CN217544162U

CN217544162U - Shock attenuation heat dissipation type solid state hard drives

Info

Publication number: CN217544162U
Application number: CN202221614742.XU
Authority: CN
Inventors: 陈鹏
Original assignee: Shenzhen Qichuangxin Electronic Technology Co ltd
Current assignee: Shenzhen Qichuangxin Electronic Technology Co ltd
Priority date: 2022-06-23
Filing date: 2022-06-23
Publication date: 2022-10-04
Anticipated expiration: 2032-06-23

Abstract

The application provides a shock attenuation heat dissipation type solid state hard drives, including base, mainboard, stock solution component, spacing component and circulation cooling subassembly. The main board is suitable for being arranged above the base, and a plug is arranged on the front end face of the main board; the liquid storage element is arranged between the base and the main board and is made of flexible and heat-conducting materials. The liquid storage element is provided with a liquid storage cavity which is connected with a liquid inlet pipe and a liquid outlet pipe. The limiting element is arranged on the base; the inlet and the outlet of the circulating cooling assembly are respectively connected with the liquid inlet pipe and the liquid outlet pipe. When the hard disk is actually used, the main board is clamped by the limiting element and the liquid storage element, and the hard disk is assembled; the liquid storage element filled with liquid is abutted against the main board, so that the main board is damped; through the cooperation of stock solution component and circulation cooling subassembly, realize the cooling of mainboard. Compared with the prior art, the shock attenuation heat dissipation type solid state hard drives that this application provided can avoid mainboard surface temperature to rise when realizing shock-absorbing function, has improved the reliability of hard disk in the use.

Description

Shock attenuation heat dissipation type solid state hard drives

Technical Field

The application belongs to the technical field of solid state disk, concretely relates to shock attenuation heat dissipation type solid state disk.

Background

A Solid State Disk (SSD), which is a computer storage device mainly using a FLASH memory as a permanent memory, is composed of a control unit and a storage unit (FLASH chip, DRAM chip, etc.), and is widely used in many fields such as industrial control, video monitoring, network terminal, navigation device, etc.; compared with a mechanical hard disk, the solid state disk has higher reading and writing speed.

The inventor finds that, in order to avoid structural damage caused by vibration, the existing solid state disk is provided with a damping structure when in use. The existing damping structure is usually a mechanical damping structure directly acting on the surface of the hard disk, and when the damping effect is effective, the surface of the hard disk can generate heat and is difficult to dissipate, so that the temperature of the hard disk is increased, and the normal operation of the hard disk is influenced.

Disclosure of Invention

The embodiment of the application provides a shock attenuation heat dissipation type solid state hard drives, aims at providing one kind and can not influence the radiating shock-absorbing structure of hard disk to solve because of the cushioning effect causes the hard disk heat dissipation to receive influence or the hard disk surface produces thermal technical problem.

In order to achieve the purpose, the technical scheme adopted by the application is as follows:

the utility model provides a shock attenuation heat dissipation type solid state hard drives includes:

the base is fixedly arranged on the surface of the host;

the main board is used for assembling a storage medium and is suitable for being arranged above the base, and the front end face of the main board is provided with a plug for being electrically connected with the host;

the liquid storage element is arranged on the base, is positioned between the base and the mainboard, is made of a flexible and heat-conducting material, is provided with a liquid storage cavity for containing liquid, and is connected with a liquid inlet pipe and a liquid outlet pipe; when the liquid storage cavity is filled with liquid, the liquid storage element expands and abuts against the lower surface of the main board;

the limiting element is arranged on the base and is used for being abutted against the upper surface of the main board so as to be matched with the expanded liquid storage element to clamp the main board; and

the circulation cooling assembly is communicated with the liquid inlet pipe and the liquid outlet pipe and used for sucking liquid in the liquid storage cavity, reducing the temperature of the liquid and discharging the cooled liquid into the liquid storage cavity to form circulation.

In a possible implementation manner, the upper surface of the base is provided with a containing cavity suitable for embedding the liquid storage element, and the front end surface of the base is provided with a first through hole communicated with the containing cavity; the liquid storage element is connected with a connecting rod which is suitable for penetrating through and extending out of the first through hole, and the extending end of the connecting rod is provided with an elastic plate which is suitable for abutting against the front end face of the base.

