CN218081994U - Cylindrical grinding machine for processing semiconductor silicon carbide - Google Patents
Cylindrical grinding machine for processing semiconductor silicon carbide Download PDFInfo
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- CN218081994U CN218081994U CN202220456241.7U CN202220456241U CN218081994U CN 218081994 U CN218081994 U CN 218081994U CN 202220456241 U CN202220456241 U CN 202220456241U CN 218081994 U CN218081994 U CN 218081994U
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- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 238000005498 polishing Methods 0.000 claims description 46
- 230000005540 biological transmission Effects 0.000 claims description 13
- 238000003754 machining Methods 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 230000001360 synchronised effect Effects 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 230000002337 anti-port Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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Abstract
The utility model relates to a carborundum processing technology field, a cylindrical grinder for processing of semiconductor carborundum, comprising a base plate, driving motor, fixture and grinding machanism, first support is installed at the top of bottom plate, the second support is installed to the bottom, driving motor installs on the second support, and driving motor's output shaft runs through the bottom plate and is connected with grinding machanism, fixture includes initiative rotating part and driven rotating part, wherein the second splint symmetric distribution on the first splint on the initiative rotating part and the driven rotating part, still install positioner on the first support, positioner includes the bracing piece, screw rod and push pedal, wherein the bracing piece adopts cross mechanism, including horizontal pole and vertical pole, wherein be provided with the scale on the horizontal pole, the screw rod runs through the vertical pole and is parallel with the horizontal pole, the push pedal is installed in the one end that the screw rod is close to the driven rotating part, the both ends at the second splint are installed to the positioner symmetry. The application effectively improves the processing efficiency and the processing quality of the silicon carbide wafer.
Description
Technical Field
The application relates to the technical field of silicon carbide processing, in particular to a cylindrical grinding machine for processing semiconductor silicon carbide.
Background
The cylindrical grinding machine is a grinding machine for processing the outer surface and the shaft shoulder end surface formed by the cylindrical, conical or other-shaped plain lines of a workpiece; the cylindrical grinder is a machine tool which is most widely applied in all grinders, and generally comprises a cast iron lathe bed at a basic part, a workbench, a headstock, a tailstock, a grinding carriage for mounting a grinding wheel, a transverse feeding mechanism for controlling the size of a grinding workpiece, an electric appliance for controlling the motion of a moving part of the machine tool, a hydraulic device and other main parts.
Chinese patent CN213917590U belongs to cylindrical grinder technical field, especially is a cylindrical grinder for semiconductor monocrystalline silicon processing, to the cylindrical grinder among the prior art can not be accurate process semiconductor monocrystalline silicon outer lane, to the poor problem of the processingquality of semiconductor monocrystalline silicon, now proposes following scheme, and it includes the bottom plate, the equal fixed mounting in bottom four corners of bottom plate has the landing leg, and the top of bottom plate is rotated and is installed first pivot, and the top fixed mounting of first pivot has first splint, and top one side fixed mounting of bottom plate has the backup pad, and the top fixed mounting of backup pad has the roof, and the bottom of roof is rotated and is installed the top of second pivot, and the bottom fixed mounting of second pivot has electric telescopic handle, and the epaxial fixedly connected with second splint of electric telescopic handle's piston. The utility model has the advantages of reasonable design, easy operation is convenient for polish the processing to semiconductor monocrystalline silicon's outer lane, and has improved the effect of polishing to semiconductor monocrystalline silicon.
The cylindrical grinding machine is needed in the processing of cylindrical semiconductors, the precision of the conventional cylindrical grinding machine is higher when the lower surface of the monocrystalline silicon is ground, but when the cylindrical monocrystalline silicon is ground, no circle center mark point exists on the cylindrical monocrystalline silicon, so that when the cylindrical monocrystalline silicon is fixed, the center of the silicon carbide wafer cannot be quickly and accurately corresponding to the centers of the first clamping plate and the second clamping plate, the efficiency of processing the cylindrical silicon carbide is low, and the processing precision is low.
