CN217523127U

CN217523127U - Laser power supply and laser

Info

Publication number: CN217523127U
Application number: CN202221143396.1U
Authority: CN
Inventors: 阮勇; 史博凯; 李泰�
Original assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Current assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-09-30
Anticipated expiration: 2032-05-13

Abstract

The utility model relates to a laser power supply and a laser, wherein the laser power supply comprises an outer shell, a cooling pipe, a circuit board and an electronic device to be cooled, and the outer shell is provided with an accommodating cavity; the cooling pipe is arranged in the accommodating cavity, cooling liquid can flow through the cooling pipe, the outer surface of the cooling pipe is provided with a cooling surface, and the cooling surface is a plane; the circuit board with need to cool off the electron device all set up in hold the intracavity, need to cool off the electron device with the circuit board electricity is connected, need to cool off the electron device with the cooling surface laminating, the cooling surface with the surface of circuit board is the contained angle setting. The laser power supply is low cost and light weight.

Description

Laser power supply and laser

Technical Field

The utility model relates to a laser equipment technical field especially relates to a laser instrument power and laser instrument.

Background

When the laser power supply works, part of electric energy is converted into heat energy. For example, a high power laser power supply has a power of about 14000W, which produces 840W of thermal power even at a laser power supply efficiency of 94%. Various devices of the conventional high-power laser power supply are arranged on a water cooling plate, and a hollow pipeline is arranged in the water cooling plate, so that the cost of a heat dissipation plate of the power supply is high, and the weight is large.

Therefore, a laser power supply is needed to solve the above technical problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a laser instrument power to reduce laser instrument power cost and weight.

In order to achieve the above object, the present invention provides in a first aspect a laser power supply, including:

an outer housing having an accommodation chamber;

the cooling pipe is arranged in the accommodating cavity, cooling liquid can flow through the cooling pipe, and the outer surface of the cooling pipe is provided with a cooling surface which is a plane;

the circuit board with need to cool off electron device, all set up in hold the intracavity, need to cool off electron device with the circuit board electricity is connected, need to cool off electron device with the cooling surface laminating, the cooling surface with the surface of circuit board is the contained angle setting.

Optionally, the cooling pipes include a first cooling pipe and a second cooling pipe, and the first cooling pipe and the second cooling pipe are arranged at an interval and communicated through a pipeline, so that the cooling liquid circulates in the first cooling pipe and the second cooling pipe.

Optionally, the first cooling pipe and the second cooling pipe each have two oppositely disposed cooling surfaces.

Optionally, the first cooling tube and the second cooling tube are arranged in parallel along a first direction, the two oppositely arranged cooling surfaces are arranged along the first direction, and the first direction is parallel to the surface of the circuit board.

Optionally, the first cooling pipe and the second cooling pipe are both square pipes.

Optionally, the first cooling pipe and the second cooling pipe are both aluminum pipes.

Optionally, both ends of the first cooling pipe extend out of the outer shell; and two ends of the second cooling pipe extend out of the outer shell.

Optionally, the electronic device to be cooled includes a transformer, the laser power supply further includes an installation frame, the installation frame is connected to the cooling surface, the installation frame has an opening, and the transformer is disposed in the installation frame and passes through the opening to be attached to the cooling surface.

Optionally, the installing frame includes the connecting plate and connects gradually first lateral wall, second lateral wall and the third lateral wall that is U type structure, first lateral wall with the one end that the second lateral wall was kept away from to the third lateral wall all is connected with the connecting plate, two form between the connecting plate the opening, the installing frame pass through the connecting plate with the cooling tube is connected.

Another object of the present invention is to provide a laser device to reduce the cost of the laser device.

To achieve the purpose, the second aspect of the present invention adopts the following technical solutions:

a laser comprises the laser power supply.

