CN218163430U - Novel radiator assembly - Google Patents

Novel radiator assembly Download PDF

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Publication number
CN218163430U
CN218163430U CN202222360662.2U CN202222360662U CN218163430U CN 218163430 U CN218163430 U CN 218163430U CN 202222360662 U CN202222360662 U CN 202222360662U CN 218163430 U CN218163430 U CN 218163430U
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China
Prior art keywords
plate
heat
conducting plate
block
circuit board
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CN202222360662.2U
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Chinese (zh)
Inventor
瞿宏军
甘文杰
刘双红
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Dongguan Weishan Electromechanical Technology Co ltd
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Dongguan Weishan Electromechanical Technology Co ltd
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Abstract

The utility model discloses a novel radiator assembly relates to radiator technical field, including the heat-conducting plate, the upper portion of heat-conducting plate is provided with the heat dissipation base member, the side-mounting of heat-conducting plate has the block subassembly, the installation component of being convenient for is installed at the bottom edge of heat-conducting plate, through the cooperation between fixed plate, fly leaf, column spinner, cardboard, first spring and the draw-in groove use, make things convenient for heat-conducting plate and heat dissipation base member to realize quick block, and also can not appear the not hard up condition under long-time use, the block is comparatively firm, through movable block, the second spring, press the movable plate, the cooperation adaptation of installation piece and baffle, make things convenient for the quick fixed of heat-conducting plate and circuit board, replaced traditional bolt that utilizes to connect, need just can accomplish the fixing of heat-conducting plate and circuit board with the help of instrument, it is all comparatively inconvenient to make its installation and dismantlement, and press the cooperation of movable plate and direction mouth and use, make things convenient for the movable block can more firm when removing.

