CN217606779U

CN217606779U - Wafer cutting detection device for optical splitter

Info

Publication number: CN217606779U
Application number: CN202221221562.5U
Authority: CN
Inventors: 吴海平; 肖庆强
Original assignee: Shenzhen Xinhaixun Photoelectric Co ltd
Current assignee: Shenzhen Xinhaixun Photoelectric Co ltd
Priority date: 2022-05-20
Filing date: 2022-05-20
Publication date: 2022-10-18
Anticipated expiration: 2032-05-20

Abstract

The utility model discloses an optical divider wafer cutting detection device, relate to wafer technical field, including the workstation body, the upper surface of workstation body is provided with clamping component, one side of clamping component is provided with cutting detection subassembly, the inside of workstation body is provided with collects the subassembly, after driving the arc piece through control telescopic cylinder and pressing from both sides the wafer tight fixed back that finishes, drive the connecting rod through starting electric telescopic handle A, the connecting rod drives circular cutting knife and cuts the wafer, cut and finish, it removes to under the microscope to drive through electric putter tight wafer removal, the rethread starts electric telescopic handle B, electric telescopic handle B drives the die-pin, the die-pin drives microscope downwardly movement, when using microscope to the inspection of wafer edge appearance, can realize the all-round inspection of wafer, need not artifical manual intervention, the accuracy nature of result has effectively been guaranteed, and partial sweeps drops in the inside of placing the concave plate through the small opening, thereby collect the sweeps.

Description

Wafer cutting detection device for optical splitter

Technical Field

The utility model relates to a wafer technology field specifically is optical divider wafer cutting detection device.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. Domestic wafer production lines are dominated by 8 inches and 12 inches.

At present, current wafer need cut in the course of working, current conventional course of working is usually for cutting by hand, and personnel are through manual cutting, the waste material clearance, the action is comparatively numerous and great and intensity of labour is great, not only waste time, hard and with high costs, and personnel manual operation tool, there is certain safety risk in the blade cutting, secondly, when detecting the calibration to the wafer, need the counter point to compare, when wafer position detection in the past, generally through the fixed point detection, need getting of fixed point to put, the testing procedure is comparatively complicated, when detecting, if take place the skew, then can lead to detecting the production deviation, influence the testing result in the later stage.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an optical divider wafer cutting detection device, have easy location, easy to assemble, simple structure's advantage, at present, current wafer need cut in the course of working, current conventional course of working is usually for manual cutting, and personnel are through manual cutting, the garbage disposal, the action is comparatively numerous and diverse and intensity of labour is great, not only take time, difficultly and with high costs, and personnel manual operation tool, there is certain safety risk in the blade cutting, secondly, when detecting the check to the wafer, need the counter point to compare, when detecting in the wafer position in the past, generally detect through the fixed point, need the fixed point to get and put, the testing procedure is comparatively complicated, when detecting, if take place the skew, then can lead to detecting the production deviation, influence the problem of the testing result in later stage.

In order to achieve the above purpose, the utility model provides a following technical scheme: the wafer cutting detection device for the optical divider comprises a workbench body, wherein a clamping component is arranged on the upper surface of the workbench body, a cutting detection component is arranged on one side of the clamping component, and a collection component is arranged inside the workbench body;

the clamping assembly comprises electric push rods arranged on the upper surface of the workbench body, the electric push rods are provided with two groups, one end of each electric push rod is provided with a sliding block, and the upper surface of each sliding block is provided with a vertical plate.

Preferably, the side of riser is provided with telescopic cylinder, and telescopic cylinder's one end is provided with the arc piece, is provided with the baffle between two sets of electric putter, and telescopic cylinder's lower extreme is provided with the limiting plate.

Preferably, the upper surface of the limiting plate is provided with two groups of limiting grooves, the inside of each limiting groove is provided with a sliding block plate in a sliding manner, and a circular groove is formed between the two groups of limiting grooves.

Preferably, the lower surface of the limiting plate is provided with a stand column, one end of the stand column is provided with a circular slide block, and the limiting plate is connected with the lower surface of the arc-shaped block through a slide block plate.

