CN218110307U - A kind of processing equipment for semiconductor - Google Patents

A kind of processing equipment for semiconductor Download PDF

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CN218110307U
CN218110307U CN202221893696.1U CN202221893696U CN218110307U CN 218110307 U CN218110307 U CN 218110307U CN 202221893696 U CN202221893696 U CN 202221893696U CN 218110307 U CN218110307 U CN 218110307U
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dust
workstation
lower extreme
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drive
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吴小娟
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Shanghai Macsem Technology Co ltd
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Shanghai Macsem Technology Co ltd
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Abstract

The utility model discloses a processing equipment for semiconductor, comprises a workbench, the lower extreme of workstation is provided with dust removal mechanism, fixture includes the spacing groove of fixed connection in workstation upper end rear side, the interior middle part of spacing groove is provided with the two-way screw rod, the right side of two-way screw rod runs through the right side middle part of spacing groove and fixedly connected with changes the handle, the equal threaded connection in middle part both ends periphery of changing the handle has the stopper, the front end of stopper all is connected with the grip block through the gag lever post. A processing equipment for semiconductor, through setting up fixture in the upper end of workstation, realized can carrying out centre gripping effectively to the semiconductor material of equidimension not, set up dust removal mechanism through the lower extreme at the workstation, realized that the automatic dust that will grind the polishing and produce is collected, avoid needing artifical later stage to clear up the upper end of workstation, saved the cost of labor.

Description

一种用于半导体的加工设备A kind of processing equipment for semiconductor

技术领域technical field

本实用新型涉及半导体加工技术领域,特别涉及一种用于半导体的加工设备。The utility model relates to the technical field of semiconductor processing, in particular to a processing equipment for semiconductors.

背景技术Background technique

半导体是指在常温下导电性能介于导体与绝缘体之间的材料,半导体是指一种导电性可控,范围从绝缘体到导体之间的材料,半导体在集成电路、消费电子、通信系统、光伏发电、照明、大功率电源转换等领域都有应用,半导体在加工过程中,需要对半导体材料进行研磨抛光,但是现有的半导体研磨抛光机,在使用过程中发现,主要存在以下两点不足,一是半导体材料只能放置在对应的研磨盘中进行研磨,研磨抛光机不能对不同大小的半导体材料进行研磨抛光,二是在研磨过程中,无法对工作台上的研磨灰尘进行及时清理,使研磨抛光的灰尘在工作台上残留,需要人工清理。A semiconductor refers to a material whose conductivity is between a conductor and an insulator at room temperature. A semiconductor refers to a material with controllable conductivity ranging from an insulator to a conductor. Semiconductors are used in integrated circuits, consumer electronics, communication systems, and photovoltaics. Power generation, lighting, high-power power conversion and other fields have applications. During the processing of semiconductors, semiconductor materials need to be ground and polished. However, the existing semiconductor grinding and polishing machines are found to have the following two shortcomings during use. One is that semiconductor materials can only be placed in the corresponding grinding discs for grinding. The grinding and polishing machine cannot grind and polish semiconductor materials of different sizes. Second, during the grinding process, the grinding dust on the workbench cannot be cleaned in time, making Grinding and polishing dust remains on the workbench and needs to be cleaned manually.

实用新型内容Utility model content

本实用新型的主要目的在于提供一种用于半导体的加工设备,可以有效解决背景技术中的问题。The main purpose of the utility model is to provide a semiconductor processing equipment, which can effectively solve the problems in the background technology.

为实现上述目的,本实用新型采取的技术方案为:In order to achieve the above object, the technical scheme that the utility model takes is:

