CN217825786U - Movable heat dissipation fan for data center machine room - Google Patents

Movable heat dissipation fan for data center machine room Download PDF

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Publication number
CN217825786U
CN217825786U CN202221487075.3U CN202221487075U CN217825786U CN 217825786 U CN217825786 U CN 217825786U CN 202221487075 U CN202221487075 U CN 202221487075U CN 217825786 U CN217825786 U CN 217825786U
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China
Prior art keywords
heat dissipation
frame
data center
dissipation fan
machine room
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CN202221487075.3U
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Chinese (zh)
Inventor
翁娟玲
杨永进
郑树人
黄纲
郭海峰
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Fujian Intelligent Technology Co ltd
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Fujian Intelligent Technology Co ltd
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Priority to CN202221487075.3U priority Critical patent/CN217825786U/en
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Abstract

The utility model discloses a movable heat dissipation fan is used to data center computer lab, concretely relates to data computer lab heat dissipation technical field, including installing first mounted frame and the second mounted frame in the computer lab, be provided with radiator unit between first mounted frame and the second mounted frame, radiator unit is including setting up the backup pad between first mounted frame and second mounted frame. The utility model discloses a set up radiator unit, compare with prior art, heat one side of semiconductor refrigeration piece through the heating plate, the opposite side of the semiconductor refrigeration piece that makes then can refrigerate, then starts through radiator fan, extracts the air current of semiconductor refrigeration piece refrigeration one side, and effect and efficiency when increasing radiator fan and dispelling the heat have good practicality with low costs when the cost of the while of facilitating the use.

