CN217765293U - Temperature sensing module and earphone - Google Patents

Abstract

The embodiments of the present application relate to a temperature sensing module and an earphone. The temperature sensing module is arranged inside the sound guide tube of the earphone, and is used for body temperature measurement in the ear canal of the user; the temperature sensing module includes: a first temperature sensor and a second temperature sensor, respectively used for sensing the first temperature signal and a second temperature signal; the first temperature sensor and the second temperature sensor are arranged along the extension direction of the sound guide tube, the first temperature sensor is closer to the eardrum of the user than the second temperature sensor, and the first temperature sensor is connected to the first temperature sensor. There is a gap between the two temperature sensors; the first temperature sensor and the second temperature sensor are fixed on the first surface of the flexible printed circuit board; the flexible printed circuit board is provided with a heat shield, the heat shield is located between the first temperature sensor and the second temperature sensor. Between the two temperature sensors; the processor is used for receiving the first temperature signal and the second temperature signal, and acquiring the user's body temperature.

Description

A temperature sensing module and earphone

technical field

The embodiments of the present application relate to the technical field of temperature detection, and in particular to a temperature sensing module and an earphone.

Background technique

Earphones are commonly used entertainment and recreation tools in people's lives. With the development of wearable health devices and people's attention to their own health, earphones with body temperature detection functions are becoming more and more valuable in the market.

The existing temperature measurement technologies mainly include contact temperature measurement and non-contact infrared temperature measurement. For contact temperature measurement products, the most common ones are contact temperature measurement needles, followed by watches and bracelets. The most common non-contact infrared temperature measurement products are forehead thermometers and ear thermometers.

However, the existing contact temperature measurement scheme needs to be in close contact with the skin to test better data. Due to the changeable shape of the human ear, it is difficult to achieve this condition in the actual application of earphones. The existing traditional infrared temperature measurement module is often unable to meet the space design requirements inside the earphone due to its large size. The above products all require a large internal space to support, and it is difficult to achieve small modular assembly in the limited space of the earphone.

Utility model content

The embodiment of the present application provides a temperature sensing module and earphones to solve the problems existing in the prior art that there are large errors in body temperature detection results, and the size of the temperature measurement module is too large to fit the earphones.

In the first aspect, the embodiment of the present application provides a temperature sensing module, the temperature sensing module is arranged inside the sound guide tube of the earphone, and is used to measure body temperature in the ear canal of the user; the temperature sensing module includes : a first temperature sensor, a second temperature sensor, a flexible printed circuit board and a processor; the first temperature sensor and the second temperature sensor are used to sense a first temperature signal and a second temperature signal respectively; the first temperature sensor A temperature sensor and the second temperature sensor are arranged along the extension direction of the sound guide tube, the first temperature sensor is closer to the eardrum of the user than the second temperature sensor, and the first There is a gap between the temperature sensor and the second temperature sensor; the first temperature sensor and the second temperature sensor are fixed on the first surface of the flexible printed circuit board; the flexible printed circuit board is provided with a thermal insulation The thermal insulation is located between the first temperature sensor and the second temperature sensor; the processor is configured to receive the first temperature signal and the second temperature signal, and based on the first The temperature signal and the second temperature signal obtain the body temperature of the user.

By setting the temperature sensing module in the sound guide tube of the earphone, and when the user wears the earphone, the sound guide tube is located at the user's ear canal, so that the temperature sensing module provided in the embodiment of the present application can use the ear canal as a temperature measurement position, and the ear canal temperature is closer to the actual temperature of the human body, thereby improving the accuracy of body temperature detection results. In addition, the position of the ear canal corresponding to the earphone is the sound guide tube. The combination of the temperature sensing module and the sound guide tube will not affect the design of the sound cavity, so that the industrial design of different styles of earphones can be considered. The temperature sensing module includes two temperature sensors, and there is a difference in the distance between the two temperature sensors and the eardrum. Since the temperature of the eardrum in the ear is the highest, the heat will gradually flow along the direction of the ear canal from the eardrum to the temperature sensing module. Weakened, so that there is a temperature difference between the two temperature sensors, and the user's body temperature is obtained based on the temperature signals sensed by the two temperature sensors, which is conducive to eliminating the error caused by environmental factors to the body temperature detection results and further improving the accuracy of body temperature detection .

Optionally, the heat insulating member is a first heat insulating groove opened on the flexible printed circuit board; wherein, in a direction perpendicular to the first surface of the flexible printed circuit board, the first insulating groove The depth of the thermal groove is equal to the thickness of the flexible printed circuit board.

Optionally, the first heat insulation groove is in-line; wherein, the first heat insulation groove extends along a direction perpendicular to the connecting line between the first temperature sensor and the second temperature sensor; The length of the first heat insulation groove is in the range of 0.6 mm to 2.0 mm; and/or, the width of the first heat insulation groove is in the range of 0.3 mm to 2.0 mm.

Optionally, the first heat insulation groove is H-shaped; wherein, the first heat insulation groove includes a first strip, a second strip and a third strip, and the first strip and the first strip Two strips extend in parallel and have equal length and width, and the third strip is connected between the first strip and the second strip; the first strip and the second strip are along The extension direction of the sound guide tube is set, and are respectively located at one end of the first temperature sensor close to the eardrum and at one end of the second temperature sensor away from the eardrum; the third strip is located at the end of the eardrum Between the first temperature sensor and the second temperature sensor; the length of the first strip and the second strip is in the range of 1.5 mm to 3.0 mm; the first strip and the second strip The width of the strip is in the range of 0.1 mm to 1.0 mm; the length of the third strip is in the range of 1.0 mm to 2.0 mm; and/or, the width of the third strip is in the range of 0.1 mm to 2.0 mm.

Optionally, the thermal insulation member is an insulating medium layer; wherein, the thickness of the insulating medium layer is equal to the distance between the first temperature sensor and the second temperature sensor.

Optionally, the temperature sensing module further includes: a heat transfer layer, configured to conduct heat at the eardrum to the first temperature sensor; wherein, the heat transfer layer is disposed on the first temperature sensor and the first surface of the flexible printed circuit board.

Optionally, in the extension direction of the sound guide tube, one end of the heat transfer layer extends to the end surface of the sound guide tube close to the eardrum; the other end of the heat transfer layer is connected to the first An end of a temperature sensor remote from the eardrum is aligned, or extends to a space between the first temperature sensor and the second temperature sensor.

Optionally, the temperature sensing module further includes: a heat insulation reinforcement board; the heat insulation reinforcement board is attached to the second surface of the flexible printed circuit board, and the second surface of the flexible printed circuit board facing the first surface of the flexible printed circuit board.