Preferably, the standing groove has been seted up to the side of workstation body, and the sliding tray has been seted up to the upper surface of standing groove, and the sliding tray has been seted up two sets ofly, has seted up the card spout between two sets of sliding trays, and the card spout has been seted up two sets ofly, has seted up the small opening between two sets of card spouts.

Preferably, electric putter's one end is connected with the inner wall one end of sliding tray, the sliding block setting in the inside of sliding tray and with sliding tray sliding connection, the stand passes through circular sliding block and card spout block sliding connection.

Preferably, the cutting detection assembly comprises a storage plate arranged on the upper surface of the workbench body, a movable groove is formed in the upper surface of the storage plate, a movable block A and a movable block B are arranged in the movable groove in a sliding mode, and an electric telescopic rod A is arranged on the lower surface of the movable block A.

Preferably, the one end of electric telescopic handle A is provided with the connecting rod, and the one end of connecting rod is provided with circular cutting knife, and the lower surface of movable block B is provided with electric telescopic handle B, and the one end of electric telescopic handle B is provided with the die-pin, and the one end of die-pin is provided with the microscope.

Preferably, the collecting assembly comprises a collecting box arranged inside the placing groove, clamping grooves are formed in two ends of the inner wall of the collecting box, handles are arranged on the side faces of the collecting box, and the collecting box is connected with the placing groove in a sliding mode.

Preferably, the collecting box is internally provided with a placing concave plate, clamping blocks are arranged on two sides of the placing concave plate, the placing concave plate is connected with the clamping grooves in a sliding clamping mode through the clamping blocks, and a drawing rod is arranged on the upper surface of each clamping block.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. when the optical divider wafer cutting detection device is used, a wafer with a cut function is prevented from being arranged between two groups of arc-shaped blocks and is placed on the upper surface of a circular groove at the same time, two groups of telescopic cylinders are started to drive the arc-shaped blocks to clamp two ends of the wafer, after the circular cutting knife is controlled to cut, the upper surface of the circular groove can accumulate a few waste scraps, an electric push rod is started to drive a sliding block, the sliding block drives a vertical plate, the vertical plate further drives the clamped wafer to move rightwards, the circular sliding block is clamped at the rightmost end of a clamping sliding groove in a sliding mode, and therefore the few waste scraps accumulated on the upper surface of the circular groove can fall into a leakage groove, certain waste scraps can be prevented from being scattered, the structure is simple, the use is convenient, the design is reasonable, and certain manual labor force can be effectively saved;

2. optical divider wafer cutting detection device, during the use, after driving the arc piece through control telescopic cylinder and pressing from both sides tight fixed back with the wafer, through starting electric telescopic handle A, electric telescopic handle A drives the connecting rod, the connecting rod drives circular cutting knife and cuts the wafer, cut and finish, drive the wafer that is pressed from both sides tightly through electric putter and move to under the microscope, rethread starts electric telescopic handle B, electric telescopic handle B drives the die-pin, the die-pin drives microscope and moves down, when using microscope to the inspection of wafer edge appearance, can realize the all-round inspection of wafer, need not artifical manual intervention, the accuracy of result has effectively been guaranteed, and partial sweeps drops through the small opening and is placing the inside of concave plate, thereby collect the sweeps, moreover, the steam generator is simple in structure, high durability and convenient use.

Drawings

FIG. 1 is an overall structure diagram of the present invention;

FIG. 2 is a schematic view of the structure of the worktable body and the clamping assembly of the present invention;

FIG. 3 is a structural diagram of the cutting detecting assembly of the present invention;

fig. 4 is an enlarged view of fig. 3 a according to the present invention;

FIG. 5 is a structural view of the collecting box of the present invention;

fig. 6 is a structural view of the slot plate of the present invention.