In a possible implementation manner, the liquid inlet pipe and the liquid outlet pipe are respectively connected to the front end and the rear end of the liquid storage element; the side surface of the base is also provided with two second through holes which are communicated with the containing cavity and are suitable for the liquid inlet pipe and the liquid outlet pipe to pass through.

In one possible implementation, the limiting element includes:

the fixing arm is fixedly connected to the upper surface of the base; and

and the limiting plate is detachably connected to the upper end of the fixing arm and is used for being abutted to the upper surface of the main board.

In a possible implementation manner, the upper end face of the fixed arm is provided with a thread groove, and the limiting plate is provided with a positioning hole which penetrates through the limiting plate in the vertical direction and is suitable for being communicated with the thread groove; and a connecting bolt is arranged between the fixed arm and the limiting plate, and the connecting bolt is suitable for penetrating through the positioning hole and is in threaded connection with the threaded groove so as to clamp the limiting plate to the fixed arm.

In a possible implementation manner, the limiting plate is provided with a plurality of radiating holes distributed along the left-right direction; each heat dissipation hole penetrates through the limiting plate in the vertical direction and extends in the front-back direction.

In one possible implementation, the main plate has an engagement hole penetrating in the up-down direction and adapted to allow the fixing arm to be inserted, and the engagement hole penetrates through the rear end surface of the main plate from front to rear.

In a possible implementation manner, the lower surface of the limiting plate has a protrusion, and the upper surface of the main plate has a groove into which the protrusion is adapted to be inserted.

In one possible implementation, the circulation cooling assembly includes:

the water tank is fixedly arranged on the limiting element and is provided with a cooling cavity for containing liquid;

the two micro water pumps are arranged on the water tank and are communicated with the cooling cavity;

the first ends of the two water delivery pipes are respectively connected with the two micro water pumps, and the second ends of the two water delivery pipes are respectively communicated with the liquid inlet pipe and the liquid outlet pipe; and

the rotating roller is rotatably connected to the upper surface of the water tank along the vertical direction and is connected with a rotating motor; the rotating roller is connected with fan blades extending outwards along the radial direction;

when the micro water pump is started, liquid in the liquid storage cavity enters the cooling cavity through the liquid outlet pipe, and simultaneously the liquid in the cooling cavity enters the liquid storage cavity through the liquid inlet pipe.

In a possible implementation manner, the upper surface of the water tank is connected with a support frame, and the rotating roller and the rotating motor are both connected to the support frame.

In the embodiment of the application, the base is preassembled on the surface of the host, and the mainboard is clamped between the liquid storage element and the limiting element, so that the plug is inserted into the hard disk slot of the host, and the assembling process of the hard disk and the host can be completed.

When the mainboard vibrates, the liquid storage element has a damping effect on the mainboard; and, in the operation of mainboard in-process, the circulation cooling subassembly is opened to the accessible, makes the liquid in the stock solution component circulate and flow and take away the heat between stock solution component and circulation cooling subassembly, realizes the cooling effect to the mainboard.

Compared with the prior art, the shock attenuation heat dissipation type solid state hard drives that this embodiment provided can avoid mainboard surface temperature to rise when realizing shock-absorbing function, has improved the reliability of hard disk in the use.

Drawings

Fig. 1 is a schematic perspective view of a shock-absorbing heat-dissipating solid-state hard disk according to an embodiment of the present application;

FIG. 2 is an enlarged partial view of the circle A of FIG. 1;

FIG. 3 is a schematic perspective view of a circulating cooling assembly used in an embodiment of the present application (for convenience of illustration, a water tank is processed in a sectional view and a water supply pipe is hidden);

FIG. 4 is an exploded view of a stop element used in an embodiment of the present application;

FIG. 5 is a schematic view of a connection between a reservoir element and a circulating cooling assembly (for ease of illustration, the reservoir element is shown in cross-section) used in an embodiment of the present application;

description of reference numerals:

