CN218039173U - Heat radiator for integrated circuit chip - Google Patents
Heat radiator for integrated circuit chip Download PDFInfo
- Publication number
- CN218039173U CN218039173U CN202221754416.9U CN202221754416U CN218039173U CN 218039173 U CN218039173 U CN 218039173U CN 202221754416 U CN202221754416 U CN 202221754416U CN 218039173 U CN218039173 U CN 218039173U
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- CN
- China
- Prior art keywords
- heat dissipation
- installation shell
- fixed mounting
- heating panel
- chip body
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 83
- 238000009434 installation Methods 0.000 claims abstract description 45
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 238000009423 ventilation Methods 0.000 claims abstract description 12
- 239000000428 dust Substances 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 11
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat abstractor of integrated circuit chip, include the chip body and be used for bearing the installation shell of chip body, the inside fixed mounting of installation shell has many connecting pipes, the inside threaded connection of connecting pipe has connecting screw, the chip body passes through connecting screw and installation shell fixed mounting, the even fixed mounting of diapire of installation shell has the polylith heating panel, the diapire fixed mounting of installation shell has the heat dissipation frid of V-arrangement, the terminal surface fixed mounting of heat dissipation frid of V-arrangement and polylith heating panel. The utility model discloses a heat that the polylith heating panel distributed out the chip body adsorbs, makes the heat dissipation fan introduce the cold air in the external world to the mounting shell between the piece of heating panel from the ventilation groove that the other end was seted up, makes the formation air convection effect in the mounting shell, makes external cold air can cool down to the heating panel to the realization is to the whole radiating effect of chip body, avoids the chip body to influence performance because the temperature is overheated.
Description
Technical Field
The utility model relates to an integrated circuit chip technical field especially relates to an integrated circuit chip's heat abstractor.
Background
In the use process of the existing integrated circuit chip, a radiating fin or a radiating fan is generally adopted for radiating so as to ensure the normal use performance of the integrated circuit chip. Because the wind power of the existing heat dissipation fan is set in a fixed direction, the heat dissipation fan can only cool and dissipate partial positions of the integrated circuit chip, and the use performance of the integrated circuit chip is easily affected due to overhigh local temperature.
SUMMERY OF THE UTILITY MODEL
The purpose of the utility model is to provide a heat dissipation device of integrated circuit chip in order to solve the shortcoming that exists among the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an integrated circuit chip's heat abstractor, includes chip body and the installation shell that is used for bearing the weight of the chip body, the inside fixed mounting of installation shell has many connecting pipes, the inside threaded connection of connecting pipe has connecting screw, the chip body passes through connecting screw and installation shell fixed mounting, the even fixed mounting of diapire of installation shell has the polylith heating panel, the diapire fixed mounting of installation shell has V-arrangement heat dissipation frid, the terminal surface fixed mounting of V-arrangement heat dissipation frid and polylith heating panel, the surface that V-arrangement heat dissipation frid is close to heating panel one side evenly runs through and has seted up a plurality of louvres, the surface that V-arrangement heat dissipation frid kept away from heating panel one side runs through and has seted up the through-hole, the diapire that the installation shell is close to the through-hole is equipped with heat dissipation mechanism.
As a further aspect of the utility model, heat dissipation mechanism includes fixed mounting in the fixed plate of installation shell diapire, the surface rotation that the fixed plate is close to through-hole one side installs the heat dissipation fan.
As a further aspect of the utility model, the fixed surface of fixed plate installs micro motor, micro motor's output run through the surface of fixed plate and with the rotation center fixed mounting of heat dissipation fan.
As a further scheme of the utility model, the surface that the installation shell is close to V-arrangement heat dissipation frid one side runs through and has seted up the hole of airing exhaust, the inner wall fixed mounting in hole of airing exhaust has the dust screen.
As a further scheme of the utility model, the surface that V-arrangement heat dissipation frid one side was kept away from to the installation shell runs through and has seted up the ventilation groove, the inner wall fixed mounting in ventilation groove has the filter screen.
As a further scheme of the utility model, the surface symmetry fixed mounting that the V-arrangement heat dissipation frid is close to through-hole one side has two baffles, two the baffle sets up between the inner wall of V-arrangement heat dissipation frid and installation shell.
The utility model has the advantages that:
1. adsorb the heat that gives out through the polylith heating panel to the chip body, and drive the heat dissipation fan through micro motor and rotate, make the heat dissipation fan with the inside air current of V-arrangement heat dissipation frid to the outside water conservancy diversion of installation shell, make the louvre that the heat between the polylith heating panel can be seted up from the V-arrangement heat dissipation frid surface discharge outside the installation shell, and simultaneously, the gas flow in the installation shell, make external cold air get into between the piece of heating panel from the ventilation groove that the installation shell other end was seted up, form the air convection effect in making the installation shell, make external cold air can cool down the heating panel, thereby realize the whole radiating effect to the chip body, avoid the chip body to influence performance because the temperature is overheated.