Optionally, in the extension direction of the sound guide tube, one end of the heat insulation reinforcing plate is aligned with an end of the first temperature sensor close to the eardrum, or extends to One end of the temperature sensor close to the eardrum is closer to the position of the eardrum; the other end of the heat insulation reinforcing plate is aligned with the end of the second temperature sensor away from the eardrum, or extends to a position The end of the second temperature sensor farther away from the eardrum is farther away from the eardrum.

Optionally, a second heat insulation groove is opened on the heat insulation reinforcement board; wherein, in a direction perpendicular to the surface of the heat insulation reinforcement board, the depth of the second heat insulation groove is equal to the The thickness of the heat insulation reinforcing plate; the shape and size of the second heat insulation groove and the first heat insulation groove are the same.

Optionally, the flexible printed circuit board includes: a reinforced area and a non-reinforced area; the area of the flexible printed circuit board bonded with the heat insulation reinforcing plate is a reinforced area, and the flexible printed circuit board The other area of is an unreinforced area; wherein, the unreinforced area is used to electrically connect the first temperature sensor and the second temperature sensor to the processor; the length of the unreinforced area is greater than Or equal to 1.5mm.

Optionally, the temperature sensing module further includes: a heat dissipation strip; the heat dissipation strip is disposed on the first surface of the flexible printed circuit board, and is located in a non-reinforced area of the flexible printed circuit board.

Optionally, the processor is electrically connected to the first temperature sensor and the second temperature sensor respectively; wherein, the first temperature sensor is electrically connected to the heat dissipation strip through a first lead, and the second The temperature sensor is electrically connected to the heat dissipation strip through the second lead; the heat dissipation strip is electrically connected to the processor.

Optionally, the center distance between the first temperature sensor and the second temperature sensor is greater than or equal to 1.5mm.

Optionally, the center distance between the first temperature sensor and the second temperature sensor is within a range of 1.5 mm to 3.0 mm.

In the second aspect, the embodiment of the present application provides an earphone, including: an earphone housing and a temperature sensor as described in the first aspect provided by the embodiment of the present application or any alternative thereof, housed in the earphone housing Module; the earphone housing is surrounded by an earphone cavity, and the earphone cavity extends outward to form a sound guide tube; when the user wears the earphone, the sound guide tube is located at the eardrum of the earphone cavity side.

By setting the temperature sensing module in the sound guide tube of the earphone, and when the user wears the earphone, the sound guide tube is located at the user's ear canal, so that the earphone provided by the embodiment of the present application can use the ear canal as the temperature measurement position, and The temperature of the ear canal is closer to the actual temperature of the human body, thus improving the accuracy of the body temperature detection results. In addition, the temperature sensing module includes two temperature sensors, and there is a difference in the distance between the two temperature sensors and the eardrum. Since the temperature of the eardrum in the ear is the highest, the heat is along the direction of the ear canal from the eardrum to the temperature sensing module. It will gradually become weaker, so that there is a temperature difference between the two temperature sensors, and the user's body temperature is obtained based on the temperature signals sensed by the two temperature sensors, which is conducive to eliminating the error caused by environmental factors to the body temperature detection results and further improving the body temperature detection. accuracy.

Optionally, the earphone further includes: a heat-insulating adhesive layer for fixing the temperature sensing module to the inner wall of the sound guide tube.

Optionally, the earphone further includes: a snap-in mechanism; the part of the temperature sensing module close to the eardrum is fixed to the inner wall of the sound guide tube through the snap-in mechanism; the temperature sensing module The part away from the eardrum is in contact with the inner wall of the sound guide tube through the support body.

Optionally, the earphone further includes: a bracket mechanism; the temperature sensing module is assembled on the bracket mechanism and fixed to the inner wall of the sound guide tube through the bracket mechanism.

Optionally, the earphone further includes: a fixed heat conductor, one end of the flexible printed circuit board close to the eardrum is fixed to the inner wall of the sound pipe through the fixed heat conductor, and Heat is conducted to the first temperature sensor.

Optionally, one end of the temperature sensing module extends to the end surface of the sound guide tube close to the eardrum; the other end of the temperature sensing module is electrically connected to the main board of the earphone.

Description of drawings

One or more embodiments are exemplified by the pictures in the corresponding drawings, these exemplifications do not constitute a limitation to the embodiments, and components with the same reference numerals in the drawings represent substantially the same components. Unless otherwise stated, the drawings in the drawings are not limited to scale.

FIG. 1 is a schematic structural diagram of a body temperature detection earphone provided in an embodiment of the present application;

Fig. 2 is a schematic diagram of cooperation between a body temperature detection earphone and a human ear provided by an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a body temperature detection earphone with a first spacer provided in an embodiment of the present application;

FIG. 4 is a schematic structural diagram of a body temperature detection earphone with an air gap provided in an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a body temperature detection earphone with a second spacer provided in an embodiment of the present application;

Fig. 6 is an exploded schematic view of the temperature sensing module provided by the embodiment of the present application;

Fig. 7 is another structural schematic diagram of a body temperature detection earphone provided by the embodiment of the present application;

FIG. 8 is a schematic diagram of the electrical connection between the temperature sensing module and the processor provided by the embodiment of the present application;

9 is a schematic diagram of another electrical connection between the temperature sensing module and the processor provided by the embodiment of the present application;

FIG. 10 is a schematic flow diagram of a body temperature measurement method provided in an embodiment of the present application;

FIG. 11 is a schematic structural diagram of an embodiment of a temperature sensing module provided in an embodiment of the present application;

FIG. 12 is a schematic diagram of an implementation of a thermal insulation member of a temperature sensing module provided in an embodiment of the present application;

Fig. 13 is a schematic diagram of another implementation of the heat insulation member of the temperature sensing module provided by the embodiment of the present application;

Fig. 14 is a schematic diagram of a pattern of a thermal insulation member of a temperature sensing module provided in an embodiment of the present application;

Fig. 15 is a schematic diagram of another pattern of the heat insulation member of the temperature sensing module provided by the embodiment of the present application;

Fig. 16 is a schematic structural diagram of another embodiment of the temperature sensing module provided by the embodiment of the present application;

Fig. 17 is a schematic structural diagram of another embodiment of the temperature sensing module provided by the embodiment of the present application;

Fig. 18 is a schematic diagram of the top layer layout of another embodiment of the temperature sensing module provided by the embodiment of the present application;

Fig. 19 is a schematic structural diagram of another embodiment of the temperature sensing module provided by the embodiment of the present application;

Fig. 20 is a schematic diagram of the lower layer layout of another embodiment of the temperature sensing module provided by the embodiment of the present application;

Fig. 21 is a schematic structural diagram of another embodiment of the temperature sensing module provided by the embodiment of the present application;

Fig. 22 is a schematic diagram of an embodiment in which the temperature sensing module provided by the embodiment of the present application is installed inside the earphone;

Fig. 23 is a schematic diagram of another embodiment in which the temperature sensing module provided by the embodiment of the present application is installed inside the earphone.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of the present application, but not all of the embodiments.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise.

