CN217606335U - Efficient heat dissipation mechanism for computer CPU - Google Patents
Efficient heat dissipation mechanism for computer CPU Download PDFInfo
- Publication number
- CN217606335U CN217606335U CN202221714839.8U CN202221714839U CN217606335U CN 217606335 U CN217606335 U CN 217606335U CN 202221714839 U CN202221714839 U CN 202221714839U CN 217606335 U CN217606335 U CN 217606335U
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- China
- Prior art keywords
- fixedly connected
- heat dissipation
- shell
- cpu
- dissipation mechanism
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 238000002791 soaking Methods 0.000 claims abstract description 12
- 241000883990 Flabellum Species 0.000 claims abstract description 7
- 238000009434 installation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a computer device field discloses a high-efficient heat dissipation mechanism for computer CPU, which comprises an outer shell, roof fixed connection is in the one end of spring under the shell, the other end fixedly connected with fan cover of spring, a plurality of evenly distributed's of shell lower extreme fixedly connected with fixed block, the inboard fixedly connected with fixture block of fixed block, fixture block periphery sliding connection has the base, the inside CPU trompil that is provided with of base, the base periphery is provided with a plurality of evenly distributed's entering groove, it is provided with the slide rail to get into the groove side, the slide rail opposite side is provided with the bayonet socket, the fan casing rotates to be connected inside the shell. The utility model discloses in, the base is installed in CPU's periphery alone, and the shell slides through the fixture block and installs the dismantlement in the slide rail, and the soaking plate conducts the CPU temperature for the heat conduction post fast, rethread heat conduction post increase area of contact, and the motor drives the flabellum and rotates and dispel the heat.
Description
Technical Field
The utility model relates to a computer device field especially relates to a high-efficient heat dissipation mechanism for computer CPU.
Background
The computer is one of the most commonly used working tools in the modern society, and has an indispensable status, when the computer works, a CPU in the computer generates a large amount of heat, if the heat is not removed in time, the running speed of the CPU is affected, and even the CPU is burnt, so that a lot of heat dissipation devices are provided, and most of the commonly used CPU heat dissipation devices are heat dissipation by fans.
At present, the commonly used fan heat dissipation equipment is of an integrated structure, and if the surface of a CPU is coated with heat dissipation silicone grease, the heat dissipation equipment of the fan needs to be completely disassembled, so that the operation is very inconvenient; in the fan heat dissipation device, the heat conducting fins are commonly used, the heat conducting effect of the heat conducting fins is not high, the temperature is difficult to conduct quickly, and the heat dissipation speed is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the high-efficient heat dissipation mechanism for computer CPU who proposes, which comprises an outer shell, roof fixed connection is in the one end of spring in the shell, the other end fixedly connected with fan cover of spring, fan cover downside middle part fixedly connected with motor, motor downside drive end fixedly connected with axis of rotation, a plurality of evenly distributed's of axis of rotation periphery fixedly connected with flabellum, a plurality of evenly distributed's of shell lower extreme fixedly connected with fixed block, the inboard fixedly connected with fixture block of fixed block, fixture block periphery sliding connection has the base.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
as a further description of the above technical solution:
the lower end of the fan cover is fixedly connected to the upper side of the fan cover.
As a further description of the above technical solution:
the fan casing periphery is provided with the electric wire interface, electric wire interface electric connection is on the motor, the fan casing periphery is provided with a plurality of evenly distributed's louvre.
As a further description of the above technical solution:
the base periphery is provided with a plurality of evenly distributed's entering groove, it is provided with the slide rail to get into the groove side, the slide rail opposite side is provided with the bayonet socket.
As a further description of the above technical solution:
the base is internally provided with a CPU opening.
As a further description of the above technical solution:
the base is internally provided with evenly distributed screw caps, and screw holes are formed in the lower sides of the screw caps.
As a further description of the above technical solution:
the fan cover is characterized in that a heat conduction column is fixedly connected to the lower side of the fan cover, and a soaking plate is fixedly connected to the bottom of the heat conduction column.
As a further description of the above technical solution:
the fan cover is rotatably connected inside the housing.
The utility model discloses following beneficial effect has:
1. the utility model discloses in, through base and shell separation, fix the base in the CPU periphery during installation, the shell makes the bottom fixture block get into the slide rail through pressing down, through rotating the shell, when the fixture block slided to the bayonet socket position, loosens the shell, and the shell passes through the spring card at the bayonet socket position, and reverse operation can be dismantled fast, can operate more conveniently when paining heat dissipation silicone grease to the CPU surface.