一种用于半导体的加工设备,包括工作台,所述工作台的下端设置有除尘机构,所述工作台的上端后侧设置有夹持机构,所述工作台的上端中部设置有龙门架,所述龙门架的下端固定连接有驱动机构,所述驱动机构的下端驱动端固定连接有液压杆,所述液压杆的下端驱动端固定连接有研磨机,所述夹持机构包括固定连接在工作台上端后侧的限位槽,所述限位槽的内中部设置有双向螺杆,所述双向螺杆的两端均通过转动连接在限位槽的内两侧中部,所述双向螺杆的右侧贯穿限位槽的右侧中部并固定连接有转把,所述转把的中部两端外周均螺纹连接有限位块,所述限位块的前端均通过限位杆连接有夹持块。A processing equipment for semiconductors, comprising a workbench, a dust removal mechanism is arranged at the lower end of the workbench, a clamping mechanism is arranged at the rear of the upper end of the workbench, and a gantry frame is arranged at the middle of the upper end of the workbench, The lower end of the gantry is fixedly connected with a driving mechanism, the driving end of the lower end of the driving mechanism is fixedly connected with a hydraulic rod, the lower driving end of the hydraulic rod is fixedly connected with a grinding machine, and the clamping mechanism includes a working The limit groove on the rear side of the upper end of the table, the inner middle of the limit groove is provided with a two-way screw, the two ends of the two-way screw are connected to the middle of the two sides of the limit groove by rotation, the right side of the two-way screw The middle part on the right side of the limiting groove is fixedly connected with a turning handle, the outer circumference of both ends of the middle part of the turning handle is screwed with limiting blocks, and the front ends of the limiting blocks are connected with clamping blocks through limiting rods.

优选的,所述限位块的外周均滑动连接在限位槽的内周中部两侧,所述夹持块的下端均滑动连接在工作台的上端中部两侧。Preferably, the outer circumference of the limiting block is slidably connected to both sides of the inner peripheral middle of the limiting groove, and the lower end of the clamping block is slidably connected to both sides of the upper middle of the workbench.

优选的,所述驱动机构包括固定连接在龙门架的内顶部驱动槽,所述驱动槽的内中部设置有螺纹杆,所述螺纹杆的两端均通过第二限位轴承转动连接在驱动槽的内两侧中部,所述螺纹杆的中部外周螺纹连接有驱动块,所述螺纹杆的右端固定连接在电动机的左端驱动端。Preferably, the drive mechanism includes an inner top drive slot fixedly connected to the gantry, a threaded rod is provided in the inner middle of the drive slot, and both ends of the threaded rod are rotatably connected to the drive slot through a second limit bearing In the middle of the two inner sides of the threaded rod, the outer periphery of the middle part of the threaded rod is screwed with a driving block, and the right end of the threaded rod is fixedly connected to the left end of the driving end of the motor.

优选的,所述电动机的左端固定连接在龙门架的右侧上端,所述驱动块的外周滑动连接在驱动槽的内部。Preferably, the left end of the motor is fixedly connected to the upper right end of the gantry frame, and the outer periphery of the driving block is slidably connected to the inside of the driving groove.

优选的,所述除尘机构包括固定连接在工作台下端的储灰仓,所述储灰仓的内下部滑动连接有储灰抽屉,所述储灰仓的内上端中部设置有吸尘器,所述吸尘器的前端进尘口固定连接有吸尘管,所述吸尘管的前端贯穿储灰仓的前侧上端中部并与集尘槽的内部连通,所述集尘槽的下端固定连接在工作台的上端前侧。Preferably, the dust removal mechanism includes an ash storage bin fixedly connected to the lower end of the workbench, an ash storage drawer is slidably connected to the inner and lower parts of the ash storage bin, and a vacuum cleaner is provided at the middle part of the inner upper end of the ash storage bin. The front end of the dust inlet is fixedly connected with a dust suction pipe. The front end of the dust suction pipe runs through the upper middle of the front side of the dust storage bin and communicates with the inside of the dust collection tank. The lower end of the dust collection tank is fixedly connected to the workbench. upper front side.

优选的,所述储灰仓的下端固定连接在底座的上端,所述底座的下端四角均固定安装有万向轮。Preferably, the lower end of the ash storage bin is fixedly connected to the upper end of the base, and universal wheels are fixedly installed at four corners of the lower end of the base.