1. a base; 11. an accommodating chamber; 12. a first through hole; 13. a second through hole; 2. a main board; 21. a plug; 22. embedding holes; 23. a groove; 3. a liquid storage element; 31. a liquid storage cavity; 32. a liquid inlet pipe; 33. a liquid outlet pipe; 34. a connecting rod; 341. an elastic plate; 4. a spacing element; 41. a fixed arm; 411. a thread groove; 42. a limiting plate; 421. positioning holes; 422. a connecting bolt; 423. heat dissipation holes; 424. a boss portion; 5. a circulating cooling component; 51. a water tank; 511. a cooling cavity; 512. a support frame; 52. a micro water pump; 53. a water supply pipe; 54. a rotating roller; 541. rotating the motor; 542. a fan blade.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Referring to fig. 1 to 5 together, a shock-absorbing heat-dissipating solid-state hard disk provided in the present application will now be described. Shock attenuation heat dissipation type solid state hard drives includes base 1, mainboard 2, stock solution component 3, spacing component 4 and circulation cooling subassembly 5.

The base 1 adopts the cross section to be the rectangle for fixed mounting is on the surface of host computer, and specific mounted position is predetermined solid state hard drives installation position. In this embodiment, after the base 1 is fixedly connected to the host computer, the longitudinal direction of the base 1 is the front-back direction of the host computer.

Mainboard 2 is used for assembling storage medium, and the effect that mainboard 2 that is equipped with storage medium played is with current solid state hard drives equivalent effect. The main board 2 is suitable for being arranged above the base 1, and the front end face is provided with a plug 21 protruding forwards, and the electrical connection relation between the main board 2 and the host can be realized through the plug 21.

The liquid storage element 3 is arranged on the base 1, part of the structure of the liquid storage element is located between the upper surface of the base 1 and the lower surface of the mainboard 2, the liquid storage element is made of flexible and heat-conducting materials and is provided with a liquid storage cavity 31 used for containing liquid, and when the liquid storage cavity 31 is filled with the liquid, the liquid storage element 3 expands and abuts against the lower surface of the mainboard 2; the purpose of this design is:

first, the liquid storage element 3 has a flexible material property, and can abut against and support the lower surface of the main board 2 when the liquid storage cavity 31 is filled inside; when the mainboard 2 vibrates, the liquid storage element 3 elastically deforms to buffer the vibration, so that the damping effect is achieved;

secondly, the liquid storage element 3 has the characteristic of heat conduction material, when heat is generated on the main board 2 which is abutted against the liquid storage element 3, the heat can enter the liquid storage cavity 31 along the surface of the liquid storage element 3, so that the heat is absorbed by the liquid contained in the liquid storage cavity;

it should be noted that, in order to enhance the heat dissipation function of the liquid storage element 3, the liquid stored in the liquid storage cavity 31 may be selected from distilled water and other liquids with excellent heat conduction effect.

Liquid inlet pipe 32 and drain pipe 33 are connected to liquid storage element 3, and liquid can get into liquid storage cavity 31 through liquid inlet pipe 32, then exports to the external world by liquid storage cavity 31 through drain pipe 33.

Spacing component 4 sets up on base 1 for with the upper surface butt of mainboard 2, press from both sides spacing mainboard 2 with the expanding stock solution component 3 of cooperation.

Circulation cooling assembly 5 communicates with feed liquor pipe 32 and drain pipe 33 for suck out the liquid in liquid storage chamber 31, reduce the liquid temperature and discharge the liquid after the cooling in liquid storage chamber 31, in order to form the circulation.

In the embodiment of the application, the base 1 is preassembled on the surface of the host, and the mainboard 2 is clamped between the liquid storage element 3 and the limiting element 4, so that the plug 21 is inserted into the hard disk slot of the host, and the assembling process of the hard disk and the host can be completed.

When the mainboard 2 vibrates, the liquid storage element 3 has a damping effect on the mainboard 2; and, in the operation of mainboard 2, circulation cooling subassembly 5 is opened to the accessible, makes the liquid in the stock solution component 3 circulate between stock solution component 3 and circulation cooling subassembly 5 and flow and take away the heat, realizes the cooling effect to mainboard 2.

Compared with the prior art, the shock attenuation heat dissipation type solid state hard drives that this embodiment provided can avoid 2 surface temperature risees of mainboard when realizing shock-absorbing function, has improved the reliability of hard disk in the use.