2. The utility model discloses in, CPU top direct contact soaking pit, the soaking pit can give the heat conduction post with the quick conduction of heat, and the increase of rethread heat conduction post and air contact's surface area makes the fan rotate clamp splice air velocity for the radiating rate.
Drawings
Fig. 1 is a front perspective view of an efficient heat dissipation mechanism for a computer CPU according to the present invention;
fig. 2 is a schematic structural diagram of a rotating shaft of an efficient heat dissipation mechanism for a computer CPU according to the present invention;
fig. 3 is a schematic structural diagram of a base of an efficient heat dissipation mechanism for a computer CPU according to the present invention;
fig. 4 is a schematic structural diagram of an electrical wire interface of a high-efficiency heat dissipation mechanism for a CPU of a computer according to the present invention.
Illustration of the drawings:
1. a housing; 2. a fan cover; 3. heat dissipation holes; 4. a heat-conducting column; 5. a slide rail; 6. a base; 7. a bayonet; 8. a fixed block; 9. a vapor chamber; 10. an electrical wire interface; 11. a fan housing; 12. a spring; 13. a fan blade; 14. a rotating shaft; 15. covering the opening with a screw; 16. a screw hole; 17. opening a hole in the CPU; 18. entering a groove; 19. A clamping block; 20. an electric motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides a high-efficient heat dissipation mechanism for computer CPU, which comprises an outer shell 1, roof fixed connection is in the one end of spring 12 under the shell 1, the other end fixedly connected with fan cover 2 of spring 12, fan cover 2 downside middle part fixedly connected with motor 20, motor 20 downside drive end fixedly connected with axis of rotation 14, 14 a plurality of evenly distributed's of axis of rotation periphery fixedly connected with flabellum 13, a plurality of evenly distributed's of 1 lower extreme fixedly connected with fixed block 8 of shell, 8 fixed block peripheries fixedly connected with fixture block 19 of fixed block, 19 sliding connection of fixture block has base 6. To sum up, fix base 6 in the CPU periphery through screw hole 16, it is to it with entering groove 18 with fixture block 19 of shell 1 downside, press shell 1, insert fixture block 19 in slide rail 5, rotate shell 1, make fixture block 19 remove bayonet 7 position, loosen shell 1, shell 1 can bounce under the effect of spring 12, fixture block 19 is fixed in bayonet 7 position, it only needs the reverse operation to dismantle the messenger, convenient mounting means, separate base 6 and shell 1, make more convenience when paining heat dissipation silicone grease to CPU's surface, CPU's top direct contact soaking plate 9, conduct the heat through soaking plate 9 is quick, rethread heat conduction post 4 increases the area of contact with the air, make the air that flabellum 13 rotated the drive can be more right contact with heat conduction post 4, accelerate the radiating rate.
The lower end of the fan cover 2 is fixedly connected to the upper side of the fan cover 11, the periphery of the fan cover 11 is provided with the electric wire interface 10, the electric wire interface 10 is arranged inside the fan cover 11 and does not cause influence in the installation and disassembly processes of the shell 1, the electric wire interface 10 is electrically connected to the motor 20, the driving end of the motor 20 is fixedly connected with the rotating shaft 14, the motor 20 is powered through the electric wire interface 10, the electric wire interface 10 is the prior art, redundant description is not repeated in the embodiment, the periphery of the fan cover 11 is provided with a plurality of radiating holes 3 which are uniformly distributed and radiate the temperature of the fan, the periphery of the base 6 is provided with a plurality of uniformly distributed inlet grooves 18, the fixture block 19 enters the sliding rail 5 through the inlet grooves 18, the side edges of the inlet grooves 18 are provided with the sliding rail 5, the fixture block 19 slides in the sliding rail 5 and can perform installation and disassembly operations on the shell 1, 5 opposite sides of slide rail are provided with bayonet socket 7, be used for fixed fixture block 19, 6 inside CPU trompil 17 that are provided with of base, be used for setting up 6 peripheries at CPU with base, 6 inside peripheries of base are provided with screw lid mouth 15, 15 downside of screw lid mouth is provided with screw hole 16, 6 bases pass through screw hole 16 to be fixed in the CPU periphery, screw lid mouth 15 prevents that the screw cap from disturbing to soaking plate 9, 11 downside fixedly connected with heat conduction post 4 of fan casing, heat conduction post 4 is used for increasing the area of contact of heat and air, it is faster to make the radiating rate, 4 bottom fixedly connected with soaking plate 9 of heat conduction post, soaking plate 9 can come out the quick conduction of heat, cooperate with heat conduction post 4 and flabellum 13, quick heat dissipation, fan casing 11 rotates to be connected inside shell 1, do not exert an influence to the inner structure when shell 1 carries out installation dismantlement operation.