Description

Novel radiator assembly
Technical Field
The utility model relates to a radiator technical field specifically is a novel radiator assembly.
Background
The assembly mode of the radiator assembly at present is mainly to fix the radiator on the heat conducting plate, and then fix on the printed circuit board after the radiator assembly is formed;
through retrieval, chinese patent discloses a radiator subassembly of easy dismounting (publication No. CN 201590979U), and the technical content of this patent is: the end parts of the radiator and the heat conducting plate are provided with elastic tools for buckling the radiator and the heat conducting plate together, bayonets are formed between the two end parts of the elastic fasteners, after buckling, one end part of the elastic fastener is hooked between the radiating fins of the radiator, and the other end part is buckled on the bottom surface of the heat conducting plate to clamp and fasten the radiator and the heat conducting plate;
in view of the above, the following disadvantages exist: the above patent utilizes one end hook of elasticity fastener to hang between the heat radiation fin of radiator, and long-time fixed can lead to the heat radiation fin of radiator to take place to deform, and then elasticity fastener fixed can appear becoming flexible, for this reason, we provide a novel radiator subassembly.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the utility model provides a novel radiator assembly has solved the problem that the above background art provided.
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a novel radiator component comprises a heat conducting plate, wherein a radiating base body is arranged at the upper part of the heat conducting plate, a clamping component is arranged on the side surface of the heat conducting plate, and a component convenient to mount is arranged at the edge of the bottom end of the heat conducting plate;
the clamping component comprises a fixing plate connected with the side face of the heat conducting plate, a movable plate is arranged at the top end of the fixing plate, limiting grooves are formed in the surfaces of the fixing plate and the movable plate, a first spring is connected to the inner portion, provided with the limiting grooves, of the surface of the fixing plate, a rotating column is arranged inside the limiting grooves formed in the surface of the movable plate, a clamping plate is connected to the bottom end of the rotating column, and a clamping groove is formed in the inner portion, provided with the limiting grooves, of the surface of the fixing plate.
As a further technical scheme of the utility model, the below of heat-conducting plate is provided with the circuit board, the upper surface of circuit board is provided with the chip, the socket has been seted up at the surface edge of circuit board.
As a further technical scheme of the utility model, the size of a dimension looks adaptation of cardboard and spacing groove, the one end of fly leaf is laminated with the crack of heat dissipation base member each other.
As a further technical scheme of the utility model, the riser that the installation component of being convenient for includes heat-conducting plate bottom edge connection, the bottom of riser is provided with the movable block, the one end of movable block is connected with the second spring, the front of movable block is connected with presses the movable plate, the front of riser is connected with the installation piece, the surface of installation piece is provided with the baffle.
As a further technical scheme of the utility model, the side of riser corresponds movable block department and has all seted up the notch, the front of riser corresponds presses movable plate department to have seted up the direction mouth.
As the utility model discloses further technical scheme, the movable block with press the size of a dimension looks adaptation of movable plate and notch and direction mouth, the installation piece is swing joint with the baffle.
Advantageous effects
The utility model provides a novel radiator assembly. Compared with the prior art, the method has the following beneficial effects:
1. the utility model provides a novel radiator assembly, uses through the cooperation between fixed plate, fly leaf, column spinner, cardboard, first spring and the draw-in groove, makes things convenient for the heat-conducting plate to realize quick block with the heat dissipation base member, and also can not appear the not hard up condition under long-time use, and the block is comparatively firm.
2. The utility model provides a novel radiator unit, through movable block, second spring, press the cooperation adaptation of movable plate, installation piece and baffle, makes things convenient for the quick fixed of heat-conducting plate and circuit board, has replaced traditional utilization bolt to connect, need just can accomplish the fixed of heat-conducting plate and circuit board with the help of the instrument, makes its installation and dismantlement all comparatively inconvenient.
Drawings
FIG. 1 is a schematic view of a novel heat sink assembly;
FIG. 2 is an exploded view of a novel heat sink assembly;
FIG. 3 is an exploded view of a snap-fit assembly of the novel heat sink assembly;
FIG. 4 is a schematic cross-sectional view of a snap-fit assembly of the novel heat sink assembly;
FIG. 5 is an exploded view of a novel heat sink assembly to facilitate mounting of the assembly;
fig. 6 is a schematic view of a novel heat sink assembly with a snap-fit structure for facilitating assembly.
In the figure: 1. a heat conducting plate; 2. a heat-dissipating substrate; 3. clamping the assembly; 31. a fixing plate; 32. a movable plate; 33. a limiting groove; 34. a spin column; 35. clamping a plate; 36. a first spring; 37. a card slot; 4. a circuit board; 5. the assembly is convenient to install; 51. a vertical plate; 52. a moving block; 53. a second spring; 54. pressing the movable plate; 55. mounting blocks; 56. a baffle plate; 57. a guide port; 58. a notch; 6. a chip; 7. and (4) inserting the socket.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a novel heat sink assembly, comprising: the utility model provides a novel radiator assembly, includes heat-conducting plate 1, and heat-conducting plate 1's upper portion is provided with heat dissipation base member 2, and heat-conducting plate 1's side-mounting has block subassembly 3, and the installation component 5 of being convenient for is installed at heat-conducting plate 1's bottom edge, and heat-conducting plate 1's below is provided with circuit board 4, and circuit board 4's upper surface is provided with chip 6, and socket 7 has been seted up at circuit board 4's surperficial edge.
Referring to fig. 3-4, the engaging assembly 3 includes a fixed plate 31 connected to the side of the heat conducting plate 1, a movable plate 32 is disposed on the top of the fixed plate 31, both surfaces of the fixed plate 31 and the movable plate 32 are formed with a limiting groove 33, a first spring 36 is connected to the inside of the limiting groove 33 formed on the surface of the fixed plate 31, a rotating column 34 is disposed inside the limiting groove 33 formed on the surface of the movable plate 32, a clamping plate 35 is connected to the bottom of the rotating column 34, a clamping groove 37 is formed inside the limiting groove 33 formed on the surface of the fixed plate 31, the clamping plate 35 is matched with the limiting groove 33 in size, and one end of the movable plate 32 is attached to the crack of the heat dissipating base 2.
When the engaging assembly 3 is actually used, one end of the movable plate 32 is inserted between the heat dissipating fins of the heat dissipating base 2 to be attached to each other, the rotating column 34 is pressed downward to press the clamping plate 35 downward to deform the first spring 35, and the rotating column 34 is rotated 90 degrees to clamp the clamping plate 35 in the clamping groove 37, so that the heat conducting plate 1 is stably connected with the heat dissipating base 2.
Referring to fig. 5-6, the installation component 5 includes a vertical plate 51 connected to the bottom edge of the heat conducting plate 1, a moving block 52 is disposed at the bottom of the vertical plate 51, a second spring 53 is connected to one end of the moving block 52, a pressing plate 54 is connected to the front surface of the moving block 52, an installation block 55 is connected to the front surface of the vertical plate 51, a retaining plate 56 is disposed on the surface of the installation block 55, notches 58 are disposed on the side surfaces of the vertical plate 51 corresponding to the moving block 52, guide openings 57 are disposed on the front surface of the vertical plate 51 corresponding to the pressing plate 54, the moving block 52 and the pressing plate 54 are matched with the notches 58 and the guide openings 57 in size, and the installation block 55 is movably connected with the retaining plate 56.
When the mounting assembly 5 is used in practice, the baffle plate 56 is pushed upwards, the pressing plate 54 is pushed again, the moving block 52 is driven to move, the second spring 53 is extruded, when the pressing plate 54 moves to the other end of the guide opening 57, pushing is stopped, the baffle plate 56 is loosened at the moment, one end of the baffle plate 56 is attached to the pressing plate 54, the second spring 53 extrudes the moving block 52, the baffle plate 56 is clamped at the pressing plate 54, the socket 7 formed in the surface of the circuit board 4 is inserted into the vertical plate 51, the baffle plate 56 is pushed upwards again, the second spring 53 resets the moving block 52, the moving block 52 is attached to the bottom surface of the circuit board 4, and the circuit board 4 and the heat conducting plate 1 are fixed with each other.
The utility model discloses a theory of operation: when the heat-conducting plate is installed, firstly, one end of the movable plate 32 is inserted between the heat-radiating fins of the heat-radiating base body 2 to be mutually attached, then the rotating column 34 is pressed downwards to enable the clamping plate 35 to press the first spring 35 downwards to enable the first spring 35 to deform, then the rotating column 34 is rotated by 90 degrees to enable the clamping plate 35 to be clamped in the clamping groove 37, and then the heat-conducting plate 1 and the heat-radiating base body 2 are stably connected; the baffle plate 56 is pushed upwards and kept still, the pressing plate 54 is pushed again to drive the moving block 52 to move, the second spring 53 is extruded to deform, when the pressing plate 54 moves to the other end of the guide opening 57, the pushing is stopped, the baffle plate 56 is loosened at the moment, one end of the baffle plate 56 is attached to the pressing plate 54, the second spring 53 extrudes the moving block 52, the baffle plate 56 is clamped at the position of the pressing plate 54, the socket 7 formed in the surface of the circuit board 4 is inserted opposite to the vertical plate 51, the baffle plate 56 is pushed upwards again, the second spring 53 resets the moving block 52, the moving block 52 is attached to the bottom surface of the circuit board 4, and the circuit board 4 and the heat conduction plate 1 are fixed to each other.

