CN218108653U - Degumming machine for monocrystalline silicon wafers - Google Patents

Abstract

The utility model discloses a degumming machine for monocrystalline silicon wafers in the technical field of degumming single crystal silicon wafers. There is a moving mechanism, the top of the mounting plate is slidingly connected with a mounting frame, the top of the mounting frame is equipped with a hydraulic rod, the bottom of the hydraulic rod is provided with a mounting rod, the bottom of the mounting rod is provided with a degumming frame, and there are three sets of placement plates in the degumming frame. There is a pressing mechanism in the frame. Under the action of the moving mechanism, the utility model can drive the mounting frame to move back and forth, thereby driving the degumming frame to move back and forth in the cleaning box, which solves the problem that most of the existing single crystal silicon wafers are washed statically Degumming, the degumming effect is poor, and the surface of the silicon wafer after cleaning has the problem of incomplete degumming, which improves the yield of single crystal silicon wafers and is beneficial to the production of single crystal silicon wafers.

Description

A degumming machine for monocrystalline silicon wafers

technical field

The utility model relates to the technical field of degumming single crystal silicon wafers, in particular to a degumming machine for single crystal silicon wafers.

Background technique

Single crystal silicon wafer: A single crystal of silicon, a crystal with a substantially complete lattice structure. Different directions have different properties. It is a good semiconducting material, used to manufacture semiconductor devices, solar cells, etc.; it is made of high-purity polysilicon drawn in a single crystal furnace, and the cleaning of single crystal silicon wafers is to The monocrystalline silicon wafers after cutting are cleaned, and most of them are washed with water when the monocrystalline silica gel is degummed.

When the existing degumming machine is cleaning and degumming, most of the monocrystalline silicon wafers are washed standing still, and the degumming effect is poor. It is beneficial to the production of monocrystalline silicon wafers, therefore, a degumming machine for monocrystalline silicon wafers is needed.

Utility model content

The purpose of this utility model is to provide a degumming machine for single crystal silicon wafers, so as to solve the problems raised in the above-mentioned background technology.

In order to achieve the above purpose, the utility model provides the following technical solutions: a degumming machine for monocrystalline silicon wafers, including a cleaning box, the right side wall of the cleaning box is provided with a mounting plate, and the top of the mounting plate is provided with a mounting groove , a moving mechanism is provided in the installation groove, a mounting frame is provided for sliding connection at the top of the mounting plate, a hydraulic rod is provided at the top of the mounting frame, a mounting rod is provided at the bottom of the hydraulic rod, and a mounting rod is provided at the bottom of the mounting rod. There is a degumming frame, and three sets of placement plates are arranged in the degumming frame, and a pressing mechanism is arranged in the degumming frame.

Further, the moving mechanism includes a screw rod connected to the rear side wall of the installation groove through a bearing, the outer wall of the screw rod is sleeved with a slider, the top of the slider is connected to the bottom of the mounting frame, the wire One end of the rod penetrates through the inner front side wall of the installation groove and is connected with the driven gear provided outside. The right side wall of the installation plate is provided with a motor, and the output end of the motor is connected with a driving gear meshed with the driven gear.

Further, a limit slot is provided at the inner bottom of the installation groove, and a limit block matching the limit slot is provided at the bottom of the slider.

Further, the pressing mechanism includes sliding rods provided on the left and right sides of the degumming frame, one end of the two groups of sliding rods runs through the top of the degumming frame to connect with the connecting plate provided on the outside, and the two groups of sliding rods The outer walls of the rods are all socketed with springs, one end of the springs is connected to the bottom of the connecting plate, the other end of the springs is connected to the top of the degumming frame, and the opposite side walls of the two sets of sliding rods are provided with three sets of pressing blocks, two The bottom of the slide bar in one group is provided with a movable rod, and one end of the movable rod in the two groups runs through the inner bottom of the degumming frame and is connected with the sliding plate provided on the outside, and the bottom of the degumming frame is connected with a threaded rod through a bearing. One end of the threaded rod runs through the top of the sliding plate and is connected with the rotating plate provided outside.

Further, the three sets of placing plates are distributed in a linear array in the vertical direction in the degumming frame, and the left and right sides of the top of the three sets of placing plates are provided with through holes matching the slide bars.

Further, the three sets of pressing blocks are respectively located above the three sets of placing plates, and the bottoms of the pressing blocks are provided with anti-slip layers.