The working principle is as follows: fix the periphery at CPU with the screw for the base earlier, the screw lid mouth that sets up on the screw hole, can make the screw get into the base completely, thereby eliminate the influence of screw cap to soaking plate work, aim at the entering groove with the fixture block, then press down the shell, slide the fixture block from entering groove, the rethread rotates the shell, it slides in the slide rail to be the fixture block, slide to the bottom and loosen the shell, the spring is bounced the shell, the fixture block gets into in the bayonet socket, bottom surface direct contact CPU under the soaking plate, make the quick conduction of CPU temperature come, the area of contact of rethread heat conduction post increase heat and air, the flabellum rotates under the drive of axis of rotation, blow wind and follow the middle space process of heat conduction post, thereby carry out quick heat dissipation to CPU.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (8)
1. An efficient heat dissipation mechanism for a computer CPU, comprising a housing (1), characterized in that: roof fixed connection is in the one end of spring (12) in shell (1), the other end fixedly connected with fan lid (2) of spring (12), fan lid (2) downside middle part fixedly connected with motor (20), motor (20) downside drive end fixedly connected with axis of rotation (14), axis of rotation (14) periphery fixedly connected with a plurality of evenly distributed's flabellum (13), a plurality of evenly distributed's of shell (1) lower extreme fixedly connected with fixed block (8), inboard fixedly connected with fixture block (19) of fixed block (8), fixture block (19) periphery sliding connection has base (6).
2. The efficient heat dissipation mechanism for a computer CPU of claim 1, wherein: the lower end of the fan cover (2) is fixedly connected to the upper side of the fan cover (11).
3. The efficient heat dissipation mechanism for a computer CPU of claim 2, wherein: fan casing (11) periphery is provided with electric wire interface (10), electric wire interface (10) electric connection is on motor (20), fan casing (11) periphery is provided with a plurality of evenly distributed's louvre (3).
4. The efficient heat dissipation mechanism for a computer CPU of claim 1, wherein: the base (6) periphery is provided with a plurality of evenly distributed's entering groove (18), entering groove (18) side is provided with slide rail (5), slide rail (5) opposite side is provided with bayonet socket (7).
5. The efficient heat dissipation mechanism for a computer CPU of claim 1, wherein: a CPU hole (17) is formed in the base (6).
6. The efficient heat dissipation mechanism for a computer CPU of claim 1, wherein: base (6) inside is provided with evenly distributed's screw lid mouth (15), screw lid mouth (15) downside is provided with screw hole (16).
7. The efficient heat dissipation mechanism for a computer CPU of claim 2, wherein: the fan cover (11) downside fixedly connected with heat conduction post (4), heat conduction post (4) bottom fixedly connected with soaking board (9).
8. The efficient heat dissipation mechanism for a computer CPU of claim 2, wherein: the fan cover (11) is rotatably connected inside the shell (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221714839.8U CN217606335U (en) | 2022-07-05 | 2022-07-05 | Efficient heat dissipation mechanism for computer CPU |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221714839.8U CN217606335U (en) | 2022-07-05 | 2022-07-05 | Efficient heat dissipation mechanism for computer CPU |
Publications (1)
Publication Number | Publication Date |
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CN217606335U true CN217606335U (en) | 2022-10-18 |
Family
ID=83591158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202221714839.8U Expired - Fee Related CN217606335U (en) | 2022-07-05 | 2022-07-05 | Efficient heat dissipation mechanism for computer CPU |
Country Status (1)
Country | Link |
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CN (1) | CN217606335U (en) |
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2022
- 2022-07-05 CN CN202221714839.8U patent/CN217606335U/en not_active Expired - Fee Related
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Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20221018 |
|
CF01 | Termination of patent right due to non-payment of annual fee |