SUMMERY OF THE UTILITY MODEL
In order to overcome the problems in the prior art, the application provides a cylindrical grinding machine for processing semiconductor silicon carbide.
The application provides a cylindrical grinder for processing of semiconductor carborundum adopts following technical scheme:
the utility model provides a cylindrical grinder for processing of semiconductor carborundum, comprising a base plate, driving motor, fixture and grinding machanism, first support is installed at the top of bottom plate, the second support is installed to the bottom, driving motor installs on the second support, and driving motor's output shaft runs through the bottom plate and is connected with grinding machanism, fixture is including installing the initiative rotating part on the bottom plate and installing the driven rotating part on first support, wherein the second splint symmetric distribution on the first splint on the initiative rotating part and the driven rotating part, still install positioner on the first support, positioner includes the bracing piece, screw rod and push pedal, wherein the bracing piece adopts cross mechanism, including horizontal pole and vertical pole, wherein be provided with the scale on the horizontal pole, the screw rod runs through the vertical pole and is parallel with the horizontal pole, the push pedal is installed in the one end that the screw rod is close to the driven rotating part, the both ends at the second splint are installed to the positioner symmetry.
Through adopting above-mentioned technical scheme, driving motor on the second support of bottom plate bottom passes through output shaft drive grinding machanism and initiative rotating part and rotates, and initiative rotating part carries out the centre gripping with driven rotating part to the wafer, and grinding machanism polishes the wafer. The positioning device arranged on the first support rotates through the screw rod to push the push plate to limit the wafer, the push plate moves on the cross rod of the support rod through the pushing of the screw rod, the scales arranged on the cross rod can indicate the position of the push plate, and the centers of the wafer and the centers of the second clamping plate and the first clamping plate are symmetrically arranged on the positioning devices at the two ends of the second clamping plate, so that the wafer processing efficiency and the processing precision are effectively improved.
Preferably, first support and second support all adopt "L" shape structure, and wherein first support is kept away from and is provided with driven rotating part in the one end of bottom plate, including seting up the circular cavity in first support, installs the carousel of being connected with circular cavity lateral wall rotation in the circular cavity, and first pivot is installed at the carousel center, and wherein the telescopic link is installed to the bottom of first pivot, and the bottom of telescopic link installs the second splint.
Through adopting above-mentioned technical scheme, the driven rotating part that first support set up can pass through the lift of telescopic link control second splint, thereby realize getting on first splint of wafer and put, after first splint and the centre gripping wafer of second splint, first splint on the initiative swivel mount can drive whole driven swivel mount and rotate, drive telescopic link and first rotation through second splint on the driven swivel mount, first pivot is gone on through the carousel and is rotated in the circular cavity of first support, thereby realize the synchronous rotation of driven swivel mount and initiative swivel mount.
Preferably, a driving motor is installed at one end, far away from the bottom plate, of the second support, a transmission gear and a polishing wheel are installed on an output shaft of the driving motor, wherein the transmission gear is located below the bottom plate, and the polishing wheel is located above the bottom plate.
Through adopting above-mentioned technical scheme, the driving motor of first shelf location passes through the output shaft and goes up drive gear drive initiative rotating part, and grinding wheel drive grinding machanism realizes the antiport of grinding machanism and wafer, and effectual improvement is to the effect of polishing of carborundum wafer.
Preferably, the driving rotation part includes a second rotation shaft, a driven gear and a first clamping plate, the second rotation shaft penetrates through the bottom plate, the first clamping plate is fixed to the top of the second rotation shaft, and the driven gear fixed to the bottom of the second rotation shaft is meshed with the transmission gear.
Through adopting above-mentioned technical scheme, carry out the meshing transmission through driven gear and the drive gear on the driving motor output shaft in the initiative rotating part, realize that the grinding wheel on the output shaft is opposite with the direction of rotation of initiative rotating part, improve the effect of polishing. The first splint of installation are responsible for the driven rotating part of cooperation and carry out the centre gripping to the wafer in the second pivot.
