CN218216604U (en) | 2022-09-07 | 2022-09-07 | Efficient heat dissipation low-impedance intensive bus duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222395478.1U CN218216604U (en) | 2022-09-07 | 2022-09-07 | Efficient heat dissipation low-impedance intensive bus duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218216604U true CN218216604U (en) | 2023-01-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222395478.1U Active CN218216604U (en) | 2022-09-07 | 2022-09-07 | Efficient heat dissipation low-impedance intensive bus duct |
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| Country | Link |
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| CN (1) | CN218216604U (en) |
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2022
- 2022-09-07 CN CN202222395478.1U patent/CN218216604U/en active Active
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