与现有技术相比,本实用新型具有如下有益效果:Compared with the prior art, the utility model has the following beneficial effects:

1、将半导体材料放置在工作台的上端中部,转动转把,带动双向螺杆转动,带动限位槽内部的限位块相靠近,进而通过限位杆带动夹持块相靠近,对半导体材料进行夹持,通过在工作台的上端设置夹持机构,实现了可对不同大小的半导体材料进行有效地夹持。1. Place the semiconductor material in the middle of the upper end of the workbench, turn the handle, drive the two-way screw to rotate, drive the limit block inside the limit groove to approach each other, and then drive the clamping block to approach each other through the limit rod, and carry out the semiconductor material Clamping, by setting a clamping mechanism at the upper end of the workbench, it is possible to effectively clamp semiconductor materials of different sizes.

2、启动储灰仓内部的吸尘器,通过吸尘管和集尘槽将灰尘吸入储灰仓内的储灰抽屉内部进行储存,通过在工作台的下端设置除尘机构,实现了自动将研磨抛光产生的灰尘进行收集,避免需要人工后期对工作台的上端进行清理,节省了人工成本。2. Start the vacuum cleaner inside the ash storage bin, suck the dust into the ash storage drawer in the ash storage bin through the dust suction pipe and dust collection tank for storage, and set the dust removal mechanism at the lower end of the workbench to realize automatic grinding and polishing. Collect the dust, avoid the need to manually clean the upper end of the workbench, and save labor costs.

附图说明Description of drawings

图1为本实用新型一种用于半导体的加工设备的立体结构示意图;Fig. 1 is a schematic diagram of a three-dimensional structure of a semiconductor processing equipment of the present invention;

图2为本实用新型一种用于半导体的加工设备的夹持机构局部剖视背部结构示意图;Fig. 2 is a partial sectional view of the back structure of a clamping mechanism for semiconductor processing equipment of the present invention;

图3为本实用新型一种用于半导体的加工设备的除尘机构侧剖立体结构示意图;Fig. 3 is a schematic diagram of a side-sectional three-dimensional structure of a dust removal mechanism used in semiconductor processing equipment of the present invention;

图4为本实用新型一种用于半导体的加工设备的驱动机构正剖立体结构示意图。Fig. 4 is a schematic perspective view of a driving mechanism of a semiconductor processing equipment according to the present invention.

图中:1、工作台;2、除尘机构;201、储灰仓;202、储灰抽屉;203、吸尘器;204、吸尘管;205、集尘槽;3、夹持机构;301、限位槽;302、第二限位轴承;303、双向螺杆;304、转把;305、限位块;306、夹持块;4、龙门架;5、驱动机构;501、驱动槽;502、第二限位轴承;503、螺纹杆;504、驱动块;505、电动机;6、液压杆;7、研磨机;8、底座;9、万向轮。In the figure: 1, workbench; 2, dust removal mechanism; 201, ash storage bin; 202, ash storage drawer; 203, vacuum cleaner; 204, dust suction pipe; 205, dust collecting tank; Position slot; 302, the second limit bearing; 303, two-way screw; 304, turn handle; 305, limit block; 306, clamping block; 4, gantry; 5, drive mechanism; 501, drive slot; 502, 503, threaded rod; 504, driving block; 505, electric motor; 6, hydraulic rod; 7, grinder; 8, base; 9, universal wheel.

具体实施方式detailed description

为使本实用新型实现的技术手段、创作特征、达成目的与功效易于明白了解,下面结合具体实施方式,进一步阐述本实用新型。In order to make the technical means, creative features, goals and effects achieved by the utility model easy to understand, the utility model will be further elaborated below in conjunction with specific embodiments.