In this application, directional terms such as "upper", "lower", "front", and "rear" are defined relative to the schematic placement of components in the drawings, and it should be understood that these directional terms are relative Concepts, which are used for description and clarification relative to one another, may change accordingly according to changes in the orientation of parts in the drawings.

In addition, unless the specified order is clearly stated in the context of the application, the processing steps described herein may be performed out of the specified order, that is, each step may be performed in the specified order, substantially simultaneously. steps, perform each step in reverse order, or perform each step in a different order.

FIG. 1 is a schematic structural diagram of a body temperature detection earphone provided in an embodiment of the present application. As shown in Figure 1, the earphone 10 includes: an earphone housing 11 and a temperature sensing module 12 housed in the earphone housing 11, the earphone housing 11 is surrounded by an earphone cavity 13, and the earphone cavity 13 extends outward to form a The sound guide tube 14 communicated with the outside world.

FIG. 2 is a schematic diagram of cooperation between a body temperature detection earphone provided in an embodiment of the present application and a human ear. 1 and 2, when the user wears the earphone 10, the sound guide tube 14 is located on the side of the earphone cavity 13 close to the eardrum 202, and the temperature sensing module 12 includes a first temperature measurement module 121 and a second temperature measurement module 122; The first temperature measuring module 121 and the second temperature measuring module 122 are sequentially fixed in the sound guiding tube 14 along the direction of the sound guiding tube 14 . This setting can make the heat received by the first temperature measurement module 121 and the second temperature measurement module 122 produce a difference, and then generate a temperature difference between the first temperature measurement module 121 and the second temperature measurement module 122, based on the first temperature measurement The temperature detection results of the module 121 and the second temperature measurement module 122 can accurately calculate the user's body temperature.

The first temperature measurement module 121 and the second temperature measurement module 122 are arranged in the sound guide tube 14 along the direction of the sound guide tube 14, and the positions of the temperature sensing module 12 and the sound guide tube 14 are relatively fixed, and the middle eardrum of the ear 200 202 has the highest temperature. From the eardrum 202 to the temperature sensing module 12, along the direction of the ear canal 201, the heat conducts from strong to weak. The temperature sensing module 12 is arranged along the direction of the sound guide tube 14, so that the second There is a difference in the heat received by the first temperature measurement module 121 and the second temperature measurement module 122, thereby generating a temperature difference between the first temperature measurement module 121 and the second temperature measurement module 122, based on the first temperature measurement module 121 and the second temperature measurement module The temperature detection result of the temperature module 122 can calculate the user's body temperature, and it is beneficial to eliminate the influence of the ambient temperature on the accuracy of body temperature detection, thereby improving the accuracy of body temperature detection.

FIG. 3 is a schematic structural diagram of a body temperature detection earphone with a first spacer provided in an embodiment of the present application. As shown in the figure, a first spacer 15 is disposed between the first temperature sensor 121 and the second temperature sensor 122 . The first spacer 15 can reduce the thermal conductivity between the two temperature sensors. By adjusting the thickness and/or material of the first spacer, the temperature difference between the first temperature sensor 121 and the second temperature sensor 122 can be controlled. Adjust the temperature difference to an appropriate size, combined with the corresponding algorithm, the temperature to be measured can be calculated. Exemplarily, if the first spacer 15 with a larger thickness is selected, the temperature difference between the first temperature measurement module 121 and the second temperature measurement module 122 is relatively large, which is conducive to reducing the complexity of body temperature detection data processing and increasing body temperature. Detection accuracy.

The material of the first spacer 15 is a material with low thermal conductivity, preferably plastic or foam. The embodiment of the present application does not specifically limit the material of the first spacer 15 . Selecting materials with low thermal conductivity can make the temperature difference between at least two temperature measurement modules larger, which is beneficial to reduce the complexity of body temperature detection data processing and improve the accuracy of body temperature detection.

In an optional embodiment, as shown in FIG. 4 , there is an air gap 16 surrounding the outer surface of the temperature sensing module 12 between the outer surface of the temperature sensing module 12 and the inner wall of the sound guide tube 14 . With the scheme of this embodiment, the air gap 16 can play a role of heat insulation, reduce the influence of the external environment on the temperature sensing module 12, and improve the accuracy of temperature detection. Meanwhile, the air gap 16 is also a sound guiding path.

In another implementation manner of the present application, as shown in FIG. 5 , the earphone 10 further includes a second spacer 17 sleeved on the outer surface of the temperature sensing module 12 . By adopting the solution of this embodiment, by sheathing the second spacer 17 on the surface of the temperature sensing module 12 , the influence of the external environment on the temperature sensing module 12 can be reduced, thereby making temperature detection more accurate. The material of the second spacer 17 may be any material with low thermal conductivity, and the embodiment of the present application does not specifically limit the material of the second spacer, for example, it may be foam or the like.

FIG. 6 is an exploded schematic view of the temperature sensing module provided by the embodiment of the present application. The temperature sensing module 12 includes a first temperature measurement module 121 and a second temperature measurement module 122 .

The first temperature measurement module 121 includes: a first temperature sensor 1211, a first heat conduction member 1212, a first support member 1213, a first cavity 12121 is arranged inside the first heat conduction member 1212, and the first temperature sensor 1211 is arranged in the first Cavity 12121. Adopting the scheme of this embodiment, the first heat conduction member 1212 wraps the first temperature sensor 1211 in the first cavity 12121 , which can make the first temperature sensor 1211 fully contact with the first support member 1213 and improve the efficiency of heat conduction and heat dissipation.

The first support 1213 is in contact with the inner wall of the sound guide tube 14, so that the positions of the first support 1213 and the sound guide tube 14 are relatively fixed, and the first temperature measurement module 121 and the second temperature measurement module 122 pass through the first gap The component 15 is fixed, and then the temperature sensing module 12 and the sound guide tube 14 are relatively fixed.