Claims (6)

1. A novel radiator component comprises a heat conducting plate (1) and is characterized in that a radiating base body (2) is arranged at the upper part of the heat conducting plate (1), a clamping component (3) is installed on the side surface of the heat conducting plate (1), and a component (5) convenient to install is installed at the edge of the bottom end of the heat conducting plate (1);
the clamping component (3) comprises a fixing plate (31) connected with the side surface of the heat conducting plate (1), a movable plate (32) is arranged at the top end of the fixing plate (31), a limiting groove (33) is formed in the surfaces of the fixing plate (31) and the movable plate (32), a first spring (36) is connected to the surface of the fixing plate (31) in the limiting groove (33), a rotating column (34) is arranged in the surface of the movable plate (32) in the limiting groove (33), a clamping plate (35) is connected to the bottom end of the rotating column (34), and a clamping groove (37) is formed in the surface of the fixing plate (31) in the limiting groove (33).
2. The novel heat sink assembly as claimed in claim 1, wherein a circuit board (4) is disposed below the heat conducting plate (1), a chip (6) is disposed on an upper surface of the circuit board (4), and a socket (7) is disposed on a surface edge of the circuit board (4).
3. The novel heat sink assembly as claimed in claim 1, wherein the clamping plate (35) is adapted to the size of the limiting groove (33), and one end of the movable plate (32) is attached to the gap of the heat dissipating base (2).
4. The novel radiator assembly as claimed in claim 1, wherein the mounting facilitating assembly (5) comprises a vertical plate (51) connected with the bottom end edge of the heat conducting plate (1), a moving block (52) is arranged at the bottom of the vertical plate (51), a second spring (53) is connected with one end of the moving block (52), a pressing plate (54) is connected with the front surface of the moving block (52), a mounting block (55) is connected with the front surface of the vertical plate (51), and a baffle plate (56) is arranged on the surface of the mounting block (55).
5. The novel heat sink assembly as claimed in claim 4, wherein the vertical plate (51) has a notch (58) on its side corresponding to the moving block (52), and the vertical plate (51) has a guide opening (57) on its front corresponding to the pressing plate (54).
6. The novel heat sink assembly as claimed in claim 5, wherein the moving block (52) and the pressing plate (54) are adapted to the size of the notch (58) and the guide opening (57), and the mounting block (55) is movably connected to the baffle (56).
CN202222360662.2U 2022-09-06 2022-09-06 Novel radiator assembly Active CN218163430U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222360662.2U CN218163430U (en) 2022-09-06 2022-09-06 Novel radiator assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222360662.2U CN218163430U (en) 2022-09-06 2022-09-06 Novel radiator assembly

Publications (1)

Publication Number Publication Date
CN218163430U true CN218163430U (en) 2022-12-27

Family

ID=84558767

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222360662.2U Active CN218163430U (en) 2022-09-06 2022-09-06 Novel radiator assembly

Country Status (1)

Country Link
CN (1) CN218163430U (en)

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