Preferably, the grinding mechanism comprises a grinding wheel, a driven grinding mechanism and a grinding belt, wherein the driven grinding mechanism and the grinding wheel are symmetrically distributed relative to the driving rotating part, and the driven grinding mechanism comprises a wheel body at the top and a rotating mechanism at the bottom.
Through adopting above-mentioned technical scheme, the wheel of polishing among the grinding machanism drives through driving motor's output shaft, drives the area of polishing of being connected with driven grinding machanism and rotates, and the area of polishing is polished the wafer, and the rotation that accompanies the wafer simultaneously can realize better effect of polishing.
Preferably, a polishing belt is installed between the polishing wheel and the wheel body, wherein the polishing belt is annular, and the positioning device is arranged on the inner side of the polishing belt.
Through adopting above-mentioned technical scheme, the area of polishing that sets up between wheel and the wheel body of polishing adopts the loop configuration, can polish from the both sides of wafer, and the positioner who sets up in annular inside does not receive grinding machanism's influence to can carry on spacingly to the wafer from both sides, carry out pivoted in-process at the wafer, positioner can guarantee that the wafer is in the central point of initiative rotating part and driven rotating part and put.
Preferably, slewing mechanism includes pivot and support frame, and wherein the pivot passes through the bearing and rotates with the top of bottom plate to be connected, and the support frame passes through the bearing and rotates with the interlude of pivot to be connected.
Through adopting above-mentioned technical scheme, slewing mechanism is arranged in installing the wheel body among the grinding machanism, and wherein fixed connection between pivot and the wheel body rotates between pivot and bottom plate and the support frame to be connected, realizes the comparatively stable rotation in area of polishing.
Preferably, the bottom plate bottom is provided with the supporting leg, and the bottom of supporting leg sets up the abrasive pad.
Through adopting above-mentioned technical scheme, the supporting leg is installed to the bottom plate bottom for the position that the support department is used for installing the second support, and the wearing pad that the supporting leg bottom was equipped with can prevent that cylindrical grinder from removing in-process going on polishing from appearing, improves the stability ability of polishing.
In summary, the present application includes at least one of the following beneficial technical effects:
1. the wafer on the first clamping plate is clamped by the lifting and matching of the second clamping plate in the clamping mechanism, so that the wafer is taken and placed, meanwhile, the clamping mechanism drives the wafer to rotate, and the edge of the wafer is efficiently polished by the matching of the polishing mechanism;
2. the positioner who first shelf location rotates through the screw rod and promotes the push pedal and carry on spacingly to the wafer, and the push pedal moves on the horizontal pole of bracing piece through the promotion of screw rod, and the position of push pedal can be instructed to the scale that is equipped with on the horizontal pole, the position of regulation wafer in fixture that can be accurate to improve the precision of polishing of wafer.
Drawings
FIG. 1 is a schematic view of the overall structure of a cylindrical grinding machine for processing semiconductor silicon carbide;
fig. 2 is an enlarged view of the positioning device of fig. 1.
Description of reference numerals: 1. a base plate; 11. a first bracket; 111. a driven rotating part; 1111. a second splint; 1112. a circular cavity; 1113. a turntable; 1114. a first rotating shaft; 1115. a telescopic rod; 12. a second bracket; 13. an active rotating part; 14. supporting legs; 141. a wear pad; 131. a first splint; 132. a second rotating shaft; 133. a driven gear; 2. a drive motor; 21. an output shaft; 22. a transmission gear; 3. a clamping mechanism; 4. a polishing mechanism; 41. grinding the wheel; 42. polishing the belt; 5. a positioning device; 51. a support bar; 511. a cross bar; 512. a longitudinal bar; 52. a screw; 53. pushing the plate; 6. a driven grinding mechanism; 61. a wheel body; 62. a rotating mechanism; 621. a rotating shaft; 622. a support frame.
Detailed Description
The present application is described in further detail below with reference to figures 1-2.
The embodiment of the application discloses a cylindrical grinder for processing semiconductor silicon carbide.