In some embodiments, the structure shown in fig. 1, 4 and 5 can be used between the base 1 and the reservoir member 3. Referring to fig. 1, 4 and 5, the upper surface of the base 1 has a receiving cavity 11 adapted to receive the liquid storage element 3, and the front surface of the base 1 has a first through hole 12 communicating with the receiving cavity 11.

The liquid storage element 3 is connected with a connecting rod 34 which is suitable for passing through and extending out of the first through hole 12, and the extending end of the connecting rod 34 is provided with an elastic plate 341 which is suitable for abutting against the front end surface of the base 1.

In actual installation, the liquid storage element 3 is moved to insert the connecting rod 34 into the first through hole 12; the elastic plate 341 is elastically deformed during the process in which the connection rod 34 passes through the first through hole 12; after the end of the connecting rod 34 extends out of the first through hole 12, the elastic plate 341 recovers deformation to abut against the front end surface of the base 1, which has the effect of limiting the liquid storage element 3 from moving backward relative to the base 1.

By adopting the technical scheme, the accommodating cavity 11 can enable the liquid storage element 3 to be partially embedded, and the range of horizontal movement of the liquid storage element 3 relative to the base 1 is limited; stock solution component 3 passes through the integrated configuration butt base 1's of connecting rod 34 and elastic plate 341 preceding terminal surface to avoid stock solution component 3 to take place the back-and-forth movement for base 1, improved the reliability of this hard disk in the in-service use process.

It should be added that, in this embodiment, the combination structure of the first through hole 12 and the connecting rod 34 has two sets, and the two sets of structures are arranged at the front end of the hard disk structure at intervals along the left-right direction, so as to improve the stability of the effect of the structure.

In some embodiments, the above features of inlet tube 32 and outlet tube 33 may be used as shown in fig. 1, 4 and 5. Referring to fig. 1, 4 and 5, the liquid inlet pipe 32 and the liquid outlet pipe 33 are respectively connected to the front end and the rear end of the liquid storage element 3 and are respectively positioned at the left side and the right side of the liquid storage element 3, so that the distance between the liquid inlet pipe and the liquid outlet pipe and the connecting position of the liquid storage element 3 is maximized.

The side of the base 1 also has two second through holes 13 communicating with the housing chamber 11 and suitable for the passage of an inlet duct 32 and an outlet duct 33.

By adopting the technical scheme, the flow range of the liquid entering the liquid storage cavity 31 is maximized, so that the cooled liquid can carry more heat to be output, and the stability of the heat dissipation efficiency of the liquid is ensured; the abutting relation between the second through hole 13 and the pipe body can prevent the pipe body from separating from the second through hole 13, so that the position change of the liquid inlet pipe 32 and the liquid outlet pipe 33 relative to the base 1 is limited; the combination of the two improves the stability of the hard disk product in practical use.

In some embodiments, the above-described feature limiting element 4 may be configured as shown in fig. 4. Referring to fig. 4, the limiting member 4 includes a fixing arm 41 and a limiting plate 42.

The fixing arm 41 is fixedly connected to the upper surface of the base 1 and extends from bottom to top.

The limiting plate 42 is detachably connected to the upper end of the fixing arm 41, is located above the main board 2, and is used for abutting against the upper surface of the main board 2 which is abutted and lifted by the liquid storage element 3.

Through adopting above-mentioned technical scheme, the integrated configuration of fixed arm 41 and limiting plate 42 can restrict the ascending removal of mainboard 2 to the cooperation stock solution component 3 presss from both sides tight mainboard 2, has improved the structural reliability of this product.

In some embodiments, the above-mentioned feature between the fixing arm 41 and the limiting plate 42 can adopt a structure as shown in fig. 4. Referring to fig. 4, the upper end surface of the fixing arm 41 has a threaded groove 411, and the limiting plate 42 has a positioning hole 421 penetrating in the vertical direction and adapted to communicate with the threaded groove 411.

A connecting bolt 422 is arranged between the fixed arm 41 and the limiting plate 42, and the connecting bolt 422 is suitable for penetrating through the positioning hole 421 and is in threaded connection with the threaded groove 411 so as to clamp the limiting plate 42 to the fixed arm 41.