It is from top to bottom visible, the utility model provides a technical scheme, the coolant liquid can circulate to the cooling tube, consequently, the coolant liquid can take away the heat on cooling tube surface, reduces cooling tube surface temperature fast. The outer surface of the cooling pipe is provided with a cooling surface, and the cooling surface is a plane, so that the contact area between the electronic device to be cooled and the cooling pipe can be ensured, the heat transfer efficiency between the electronic device to be cooled and the cooling pipe is improved, and the heat of the electronic device to be cooled is quickly transferred to the cooling surface of the cooling pipe.

In the prior art, the electronic device to be cooled is arranged at an included angle with the surface of the circuit board, and the electronic device to be cooled is parallel to and attached to the cooling surface because the cooling surface is also arranged at an included angle with the surface of the circuit board, so that the cooling efficiency of the electronic device to be cooled is improved; on the other hand, the arrangement direction of the cooling surface and the electronic devices to be cooled is approximately parallel to the surface of the circuit board, so that the size of the laser power supply in the thickness direction (the thickness direction of the laser power supply, namely the thickness direction of the circuit board) is not increased, and the compactness of the laser power supply is improved.

Through the main device and the cooling tube laminating that generate heat with the laser power, rather than all the devices that generate heat of laser power all with the cooling tube laminating to under the good prerequisite of guaranteeing the laser power radiating, reduced the volume of cooling tube, reduced the cost and the weight of laser power.

Drawings

Fig. 1 is a schematic structural diagram of a laser power supply provided by an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a laser power supply provided by the embodiment of the present invention after an upper cover is removed.

In the figure:

1. an outer housing; 11. a bottom case; 12. an upper cover; 13. an accommodating chamber;

2. a cooling tube; 21. cooling the dough; 22. a first cooling pipe; 23. a second cooling pipe;

3. installing a frame; 31. a first side wall; 32. a second side wall; 33. a third side wall; 34. a connecting plate.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements related to the present invention are shown in the drawings.

The present invention is limited to certain orientation words, and the use of orientation words such as "upper", "lower", "left", "right", "inner" and "outer" in the case where no opposite explanation is made is convenient for understanding, and thus does not limit the scope of the present invention.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The embodiment provides a laser power supply which is used in a laser to reduce the cost and weight of the laser power supply.

As shown in fig. 1 and 2, the laser power supply provided in the present embodiment includes an outer case 1, a cooling pipe 2, a circuit board, and an electronic device to be cooled. The outer shell 1 is used for accommodating the cooling pipe 2, the circuit board and electronic devices to be cooled, the circuit board is used for being electrically connected with the electronic devices to be cooled so as to form a circuit structure of a laser power supply, and therefore the power supply function of the laser power supply is achieved. For example, a bridge rectifier is required to be disposed in the laser power supply, and a diode in the bridge rectifier generates a large amount of heat when the laser power supply is operated, and the diode needs to be cooled. Such as semiconductor devices in Power Factor Correction (PFC) circuits, electronic devices in resonant circuits, etc. The cooling pipe 2 is used for cooling the electronic device to be cooled.

As shown in fig. 1 and 2, specifically, the outer casing 1 has an accommodating chamber 13, and the outer casing 1 may include a bottom case 11 and an upper cover 12, and the upper cover 12 is detachably attached to the bottom case 11 by screws or the like to form the accommodating chamber 13 described above.

As shown in fig. 2, the cooling pipe 2, the circuit board, and the electronic component to be cooled are disposed in the accommodating chamber 13. The circuit board is optionally attached to the bottom surface of the back case 11. The cooling pipe 2 can flow a cooling liquid, and the outer surface of the cooling pipe 2 has a cooling surface 21, and the cooling surface 21 is a flat surface. The electronic device to be cooled is electrically connected with the circuit board, the electronic device to be cooled is attached to the cooling surface 21, and the cooling surface 21 and the surface of the circuit board form an included angle.