Referring to fig. 1 and 2, a cylindrical grinder for processing semiconductor silicon carbide, including a base plate 1, a driving motor 2, a clamping mechanism 3 and a grinding mechanism 4, a first support 11 is installed at the top of the base plate 1, a second support 12 is installed at the bottom, the driving motor 2 is installed on the second support 12, an output shaft 21 of the driving motor 2 penetrates through the base plate 1 and is connected with the grinding mechanism 4, the clamping mechanism 3 includes a driving rotating part 13 installed on the base plate 1 and a driven rotating part 111 installed on the first support 11, wherein a first clamping plate 131 on the driving rotating part 13 and a second clamping plate 1111 on the driven rotating part 111 are symmetrically distributed, a positioning device 5 is further installed on the first support 11, the positioning device 5 includes a supporting rod 51, a screw rod 52 and a push plate 53, wherein the supporting rod 51 adopts a cross-shaped mechanism and includes a cross rod 511 and a longitudinal rod 512, wherein scales are provided on the cross rod 511, the screw rod 52 penetrates through the longitudinal rod 512 and is parallel to the cross rod 511, the push plate 53 is installed at one end of the screw rod 52 close to the driven rotating part 111, and the positioning device 5 is symmetrically installed at two ends of the second clamping plate 1111. The driving motor 2 on the second support 12 at the bottom of the base plate 1 drives the polishing mechanism 4 and the driving rotating part 13 to rotate through the output shaft 21, the driving rotating part 13 and the driven rotating part 111 clamp the wafer, and the polishing mechanism 4 polishes the wafer. The positioning device 5 installed on the first support 11 rotates through the screw 52 to push the push plate 53 to limit the wafer, the push plate 53 moves on the cross rod 511 of the support rod 51 through the pushing of the screw 52, the scales arranged on the cross rod 511 can indicate the position of the push plate 53, the centers of the wafer and the centers of the second clamp plate 1111 and the first clamp plate 131 are corresponding to the positioning devices 5 symmetrically arranged at the two ends of the second clamp plate 1111, and therefore the wafer processing efficiency and the processing precision are effectively improved.
Referring to fig. 1, first support 11 and second support 12 all adopt "L" shape structure, wherein be provided with driven rotating part 111 in the one end that bottom plate 1 was kept away from to first support 11, including offering the circular cavity 1112 in first support 11, install in the circular cavity 1112 and rotate the carousel 1113 of being connected with circular cavity 1112 lateral wall, first pivot 1114 is installed at carousel 1113 center, wherein telescopic link 1115 is installed to the bottom of first pivot 1114, and second splint 1111 is installed to the bottom of telescopic link 1115. Driven rotating portion 111 that first support 11 set up can pass through the lift of telescopic link 1115 control second splint 1111, thereby realize getting on first splint 131 of wafer and put, after first splint 131 and second splint 1111 centre gripping wafer, first splint 131 on the initiative swivel mount can drive whole driven swivel mount and rotate, drive telescopic link 1115 and first rotation through second splint 1111 on the driven swivel mount, first pivot 1114 rotates in the circular cavity 1112 of first support 11 through carousel 1113, thereby realize the synchronous rotation of driven swivel mount and initiative swivel mount.
Referring to fig. 1, a driving motor 2 is installed on one end of the second bracket 12 far away from the bottom plate 1, and a transmission gear 22 and a grinding wheel 41 are installed on an output shaft 21 of the driving motor 2, wherein the transmission gear 22 is located below the bottom plate 1, and the grinding wheel 41 is located above the bottom plate 1. The driving motor 2 installed on the first support 11 drives the driving rotating part 13 through the upper transmission gear 22 on the output shaft 21, the polishing wheel 41 drives the polishing mechanism 4, the reverse rotation of the polishing mechanism 4 and the wafer is realized, and the polishing effect of the silicon carbide wafer is effectively improved.