Through adopting above-mentioned technical scheme, realized being connected dismantled of fixed arm 41 and limiting plate 42, ensured the structural stability of this product.

It should be added that, in the present embodiment, the combination structure of the thread groove 411, the positioning hole 421 and the connecting bolt 422 has four sets, and is distributed on the product structure in a rectangular shape.

In some embodiments, the limiting plate 42 may be configured as shown in fig. 1. Referring to fig. 1, the limiting plate 42 has a plurality of heat dissipation holes 423 distributed in the left-right direction; each heat radiation hole 423 penetrates the position restriction plate 42 in the up-down direction and extends in the front-rear direction.

Through adopting above-mentioned technical scheme, when the heat that mainboard 2 gived off upwards propagated to limiting plate 42 on, can export to the outside through louvre 423, avoid limiting plate 42 overheated to lead to warping, improved the stability when this product uses.

In some embodiments, the above feature board 2 may adopt a structure as shown in fig. 4. Referring to fig. 4, the main plate 2 has an engagement hole 22 penetrating in the up-down direction and adapted to receive the fixing arm 41, and the engagement hole 22 penetrates the rear end surface of the main plate 2 from front to rear.

By adopting the technical scheme, the scarf joint hole 22 is matched with the main board 2, so that the movement of the main board 2 from front to back is further limited, and the structural stability of the product is improved; the hole-like structure passing through from front to back is selected because such a structure can fit the fixing arms 41 of different sizes, facilitating the installation.

In some embodiments, the above-mentioned feature limiting plate 42 and the main plate 2 may adopt a structure as shown in fig. 4. Referring to fig. 4, the lower surface of the restriction plate 42 has a protrusion 424, and the upper surface of the main plate 2 has a groove 23 adapted to fit the protrusion 424.

Through adopting above-mentioned technical scheme, the integrated configuration of bellying 424 and recess 23 can restrict the removal of limiting plate 42 for mainboard 2, has improved the structural stability of this product.

In some embodiments, the above-described features of the cyclical temperature reduction assembly 5 may be configured as shown in FIGS. 2 and 3. Referring to fig. 2 and 3, the circulation cooling module 5 includes a water tank 51, two micro water pumps 52, two water supply pipes 53, and a rotating roller 54.

The water tank 51 is fixedly arranged on the limiting element 4 and is provided with a cooling cavity 511 for containing liquid.

The two micro water pumps 52 are both arranged on the water tank 51 and are communicated with the cooling cavity 511; specifically, an output port of one of the micro water pumps 52 is communicated with the cooling chamber 511, and an input port of the other micro water pump 52 is communicated with the cooling chamber 511.

Two water supply pipes 53 are arranged between the micro water pump 52 and the liquid storage element 3, and each water supply pipe 53 has a first end and a second end, specifically:

the first end of one of the water supply pipes 53 is communicated with the input port of the micro water pump 52, and the output port of the micro water pump 52 is communicated with the cooling cavity 511; the second end of the water delivery pipe 53 is communicated with the liquid outlet pipe 33, so that the liquid output by the liquid outlet pipe 33 enters the cooling cavity 511 under the action of the micro water pump 52;

the first end of the other water supply pipe 53 is communicated with the output port of the micro water pump 52, and the input port of the micro water pump 52 is communicated with the cooling cavity 511; the second end of the water pipe 53 is connected to the liquid inlet pipe 32, so that the liquid in the cooling chamber 511 is sucked out by the suction force of the micro water pump 52 and re-enters the liquid storage chamber 31 through the water pipe 53 and the liquid inlet pipe 52.

The rotating roller 54 is connected to the upper surface of the water tank 51 in a vertical direction, and is connected to a rotating motor 541.

The rotatable roller 54 is connected with fan blades 542 extending radially outward, and in the present embodiment, the fan blades 542 have four and are spaced apart along the radial direction of the rotatable roller 54.

When the two micro water pumps 52 are started, the liquid in the liquid storage cavity 31 enters the cooling cavity 511 through the liquid outlet pipe 33, and meanwhile, the liquid in the cooling cavity 511 enters the liquid storage cavity 31 through the liquid inlet pipe 32.