如图1-4所示,一种用于半导体的加工设备,包括工作台1,工作台1的下端设置有除尘机构2,工作台1的上端后侧设置有夹持机构3,工作台1的上端中部设置有龙门架4,龙门架4的下端固定连接有驱动机构5,驱动机构5的下端驱动端固定连接有液压杆6,液压杆6的下端驱动端固定连接有研磨机7,夹持机构3包括固定连接在工作台1上端后侧的限位槽301,限位槽301的内中部设置有双向螺杆303,双向螺杆303的两端均通过302转动连接在限位槽301的内两侧中部,双向螺杆303的右侧贯穿限位槽301的右侧中部并固定连接有转把304,转把304的中部两端外周均螺纹连接有限位块305,限位块305的前端均通过限位杆连接有夹持块306。As shown in Figures 1-4, a semiconductor processing equipment includes a workbench 1, a dust removal mechanism 2 is arranged at the lower end of the workbench 1, and a clamping mechanism 3 is arranged at the rear of the upper end of the workbench 1, and the workbench 1 A gantry 4 is arranged in the middle of the upper end of the gantry 4, the lower end of the gantry 4 is fixedly connected with a driving mechanism 5, the driving end of the lower end of the driving mechanism 5 is fixedly connected with a hydraulic rod 6, and the lower driving end of the hydraulic rod 6 is fixedly connected with a grinding machine 7. The holding mechanism 3 includes a limit groove 301 fixedly connected to the rear side of the upper end of the workbench 1. The inner middle of the limit groove 301 is provided with a two-way screw 303, and the two ends of the two-way screw 303 are connected in the limit groove 301 through 302 rotation. In the middle part of both sides, the right side of the two-way screw rod 303 runs through the right side middle part of the limit groove 301 and is fixedly connected with a turning handle 304, and the outer circumferences of both ends of the middle part of the turning handle 304 are threaded with a limit block 305, and the front ends of the limit block 305 are A clamping block 306 is connected through a limit rod.

本实施例中,限位块305的外周均滑动连接在限位槽301的内周中部两侧,夹持块306的下端均滑动连接在工作台1的上端中部两侧,驱动机构5包括固定连接在龙门架4的内顶部驱动槽501,驱动槽501的内中部设置有螺纹杆503,螺纹杆503的两端均通过第二限位轴承502转动连接在驱动槽501的内两侧中部,螺纹杆503的中部外周螺纹连接有驱动块504,螺纹杆503的右端固定连接在电动机505的左端驱动端,电动机505的左端固定连接在龙门架4的右侧上端,驱动块504的外周滑动连接在驱动槽501的内部。In this embodiment, the outer circumference of the limiting block 305 is slidably connected to both sides of the inner peripheral middle of the limiting groove 301, the lower end of the clamping block 306 is slidably connected to both sides of the upper middle of the workbench 1, and the driving mechanism 5 includes a fixed Connected to the inner top driving groove 501 of the gantry frame 4, the inner middle part of the driving groove 501 is provided with a threaded rod 503, and the two ends of the threaded rod 503 are connected to the middle parts of the inner two sides of the driving groove 501 through the second limit bearing 502 for rotation, The outer circumference of the middle part of the threaded rod 503 is threadedly connected with a drive block 504, the right end of the threaded rod 503 is fixedly connected to the left end driving end of the motor 505, the left end of the motor 505 is fixedly connected to the right upper end of the gantry 4, and the outer periphery of the drive block 504 is slidably connected Inside the drive slot 501 .

具体的,将半导体材料放置在工作台1的上端中部,转动转把304,带动双向螺杆303转动,带动限位槽301内部的限位块305相靠近,进而通过限位杆带动夹持块306相靠近,对半导体材料进行夹持,通过在工作台1的上端设置夹持机构3,实现了可对不同大小的半导体材料进行有效地夹持,启动研磨机7,并启动液压杆6,对半导体材料进行研磨抛光,并启动电动机505,带动螺纹杆503转动,进而带动驱动块504在驱动槽501内部滑动,再而带动液压杆6和研磨机7进行移动,对半导体材料不同位置进行研磨抛光。Specifically, the semiconductor material is placed in the middle of the upper end of the workbench 1, the turning handle 304 is turned to drive the two-way screw 303 to rotate, and the limit block 305 inside the limit groove 301 is driven to approach each other, and then the clamping block 306 is driven by the limit rod. Close to each other, the semiconductor material is clamped. By setting the clamping mechanism 3 on the upper end of the workbench 1, semiconductor materials of different sizes can be effectively clamped, the grinding machine 7 is started, and the hydraulic rod 6 is started. The semiconductor material is ground and polished, and the motor 505 is started to drive the threaded rod 503 to rotate, and then the driving block 504 is driven to slide inside the driving groove 501, and then the hydraulic rod 6 and the grinding machine 7 are driven to move, and different positions of the semiconductor material are ground and polished .