In the figure: 1. a table body; 11. a placement groove; 12. a sliding groove; 13. a card chute; 14. a leak groove; 2. a clamping assembly; 21. an electric push rod; 211. a slider; 212. a vertical plate; 213. a telescopic cylinder; 2131. an arc-shaped block; 22. a baffle plate; 23. a limiting plate; 231. a limiting groove; 2311. a slider plate; 232. a circular groove; 233. a column; 2331. a circular slider; 3. a cutting detection assembly; 31. a placement plate; 311. a movable groove; 3111. a movable block A; 3112. a movable block B; 312. an electric telescopic rod A; 313. a connecting rod; 3131. a circular cutter; 314. an electric telescopic rod B; 315. a supporting rod; 3151. a microscope; 4. a collection assembly; 41. a collection box; 411. a card slot; 412. a handle; 42. placing the concave plate; 421. a clamping block; 422. and a pull rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

For a further understanding of the present invention, reference will be made to the following detailed description taken in conjunction with the accompanying drawings.

With reference to fig. 1, the wafer cutting and detecting device for the optical splitter comprises a workbench body 1, wherein a clamping component 2 is arranged on the upper surface of the workbench body 1, a cutting and detecting component 3 is arranged on one side of the clamping component 2, and a collecting component 4 is arranged inside the workbench body 1.

The present invention will be further described with reference to the following examples.

The first embodiment is as follows:

referring to fig. 1-3, an optical splitter wafer cutting detection device, a clamping assembly 2 includes two sets of electric push rods 21 disposed on an upper surface of a table body 1, the electric push rods 21 are provided with two sets of sliding blocks 211, one end of each electric push rod 21 is provided with a vertical plate 212, a side surface of each vertical plate 212 is provided with a telescopic cylinder 213 for clamping and fixing wafers to be cut of different sizes, one end of each telescopic cylinder 213 is provided with an arc 2131, a baffle 22 is disposed between the two sets of electric push rods 21 for preventing scraps from falling into a card sliding groove 13, a lower end of each telescopic cylinder 213 is provided with a limiting plate 23, an upper surface of each limiting plate 23 is provided with two sets of limiting grooves 231, the limiting grooves 231 are disposed inside the limiting grooves 231 in a sliding manner, a slider plate 2311 is disposed inside the limiting grooves 231, a circular groove 232 is disposed between the two sets of limiting grooves 231, an upright column 233 is disposed on a lower surface of the limiting plate 23, the limiting plate 23 is connected to a lower surface of the arc 2131 via the slider 2311, the slider plate 2311 is disposed on a side surface of the table body 1, a sliding groove 11, a sliding groove 12 is disposed on the sliding surface of the sliding block 12, a sliding groove 12 is disposed on an end of the sliding groove 12, a sliding block 12 is disposed on an inner wall of the sliding groove 13 for preventing the sliding belt, and for preventing the sliding belt from falling, and the sliding belt 13, and the sliding belt is connected to collect the sliding block 21, and the sliding belt 13, and the sliding belt is disposed on the sliding belt, and the sliding groove 21, through starting two sets of telescopic cylinder 213, make to drive arc piece 2131 and press from both sides tightly with the both ends of wafer, after cutting through control circular cutting knife 3131 finishes, some sweeps can be piled up to the upper surface of circular slot 232, and then drive sliding block 211 through starting electric putter 21, sliding block 211 drives riser 212, riser 212 and then drive the wafer that is pressed from both sides tightly and move to the right, make circle slider 2331 slip block at the rightmost end of card spout 13, thereby some sweeps of piling up at the upper surface of circular slot 232 can drop in the small opening 14, can prevent that certain sweeps from unrestrained, moreover, the steam generator is simple in structure, high durability and convenient use, and reasonable design can effectively save certain hand labor power.