Compared with the prior art, the beneficial effect of the utility model is that the utility model places the monocrystalline silicon wafer on the surface of the placement plate, and then compresses and fixes the monocrystalline silicon wafer under the action of the pressing mechanism, which solves the problem of traditional Most of the single crystal silicon wafers are placed in the degumming frame for cleaning, which does not have the function of pressing the single crystal silicon wafers, which may easily cause the single crystal silicon wafers to fall and cause damage to the single crystal silicon wafers. Under the action, it can drive the mounting frame to move back and forth, thereby driving the degumming frame to move back and forth in the cleaning box, which solves the problem that most of the existing monocrystalline silicon wafers are washed and degummed by standing water, the degumming effect is poor, and there is degumming on the surface of the silicon wafer after cleaning Incomplete problems, improving the yield of monocrystalline silicon wafers is conducive to the production of monocrystalline silicon wafers.

Description of drawings

Fig. 1 is a structural representation of the utility model;

Fig. 2 is a front view of the internal structure of the degumming frame of the present invention.

In the figure: 1, cleaning box; 2, moving mechanism; 20, driving gear; 21, motor; 22, driven gear; 23, screw rod; 24, slider; 3, mounting plate; 4, mounting groove; 5, Mounting frame; 6, degumming frame; 7, placing plate; 8, mounting rod; 9, hydraulic rod; 10, pressing mechanism; 100, connecting plate; 101, spring; 102, pressing block; 103, slide bar; 104 , movable rod; 105, threaded rod; 106, slide plate; 107, rotating plate.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

Example 1:

Please refer to Figure 1-2, the utility model provides a technical solution: a degumming machine for monocrystalline silicon wafers, including a cleaning box 1, the right side wall of the cleaning box 1 is provided with a mounting plate 3, and the top of the mounting plate 3 is opened There is a mounting groove 4, a moving mechanism 2 is arranged in the mounting groove 4, a mounting frame 5 is provided for sliding connection on the top of the mounting plate 3, the mounting frame 5 is arranged in an L shape, a hydraulic rod 9 is arranged on the top of the mounting frame 5, and a hydraulic rod 9 is arranged at the bottom Be provided with mounting bar 8, be provided with degumming frame 6 at the bottom of mounting bar 8, degumming frame 6 is arranged in rectangular shape, be provided with three groups of placement plates 7 in degumming frame 6, be provided with pressing mechanism 10 in degumming frame 6.

Referring to Fig. 1, the moving mechanism 2 includes a screw 23 connected to the rear side wall of the installation groove 4 by bearings, the outer wall of the screw rod 23 is sleeved with a slider 24, and the bottom of the installation groove 4 is provided with a limit groove, and the slider The bottom of 24 is provided with a limit block matched with the limit groove, and under the action of the limit groove and the limit block, the slide block 24 moves more stably on the outer wall of the screw rod 23, and the top of the slide block 24 is connected with the bottom of the mounting frame 5, One end of the screw mandrel 23 runs through the inner front side wall of the mounting groove 4 and is connected with the driven gear 22 provided on the outside. Drive gear 20.

Please refer to Fig. 2, the pressing mechanism 10 comprises the slide bars 103 that are provided on the left and right sides in the degumming frame 6, and one end of two groups of slide bars 103 all runs through the top of the degumming frame 6 and is connected with the connecting plate 100 provided on the outside. The outer walls of the sets of slide bars 103 are all socketed with springs 101, one end of the springs 101 is connected to the bottom of the connecting plate 100, the other end of the springs 101 is connected to the top of the degumming frame 6, and the opposite side walls of the two sets of slide bars 103 are provided with three sets of pressing Block 102, three groups of placing plates 7 are distributed in a linear array in the vertical direction in the degumming frame 6, and the left and right sides of the top of the three groups of placing plates 7 are provided with through holes matching the slide bars 103, and the three groups of pressing blocks 102 Located above the three groups of placing plates 7 respectively, the bottoms of the pressing blocks 102 are provided with anti-skid layers, which can improve the stability of the pressing blocks 102 for pressing single crystal silicon wafers under the effect of the anti-slip layers. There are movable rods 104, one end of two groups of movable rods 104 runs through the inner bottom of the degumming frame 6 and is connected with the sliding plate 106 provided on the outside, the bottom of the degumming frame 6 is connected with a threaded rod 105 through a bearing, and one end of the threaded rod 105 runs through the sliding plate 106 tops are connected with the rotating plate 107 that is provided with outside.