本实施例中,除尘机构2包括固定连接在工作台1下端的储灰仓201,储灰仓201的内下部滑动连接有储灰抽屉202,储灰仓201的内上端中部设置有吸尘器203,吸尘器203的前端进尘口固定连接有吸尘管204,吸尘管204的前端贯穿储灰仓201的前侧上端中部并与集尘槽205的内部连通,集尘槽205的下端固定连接在工作台1的上端前侧,储灰仓201的下端固定连接在底座8的上端,底座8的下端四角均固定安装有万向轮9。In this embodiment, the dust removal mechanism 2 includes an ash storage bin 201 fixedly connected to the lower end of the workbench 1. The ash storage drawer 202 is slidably connected to the inner and lower parts of the ash storage bin 201, and a dust collector 203 is provided in the middle of the inner upper end of the ash storage bin 201. The front end dust inlet of the vacuum cleaner 203 is fixedly connected with a dust suction pipe 204, and the front end of the dust suction pipe 204 runs through the upper middle part of the front side of the dust storage bin 201 and communicates with the inside of the dust collection tank 205, and the lower end of the dust collection tank 205 is fixedly connected to the On the front side of the upper end of the workbench 1, the lower end of the ash storage bin 201 is fixedly connected to the upper end of the base 8, and the four corners of the lower end of the base 8 are fixedly equipped with universal wheels 9.

具体的,启动储灰仓201内部的吸尘器203,通过吸尘管204和集尘槽205将灰尘吸入储灰仓201内的储灰抽屉202内部进行储存,通过在工作台1的下端设置除尘机构2,实现了自动将研磨抛光产生的灰尘进行收集,避免需要人工后期对工作台1的上端进行清理,节省了人工成本。Specifically, start the vacuum cleaner 203 inside the ash storage bin 201, suck the dust into the ash storage drawer 202 in the ash storage bin 201 through the dust suction pipe 204 and the dust collection tank 205 for storage, and set the dust removal mechanism at the lower end of the workbench 1 2. Automatically collect the dust generated by grinding and polishing, avoiding the need to manually clean the upper end of the workbench 1 later, and saving labor costs.

工作原理:working principle:

首先,将半导体材料放置在工作台1的上端中部,转动转把304,带动双向螺杆303转动,带动限位槽301内部的限位块305相靠近,进而通过限位杆带动夹持块306相靠近,对半导体材料进行夹持,通过在工作台1的上端设置夹持机构3,实现了可对不同大小的半导体材料进行有效地夹持,启动研磨机7,并启动液压杆6,对半导体材料进行研磨抛光,并启动电动机505,带动螺纹杆503转动,进而带动驱动块504在驱动槽501内部滑动,再而带动液压杆6和研磨机7进行移动,对半导体材料不同位置进行研磨抛光,并同时启动储灰仓201内部的吸尘器203,通过吸尘管204和集尘槽205将灰尘吸入储灰仓201内的储灰抽屉202内部进行储存,通过在工作台1的下端设置除尘机构2,实现了自动将研磨抛光产生的灰尘进行收集,避免需要人工后期对工作台1的上端进行清理,节省了人工成本。First, place the semiconductor material on the upper middle of the workbench 1, turn the handle 304, drive the two-way screw 303 to rotate, drive the limit block 305 inside the limit groove 301 to approach each other, and then drive the clamping block 306 to move towards each other through the limit rod. Approaching to clamp the semiconductor material, by setting the clamping mechanism 3 on the upper end of the workbench 1, it is possible to effectively clamp semiconductor materials of different sizes, start the grinder 7, and start the hydraulic rod 6, and the semi-conductor The material is ground and polished, and the motor 505 is started to drive the threaded rod 503 to rotate, and then drive the drive block 504 to slide inside the drive groove 501, and then drive the hydraulic rod 6 and the grinder 7 to move, and grind and polish different positions of the semiconductor material. And start the vacuum cleaner 203 inside the ash storage bin 201 at the same time, and the dust is sucked into the ash storage drawer 202 in the ash storage bin 201 by the dust suction pipe 204 and the dust collection tank 205 for storage. , to realize the automatic collection of dust generated by grinding and polishing, avoiding the need to manually clean the upper end of the workbench 1 later, and saving labor costs.