Description

Movable heat dissipation fan for data center machine room
Technical Field
The utility model relates to a data computer lab heat dissipation technical field, more specifically say, the utility model relates to a movable heat dissipation fan for data center computer lab.
Background
The data computer room is mainly used for data storage, calculation, transportation and other functions, so that the data computer room is very high in importance, and the data computer room generates a large amount of heat energy during working due to very high power consumption, and a heat dissipation device is usually installed in the computer room for diversion and heat dissipation;
the utility model discloses a utility model patent with patent application publication No. CN216017531U, which relates to the technical field of data machine room heat dissipation, and discloses a movable heat dissipation fan for a data center machine room, comprising a bottom box, wherein the bottom part is provided with a plurality of universal wheels; the rotary disc is rotatably arranged on the upper end wall of the bottom box; the positioning columns are arranged in a rectangular shape and are arranged on the turntable; the plurality of air collecting boxes are connected with the plurality of positioning columns in a lifting manner; the positioning box is arranged on the upper end wall of the air collecting box and connected with the air collecting box, and a plurality of fans are arranged on the positioning box; wherein, two rotating boxes are respectively and rotatably arranged on the side wall of one side of each air collecting box, a plurality of air outlet pipes are arranged on the rotating boxes, and the rotating boxes are communicated with the air collecting boxes through the air outlet pipes; the cooling device has the advantages of high flexibility, good cooling effect, wide range and the like;
but there is certain drawback when above-mentioned technical scheme uses, for example the device is installed subaerial through the universal wheel, the device is when the displacement, need staff's thrust unit to take place the displacement, can lead to the device to have certain inconvenience when using, simultaneously also only through starting the fan, the universal wheel through the under casing can make the under casing be convenient for remove, rotation through the carousel can change the position of tuber pipe, reach radiating function, but itself is comparatively sealed environment in the computer lab, the performance of circulation of air is relatively poor, this kind only adopts the fan to dispel the heat and probably leads to the radiating effect not good.
SUMMERY OF THE UTILITY MODEL
In order to overcome prior art's above-mentioned defect, the embodiment of the utility model provides a movable heat dissipation fan is used to data center computer lab starts through radiator fan, extracts the air current of semiconductor refrigeration piece refrigeration one side, increases effect and efficiency when radiator fan dispels the heat, and cost is with low costs when facilitating the use simultaneously, has good practicality to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a movable heat dissipation fan for a data center machine room comprises a first suspension bracket and a second suspension bracket which are installed in the machine room, wherein a heat dissipation assembly is arranged between the first suspension bracket and the second suspension bracket;
the heat dissipation assembly comprises a supporting plate arranged between a first suspension frame and a second suspension frame, an installation frame is arranged on one side of the supporting plate, a heating plate is arranged between the supporting plate and the installation frame, and a semiconductor refrigerating plate is arranged on one side of the heating plate;
the inside of installation frame is provided with the support frame, one side of support frame is provided with radiator fan.
In a preferred embodiment, the opposite sides of the first suspension frame and the second suspension frame are both provided with a T-shaped sliding groove, and a T-shaped sliding block matched with the T-shaped sliding groove is connected in each of the two T-shaped sliding grooves in a sliding manner.
In a preferred embodiment, two T-shaped sliding blocks are provided with connecting frames, and the two connecting frames are respectively arranged at the top and the bottom of the supporting plate and the mounting frame.
In a preferred embodiment, a screw rod is connected to the middle of the T-shaped sliding block on the first suspension frame in a threaded manner, and a driving motor for driving the screw rod to rotate is arranged at one end of the first suspension frame.
In a preferred embodiment, the four corners of the mounting frame are provided with limiting holes in a penetrating manner, and the four corners of the heating plate are provided with limiting rods matched with the limiting holes.
In a preferred embodiment, the first suspension bracket and the second suspension bracket are made of stainless steel, and one side of the heating plate is in contact with the semiconductor chilling plate.
The utility model discloses a technological effect and advantage:
1. through the arrangement of the heat dissipation assembly, compared with the prior art, one side of the semiconductor refrigeration piece is heated through the heating piece, the other side of the semiconductor refrigeration piece is refrigerated, then the heat dissipation fan is started to extract airflow at the refrigerating side of the semiconductor refrigeration piece, the effect and the efficiency of the heat dissipation fan in heat dissipation are improved, the use is convenient, the manufacturing cost is low, and the practicability is good;
2. through setting up T type spout, T type slider, lead screw and link, driving motor's output drive lead screw is rotatory, T type slider can take place the displacement along the screw pitch on lead screw surface in the T type spout that first mounted frame that then makes belongs to, and can drive the link when T type slider takes place the displacement and take place the displacement, thereby the radiator unit who makes takes place the displacement, and spacing through T type spout, stability when can effectually ensure radiator unit and take place the displacement, increase the convenience of device when using.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a front view of the heat dissipation assembly of the present invention.
Fig. 3 is a side view of the heat dissipation assembly of the present invention.
Fig. 4 is an exploded view of the heat dissipating assembly of the present invention.
The reference signs are: 1. a first hanger bracket; 2. a second hanger bracket; 3. a support plate; 4. installing a frame; 5. a heating plate; 6. a semiconductor refrigeration sheet; 7. a support frame; 8. a heat radiation fan; 9. a T-shaped chute; 10. a T-shaped slider; 11. a screw rod; 12. a drive motor; 13. a limiting hole; 14. a limiting rod; 15. a connecting frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
The movable heat dissipation fan for the data center machine room shown in the attached drawings 1 to 4 comprises a first suspension frame 1 and a second suspension frame 2 which are installed in the machine room, wherein a heat dissipation assembly is arranged between the first suspension frame 1 and the second suspension frame 2;
the heat dissipation assembly comprises a supporting plate 3 arranged between a first suspension frame 1 and a second suspension frame 2, an installation frame 4 is arranged on one side of the supporting plate 3, a heating plate 5 is arranged between the supporting plate 3 and the installation frame 4, and a semiconductor refrigerating plate 6 is arranged on one side of the heating plate 5;
