CN217626331U

CN217626331U - Feeding machine

Info

Publication number: CN217626331U
Application number: CN202221270577.0U
Authority: CN
Inventors: 陆国林; 文岳丰
Original assignee: Shenzhen Hongchao Precision Machinery Equipment Co ltd
Current assignee: Shenzhen Hongchao Precision Machinery Equipment Co ltd
Priority date: 2022-05-25
Filing date: 2022-05-25
Publication date: 2022-10-21
Anticipated expiration: 2032-05-25

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a feeding machine which is used for conveying wafers and comprises a machine table, wherein the interior of the machine table is hollow, a baffle is respectively arranged at the front side and the rear side above the machine table, the two baffles are respectively a first baffle and a second baffle, and a conveying mechanism is arranged in front of the second baffle and the second baffle; the conveying mechanism comprises a transmission motor, a transmission wheel and a plurality of conveying shafts, the plurality of conveying shafts are arranged in parallel between the first baffle and the second baffle, two ends of each conveying shaft are respectively connected with the first baffle and the second baffle, the conveying shafts are connected with the transmission wheel, the transmission wheel is connected with the transmission motor, the transmission motor drives the transmission wheel to rotate, and the transmission motor is arranged in the machine table; and the left end and the right end of the conveying shaft are respectively provided with a push piece, and the distance between the two push pieces is equal to the diameter length of the wafer, so that the problem of dislocation in the wafer conveying process is solved, the processing efficiency is improved, and efficient automatic processing is realized.

Description

Feeding machine

Technical Field

The utility model relates to a semiconductor manufacturing technology field, concretely relates to pan feeding machine.

Background

In automatic assembly or automatic processing machines, vibratory trays or linear vibrators are commonly used to orderly arrange the various products or components. In the existing vibrating disk and linear vibrator, after the materials are arranged and screened out, the materials at the forefront end are taken out from the flow channel. In the field of feeding of semiconductor wafer vibration discs in the prior art, the front and the back surfaces of a semiconductor wafer need to be detected in the feeding process of the semiconductor wafer, and after the detection, the surfaces which do not meet the requirements of a production line need to be removed, so that the surfaces enter the vibration discs again, and the feeding is carried out in the vibration discs again. The front side and the secondary side of the semiconductor wafer entering the straight vibration feeder (straight vibration guide rail) from the vibration disc are random, and the probability of each is half, so that the feeding efficiency of the semiconductor wafer is greatly limited.

For example, in the existing chinese patent 201721004266.9, a material conveying device realizes the sorting of materials by a vibrating disk and a direct vibration feeder, and the prior art designs a design that materials flow back to the vibrating disk for overstocking the backflow of the materials. In order to improve the production efficiency, the material feeding efficiency of the vibration disc in the field of semiconductor wafers has very high requirements, so that the design makes a shunting design on the semiconductor wafers after the front and the back surfaces are detected, the semiconductor wafers can be simultaneously supplied to two sets of processing equipment with different surfaces, and the production efficiency is greatly improved.

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent.

However, when the above-mentioned apparatus is used for wafer transportation, misalignment is likely to occur, which affects subsequent processing operations.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned weak point that exists among the prior art, the utility model provides a pan feeding machine for solve the problem that takes place the dislocation among the prior art's the wafer transportation process, thereby improve machining efficiency, realize high-efficient automated processing.

In order to solve the technical problem, the utility model adopts the following technical scheme: a feeding machine is used for conveying wafers and comprises a machine table, wherein the machine table is hollow, a baffle is arranged on the front side and the rear side above the machine table respectively, the two baffles are respectively a first baffle and a second baffle which are arranged in parallel, and a conveying mechanism is arranged in front of the second baffle and the second baffle;

the conveying mechanism comprises a transmission motor, a transmission wheel and a plurality of conveying shafts, the plurality of conveying shafts are arranged in parallel between the first baffle and the second baffle, two ends of each conveying shaft are respectively connected with the first baffle and the second baffle, the conveying shafts are connected with the transmission wheel, the transmission wheel is connected with the transmission motor, the transmission motor drives the transmission wheel to rotate, and the transmission motor is arranged inside the machine table;

each conveying shaft is uniformly provided with a plurality of rollers at intervals, the left end and the right end of the conveying shaft are respectively provided with a push piece, the rollers are arranged between the two push pieces, and the distance between the two push pieces is equal to the diameter length of the wafer.