以上显示和描述了本实用新型的基本原理和主要特征和本实用新型的优点。本行业的技术人员应该了解,本实用新型不受上述实施例的限制,上述实施例和说明书中描述的只是说明本实用新型的原理,在不脱离本实用新型精神和范围的前提下,本实用新型还会有各种变化和改进,这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等效物界定。The basic principles and main features of the present utility model and the advantages of the present utility model have been shown and described above. Those skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions only illustrate the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model The new model also has various changes and improvements, and these changes and improvements all fall within the scope of the claimed utility model. The scope of protection required by the utility model is defined by the appended claims and their equivalents.

Claims (6)

1. A processing apparatus for semiconductors, comprising a work table (1), characterized in that: the lower extreme of workstation (1) is provided with dust removal mechanism (2), the upper end rear side of workstation (1) is provided with fixture (3), the upper end middle part of workstation (1) is provided with portal frame (4), the lower extreme fixedly connected with actuating mechanism (5) of portal frame (4), the lower extreme drive end fixedly connected with hydraulic stem (6) of actuating mechanism (5), the lower extreme drive end fixedly connected with of hydraulic stem (6) grinds machine (7), fixture (3) are including fixed connection spacing groove (301) at workstation (1) upper end rear side, the interior middle part of spacing groove (301) is provided with two-way screw rod (303), the both ends of two-way screw rod (303) all rotate through (302) and connect in the interior both sides middle part of spacing groove (301), the right side of two-way screw rod (303) runs through the right side middle part and fixedly connected with commentaries on classics handle (304) of spacing groove (301), the equal threaded connection in both ends periphery of commentaries on classics handle (304) has stopper (305), the front end of stopper (305) all is connected with clamping block (306) through the spacing rod.
2. The processing apparatus for semiconductors according to claim 1, wherein: the equal sliding connection in the inner periphery middle part both sides in spacing groove (301) of periphery of stopper (305), the equal sliding connection in the upper end middle part both sides of workstation (1) of lower extreme of grip block (306).
3. A processing apparatus for semiconductors as recited in claim 1, wherein: actuating mechanism (5) are including fixed connection at the interior top drive groove (501) of portal frame (4), the interior middle part in drive groove (501) is provided with threaded rod (503), the both ends of threaded rod (503) are all rotated through second limit bearing (502) and are connected in the interior both sides middle part in drive groove (501), the middle part periphery threaded connection of threaded rod (503) has drive block (504), the right-hand member fixed connection of threaded rod (503) is at the left end drive end of motor (505).
4. A processing apparatus for semiconductors as recited in claim 3, wherein: the left end of the motor (505) is fixedly connected to the upper end of the right side of the portal frame (4), and the periphery of the driving block (504) is connected to the inside of the driving groove (501) in a sliding mode.
5. A processing apparatus for semiconductors as recited in claim 1, wherein: dust removal mechanism (2) are including dust storage bin (201) of fixed connection at workstation (1) lower extreme, the interior lower part sliding connection in dust storage bin (201) has dust storage drawer (202), the interior upper end middle part in dust storage bin (201) is provided with dust catcher (203), dust inlet fixedly connected with dust absorption pipe (204) are advanced to the front end of dust catcher (203), the front end of dust absorption pipe (204) run through the front side upper end middle part in dust storage bin (201) and with the inside intercommunication of dust collecting tank (205), the lower extreme fixed connection of dust collecting tank (205) is in the upper end front side of workstation (1).
6. A processing apparatus for semiconductors as recited in claim 5, wherein: the lower extreme fixed connection in the upper end of base (8) in ash storage storehouse (201), the equal fixed mounting in lower extreme four corners of base (8) has universal wheel (9).
CN202221893696.1U 2022-07-20 2022-07-20 A kind of processing equipment for semiconductor Active CN218110307U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117182730A (en) * 2023-10-16 2023-12-08 扬州市职业大学(扬州开放大学) A convenient noise-reducing bed structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117182730A (en) * 2023-10-16 2023-12-08 扬州市职业大学(扬州开放大学) A convenient noise-reducing bed structure

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