2. Through two baffles of the outer surface symmetry fixed mounting at V-arrangement heat dissipation frid for two baffles can form the ventilation cavity between the inner wall of V-arrangement heat dissipation frid and installation shell, avoid heat dissipation fan exhaust hot-air still to persist in the installation shell, influence the radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation device for an integrated circuit chip according to the present invention;
fig. 2 is a schematic diagram of an internal structure of a heat dissipation device for an integrated circuit chip according to the present invention;
fig. 3 is an enlarged view of a structure a in fig. 2.
In the figure: 1. a chip body; 2. mounting a shell; 3. a connecting pipe; 4. a connecting screw; 5. a heat dissipation plate; 6. a V-shaped heat dissipation groove plate; 7. a ventilation slot; 8. heat dissipation holes; 9. a baffle plate; 10. a fixing plate; 11. a heat dissipation fan; 12. an air exhaust hole; 13. a micro motor; 14. a dust screen; 15. a filter screen; 16. and a through hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Examples
Referring to fig. 1-3, a heat dissipation device for an integrated circuit chip includes a chip body 1 and an installation shell 2 for carrying the chip body 1, a plurality of connection pipes 3 are fixedly installed inside the installation shell 2, the connection screws 4 are connected to the internal threads of the connection pipes 3, the chip body 1 is fixedly installed with the installation shell 2 through the connection screws 4, a plurality of heat dissipation plates 5 are uniformly and fixedly installed on the bottom wall of the installation shell 2, a V-shaped heat dissipation groove plate 6,V-shaped heat dissipation groove plate 6 is fixedly installed on the bottom wall of the installation shell 2, and end faces of the plurality of heat dissipation plates 5 are fixedly installed, a plurality of heat dissipation holes 8 are uniformly formed in the outer surface of one side, close to the heat dissipation plate 5, of the V-shaped heat dissipation groove plate 6, and are gradually increased in diameter from the middle to two sides, the diameter of the heat dissipation holes 8, which is closer to the heat dissipation fan 11, is smaller, so that the wind power of the heat dissipation fan 11 can ensure that the suction force to the plurality of heat dissipation plates 8 is the same, thereby realizing the simultaneous heat dissipation effect to the plurality of heat dissipation plates 5; the outer surface of one side of the V-shaped heat dissipation groove plate 6, which is far away from the heat dissipation plate 5, is provided with a through hole 16 in a penetrating way, and the bottom wall of the installation shell 2, which is close to the through hole 16, is provided with a heat dissipation mechanism.
In this embodiment, the heat dissipation mechanism includes a fixing plate 10 fixedly mounted on the bottom wall of the mounting case 2, and a heat dissipation fan 11 is rotatably mounted on the outer surface of the fixing plate 10 on the side close to the through hole 16.
In this embodiment, a micro motor 13 is fixedly mounted on an outer surface of the fixing plate 10, and an output end of the micro motor 13 penetrates through the outer surface of the fixing plate 10 and is fixedly mounted with a rotation center of the heat dissipating fan 11.
In this embodiment, the outer surface of the mounting case 2 near one side of the V-shaped heat dissipation slot plate 6 is provided with an air exhaust hole 12 in a penetrating manner, and the inner wall of the air exhaust hole 12 is fixedly provided with a dust screen 14 to prevent external dust from adhering to the heat dissipation fan 11 and increase the weight of the heat dissipation fan 11, thereby increasing the power consumption of the micro motor 13.
In this embodiment, the surface that V-arrangement heat dissipation frid 6 one side was kept away from to installation shell 2 runs through and has seted up ventilation groove 7, and the inner wall fixed mounting of ventilation groove 7 has filter screen 15, prevents that external dust from entering into in installation shell 2 to the adhesion influences the radiating effect of chip body 1 and heating panel 5 at the surface of chip body 1 with heating panel 5.
In this embodiment, two baffles 9 are symmetrically and fixedly installed on the outer surface of the V-shaped heat dissipation slot plate 6 close to one side of the through hole 16, and the two baffles 9 are arranged between the V-shaped heat dissipation slot plate 6 and the inner wall of the installation shell 2.