Through adopting above-mentioned technical scheme, realized the circulation of liquid, and effectively cool down it among the circulation process, improved this structure and played the stability of radiating effect to mainboard 2.

It should be noted that, in the present embodiment, as shown in fig. 3, the upper surface of the water tank 51 is made of a heat conducting material to ensure that the heat contained in the internal liquid can be conducted upwards, so as to ensure the stability of the cooling effect of the fan blades 542.

In some embodiments, the water tank 51 may be configured as shown in FIG. 2. Referring to fig. 2, a supporting frame 512 is connected to an upper surface of the water tank 51, and the rotating roller 54 and the rotating motor 541 are both connected to the supporting frame 512.

By adopting the technical scheme, the rotating roller 54 and the rotating motor 541 can be stably connected by utilizing the lifting effect of the support frame 512, and the rotating roller 54 is arranged higher than the upper surface of the water tank 51, so that the fan blades 542 are ensured to be stably translated to play a role of cooling.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. Shock attenuation heat dissipation type solid state hard drives, its characterized in that includes:

the base is fixedly arranged on the surface of the host;

the limiting element is arranged on the base and used for being abutted against the upper surface of the mainboard so as to be matched with the expanded liquid storage element to clamp the mainboard; and

and the circulating cooling assembly is communicated with the liquid inlet pipe and the liquid outlet pipe and is used for sucking out liquid in the liquid storage cavity, reducing the temperature of the liquid and discharging the cooled liquid into the liquid storage cavity to form circulation.

2. The shock-absorbing and heat-dissipating type solid state disk according to claim 1, wherein the upper surface of the base has an accommodating cavity into which the liquid storage element is inserted, and the front end surface of the base has a first through hole communicating with the accommodating cavity; the liquid storage element is connected with a connecting rod which is suitable for penetrating through and extending out of the first through hole, and the extending end of the connecting rod is provided with an elastic plate which is suitable for abutting against the front end face of the base.

3. The shock-absorbing heat-dissipating solid state disk of claim 2, wherein the liquid inlet pipe and the liquid outlet pipe are connected to the front end and the rear end of the liquid storage element respectively; the side surface of the base is also provided with two second through holes which are communicated with the accommodating cavity and are suitable for the liquid inlet pipe and the liquid outlet pipe to pass through.

4. The shock absorbing and heat dissipating solid state disk of claim 1, wherein the position limiting element comprises:

the fixing arm is fixedly connected to the upper surface of the base; and

5. The shock-absorbing and heat-dissipating type solid state disk of claim 4, wherein the upper end surface of the fixing arm is provided with a thread groove, and the limiting plate is provided with a positioning hole which penetrates in the up-down direction and is suitable for being communicated with the thread groove; and a connecting bolt is arranged between the fixed arm and the limiting plate and is suitable for penetrating through the positioning hole and in threaded connection with the threaded groove so as to clamp the limiting plate to the fixed arm.

6. The shock-absorbing and heat-dissipating type solid state disk according to claim 4, wherein the limiting plate has a plurality of heat dissipating holes distributed in a left-right direction; each heat dissipation hole penetrates through the limiting plate in the vertical direction and extends in the front-back direction.

7. The shock-absorbing and heat-dissipating solid state disk according to claim 4, wherein the motherboard has an engagement hole penetrating in the up-down direction and adapted to allow the fixing arm to engage therein, and the engagement hole penetrates through the rear end face of the motherboard from front to rear.

8. The shock-absorbing and heat-dissipating type solid state disk according to claim 4, wherein the lower surface of the limiting plate has a protrusion, and the upper surface of the motherboard has a groove into which the protrusion is adapted to be inserted.

9. The shock-absorbing heat-dissipating solid state disk of claim 1, wherein the cycle cool down assembly comprises:

the first ends of the two water supply pipes are respectively connected with the two micro water pumps, and the second ends of the two water supply pipes are respectively communicated with the liquid inlet pipe and the liquid outlet pipe; and

10. The shock-absorbing heat-dissipating solid state disk of claim 9, wherein a support frame is connected to an upper surface of the water tank, and the rotating roller and the rotating motor are both connected to the support frame.