The cooling tube 2 of the laser power supply that this embodiment provided can circulate the coolant liquid, therefore, the coolant liquid can take away the heat on cooling tube 2 surface, reduces cooling tube 2 surface temperature fast. The outer surface of the cooling pipe 2 is provided with a cooling surface 21, and the cooling surface 21 is a plane, so that the contact area between the electronic device to be cooled and the cooling pipe 2 can be ensured, the heat transfer efficiency between the electronic device to be cooled and the cooling pipe 2 is improved, and the heat of the electronic device to be cooled is rapidly transferred to the cooling surface 21 of the cooling pipe 2.

In the prior art, the electronic device to be cooled is arranged at an included angle with the surface of the circuit board, and the cooling surface 21 is also arranged at an included angle with the surface of the circuit board, so that the electronic device to be cooled is parallel to and attached to the cooling surface 21, and the cooling efficiency of the electronic device to be cooled is improved; on the other hand, the arrangement direction of the cooling surface 21 and the electronic devices to be cooled is approximately parallel to the surface of the circuit board, so that the size of the laser power supply in the thickness direction (the thickness direction of the laser power supply, namely the thickness direction of the circuit board) is not increased, and the compactness of the laser power supply is improved.

This embodiment is through the main device and the cooling tube 2 laminating that generate heat with the laser power, rather than all devices that generate heat with the laser power all with the cooling tube 2 laminating to under the good prerequisite of guaranteeing the laser power heat dissipation, reduced the volume of cooling tube 2, reduced the cost and the weight of laser power.

Optionally, the cooling tube 2 includes a first cooling tube 22 and a second cooling tube 23, and the first cooling tube 22 and the second cooling tube 23 are disposed at intervals, so that electronic devices to be cooled can be arranged between the first cooling tube 22 and the second cooling tube 23, thereby improving the structural compactness of the laser power supply.

The first cooling pipe 22 and the second cooling pipe are communicated through a pipeline, so that cooling liquid circulates in the first cooling pipe 22 and the second cooling pipe 23, and the purpose of saving the cooling liquid is achieved. Optionally, a refrigeration device may be added to the pipeline connecting the first cooling pipe 22 and the second cooling pipe 23 to cool the cooling liquid.

Of course, in other alternative embodiments, the cooling pipe 2 may also be a U-shaped pipe, and both ends of the U-shaped pipe are connected through a pipeline to realize the circulation of water in the cooling pipe 2.

Optionally, each of the first cooling tube 22 and the second cooling tube 23 has two cooling surfaces 21 disposed opposite to each other, so that the arrangement direction of each cooling surface 21 and the electronic devices to be cooled attached thereto is substantially parallel to the surface of the circuit board.

Alternatively, the first cooling tube 22 and the second cooling tube 23 are arranged in parallel in a first direction, and the two oppositely arranged cooling surfaces 21 are arranged in the first direction, which is parallel to the surface of the circuit board. Namely, the four cooling surfaces 21 of the cooling tube 2 are sequentially arranged along the first direction, and the accommodating cavity 13 is divided into four independent spaces along the first direction by the four cooling surfaces 21, so that the arrangement of all electronic devices of the laser power supply is facilitated.

Optionally, the first cooling pipe 22 and the second cooling pipe 23 are square pipes, so as to machine the cooling surface 21 and reduce the machining cost of the cooling pipe 2.

Optionally, the first cooling pipe 22 and the second cooling pipe 23 are aluminum pipes to improve the heat transfer efficiency between the electronic device to be cooled and the cooling pipe 2.

Preferably, both ends of the first cooling pipe 22 protrude out of the outer case 1; the both ends of second cooling tube 23 stretch out shell body 1, and the pipeline of connecting first cooling tube 22 and second cooling tube 23 all is located outside holding chamber 13 promptly to can not realize the cooling of coolant liquid outside holding chamber 13.

In particular, the electronic device to be cooled may comprise a transformer. The laser power supply further comprises an installation frame 3, the installation frame 3 is connected with the cooling surface 21, the installation frame 3 is provided with an opening, and the transformer is arranged in the installation frame 3 and penetrates through the opening to be attached to the cooling surface 21. The transformer passes through the installing frame 3 to be fixed in holding chamber 13 to be convenient for the fixed of transformer, and improve the fixed stability of transformer. The mounting frame 3 is provided with openings so that the mounting frame 3 does not affect the heat transfer between the transformer and the cooling tube 2.