Preferably, the conveying head end and the conveying tail end of the conveying mechanism are respectively provided with a first induction strip and a second induction strip, and the first induction strip and the second induction strip are respectively provided with a first inductor and a second inductor.

Preferably, the conveying mechanism is provided with a lifting mechanism near the conveying end, the lifting mechanism is arranged in front of the second induction strip, the lifting mechanism comprises a lifting cylinder and an ejector rod, the lifting cylinder is arranged in the machine table and drives the ejector rod to contract and jack, and when the ejector rod is in a contraction state, the top of the ejector rod is below the driving shaft.

Preferably, the ejector rods comprise four ejector rods, and the heights of the four ejector rods are kept consistent.

Preferably, the top of each ejector rod is provided with a rubber pad.

Preferably, the access door is arranged in front of the machine table, and four corners of the bottom of the machine table are respectively provided with a supporting base.

Compared with the prior art, the utility model, following beneficial effect has: the prior art is when being used for the wafer to carry, takes place the condition of dislocation easily to influence follow-up processing operation, and the utility model discloses when carrying out the pan feeding of wafer transport, be equipped with the push jack at the both ends of carrying the axle, just distance between two push jacks equals the diameter length of wafer to guarantee that the wafer is in same transport straight line, improve follow-up machining efficiency, reduce machining error, and still be equipped with and lift up the mechanism, because wafer itself is thin, it is not too convenient to adopt the manual work to get, and lift up the mechanism and jack up the wafer after, make things convenient for subsequent mechanism to get, and the top of ejector pin is equipped with the cushion, causes the damage to the wafer surface when avoiding the ejector pin to jack up the wafer, influences processingquality.

Drawings

Fig. 1 is a schematic view of a three-dimensional structure of a feeding machine of the present invention;

fig. 2 is a schematic view of a top view structure of the feeding machine of the present invention.

Reference numerals referred to in the drawings are: the machine table 1, a supporting base 2, an access door 3, a baffle 4, a conveying shaft 5, a push sheet 6, a first induction strip 7, a first inductor 8, a push rod 9, a rubber mat 10, a second induction strip 11, a second inductor 12, a roller 13 and a wafer 14.

Detailed Description

In order to make the technical solution of the present invention better understood by those skilled in the art, the following technical solution of the present invention is further explained with reference to the accompanying drawings and embodiments:

the solar energy has the characteristics of environmental protection, high practicability and the like, the requirement of alternative energy sources is intensified at the current that the price of crude oil is continuously increased, and the pollution-free solar energy is the first choice of the alternative energy sources. In the utilization of solar energy, a solar wafer which is responsible for absorbing and capturing sunlight and converting the sunlight into electric energy for output becomes an indispensable role; therefore, the efficiency of solar wafer manufacturing and related testing, sorting, packaging, and transportation is a goal of the industry.

A feeding machine is used for conveying wafers 14 and comprises a machine table 1, wherein the machine table 1 is hollow, a baffle 4 is respectively arranged on the front side and the rear side above the machine table 1, the two baffles 4 are respectively a first baffle 4 and a second baffle 4, the first baffle 4 and the second baffle 4 are arranged in parallel, and a conveying mechanism is arranged in front of the second baffle 4 and the second baffle 4; conveying mechanism includes drive machine, drive wheel and a plurality of transport axle 5, and a plurality of transport axle 5 parallel arrangement and first baffle 4 and second baffle 4 between, and every both ends of carrying axle 5 equally divide and do not be connected with first baffle 4 and second baffle 4, and carry axle 5 to be connected with the drive wheel, and the drive wheel is connected with drive machine, and drive machine drive wheel rotates, and drive machine locates inside board 1.

A plurality of rollers 13 are uniformly arranged on each conveying shaft 5 at intervals, two pushing pieces 6 are respectively arranged at the left end and the right end of each conveying shaft 5, the plurality of rollers 13 are arranged between the two pushing pieces 6, and the distance between the two pushing pieces 6 is equal to the diameter length of the wafer 14.

Conveying mechanism's transport head end and transport end are equipped with first response strip 7 and second response strip 11 respectively, and be equipped with first inductor 8 and second inductor 12 on first response strip 7 and the second response strip 11 respectively, conveying mechanism is close to and carries the end department to be equipped with and lifts up the mechanism, and lift up the mechanism and locate 11 the place ahead of second response strip, the mechanism that lifts up is including lifting up cylinder and ejector pin 9, lift up the cylinder and locate 1 inside the board, lift up cylinder drive ejector pin 9 shrink and jack-up, when ejector pin 9 is in the shrink state, the top of ejector pin 9 belongs to the drive shaft below.