On the one hand, the first support member 1213 plays the role of heat conduction and heat dissipation, and on the other hand, it plays the role of fixing. The embodiment of the present application does not limit the relatively fixed structure and method of the first support member 1213 and the sound guide tube 14. For example, the first support member 1213 is in contact with the inner wall of the sound guide tube 14 or the first support member 1213 is in contact with the inner wall of the sound guide tube 14. The sound guide tubes 14 are fixed by gluing. The embodiment of the present application does not specifically limit the material of the first support member 1213 . Exemplarily, the first supporting member 1213 is made of plastic or metal.

A second cavity 12131 is formed inside the first support member 1213 , and the first heat conducting member 1212 is disposed in the second cavity 12131 .

The second temperature measurement module 121 includes: a second temperature sensor 1221, a second heat conduction member 1222, a second support member 1223, a third cavity 12221 is arranged inside the second heat conduction member 1222, and the second temperature sensor 1221 is arranged in the third Cavity 12121. Adopting the scheme of this embodiment, the second heat conduction member 1212 wraps the second temperature sensor 1221 in the third cavity 12121 , which can make the second temperature sensor 1221 fully contact with the second support member 1223 and improve the efficiency of heat conduction and heat dissipation.

A fourth cavity 12231 is formed inside the second supporting member 1223 , and the second heat conducting member 1222 is disposed in the fourth cavity 12231 .

Specifically, the first temperature sensor 1211 and the second temperature sensor 1221 may be NTC (Negative Temperature Coefficient, negative temperature coefficient) thermistors.

In an optional embodiment, a first spacer 15 is disposed between the first temperature measurement module 121 and the second temperature measurement module 122, and the first temperature measurement module 121 and the second temperature measurement module 122 pass through the first spacer 15, so that the first temperature measurement module 121 and the second temperature measurement module 122 are relatively fixed.

The first support member 1213 is in contact with the inner wall of the sound guide tube 14, so that the positions of the first support member 1213 and the sound guide tube 14 are relatively fixed, and the positions of the first temperature measurement module 121 and the second temperature measurement module 122 are opposite. Fixed, when the surface of the temperature sensing module 12 is not provided with the second spacer 17, the temperature sensing module 12 is suspended inside the sound guide tube.

Take Figure 6 as an example to illustrate the principle of earphone temperature detection. As shown in Figure 6, the heat transfer sequence in the ear 200 is: eardrum 202—ear canal 201—first support member 1213—first heat conducting member 1212—first temperature sensor 1211—first spacer 15—second support member 1223 —second heat conducting element 1222 —second temperature sensor 1221 . Heat is transferred from strong to weak along the above path, thus, the first temperature sensor 1211 and the second temperature sensor 1221 generate a temperature difference.

FIG. 7 is another schematic structural diagram of a body temperature detection earphone provided by an embodiment of the present application. As shown in the figure, the earphone 10 also includes an adhesive piece 18, and the temperature sensing module also includes a circuit board 19, and the circuit board 19 is fixed on the inner wall of the sound guide tube 14 through the adhesive piece 18. The temperature measurement module 121 and the second temperature measurement module 122, the first temperature measurement module 121 and the second temperature measurement module 122 are arranged on the circuit board 19, and the first temperature measurement module 121 is located near the eardrum 202 relative to the second temperature measurement module 122 side.

The first temperature measurement module 121 is located on a side closer to the eardrum 202 relative to the second temperature measurement module 122 . When the user wears the earphone 10, the heat transfer direction inside the ear 200 is: from the eardrum 202 along the ear canal 201, through the first temperature sensor 121 relatively close to the eardrum 202, and then through the second temperature sensor 122 relatively far away from the eardrum 202. The first temperature measurement module 121 and the second temperature measurement module 122 receive a difference in the heat of the ear 200 to generate a temperature difference, thereby eliminating the influence of the ambient temperature on the body temperature detection result and improving the accuracy of the body temperature detection result.

In another implementation manner of the present application, the first temperature measurement module 121 and the second temperature measurement module 122 are arranged on the circuit board 19 at intervals. Using the solution of this embodiment, there will be an air gap between the first temperature measurement module 121 and the second temperature measurement module 122, the thermal conductivity of the air is relatively low, and the first temperature measurement module 121 and the second temperature measurement module 122 are spaced apart The ground configuration can make the temperature difference between the first temperature measurement module 121 and the second temperature measurement module 122 larger, so as to eliminate the influence of ambient temperature on the body temperature detection result and reduce the error of body temperature detection.

In an optional embodiment, the adhesive member 18 is adhesive glue. On the one hand, the adhesive member 18 can make the circuit board 19 and the sound guide tube 14 relatively fixed. On the other hand, the adhesive member 18 can play a role of heat insulation. The influence of the external environment on the temperature sensing module 12 is reduced, thereby making the body temperature detection result more accurate. The embodiment of the present application does not limit the material of the adhesive. Exemplarily, the adhesive is preferably a foam material.

In an optional embodiment, the circuit board 19 is a flexible printed circuit board (Flexible Printed Circuit, FPC), and the flexible printed circuit board is relatively thin and easy to position.

FIG. 8 is a schematic diagram of the electrical connection between the temperature sensing module and the processor provided by the embodiment of the present application. As shown in the figure, the first temperature sensor 1211 and the second temperature sensor 1221 are connected by a wire (not shown in the figure), and are connected to the processor 21 through the sensor lead 20. The first temperature sensor 1211 and the second temperature sensor 1221 converts the temperature signal into an electrical signal, and the processor 21 is used to receive the electrical signal and calculate the temperature to be measured according to the electrical signal.

FIG. 9 is a schematic diagram of another electrical connection between the temperature sensing module and the processor provided by the embodiment of the present application. As shown in the figure, the first temperature sensor 1211 and the second temperature sensor 1221 are packaged in a chip type and soldered on a flexible printed circuit board (Flexible Printed Circuit, FPC). The circuit board 19 is directly connected to the processor 21 . The temperature sensor module 12 converts the temperature signal into an electrical signal, and the processor 21 is used to receive the electrical signal and calculate the temperature to be measured according to the electrical signal.

Referring to FIG. 4 , as shown in the figure, the sound guide tube 14 of the earphone 10 is sleeved with a sealing member 23. The embodiment of the present application does not limit the structure of the sealing member 23. Exemplarily, the sealing member 23 is an ear cap or an ear cap. Bag.

According to the scheme of this embodiment, the sealing member 23 cooperates with the ear canal 201 to improve the sealing effect of the earphone 10, improve the sealing performance in the ear canal 201, reduce the convective influence between the external environment and the ear canal 201, and then reduce the environmental impact. The influence of temperature on the temperature sensing module 12 makes the heat generated by the eardrum 202 and the ear canal 201 transfer to the direction of the temperature sensing module 12 to improve the accuracy of temperature detection.

In an optional implementation, the two temperature measurement modules are both contact temperature measurement modules. In this way, using the solution of this embodiment, a non-contact temperature measurement solution is realized with contact multi-temperature measurement modules. On the one hand , solve the test error problem caused by the unstable contact between the contact single temperature measurement module and the measured object, and on the other hand, solve the problem that the infrared non-contact temperature measurement module is too large and does not fit the earphone 10.

As shown in FIG. 10 , it is a schematic flowchart of a body temperature measurement method provided in the embodiment of the present application. The body temperature measurement method specifically includes the following steps: step S100, obtain two temperature measurement values through two temperature measurement modules; step S200, obtain the body temperature of the earphone wearer according to the difference between the two temperature measurement values.

Fig. 11 is a schematic structural diagram of a temperature sensing module used in earphones provided by the embodiment of the present application. The temperature sensing module shown in Fig. 11 can be applied to the earphone sound guides shown in Fig. 1, Fig. 2 and Fig. 3 Tube 14 for temperature measurement in the user's ear canal. In order to clearly show the temperature sensing module provided by the embodiment of the present application, only part of the structure of the sound guide tube 14 is shown in the figure.

11, the temperature sensing module includes: a first temperature sensor 1211, a second temperature sensor 1221, a flexible printed circuit board 123 and a processor 21; the first temperature sensor 1211 and the second temperature sensor 1221 are used to sense the first The temperature signal and the second temperature signal; the first temperature sensor 1211 and the second temperature sensor 1221 are arranged along the extension direction of the sound guide tube 14, and the first temperature sensor 1211 is closer to the eardrum of the user than the second temperature sensor 1221, and There is a gap between the first temperature sensor 1211 and the second temperature sensor 1221; the first temperature sensor 1211 and the second temperature sensor 1221 are fixed on the first surface of the flexible printed circuit board 123; the flexible printed circuit board 123 is provided with a thermal insulation 127, the thermal insulation 127 is located between the first temperature sensor 1211 and the second temperature sensor 1221; the processor 21 is used to receive the first temperature signal and the second temperature signal, and obtain the user's temperature based on the first temperature signal and the second temperature signal. body temperature.

In the embodiment of the present application, the thickness of the flexible printed circuit board is small, and it is easy to adapt to the inner wall of the sound guide tube of the earphone, which realizes the miniaturization of the temperature sensing module, occupies less internal space of the earphone, and reduces the temperature sensing capacity. Difficulty of assembly of the module to the headset.

In addition, by arranging the temperature sensing module in the sound guide tube of the earphone, and when the user wears the earphone, the sound guide tube is located at the ear canal of the user, the temperature sensing module provided in the embodiment of the present application can use the ear canal as a measurement temperature position, and the ear canal temperature is closer to the actual temperature of the human body, thereby improving the accuracy of body temperature detection results. In addition, the position of the ear canal corresponding to the earphone is the sound guide tube. The combination of the temperature sensing module and the sound guide tube will not affect the design of the sound cavity, so that the industrial design of different styles of earphones can be considered. The temperature sensing module includes two temperature sensors, and there is a difference in the distance between the two temperature sensors and the eardrum. Since the temperature of the eardrum in the ear is the highest, the heat will gradually flow along the direction of the ear canal from the eardrum to the temperature sensing module. Weakened, so that there is a temperature difference between the two temperature sensors, and the user's body temperature is obtained based on the temperature signals sensed by the two temperature sensors, which is conducive to eliminating the error caused by environmental factors to the body temperature detection results and further improving the accuracy of body temperature detection .

Exemplarily, the processor 21 may be a chip (integrated IC).

In an optional embodiment of the present application, as shown in FIG. 12 , the heat insulating element 127 is a first heat insulating groove 1271 opened on the flexible printed circuit board 123 .

In this embodiment, the first isolation groove provided on the first surface of the flexible printed circuit board is used to isolate the temperature conduction between the first temperature sensor and the second temperature sensor, so as to ensure the temperature between the first temperature sensor and the second temperature sensor. There is an obvious temperature difference between them, which is more conducive to eliminating the error caused by the ambient temperature on the first temperature signal sensed by the first temperature sensor, and further improving the accuracy of the body temperature detection result. By setting the first isolation groove on the flexible printed circuit board, the heat conduction between the first temperature sensor and the second temperature sensor can be reduced without increasing the cost of other additional accessories, and the first isolation groove is set on the flexible printed circuit board The groove approach also reduces the impact on the layout of other components on the flexible printed circuit board.

Preferably, in a direction perpendicular to the first surface of the flexible printed circuit board 123, the depth of the first heat insulation groove 1271 is equal to the thickness of the flexible printed circuit board 123

Since the greater the depth of the first isolation groove, the better the effect of reducing the heat conduction between the first temperature sensor and the second temperature sensor, which is more conducive to increasing the temperature difference between the first temperature sensor and the second temperature sensor. Therefore, making the depth of the first isolation groove equal to the thickness of the flexible printed circuit board can provide better heat insulation effect on the premise of meeting assembly requirements.

Alternatively, referring to FIG. 13 , the heat insulating element 127 is a heat insulating medium layer 1272 .

The heat conduction between the first temperature sensor and the second temperature sensor can be reduced by the miniaturized isolation medium layer.

Preferably, the thickness of the isolation medium layer 1272 is equal to or slightly smaller than the distance between the first temperature sensor 1211 and the second temperature sensor 1221 .

On the premise of the same heat-conducting material, the greater the thickness of the isolation medium layer, the better the effect of isolating the heat conduction between the first temperature sensor and the second temperature sensor. Therefore, the thickness of the isolation medium layer 1272 is equal to that of the first temperature sensor and the second temperature sensor. The size of the interval between the temperature sensors can provide a better heat insulation effect under the premise of meeting the assembly requirements.

In the embodiment of the present application, a material with a high thermal insulation coefficient may be selected as the thermal insulation medium layer according to needs. Exemplarily, foam can be selected as the insulating medium layer.

In order to provide a better heat insulation effect, referring to FIG. 14 and FIG. 15 , the first heat insulation groove 1271 can be straight or H-shaped.

The first temperature sensor 1211 and the second temperature sensor 1221 send the sensed first temperature signal and the second temperature signal to the processor through the first wire S1 and the second wire S2 respectively, and GND is a ground wire.

Table I

serial number parameter value illustrate h ≥1.5mm, preferably 1.5~3.0mm Center distance of two temperature sensors L 0.6～2.0mm The length of the first insulation slot W 0.3～2.0mm Width of the first insulation slot G ≥1.5mm The length of the non-reinforced area of the flexible printed circuit board

Preferably, please refer to Figure 14 and Table 1 for the dimensions of the first heat insulation groove being inline.

Referring to Fig. 15, the first heat insulation groove 1271 is H-shaped; wherein, the first heat insulation groove 1271 includes a first strip, a second strip and a third strip, the first strip extends parallel to the second strip and The length and width are equal, and the third strip is connected between the first strip and the second strip; the first strip and the second strip are arranged along the extension direction of the sound guide tube, and are respectively located at the first temperature sensor 1211 One end of the second temperature sensor close to the eardrum and one end of the second temperature sensor away from the eardrum; the third strip is located between the first temperature sensor and the second temperature sensor.

Exemplarily, please refer to FIG. 15 and Table 2 for the dimension description of the H-shaped first heat insulation groove.

Table II

serial number parameter value illustrate h ≥1.5mm, preferably 1.5~3mm Center distance of two temperature sensors L 1.0～2.0mm The length of the third strip W 0.1～2.0mm Width of the third strip D. 1.5～3.0mm The length of the first and second strips E. 0.1～1mm The width of the first and second strips G ≥1.5mm The length of the non-reinforced area of the flexible printed circuit board

The H-shaped pattern of the first heat insulation groove can provide a better heat insulation effect between the first temperature sensor and the second temperature sensor.

In an optional embodiment of the present application, referring to FIG. 16 , the temperature sensing module further includes: a heat transfer layer 124, the heat transfer layer 124 is disposed between the first temperature sensor 1211 and the first surface of the flexible printed circuit board 123, It is used to conduct the heat at the eardrum to the first temperature sensor 1211 .

Use the heat transfer layer to conduct the heat of the eardrum to the first temperature sensor, so that the temperature sensed by the first temperature sensor is closer to the temperature at the eardrum, which is closer to the actual temperature of the human body, and improves the temperature sensed by the first temperature sensor. The accuracy of the measured eardrum temperature, thereby further improving the accuracy of the user's body temperature obtained through the temperature signals sensed by the first temperature sensor and the second temperature sensor.

Specifically, in the direction along the sound guide tube 14 , one end of the heat transfer layer 124 extends to the end surface of the sound guide tube 14 close to the eardrum, so as to fully conduct the heat at the eardrum to the first temperature sensor 1211 . In the direction along the sound guide tube 14, the other end of the heat transfer layer 124 is aligned with the end of the first temperature sensor 1211 away from the eardrum, or extends to the space between the first temperature sensor 1211 and the second temperature sensor 1221, In order to ensure that the first temperature sensor 1211 can more fully sense the heat conducted from the eardrum and accurately obtain the actual temperature of the human body.

Specifically, the heat transfer layer 124 may be a thin metal sheet. Exemplarily, the exposed copper pad of the flexible printed circuit board 123 can be selected as the heat transfer layer 124 .

In an optional embodiment of the present application, referring to FIG. 17 , the temperature sensing module further includes: a heat insulation reinforcement board 126, and the heat insulation reinforcement board 126 is attached to the second surface of the flexible printed circuit board; the flexible printed circuit board The second surface of the flexible printed circuit board is facing the first surface.

In this embodiment, the structural strength of the temperature sensing module is improved through the heat insulation reinforcing plate, and at the same time, the heat conducted from the earphone shell and the sound guide tube to the first temperature sensor and the second temperature sensor can be isolated to ensure that the first temperature sensor and the second temperature sensor The second temperature sensor is only used to sense the heat conducted from the eardrum, thereby improving the accuracy of obtaining the user's body temperature through the temperature signals sensed by the first temperature sensor and the second temperature sensor.

Exemplarily, the heat insulation reinforcing plate 126 can be made of FR4 material or PI material, but cannot be made of high thermal conductivity materials such as steel sheets.

Specifically, in the extension direction of the sound guide tube 14, one end of the heat insulation reinforcing plate 126 is aligned with the end of the first temperature sensor 1211 close to the eardrum, or extends to the end of the first temperature sensor 1211 close to the eardrum Position closer to the eardrum; the other end of the heat insulation reinforcing plate 126 is aligned with the end of the second temperature sensor 1221 away from the eardrum, or extends to a position farther away from the eardrum than the end of the second temperature sensor 1221 away from the eardrum. This embodiment achieves better reinforcement effect and heat insulation performance without affecting the assembly structure of the temperature sensing module.

In an optional embodiment of the present application, a second heat insulation groove is opened on the heat insulation reinforcing plate. Preferably, in a direction perpendicular to the surface of the heat insulation and reinforcement board, the depth of the second heat insulation groove is equal to the thickness of the heat insulation reinforcement board, and the shape and size of the second heat insulation groove are the same as that of the first heat insulation groove .

Since the greater the depth of the second isolation groove, the better the effect of reducing the heat conduction between the first temperature sensor and the second temperature sensor, which is more conducive to increasing the temperature difference between the first temperature sensor and the second temperature sensor. Therefore, making the depth of the second isolation groove equal to the thickness of the flexible printed circuit board can provide better heat insulation effect on the premise of meeting assembly requirements.

FIG. 18 is a schematic diagram of the top layer layout of the temperature sensing module in the embodiment of the present application. The flexible printed circuit board 123 includes: a reinforced area 123a and a non-reinforced area 123b.

The area where the flexible printed circuit board is pasted with the heat insulation reinforcing plate is the reinforced area, and the other areas of the flexible printed circuit board are the non-reinforced areas. Wherein, the non-reinforced area is used to electrically connect the first temperature sensor and the second temperature sensor to the processor.

In an optional embodiment of the present application, referring to FIG. 18 and FIG. 19, the temperature sensing module further includes: a heat dissipation strip 125, the heat dissipation strip 125 is arranged on the first surface of the flexible printed circuit board 123, and is located on the flexible printed circuit board. 123 of the non-reinforced region 123b.

Since the processor or other circuit structures in the earphone will also generate a certain amount of heat, in this embodiment, a heat dissipation band is arranged on the non-reinforced area of the flexible printed circuit board to reduce the second temperature sensor from being affected by the processor or other circuits in the earphone. The influence caused by the heat dissipation of the structure reduces the error in the temperature signal sensed by the second temperature sensor, thereby further improving the accuracy of the body temperature detection result.