Working principle: the worker places the monocrystalline silicon wafer on the placement plate 7, and then the worker rotates the rotating plate 107 to drive the threaded rod 105 to rotate, so that the sliding plate 106 moves downward on the outer wall of the threaded rod 105, and the sliding plate 106 drives the movable rod 104 moves downward, and the movable rod 104 drives the sliding rod 103 to move downward, so that the connecting plate 100 squeezes the spring 101, and when the sliding rod 103 moves downward, it will drive the pressing block 102 to compress the monocrystalline silicon wafer. It solves the problem that most of the traditional single crystal silicon wafers are placed in the degumming frame 6 for cleaning, which does not have the function of pressing the single crystal silicon wafers, which may easily cause the single crystal silicon wafers to fall and cause damage to the single crystal silicon wafers (Because the monocrystalline silicon wafer is flat, the water flow easily drives the monocrystalline silicon wafer to move when it is put into the cleaning box 1), and then the installation rod 8 is driven to move downward under the action of the hydraulic rod 9, and the installation rod 8 drives the degumming The frame 6 enters the cleaning box 1 for cleaning, drives the driving gear 20 to rotate under the action of the motor 21, the driving gear 20 drives the driven gear 22 to rotate, and the driven gear 22 drives the screw mandrel 23 to rotate, so that the slider 24 The outer wall of the screw rod 23 moves back and forth, the slider 24 drives the installation frame 5 to move back and forth, and the installation frame 5 drives the degumming frame 6 to move back and forth, thereby driving the monocrystalline silicon wafer to move back and forth, which solves the problem that most of the existing single crystal silicon wafers It is standing water washing degumming, the degumming effect is poor, and there is a problem of incomplete degumming on the surface of the cleaned silicon wafer, which improves the yield of single crystal silicon wafers and is beneficial to the production of single crystal silicon wafers.

Although the embodiments of the present invention have been shown and described, those skilled in the art can understand that various changes and modifications can be made to these embodiments without departing from the principle and spirit of the present invention , replacements and modifications, the scope of the present utility model is defined by the appended claims and their equivalents.

Claims (6)

1. The utility model provides a degumming machine for monocrystalline silicon piece, is including wasing case (1), its characterized in that: wash case (1) right side wall and be equipped with mounting panel (3), mounting groove (4) have been seted up at mounting panel (3) top, be equipped with moving mechanism (2) in mounting groove (4), mounting panel (3) top sliding connection is equipped with mounting bracket (5), the top is equipped with hydraulic stem (9) in mounting bracket (5), hydraulic stem (9) bottom is equipped with installation pole (8), installation pole (8) bottom is equipped with and takes off gluey frame (6), it places board (7) to be equipped with three groups in gluey frame (6) to take off, it is equipped with hold-down mechanism (10) in gluey frame (6) to take off.

2. A degumming machine for single crystal silicon wafers according to claim 1, characterized in that: moving mechanism (2) are including mounting groove (4) interior back lateral wall lead screw (23) that are equipped with through the bearing connection, lead screw (23) outer wall cup joints and is equipped with slider (24), slider (24) top is connected with mounting bracket (5) bottom, lead screw (23) one end is run through in mounting groove (4) preceding lateral wall and is connected with driven gear (22) that the outside was equipped with, mounting panel (3) right side wall is equipped with motor (21), motor (21) output is connected and is equipped with driving gear (20) with driven gear (22) engaged with.

3. A degumming machine for a single crystal silicon wafer according to claim 2, characterized in that: the bottom has seted up the spacing groove in mounting groove (4), slider (24) bottom is equipped with the stopper with spacing groove assorted.

4. The debonding machine for a monocrystalline silicon wafer according to claim 1, characterized in that: the pressing mechanism (10) comprises sliding rods (103) arranged on the left side and the right side in the degumming frame (6), one ends of the sliding rods (103) penetrate through the degumming frame (6) and are connected with a connecting plate (100) arranged outside, springs (101) are sleeved on the outer walls of the sliding rods (103), one ends of the springs (101) are connected with the bottom of the connecting plate (100), the other ends of the springs (101) are connected with the top of the degumming frame (6), the opposite side walls of the two groups of sliding rods (103) are provided with three groups of pressing blocks (102), the bottoms of the sliding rods (103) are provided with movable rods (104), one ends of the movable rods (104) penetrate through the inner bottom of the degumming frame (6) and are connected with sliding plates (106) arranged outside, the bottom of the degumming frame (6) is provided with a threaded rod (105) through a bearing connection, and one end of the threaded rod (105) penetrates through the top of the sliding plate (106) and is connected with a rotating plate (107) arranged outside.

5. The debonding machine for a single crystal silicon wafer according to claim 4, characterized in that: the three groups of placing plates (7) are distributed in a linear array in the vertical direction in the degumming frame (6), and through holes matched with the sliding rods (103) are formed in the left side and the right side of the top of each placing plate (7).

6. The debonding machine for a single crystal silicon wafer according to claim 4, characterized in that: the three groups of the pressing blocks (102) are respectively positioned above the three groups of the placing plates (7), and anti-skid layers are arranged at the bottoms of the pressing blocks (102).

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