the inside of installing frame 4 is provided with support frame 7, and one side of support frame 7 is provided with radiator fan 8.
Referring to the attached drawings 1 and 2, T-shaped sliding grooves 9 are formed in one opposite sides of the first suspension frame 1 and the second suspension frame 2, T-shaped sliding blocks 10 matched with the T-shaped sliding grooves 9 are connected in the two T-shaped sliding grooves 9 in a sliding mode, the T-shaped sliding grooves 9 can play a role in guiding and limiting, the T-shaped sliding blocks 10 can conveniently move along the inner wall of the T-shaped sliding grooves 9 in a guiding mode, and stability of the heat dissipation assembly during moving is improved.
Referring to fig. 2, 3 and 4, the connecting frames 15 are arranged on the two T-shaped sliders 10, the two connecting frames 15 are respectively arranged at the top and the bottom of the supporting plate 3 and the bottom of the installing frame 4, the connecting frames 15 can play a limiting role, the supporting plate 3 and the installing frame 4 are conveniently limited, and the supporting plate 3 and the installing frame 4 can be conveniently connected together.
Referring to fig. 1 and 2, a screw rod 11 is connected to the middle of a T-shaped slider 10 belonging to a first suspension bracket 1 through a thread, a driving motor 12 for driving the screw rod 11 to rotate is arranged at one end of the first suspension bracket 1, the screw rod 11 can rotate when the driving motor 12 is started, and then the T-shaped slider 10 can displace along the thread guide on the surface of the screw rod 11, so that a connecting bracket 15 can drive a heat dissipation assembly to move, and the use is facilitated.
Referring to the attached drawing 4, limiting holes 13 are formed in four corners of the installation frame 4 in a penetrating mode, limiting rods 14 matched with the limiting holes 13 are arranged at the four corners of the heating plate 5, the limiting holes 13 and the limiting rods 14 are matched with each other for use, the installation frame 4 and the heating plate 5 are installed together by workers conveniently, and convenience and stability when the heating plate 5 and the installation frame 4 are installed together are improved.
Referring to the attached drawings 1, 2, 3 and 4, the first suspension bracket 1 and the second suspension bracket 2 are made of stainless steel, one side of the heating plate 5 is in contact with the semiconductor refrigerating plate 6, the stainless steel has good hardness and is not prone to deformation, the mechanism can be effectively prolonged, one side of the heating plate 5 is in contact with the semiconductor refrigerating plate 6, one side of the semiconductor refrigerating plate 6 is convenient to heat, and then the other side of the semiconductor refrigerating plate 6 is refrigerated.
The utility model discloses the theory of operation: firstly, the device manufactured by the utility model is installed at a designated position, when in use, one side of the semiconductor refrigeration sheet 6 is heated through the heating sheet 5, then the other side of the semiconductor refrigeration sheet 6 is refrigerated, and then the device is started through the cooling fan 8 to extract the airflow at the refrigeration side of the semiconductor refrigeration sheet 6, thereby increasing the effect and the efficiency when the cooling fan 8 dissipates heat;
meanwhile, the driving motor 12 is started, the output end of the driving motor 12 drives the screw rod 11 to rotate, the T-shaped sliding block 10 in the T-shaped sliding groove 9 of the first suspension frame 1 can move along the screw pitch on the surface of the screw rod 11, and the T-shaped sliding block 10 can drive the connecting frame 15 to move when moving, so that the heat dissipation assembly moves.
The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," "connecting," and "connecting" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be directly connected, and "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and when the absolute position of the object to be described is changed, the relative positional relationships may be changed;
secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;
and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. The utility model provides a movable heat dissipation fan for data center computer lab which characterized in that: the heat dissipation device comprises a first suspension bracket (1) and a second suspension bracket (2) which are installed in a machine room, wherein a heat dissipation assembly is arranged between the first suspension bracket (1) and the second suspension bracket (2);
the heat dissipation assembly comprises a supporting plate (3) arranged between a first suspension frame (1) and a second suspension frame (2), an installation frame (4) is arranged on one side of the supporting plate (3), a heating plate (5) is arranged between the supporting plate (3) and the installation frame (4), and a semiconductor refrigeration plate (6) is arranged on one side of the heating plate (5);
a supporting frame (7) is arranged inside the mounting frame (4), and a heat dissipation fan (8) is arranged on one side of the supporting frame (7).
2. The movable heat dissipation fan for the data center machine room according to claim 1, wherein: t-shaped sliding grooves (9) are formed in one opposite side of the first suspension frame (1) and the second suspension frame (2), and T-shaped sliding blocks (10) matched with the T-shaped sliding grooves (9) are connected into the two T-shaped sliding grooves (9) in a sliding mode.
3. The movable heat dissipation fan for the data center machine room according to claim 2, wherein: and the T-shaped sliding blocks (10) are provided with connecting frames (15), and the connecting frames (15) are respectively arranged at the top and the bottom of the supporting plate (3) and the mounting frame (4).
4. The movable heat dissipation fan for the data center machine room according to claim 2, wherein: the middle part of the T-shaped sliding block (10) which is arranged on the first suspension frame (1) is in threaded connection with a screw rod (11), and one end of the first suspension frame (1) is provided with a driving motor (12) which is used for driving the screw rod (11) to rotate.
5. The movable heat dissipation fan for the data center machine room according to claim 1, wherein: the four corners department of installing frame (4) all runs through and has seted up spacing hole (13), the four corners department of heating plate (5) all is provided with spacing pole (14) with spacing hole (13) assorted.
6. The movable heat dissipation fan for the data center machine room according to claim 1, wherein: the first suspension frame (1) and the second suspension frame (2) are both made of stainless steel materials, and one side of the heating plate (5) is in contact with the semiconductor refrigerating plate (6).
CN202221487075.3U 2022-06-14 2022-06-14 Movable heat dissipation fan for data center machine room Active CN217825786U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221487075.3U CN217825786U (en) 2022-06-14 2022-06-14 Movable heat dissipation fan for data center machine room

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221487075.3U CN217825786U (en) 2022-06-14 2022-06-14 Movable heat dissipation fan for data center machine room

Publications (1)

Publication Number Publication Date
CN217825786U true CN217825786U (en) 2022-11-15

Family

ID=83992295

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221487075.3U Active CN217825786U (en) 2022-06-14 2022-06-14 Movable heat dissipation fan for data center machine room

Country Status (1)

Country Link
CN (1) CN217825786U (en)

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