The second embodiment:

referring to fig. 4-6, the wafer cutting and detecting device for an optical splitter includes a cutting and detecting assembly 3 including a placement plate 31 disposed on the upper surface of a worktable body 1, a movable slot 311 disposed on the upper surface of the placement plate 31, a movable block a3111 and a movable block B3112 slidably disposed inside the movable slot 311, a circular cutting blade 3131 and a microscope 3151 disposed on the movable block a3111, an electric telescopic rod a312 disposed on the lower surface of the movable block a3111, a connecting rod 313 disposed at one end of the electric telescopic rod a312, a circular cutting blade 3131 disposed at one end of the connecting rod 313, an electric telescopic rod B314 disposed on the lower surface of the movable block B3112, a supporting rod 315 disposed at one end of the electric telescopic rod B314, a microscope 3151 disposed at one end of the supporting rod 315, a collecting assembly 4 including a collecting box 41 disposed inside a placement slot 11, and a slot 411 disposed at two ends of an inner wall of the collecting box 41, the collecting box 41 is provided with a handle 412 on the side, the collecting box 41 is connected with the placing groove 11 in a sliding manner, the collecting box 41 is provided with a placing concave plate 42 inside for collecting and processing the scraps falling in the leakage groove 14 in a centralized manner, the two sides of the placing concave plate 42 are provided with clamping blocks 421, the placing concave plate 42 is connected with the clamping grooves 411 in a sliding and clamping manner through the clamping blocks 421, the upper surface of the clamping blocks 421 is provided with a drawing rod 422, when the collecting box is used, the telescopic cylinder 213 is controlled to drive the arc-shaped blocks 2131 to clamp and fix the wafer, the electric telescopic rod A312 is started to drive the connecting rod 313, the connecting rod 313 drives the circular cutting knife 3131 to cut the wafer, the cut is finished, the clamped wafer is driven by the electric push rod 21 to move to the position under the microscope 3151, and then the electric telescopic rod B314 is started to drive the supporting rod 315, the supporting rod 315 drives the microscope 3151 to move downwards, when using microscope 3151 to wafer edge appearance inspection, can realize the all-round inspection of wafer, need not artifical manual intervention, effectively guaranteed the accuracy nature of result, and partial sweeps drops in the inside of placing concave plate 42 through small opening 14 to collect the sweeps, simple structure, convenient to use.

In summary, the following steps: the wafer cutting detection device for the optical splitter comprises a workbench body 1, wherein a clamping component 2 is arranged on the upper surface of the workbench body 1, a cutting detection component 3 is arranged on one side of the clamping component 2, a collection component 4 is arranged inside the workbench body 1, when the wafer cutting detection device is used, the wafer with cutting is prevented from being arranged between two groups of arc-shaped blocks 2131 and is simultaneously placed on the upper surface of a circular groove 232, two groups of telescopic air cylinders 213 are started to drive the arc-shaped blocks 2131 to clamp two ends of the wafer, after the circular cutting knife 3131 is controlled to cut, a few scraps are accumulated on the upper surface of the circular groove 232, an electric push rod 21 is started to drive a sliding block 211, the sliding block 211 drives a vertical plate 212, the vertical plate 212 further drives the clamped wafer to move rightmost, the circular block 2331 is clamped at the rightmost end of a clamping sliding groove 13 in a sliding mode, and the few scraps accumulated on the upper surface of the circular groove 232 fall into a leakage groove 14, can prevent certain sweeps from spilling, simple in construction, easy to use, reasonable in design, can save certain manual labor effectively, while using, after driving the arc-shaped block 2131 to clamp and fix the wafer tightly through controlling the telescopic cylinder 213, through starting the electric telescopic rod A312, the electric telescopic rod A312 drives the tie rod 313, the tie rod 313 drives the round cutting knife 3131 to cut the wafer, finish cutting, drive the wafer that is clamped to move to under the microscope 3151 through the electric push rod 21, and then through starting the electric telescopic rod B314, the electric telescopic rod B314 drives the die pin 315, the die pin 315 drives the microscope 3151 to move downward, through using the microscope 3151 to check the edge topography of the wafer, can realize the omnibearing check of the wafer, does not need the manual intervention of the manual work, has guaranteed the accuracy of the result effectively, and some sweeps drop in the inside of placing the concave plate 42 through the leak slot 14, thereby collecting the sweeps, simple structure and convenient use.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The wafer cutting detection device for the optical divider comprises a workbench body (1), and is characterized in that a clamping component (2) is arranged on the upper surface of the workbench body (1), a cutting detection component (3) is arranged on one side of the clamping component (2), and a collection component (4) is arranged inside the workbench body (1);

the clamping assembly (2) comprises electric push rods (21) arranged on the upper surface of the workbench body (1), two groups of electric push rods (21) are arranged, a sliding block (211) is arranged at one end of each electric push rod (21), and a vertical plate (212) is arranged on the upper surface of each sliding block (211).