From the above description, it can be seen that the above-mentioned embodiments of the present invention achieve the following technical effects: the plurality of heat dissipation plates 5 are fixedly installed on the bottom wall of the installation shell 2, so that the plurality of heat dissipation plates 5 can absorb heat emitted by the chip body 1, meanwhile, the micro motor 13 drives the heat dissipation fan 11 to rotate, the heat dissipation fan 11 guides airflow inside the V-shaped heat dissipation groove plate 6 to the outside of the installation shell 2, heat among the plurality of heat dissipation plates 5 can be discharged out of the installation shell 2 from a heat dissipation hole 8 formed in the outer surface of the V-shaped heat dissipation groove plate 6, meanwhile, gas in the installation shell 2 flows, external cold air enters among the plurality of heat dissipation plates 5 from a ventilation groove 7 formed in the other end of the installation shell 2, an air convection effect is formed in the installation shell 2, the external cold air can cool the heat dissipation plates 5, the integral heat dissipation effect of the chip body 1 is achieved, and the influence on service performance of the chip body 1 due to overheating of temperature is avoided; through two baffles 9 of the outer surface symmetry fixed mounting at V-arrangement heat dissipation frid 6 for two baffles 9 can form the ventilation cavity between the inner wall of V-arrangement heat dissipation frid 6 and installation shell 2, avoid heat dissipation fan 11 exhaust hot-air still to persist in installation shell 2, influence the radiating effect, and a plurality of electrical components's concrete connection mode and theory of operation are the well-known technique in this field, do not do too much to describe here.
For ease of description, spatially relative terms such as "over … …", "over … …", "over … …", "over", etc. may be used herein to describe the spatial positional relationship of one device or feature to another device or feature as shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged under appropriate circumstances such that, for example, embodiments of the application described herein may be implemented in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides an integrated circuit chip's heat abstractor, includes chip body (1) and installation shell (2) that are used for bearing chip body (1), its characterized in that, the inside fixed mounting of installation shell (2) has many connecting pipes (3), the inside threaded connection of connecting pipe (3) has connecting screw (4), chip body (1) is through connecting screw (4) and installation shell (2) fixed mounting, the even fixed mounting of diapire of installation shell (2) has polylith heating panel (5), the diapire fixed mounting of installation shell (2) has V-arrangement heat dissipation frid (6), the terminal surface fixed mounting of V-arrangement heat dissipation frid (6) and polylith heating panel (5), the surface that V-arrangement heat dissipation frid (6) is close to heating panel (5) one side evenly runs through and has seted up a plurality of louvres (8), the surface that V-arrangement heat dissipation frid (6) kept away from heating panel (5) one side runs through and has seted up through-hole (16), the diapire that installation shell (2) is close to through-hole (16) is equipped with heat dissipation mechanism.
2. The heat dissipation device of an integrated circuit chip as recited in claim 1, wherein the heat dissipation mechanism comprises a fixing plate (10) fixedly mounted on the bottom wall of the mounting housing (2), and a heat dissipation fan (11) is rotatably mounted on the outer surface of the fixing plate (10) on the side close to the through hole (16).
3. The heat sink of claim 2, wherein the micro motor (13) is fixedly mounted on the outer surface of the fixing plate (10), and the output end of the micro motor (13) penetrates through the outer surface of the fixing plate (10) and is fixedly mounted with the rotation center of the heat dissipating fan (11).
4. The heat dissipation device for integrated circuit chips as defined in claim 1, wherein the outer surface of the mounting case (2) near the side of the V-shaped heat dissipation channel plate (6) is perforated with air vents (12), and the inner wall of the air vents (12) is fixedly mounted with a dust screen (14).
5. The heat dissipation device for integrated circuit chips as defined in claim 1, wherein a ventilation slot (7) is formed through an outer surface of the mounting housing (2) on a side away from the V-shaped heat dissipation slot plate (6), and a filter screen (15) is fixedly mounted on an inner wall of the ventilation slot (7).
6. The heat dissipation device for integrated circuit chips as defined in claim 1, wherein two baffles (9) are symmetrically and fixedly mounted on the outer surface of the V-shaped heat sink plate (6) on the side close to the through hole (16), and the two baffles (9) are disposed between the V-shaped heat sink plate (6) and the inner wall of the mounting case (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221754416.9U CN218039173U (en) | 2022-07-07 | 2022-07-07 | Heat radiator for integrated circuit chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221754416.9U CN218039173U (en) | 2022-07-07 | 2022-07-07 | Heat radiator for integrated circuit chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218039173U true CN218039173U (en) | 2022-12-13 |
Family
ID=84381375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221754416.9U Expired - Fee Related CN218039173U (en) | 2022-07-07 | 2022-07-07 | Heat radiator for integrated circuit chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218039173U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117529052A (en) * | 2023-12-15 | 2024-02-06 | 陕西智引科技有限公司 | A high-security mine explosion-proof and intrinsically safe power supply |
-
2022
- 2022-07-07 CN CN202221754416.9U patent/CN218039173U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117529052A (en) * | 2023-12-15 | 2024-02-06 | 陕西智引科技有限公司 | A high-security mine explosion-proof and intrinsically safe power supply |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221213 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |