CN217731118U - Whole support packing plant and turnover case of silicon chip - Google Patents

Abstract

The present disclosure relates to a whole pallet packaging device for silicon wafers and a turnover box, including: a turnover box, including a box body and a box cover, and forming a accommodating cavity for accommodating silicon wafers; a tray having a bottom plate and a limiter arranged along the circumferential direction A position ring, a plurality of turnover boxes are stacked and arranged in the space of the limit ring along the horizontal and vertical directions respectively; and a cover plate is used to cover the plurality of turnover boxes, and the cover plate and the tray pass through multiple winding packaging The wire is fixed, and the top surface of the cover is provided with a wire slot for fixing the packaging wire. The pallet can limit the horizontal position of multiple turnover boxes, and the cover plate and packaging line can limit and fix multiple turnover boxes in the longitudinal direction, which can realize stacking and reduce storage pressure and transportation cost; in addition, the cover plate The wire slot design on the top can optimize the packaging of the whole pallet, which is not easy to fall apart, enhances the stability and support of the whole pallet, and simplifies the packaging process.

Description

Full tray packaging device and turnover box for silicon wafers

technical field

The present disclosure relates to the field of silicon wafer packaging, in particular, to a pallet packaging device and a turnover box for silicon wafers.

Background technique

At present, the packaging of silicon wafers/cells usually uses foam plastics, such as EPS (Expanded Polystyrene, polystyrene foam) or EPE (expanded polyethylene) and carton packaging. Due to the large shipments of silicon wafers/cells, this packaging It is basically a single use, causing a lot of waste every year. The specifications of single packaging materials are not standardized, it is not easy to stack, and it is easy to cause the packaging to fall apart. At the same time, it also causes problems such as increasing storage pressure. Therefore, it is necessary to develop a high-strength full-pallet packaging device that can be recycled and easily stacked.

Utility model content

The purpose of the present disclosure is to provide a pallet packaging device and a turnover box for silicon wafers, which can solve the problems in the prior art that the packaging of silicon wafers is easy to fall apart and the supporting strength is weak.

In order to achieve the above purpose, the present disclosure provides a pallet packaging device for silicon wafers, comprising:

A turnover box, including a box body and a box cover, and forming an accommodation chamber for accommodating silicon wafers;

a pallet with a bottom plate and a limit ring arranged along the circumference, and a plurality of the turnover boxes are stacked and arranged in the space of the limit ring along the horizontal and vertical directions; and

The cover plate is used to cover a plurality of turnover boxes, and the cover plate and the pallet are fixed by multiple winding packaging lines, and the top surface of the cover plate is provided with an opening for fixing the packaging line. of wire slots.

Optionally, the box cover includes an edge portion and a concave portion, the edge portion can be overlapped on the top wall of the box body, and the bottom wall of the box body is provided with a protrusion that cooperates with the concave portion. The lifting part is used to limit the position when a plurality of the turnover boxes are stacked vertically.

Optionally, buckles are provided on the edge, and slots matching the buckles are provided on the box for fixing the box cover.

Optionally, the box body includes a plurality of first reinforcing ribs arranged at intervals, and a dustproof plate located outside the first reinforcing ribs, and the plurality of first reinforcing ribs and the dustproof plate constitute the box body side wall.

Optionally, a second reinforcing rib is formed on the box body, the second reinforcing rib connects two adjacent dustproof plates and is parallel to the box cover, and the middle section of the second reinforcing rib is also provided with a In the branch section of the box cover, the second reinforcing rib in the width direction of the box body is wavy and formed as a handle for handling.

Optionally, a label sticking area is further provided on the side wall of the box below the second reinforcing rib, and the label sticking area is a frosted surface.

Optionally, the bottom of the side wall of the box is also provided with a card slot for fixing the card holder.

Optionally, the pallet includes a plurality of uprights located below the bottom plate, and an avoidance space for the packaging line to pass is formed between two adjacent uprights.

Optionally, a plurality of protrusions extending along the length direction of the cover plate are formed at intervals on the top surface of the cover plate, and the wire grooves are provided on the protrusions and include The first wire groove and the second wire groove extending along the width direction of the cover plate, the first wire groove and the second wire groove are connected.

According to still another aspect of the present disclosure, a turnover box is also provided, and the vehicle includes the turnover box in the pallet packaging device for silicon wafers described above.

Through the above technical solution, the pallet can limit the position of multiple turnover boxes in the horizontal direction, and the cover plate and packaging line can limit and fix the position of multiple turnover boxes in the longitudinal direction, which can realize stacking and reduce storage pressure and transportation costs. ;In addition, the wire groove design on the cover can optimize the whole pallet packaging, which is not easy to fall apart, enhances the stability and support of the whole pallet, and simplifies the packaging process.

Other features and advantages of the present disclosure will be described in detail in the detailed description that follows.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present disclosure, and constitute a part of the description, together with the following specific embodiments, are used to explain the present disclosure, but do not constitute a limitation to the present disclosure. In the attached picture:

FIG. 1 is a schematic diagram of a pallet packaging device for silicon wafers according to an embodiment of the present disclosure.

Fig. 2 is a schematic diagram of a turnover box according to an embodiment of the present disclosure.

Fig. 3 is a schematic diagram of a pallet in a pallet packaging device for silicon wafers according to an embodiment of the present disclosure.

Fig. 4 is a schematic diagram of a cover plate in a pallet packaging device for silicon wafers according to an embodiment of the present disclosure.

Explanation of reference signs

1-box body; 11-dustproof board; 12-second rib; 13-label pasting area; 14-connecting plate; 15-card slot; 2-box cover; 21-edge; 211-buckle; -recessed part; 3-tray; 31-limiting ring; 4-cover plate; 41-first wire slot; 42-second wire slot; 43-handle; 5-packing line.

Detailed ways

Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

In the present disclosure, unless stated otherwise, the terms "first, second" and the like are used for the purpose of distinguishing different components, and do not have sequence or importance. Furthermore, in the following description, when referring to the drawings, the same reference numerals in different drawings denote the same or similar elements unless otherwise explained.

According to an embodiment of the present disclosure, as shown in FIGS. 1 to 4 , a pallet packaging device for silicon wafers is provided, including a turnover box, a tray 3 and a cover plate 4, wherein the turnover box may include a box body 1 and a box body. Cover 2, and form an accommodating cavity for accommodating silicon wafers. The tray 3 has a bottom plate and a limit ring 31 arranged along the circumference. The limit ring 31 limits the periphery of the turnover box accommodated therein, so that a plurality of turnover boxes are stacked and arranged in the space of the limit ring 31 along the horizontal and vertical directions. Inside, to prevent the misplacement of the turnover box and the pallet 3 from causing hidden dangers in transportation. The cover plate 4 is used to cover multiple turnover boxes, and the cover plate 4 and the tray 3 are fixed by the packaging line 5 wound multiple times, and the top surface of the cover plate 4 is provided with a wire groove for fixing the packaging line 5 . Here, the turnover box can be made of plastic material, such as PP material (Polypropylene, polypropylene), which has high strength, can replace the currently used carton, can be recycled, and is more environmentally friendly, while reducing packaging costs and improving production efficiency. Protective effect on silicon wafers, easy to operate, easy to clean, and easy to match with automatic packaging lines.

Through the above technical solution, the pallet 3 can limit the position of multiple turnover boxes in the horizontal direction, and the cover plate 4 and the packaging line 5 can limit and fix the position of multiple turnover boxes in the longitudinal direction, which can realize stacking and reduce storage pressure. and transportation costs. In addition, the wire groove design on the cover plate 4 can optimize the packaging of the whole pallet, which is not easy to fall apart, enhances the stability and support of the whole pallet, and simplifies the packaging process.

In addition, it should be noted that the inner side of the box body 1 and the side of the box cover 2 facing the box body 1 can be provided with a buffer material, and the buffer material can be made of EPS or EPE material, so as to facilitate the protection of the silicon wafer or battery inside the chamber. The chip is protected to prevent damage to the silicon chip or the battery chip.

Further, as shown in FIG. 2 , the box cover 2 may include an edge portion 21 and a recessed portion 22 , the edge portion 21 can be overlapped on the top wall of the box body 1 , and the bottom wall of the box body 1 is provided with the recessed portion 22 The matching raised part can limit the position when multiple turnover boxes are stacked vertically, and strengthen the stability of the whole pallet packaging device. Compared with traditional packaging, it can effectively use the space for stacking to a greater extent. At the same time, the structure in which the recessed part 22 cooperates with the raised part can avoid extra irregular space when the turnover boxes are stacked, and reduce storage pressure.

Further, as shown in FIG. 2 , a buckle 211 is provided on the edge portion 21 , and a slot matching the buckle 211 is provided on the box body 1 for fixing the box cover 2 so that the box cover 2 and the box body 1 Tight connection prevents dust from falling into the box body 1 from the gap. The buckles 211 and the draw-in grooves are respectively arranged at intervals along the length direction of the turnover box, and the buckles and draw-in grooves on the opposite side walls can adopt the same structure and corresponding positions, so that when the box cover 2 is turned over, it can still It can be snapped and fixed without changing the direction.

According to an embodiment of the present disclosure, as shown in FIG. 2 , the box body 1 includes a plurality of first reinforcing ribs arranged at intervals, and a dustproof plate 11 located outside the first reinforcing ribs. The dust plate 11 constitutes the side wall of the box body 1, and the first reinforcing rib enhances the overall rigidity of the box body 1, so that it can accommodate a larger weight of silicon wafers. At the same time, the dust-proof plate is arranged outside the first reinforcing rib to reduce dust pollution , easy to clean, and enhance the protective effect of the cabinet 1.

Further, as shown in FIG. 2, a second reinforcing rib 12 is formed on the box body 1. The second reinforcing rib 12 connects two adjacent dustproof plates 11 and is parallel to the box cover 2. The middle section of the second reinforcing rib 12 is also provided There is a branch section for connecting the box cover 2, and the second reinforcing rib 12 in the width direction of the box body 1 is wavy and formed as a handle for handling. It is convenient for employees to grab and carry.

Further, as shown in Figure 2, the side wall of the box body 1 is also provided with a label sticking area 13 below the second reinforcing rib 12, and the label sticking area 13 is a frosted surface, which is convenient for sticking labels to determine the silicon contained in the turnover box. Sheet specification batches, sticky labels on the frosted surface are not easy to leave glue after being torn off, which is convenient for repeated label replacement.

According to another embodiment of the present disclosure, as shown in FIG. 2 , the bottom of the side wall of the box body 1 is also provided with a card slot 15 for fixing the card holder, which can hold a label card marked with the information of the installed silicon wafer. The function is similar to that of the label pasting area 13 above, and only one of the two can be left. It is also possible to reserve a card slot 15 below on the basis of the label pasting area 13, so as to prevent when the label pasting area 13 cannot be used. The card slot 15 can continue to function.

According to one embodiment of the present disclosure, as shown in Fig. 1 and Fig. 3 , the tray 3 may include a plurality of uprights located below the bottom plate, and an avoidance space for the packaging line 5 to pass is formed between two adjacent uprights, while the The space is also convenient for the front end of the forklift to enter, and the front end of the forklift is limited, so as to facilitate the transportation and handling of the whole pallet packaging device.