Referring to fig. 1, the driving rotation portion 13 includes a second rotation shaft 132, a driven gear 133 and a first clamping plate 131, the second rotation shaft 132 penetrates through the base plate 1, the first clamping plate 131 is fixed to the top of the second rotation shaft 132, and the driven gear 133 fixed to the bottom of the second rotation shaft is engaged with the transmission gear 22. In the driving rotation part 13, the driven gear 133 is meshed with the driving gear on the output shaft 21 of the driving motor 2 for transmission, so that the grinding wheel 41 on the output shaft 21 and the driving rotation part 13 rotate in opposite directions, and the grinding effect is improved. The first clamping plate 131 mounted on the second rotating shaft 132 is used for clamping the wafer in cooperation with the driven rotating part 111.
Referring to fig. 1, the grinding mechanism 4 includes a grinding wheel 41, a driven grinding mechanism 6 and a grinding belt 42, wherein the driven grinding mechanism 6 is symmetrically distributed with the grinding wheel 41 relative to the driving rotation part 13, and the driven grinding mechanism 6 includes a top wheel body 61 and a bottom rotation mechanism 62. The polishing wheel 41 in the polishing mechanism 4 is driven by the output shaft 21 of the driving motor 2 to drive the polishing belt 42 connected with the driven polishing mechanism 6 to rotate, the polishing belt 42 polishes the wafer, and meanwhile, the better polishing effect can be realized along with the rotation of the wafer.
Referring to fig. 1, a polishing belt 42 is installed between the polishing wheel 41 and the wheel body 61, wherein the polishing belt 42 is ring-shaped, and the positioning device 5 is disposed inside the polishing belt 42. The polishing belt 42 arranged between the polishing wheel 41 and the wheel body 61 is of an annular structure, and can polish from both sides of the wafer, and the positioning device 5 arranged inside the ring is not affected by the polishing mechanism 4, and can limit the wafer from both sides, and the positioning device 5 can ensure that the wafer is positioned at the center of the driving rotating part 13 and the driven rotating part 111 during the rotation of the wafer.
Referring to fig. 1, the rotating mechanism 62 includes a rotating shaft 621 and a supporting frame 622, wherein the rotating shaft 621 is rotatably connected to the top of the base plate 1 through a bearing, and the supporting frame 622 is rotatably connected to the middle section of the rotating shaft 621 through a bearing. The rotating mechanism 62 is used for mounting the wheel body 61 in the polishing mechanism 4, wherein the rotating shaft 621 is fixedly connected with the wheel body 61, and the rotating shaft 621 is rotatably connected with the base plate 1 and the supporting frame 622, so that the polishing belt 42 can rotate stably.
Referring to fig. 1, the bottom of the base plate 1 is provided with support legs 14, and the bottoms of the support legs 14 are provided with wear pads 141. Supporting legs 14 are installed to bottom plate 1 bottom for the position that the department is used for installing second support 12 is supported, and the abrasive pad 141 that supporting legs 14 bottom was equipped with can prevent that cylindrical grinder from removing in-process appearance of polishing, improves the stability ability of polishing.
The above are preferred embodiments of the present application, and the scope of protection of the present application is not limited thereto, so: equivalent changes in structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. The utility model provides a cylindrical grinder for processing of semiconductor carborundum, includes bottom plate (1), driving motor (2), fixture (3) and grinding machanism (4), its characterized in that: first support (11) are installed at the top of bottom plate (1), and second support (12) are installed to the bottom, install on second support (12) driving motor (2), and output shaft (21) of driving motor (2) run through bottom plate (1) and be connected with grinding machanism (4), fixture (3) are including installing initiative rotating part (13) on bottom plate (1) and installing driven rotating part (111) on first support (11), wherein second splint (1111) symmetric distribution on first splint (131) and the driven rotating part (111) on initiative rotating part (13), still install positioner (5) on first support (11), positioner (5) include bracing piece (51), screw rod (52) and push pedal (53), wherein bracing piece (51) adopt cross mechanism, include horizontal pole (511) and vertical pole (512), wherein are provided with the scale on horizontal pole (511), screw rod (52) run through vertical pole (512) and are parallel with horizontal pole (511), install push pedal (53) and be close to the one end of screw rod (52) and install at the both ends of second splint (1111) symmetric distribution.
2. The cylindrical grinding machine for processing semiconductor silicon carbide according to claim 1, characterized in that: first support (11) and second support (12) all adopt "L" shape structure, and wherein first support (11) are kept away from the one end of bottom plate (1) and are provided with driven rotating part (111), including offering circular cavity (1112) in first support (11), install carousel (1113) of being connected with circular cavity (1112) lateral wall rotation in circular cavity (1112), first pivot (1114) are installed at carousel (1113) center, and wherein telescopic link (1115) are installed to the bottom of first pivot (1114), and second splint (1111) are installed to the bottom of telescopic link (1115).
3. The cylindrical grinding machine for processing semiconductor silicon carbide according to claim 1, characterized in that: the grinding machine is characterized in that a driving motor (2) is installed at one end, far away from the bottom plate (1), of the second support (12), a transmission gear (22) and a grinding wheel (41) are installed on an output shaft (21) of the driving motor (2), wherein the transmission gear (22) is located below the bottom plate (1), and the grinding wheel (41) is located above the bottom plate (1).
4. A cylindrical grinding machine for semiconductor silicon carbide machining according to claim 3, characterized in that: the driving rotating part (13) comprises a second rotating shaft (132), a driven gear (133) and a first clamping plate (131), the second rotating shaft (132) penetrates through the base plate (1), the first clamping plate (131) is fixed to the top of the second rotating shaft (132), and the driven gear (133) fixed to the bottom of the second rotating shaft is meshed with the transmission gear (22).
5. The cylindrical grinding machine for processing semiconductor silicon carbide according to claim 1, characterized in that: grinding machanism (4) are including grinding wheel (41), driven grinding machanism (6) and the area (42) of polishing, and wherein driven grinding machanism (6) are the symmetric distribution for initiative rotating part (13) and grinding wheel (41), driven grinding machanism (6) are including wheel body (61) at top and slewing mechanism (62) of bottom.
6. The cylindrical grinding machine for processing semiconductor silicon carbide according to claim 5, characterized in that: a grinding belt (42) is arranged between the grinding wheel (41) and the wheel body (61), wherein the grinding belt (42) is annular, and the positioning device (5) is arranged on the inner side of the grinding belt (42).
7. The cylindrical grinding machine for processing semiconductor silicon carbide according to claim 5, characterized in that: slewing mechanism (62) include pivot (621) and support frame (622), and wherein pivot (621) are connected through the top rotation of bearing with bottom plate (1), support frame (622) are connected through the interlude rotation of bearing with pivot (621).
8. The cylindrical grinding machine for processing semiconductor silicon carbide according to claim 1, characterized in that: the bottom plate (1) bottom is provided with supporting leg (14), and the bottom of supporting leg (14) sets up wear pad (141).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220456241.7U CN218081994U (en) | 2022-03-03 | 2022-03-03 | Cylindrical grinding machine for processing semiconductor silicon carbide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220456241.7U CN218081994U (en) | 2022-03-03 | 2022-03-03 | Cylindrical grinding machine for processing semiconductor silicon carbide |
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| Publication Number | Publication Date |
|---|---|
| CN218081994U true CN218081994U (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220456241.7U Active CN218081994U (en) | 2022-03-03 | 2022-03-03 | Cylindrical grinding machine for processing semiconductor silicon carbide |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118238043A (en) * | 2024-04-29 | 2024-06-25 | 安徽微芯长江半导体材料有限公司 | A device for growing silicon carbide wafer and removing back side deposits |
-
2022
- 2022-03-03 CN CN202220456241.7U patent/CN218081994U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118238043A (en) * | 2024-04-29 | 2024-06-25 | 安徽微芯长江半导体材料有限公司 | A device for growing silicon carbide wafer and removing back side deposits |
| CN118238043B (en) * | 2024-04-29 | 2025-11-28 | 安徽微芯长江半导体材料有限公司 | Device for removing back sediment during growth of silicon carbide wafer |
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