2. The wafer cutting and detecting device for the optical splitter according to claim 1, wherein: the side of the vertical plate (212) is provided with a telescopic cylinder (213), one end of the telescopic cylinder (213) is provided with an arc-shaped block (2131), a baffle (22) is arranged between the two groups of electric push rods (21), and the lower end of the telescopic cylinder (213) is provided with a limiting plate (23).

3. The wafer cutting and detecting device for the optical splitter according to claim 2, wherein: limiting grooves (231) are formed in the upper surface of the limiting plate (23), two groups of limiting grooves (231) are formed in the limiting plate, a sliding plate (2311) is arranged inside the limiting grooves (231) in a sliding mode, and a circular groove (232) is formed between the two groups of limiting grooves (231).

4. The wafer cutting and detecting device for the optical splitter according to claim 3, wherein: the lower surface of the limiting plate (23) is provided with a stand column (233), one end of the stand column (233) is provided with a circular slide block (2331), and the limiting plate (23) is connected with the lower surface of the arc-shaped block (2131) through a slide block (2311).

5. The device for detecting wafer cutting of the optical splitter according to claim 4, wherein: the side of the workbench body (1) is provided with a placing groove (11), the upper surface of the placing groove (11) is provided with a sliding groove (12), the sliding groove (12) is provided with two groups, a card sliding groove (13) is provided between the two groups of sliding grooves (12), the card sliding groove (13) is provided with two groups, and a leakage groove (14) is provided between the two groups of card sliding grooves (13).

6. The wafer cutting and detecting device for the optical splitter according to claim 5, wherein: one end of the electric push rod (21) is connected with one end of the inner wall of the sliding groove (12), the sliding block (211) is arranged in the sliding groove (12) and is in sliding connection with the sliding groove (12), and the upright column (233) is in clamping sliding connection with the clamping sliding groove (13) through the circular sliding block (2331).

7. The device for detecting wafer cutting of an optical splitter according to claim 6, wherein: cutting determine module (3) including setting up thing board (31) of putting at workstation body (1) upper surface, put the upper surface of thing board (31) and seted up activity groove (311), the inside of activity groove (311) is slided and is provided with movable block A (3111) and movable block B (3112), the lower surface of movable block A (3111) is provided with electric telescopic handle A (312).

8. The device for detecting wafer cutting of an optical splitter according to claim 7, wherein: one end of the electric telescopic rod A (312) is provided with a connecting rod (313), one end of the connecting rod (313) is provided with a round cutting knife (3131), the lower surface of the movable block B (3112) is provided with an electric telescopic rod B (314), one end of the electric telescopic rod B (314) is provided with a supporting rod (315), and one end of the supporting rod (315) is provided with a microscope (3151).

9. The device for detecting wafer cutting of an optical splitter according to claim 8, wherein: the collecting assembly (4) comprises a collecting box (41) arranged in the placing groove (11), clamping grooves (411) are formed in two ends of the inner wall of the collecting box (41), a handle (412) is formed in the side face of the collecting box (41), and the collecting box (41) is connected with the placing groove (11) in a sliding mode.

10. The wafer cutting and detecting device for the optical splitter according to claim 9, wherein: the collecting box is characterized in that a placing concave plate (42) is arranged in the collecting box (41), clamping blocks (421) are arranged on two sides of the placing concave plate (42), the placing concave plate (42) is connected with the clamping grooves (411) in a sliding clamping mode through the clamping blocks (421), and a drawing rod (422) is arranged on the upper surface of each clamping block (421).