According to one embodiment of the present disclosure, as shown in Fig. 1 and Fig. 4, a plurality of protrusions extending along the length direction of the cover plate 4 are formed at intervals on the top surface of the cover plate 4, and the wire slots are set on the protrusions and include The first wire groove 41 extending along the length direction of the cover plate 4 and the second wire groove 42 extending along the width direction of the cover plate 4, the length direction and the width direction are marked as shown in Figure 1, the first wire groove 41 and the second wire groove 42 Interconnected, so as to facilitate the positioning of the packaging line 5, prevent the packaging line 5 from shifting during transportation and cause the entire pallet packaging device to fall apart, resulting in unnecessary material loss. The number of the first wire slot 41 is the same as that of the second wire slot 42 The quantity is variable and can be determined according to the actual needs of the packaging. It should be noted that a handle 43 can also be provided on the cover plate 4, and the handle 43 is arranged between two adjacent protrusions, so that it is convenient for personnel to remove the cover plate 4 when disassembling the package.

On the basis of the above solution, the present disclosure also provides a turnover box, the turnover box includes the turnover box in the above-mentioned pallet packaging device for silicon wafers, and the turnover box has the turnover box in the pallet packaging device for silicon wafers. All beneficial effects of the box will not be repeated here.

The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure. These simple modifications all belong to the protection scope of the present disclosure.

In addition, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way if there is no contradiction. The combination method will not be described separately.

In addition, various implementations of the present disclosure can also be combined in any way, as long as they do not violate the idea of the present disclosure, they should also be regarded as the content disclosed in the present disclosure.

Claims (10)

1. A whole pallet packaging device for silicon wafers, characterized in that, comprising: A turnover box, including a box body and a box cover, and forming an accommodation chamber for accommodating silicon wafers; a pallet with a bottom plate and a limit ring arranged along the circumference, and a plurality of the turnover boxes are stacked and arranged in the space of the limit ring along the horizontal and vertical directions; and The cover plate is used to cover a plurality of turnover boxes, and the cover plate and the pallet are fixed by multiple winding packaging lines, and the top surface of the cover plate is provided with an opening for fixing the packaging line. of wire slots. 2. The pallet packaging device for silicon wafers according to claim 1, wherein the box cover includes an edge portion and a recessed portion, and the edge portion can be overlapped on the top wall of the box body, so that The bottom wall of the box body is provided with a raised portion cooperating with the recessed portion, so as to limit the position when a plurality of the turnover boxes are stacked vertically. 3. The pallet packaging device for silicon wafers according to claim 2, characterized in that buckles are provided on the edge, and slots matching the buckles are provided on the box for use in to fix the lid. 4. The pallet packaging device for silicon wafers according to claim 1, wherein the box body comprises a plurality of first reinforcement ribs arranged at intervals, and a dust-proof plate located outside the first reinforcement ribs, A plurality of first reinforcing ribs and the dust-proof board constitute the side wall of the box. 5. The pallet packaging device for silicon wafers according to claim 4, wherein a second reinforcing rib is formed on the box, and the second reinforcing rib connects two adjacent dust-proof plates and is connected to the The box cover is parallel to the box cover, and the middle section of the second reinforcement rib is also provided with a branch section for connecting the box cover. The second reinforcement rib in the width direction of the box body is wave-shaped and formed as a handle for handling. 6. The pallet packaging device for silicon wafers according to claim 5, wherein a label sticking area is also provided on the side wall of the box below the second reinforcing rib, and the label sticking area For matte surface. 7 . The pallet packaging device for silicon wafers according to claim 1 , wherein a card slot for fixing a card holder is provided at the bottom of the side wall of the box. 7 . 8 . The pallet packaging device for silicon wafers according to claim 1 , wherein the tray includes a plurality of uprights located below the bottom plate, and a gap is formed between two adjacent uprights for the packaging line to pass through. avoidance space. 9. The pallet packaging device for silicon wafers according to claim 1, wherein a plurality of protrusions extending along the length direction of the cover are formed at intervals on the top surface of the cover, and the wire groove set on the protrusion and include a first wire groove extending along the length direction of the cover plate and a second wire groove extending along the width direction of the cover plate, the first wire groove and the second wire groove are connected . 10. A turnover box, characterized in that, the turnover box is a turnover box in the pallet packaging device for silicon wafers according to any one of claims 1-9.

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