Exemplarily, the heat dissipation strip 125 may use an EMI film. The size of the heat dissipation band 125 is sufficient to dissipate the heat generated by the processor or other circuit structures in the earphone; preferably, the length of the heat dissipation band 125 is equal to the length of the non-reinforced area 123b of the flexible printed circuit board 123 .

Exemplarily, as shown in FIG. 18 , the first temperature sensor 1211 and the second temperature sensor 1221 respectively transmit temperature signals sensed by them to the processor through wires. The first heat insulation groove 127 is disposed between the first temperature sensor 1211 and the second temperature sensor 1221 . The heat dissipation strip 125 covers the non-reinforced area 123 b of the flexible printed circuit board 123 . Specifically, the first temperature sensor 1211 is electrically connected to the heat dissipation strip 125 through a first lead, and the second temperature sensor 1221 is electrically connected to the heat dissipation strip 125 through a second lead; the heat dissipation strip 125 is electrically connected to the processor.

FIG. 20 is a schematic diagram of the bottom layer layout of the temperature sensing module in the embodiment of the present application. The GND layer is arranged on the side surface of the heat insulation reinforcing board 126 close to the flexible printed circuit board.

The embodiment of the present application also provides an earphone, including an earphone housing and a temperature sensing module as provided in any one of the above embodiments housed in the earphone housing; the earphone housing is surrounded by an earphone cavity, and the earphone cavity extends outward A sound guide tube is formed; when the user wears the earphone, the sound guide tube is located on the side of the earphone cavity close to the eardrum.

In an optional embodiment of the present application, referring to FIG. 21 , the earphone further includes: a heat-insulating adhesive layer 22 for fixing the temperature sensing module to the inner wall of the sound guide tube 14 .

The heat-insulating adhesive layer 22 used in the embodiment of the present application can further reduce the influence of the ambient temperature on the first temperature sensor 1211 and the second temperature sensor 1221, so that the first temperature sensor 1211 and the second temperature sensor 1221 can be as little as possible Sensing the heat conducted from the eardrum, thereby improving the accuracy of body temperature detection results. Moreover, the heat-insulating adhesive layer 22 can fix the temperature sensing module on the sound guide tube 14 through adhesion, which is more convenient for assembly and does not require other settings on the sound guide tube 14 .

Specifically, referring to FIG. 22 , the thermal insulation bonding adhesive layer 22 may be a foam adhesive layer. The foam adhesive layer can provide good adhesion effect and at the same time ensure the isolation effect on the ambient temperature.

In the embodiment of the present application, one end of the temperature sensing module extends to the end surface of the sound guide tube 14 close to the eardrum 202 , and the other end of the temperature sensing module is electrically connected to the main board of the earphone.

In an optional embodiment of the present application, referring to FIG. 23 , the earphone further includes: a clamping mechanism 28; the part of the temperature sensing module close to the eardrum 202 is fixed to the inner wall of the sound guide tube 14 through the clamping structure 23, and the temperature sensing module The part of the module away from the eardrum 202 is in contact with the inner wall of the sound guide tube 14 through the support body 24 .

The clamping mechanism 28 adopted in this embodiment does not need to use the heat-insulating adhesive layer 22 , which further reduces the thickness of the temperature sensing module. When the internal space of the earphone is limited, the temperature sensing module can be fixed to the inner wall of the sound guide tube 14 through the clamping mechanism 28 , and the unfixed end of the temperature sensing module can be supported by the support body 24 .

Specifically, the support body 24 may be foam or foam glue.

In this embodiment, the temperature sensing module is fixed to the inner wall of the sound guide tube through a clamping mechanism, and the other end of the temperature sensing module does not need to be fixed, but only needs to be supported to the inner wall of the sound guide tube by a support body. Since the heat insulation coefficient of foam is greater than that of foam glue, using foam as a support can provide better heat insulation effect compared with using foam glue as a support.

In an optional embodiment of the present application, the earphone further includes: a bracket mechanism; the temperature sensing module is assembled on the bracket mechanism and fixed to the inner wall of the sound guide tube through the bracket mechanism.

In an optional embodiment of the present application, referring to FIG. 22 and FIG. 23 , the earphone further includes: a fixed heat conductor 25 , and one end of the flexible printed circuit board 123 close to the eardrum 202 is fixed to the inner wall of the sound-conducting tube 14 through the fixed heat conductor 25 , and conduct heat to the first temperature sensor 1211 through the fixed heat conductor 25 .

In the embodiment of the present application, while fixing the end of the flexible printed circuit board close to the eardrum to the inner wall of the sound guide tube by fixing the heat conductor, the heat can also be conducted to the first temperature sensor through the fixed heat conductor, so that the first temperature sensor can More accurately sense the temperature of the eardrum, thereby further improving the accuracy of body temperature detection.

Exemplarily, one end of the flexible printed circuit board 123 close to the eardrum is fixed to the protrusion on the inner wall of the sound guiding tube 14 by dispensing glue.

Referring to Fig. 22 and Fig. 23, the earphone further includes an adhesive layer 26 for adhering the earphone main board and other circuit structures to the earphone shell.

Exemplarily, the adhesive layer 26 is double-sided tape.

It should be noted that, on the premise of no conflict, each embodiment described in this application and/or the technical features in each embodiment can be combined with each other arbitrarily, and the technical solution obtained after the combination should also fall within the scope of this application. protected range.

The above are only specific implementation methods of this application, but the protection scope of this application is not limited thereto. Any changes or replacements within the technical scope disclosed in this application shall be covered within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (21)