Ejector pin 9 includes four, and the highly keeping unanimous of four ejector pins 9, and the top of every ejector pin 9 all is equipped with

cushion

10, and 1 the place ahead of board is equipped with access door 3, and four angles in board 1 bottom are equipped with a support base 2 respectively.

Prior art is when being used for wafer 14 to carry, the condition of dislocation takes place easily, thereby influence follow-up processing operation, and the utility model discloses when carrying out wafer 14 and carrying the pan feeding, both ends at carrying axle 5 are equipped with push jack 6, and the distance between two push jacks 6 equals the diameter length of wafer 14, thereby can regular wafer 14's position, guarantee that wafer 14 is located same conveying straight line, improve follow-up machining efficiency, reduce the machining error, and still be equipped with and lift up the mechanism, because wafer 14 itself is thin, it is not too convenient to adopt the manual work to take, and lift up the mechanism with wafer 14 jack-up back, make things convenient for subsequent mechanism to get, and the top of ejector pin 9 is equipped with cushion 10, cause the damage to wafer 14 surface when avoiding ejector pin 9 to push up wafer 14, influence processingquality.

The above description is only for the embodiment of the present invention, and the common general knowledge of the known specific structures and characteristics in the schemes is not described herein too much, so that those skilled in the art can know all the common technical knowledge in the technical field of the present invention before the application date or the priority date, can know all the prior art in this field, and have the capability of applying the conventional experimental means before this date, and those skilled in the art can complete and implement the schemes in combination with their own capability, and some typical known structures or known methods should not become obstacles for those skilled in the art to implement the present application. It should be pointed out that, for the person skilled in the art, without departing from the structure of the invention, several variants and modifications can be made, which should also be regarded as the scope of protection of the invention, which will not affect the effectiveness of the implementation of the invention and the utility of the patent.

Claims

1. A material feeder for conveying wafers (14), characterized by: the machine comprises a machine table (1), wherein the machine table (1) is hollow, a baffle (4) is arranged on the front side and the rear side above the machine table (1), the two baffles (4) are respectively a first baffle (4) and a second baffle (4), the first baffle (4) and the second baffle (4) are arranged in parallel, and a conveying mechanism is arranged in front of the second baffle (4) and the second baffle (4);

the conveying mechanism comprises a transmission motor, a transmission wheel and a plurality of conveying shafts (5), the plurality of conveying shafts (5) are arranged in parallel between the first baffle (4) and the second baffle (4), two ends of each conveying shaft (5) are respectively connected with the first baffle (4) and the second baffle (4), the conveying shafts (5) are connected with the transmission wheel, the transmission wheel is connected with the transmission motor, the transmission motor drives the transmission wheel to rotate, and the transmission motor is arranged inside the machine table (1);

a plurality of rollers (13) are uniformly arranged on each conveying shaft (5) at intervals, a push piece (6) is arranged at each of the left end and the right end of each conveying shaft (5), the rollers (13) are arranged between the two push pieces (6), and the distance between the two push pieces (6) is equal to the diameter length of the wafer (14).

2. A machine as claimed in claim 1, wherein: conveying mechanism's transport head end and transport end are equipped with first response strip (7) and second response strip (11) respectively, just be equipped with first inductor (8) and second inductor (12) on first response strip (7) and the second response strip (11) respectively.

3. The material feeder according to claim 2, wherein: the conveying mechanism is provided with a lifting mechanism close to the conveying tail end, the lifting mechanism is arranged in front of the second induction strip (11), the lifting mechanism comprises a lifting cylinder and an ejector rod (9), the lifting cylinder is arranged inside the machine table (1), the lifting cylinder drives the ejector rod (9) to contract and jack, and when the ejector rod (9) is in a contraction state, the top of the ejector rod (9) belongs to the position below the driving shaft.

4. A material feeder as claimed in claim 3, wherein: the four ejector rods (9) are four, and the heights of the four ejector rods (9) are kept consistent.

5. The material feeder according to claim 4, wherein: the top of each ejector rod (9) is provided with a rubber pad (10).

6. A material feeder according to claim 5, further comprising: an access door (3) is arranged in front of the machine table (1), and four corners at the bottom of the machine table (1) are respectively provided with a supporting base (2).