1. A temperature sensing module, characterized in that, the temperature sensing module is arranged inside the sound guide tube of the earphone for measuring body temperature in the user's ear canal; the temperature sensing module includes: a first temperature a sensor, a second temperature sensor, a flexible printed circuit board, and a processor; The first temperature sensor and the second temperature sensor are used to sense a first temperature signal and a second temperature signal, respectively; The first temperature sensor and the second temperature sensor are arranged along the extension direction of the sound guide tube, the first temperature sensor is closer to the eardrum of the user than the second temperature sensor, and the There is a gap between the first temperature sensor and the second temperature sensor; The first temperature sensor and the second temperature sensor are fixed on the first surface of the flexible printed circuit board; the flexible printed circuit board is provided with a heat insulating element, and the heat insulating element is located at the first temperature between the sensor and said second temperature sensor; The processor is configured to receive the first temperature signal and the second temperature signal, and obtain the body temperature of the user based on the first temperature signal and the second temperature signal. 2. The temperature sensing module according to claim 1, wherein the heat insulating member is a first heat insulating groove provided on the flexible printed circuit board; Wherein, in a direction perpendicular to the first surface of the flexible printed circuit board, the depth of the first heat insulation groove is equal to the thickness of the flexible printed circuit board. 3. The temperature sensing module according to claim 2, characterized in that, the first heat insulation groove is in-line; Wherein, the first heat insulation groove extends along a direction perpendicular to the connecting line between the first temperature sensor and the second temperature sensor; The length of the first heat insulation groove is in the range of 0.6 mm to 2.0 mm; and/or, the width of the first heat insulation groove is in the range of 0.3 mm to 2.0 mm. 4. The temperature sensing module according to claim 2, wherein the first heat insulation tank is H-shaped; Wherein, the first heat insulation groove includes a first strip, a second strip and a third strip, the first strip extends parallel to the second strip and has the same length and width, and the third strip The strip is connected between the first strip and the second strip; the first strip and the second strip are arranged along the extension direction of the sound guide tube, and are respectively located on the An end of the first temperature sensor close to the eardrum and an end of the second temperature sensor away from the eardrum; the third strip is located between the first temperature sensor and the second temperature sensor; The length of the first strip and the second strip is in the range of 1.5 mm to 3.0 mm; the width of the first strip and the second strip is in the range of 0.1 mm to 1.0 mm; the The length of the third strip is in the range of 1.0 mm to 2.0 mm; and/or, the width of the third strip is in the range of 0.1 mm to 2.0 mm. 5. The temperature sensing module according to claim 1, wherein the heat insulating member is an insulating medium layer; Wherein, the thickness of the isolation medium layer is equal to the distance between the first temperature sensor and the second temperature sensor. 6. The temperature sensing module according to claim 1, characterized in that, the temperature sensing module further comprises: a heat transfer layer for conducting heat at the eardrum to the first temperature sensor; Wherein, the heat transfer layer is disposed between the first temperature sensor and the first surface of the flexible printed circuit board. 7. The temperature sensing module according to claim 6, characterized in that, in the extending direction of the sound guiding tube, one end of the heat transfer layer extends to the end surface of the sound guiding tube close to the eardrum the other end of the heat transfer layer is aligned with the end of the first temperature sensor away from the eardrum, or extends to the space between the first temperature sensor and the second temperature sensor. 8. The temperature sensing module according to any one of claims 2 to 4, characterized in that, the temperature sensing module further comprises: a heat insulation reinforcing plate; The heat insulation reinforcing board is attached to the second surface of the flexible printed circuit board, and the second surface of the flexible printed circuit board is opposite to the first surface of the flexible printed circuit board. 9. The temperature sensing module according to claim 8, characterized in that, in the extending direction of the sound guide tube, one end of the heat insulation reinforcing plate is in contact with the first temperature sensor close to the eardrum Align with one end of the first temperature sensor, or extend to a position closer to the eardrum than the end of the first temperature sensor close to the eardrum; the other end of the heat insulation reinforcing plate is far from the second temperature sensor One end of the eardrum is aligned, or extends to a position further away from the eardrum than an end of the second temperature sensor remote from the eardrum. 10. The temperature sensing module according to claim 8, wherein a second heat insulation groove is opened on the heat insulation reinforcing plate; Wherein, in the direction perpendicular to the surface of the heat insulation and reinforcement board, the depth of the second heat insulation groove is equal to the thickness of the heat insulation reinforcement board; the second heat insulation groove and the first The insulation slots are the same shape and size. 11. The temperature sensing module according to claim 8, wherein the flexible printed circuit board comprises: a reinforced area and a non-reinforced area; The area of the flexible printed circuit board bonded with the heat insulation reinforcing plate is a reinforced area, and other areas of the flexible printed circuit board are non-reinforced areas; Wherein, the non-reinforced area is used to electrically connect the first temperature sensor and the second temperature sensor to the processor; The length of the non-reinforced region is greater than or equal to 1.5 mm. 12. The temperature sensing module according to claim 11, characterized in that, the temperature sensing module further comprises: a heat dissipation strip; the heat dissipation strip is arranged on the first surface of the flexible printed circuit board, and is located on the first surface of the flexible printed circuit board. Non-reinforced areas of flexible printed circuit boards described above. 13. The temperature sensing module according to claim 12, wherein the processor is electrically connected to the first temperature sensor and the second temperature sensor respectively; Wherein, the first temperature sensor is electrically connected to the heat dissipation strip through a first lead, and the second temperature sensor is electrically connected to the heat dissipation strip through a second lead; the heat dissipation strip is electrically connected to the processor. 14. The temperature sensing module according to claim 1, wherein the distance between the centers of the first temperature sensor and the second temperature sensor is greater than or equal to 1.5mm. 15 . The temperature sensing module according to claim 14 , wherein the distance between the centers of the first temperature sensor and the second temperature sensor is within a range of 1.5 mm to 3.0 mm. 16. An earphone, characterized by comprising: an earphone housing and a temperature sensing module according to any one of claims 1 to 15 accommodated in the earphone housing; The earphone housing is surrounded by an earphone cavity, and the earphone cavity extends outward to form a sound guide tube; when the user wears the earphone, the sound guide tube is located on the side of the earphone cavity close to the eardrum . 17. The earphone according to claim 16, characterized in that the earphone further comprises: a heat-insulating adhesive layer for fixing the temperature sensing module to the inner wall of the sound guide tube. 18. The earphone according to claim 16, characterized in that, the earphone further comprises: a clamping mechanism; the part of the temperature sensing module close to the eardrum is fixed to the sound guide through the clamping mechanism The inner wall of the tube; the part of the temperature sensing module away from the eardrum is in contact with the inner wall of the sound guiding tube through a support body. 19. The earphone according to claim 16, characterized in that, the earphone further comprises: a bracket mechanism; the temperature sensing module is assembled on the bracket mechanism, and is fixed to the sound guide through the bracket mechanism inner wall of the tube. 20. The earphone according to claim 16, characterized in that, the earphone further comprises: a fixed heat conductor, and one end of the flexible printed circuit board close to the eardrum is fixed to the sound conductor through the fixed heat conductor. The inner wall of the tube, and conducts heat to the first temperature sensor through the fixed heat conductor. 21. The earphone according to any one of claims 16 to 20, wherein one end of the temperature sensing module extends to the end surface of the sound guide tube close to the eardrum; the temperature sensing module The other end is electrically connected with the main board of the earphone.

Images