Furthermore, the mounting frame 3 includes a connecting plate 34, and a first side wall 31, a second side wall 32 and a third side wall 33 which are connected in sequence to form a U-shaped structure, wherein the ends of the first side wall 31 and the third side wall 33, which are far away from the second side wall 32, are both connected with the connecting plate 34, an opening is formed between the two connecting plates 34, and the mounting frame 3 is connected with the cooling pipe 2 through the connecting plate 34, for example, the connecting plate 34 is connected with the cooling pipe 2 through welding or bolts. The arrangement of the connecting plate 34 can improve the connection stability of the mounting frame 3 and the cooling pipe 2.

The lower ends of the first side wall 31, the second side wall 32 and the third side wall 33 are all provided with flanges, the flanges are approximately parallel to the bottom surface of the bottom box 11, and the flanges and the bottom surface are connected through screws or welding.

The electronic device to be cooled can also comprise an MOS tube, and the MOS tube is positioned outside the installation frame 3. The MOS tube may be attached to the cooling surface 21 by a bolt, a heat conductive adhesive, or the like.

The embodiment also provides a laser which comprises the laser power supply, so that the cost of the laser is reduced.

Although the invention has been described in detail in the foregoing by way of general description, specific embodiments and experiments, it will be apparent to those skilled in the art that certain modifications and improvements may be made thereto based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. A laser power supply, comprising:

an outer housing (1) having a housing chamber (13);

the cooling pipe (2) is arranged in the accommodating cavity (13), cooling liquid can flow through the cooling pipe (2), the outer surface of the cooling pipe (2) is provided with a cooling surface (21), and the cooling surface (21) is a plane;

the circuit board with need to cool off electron device, all set up in hold in chamber (13), need to cool off electron device with the circuit board electricity is connected, need to cool off electron device with cooling surface (21) laminating, cooling surface (21) with the surface of circuit board is the contained angle setting.

2. The laser power supply according to claim 1, wherein the cooling pipe (2) comprises a first cooling pipe (22) and a second cooling pipe (23), and the first cooling pipe (22) and the second cooling pipe (23) are arranged at intervals and communicated through a pipeline so as to circulate the cooling liquid in the first cooling pipe (22) and the second cooling pipe (23).

3. Laser power supply according to claim 2, characterized in that the first cooling tube (22) and the second cooling tube (23) each have two oppositely arranged cooling surfaces (21).

4. The laser power supply according to claim 3, wherein the first cooling tube (22) and the second cooling tube (23) are arranged in parallel along a first direction along which the two oppositely arranged cooling surfaces (21) are arranged, the first direction being parallel to a surface of the circuit board.

5. The laser power supply according to claim 2, wherein the first cooling tube (22) and the second cooling tube (23) are square tubes.

6. The laser power supply according to claim 4, wherein the first cooling tube (22) and the second cooling tube (23) are aluminum tubes.

7. The laser power supply according to claim 2, characterized in that both ends of the first cooling tube (22) protrude out of the outer housing (1); the two ends of the second cooling pipe (23) extend out of the outer shell (1).

8. The laser power supply according to claim 1, wherein the electronic device to be cooled comprises a transformer, the laser power supply further comprises a mounting frame (3), the mounting frame (3) is connected to the cooling surface (21), the mounting frame (3) has an opening, and the transformer is disposed in the mounting frame (3) and attached to the cooling surface (21) through the opening.

9. The laser power supply according to claim 8, wherein the mounting frame (3) comprises a connecting plate (34) and a first side wall (31), a second side wall (32) and a third side wall (33) which are sequentially connected to form a U-shaped structure, the connecting plate (34) is connected to one ends of the first side wall (31) and the third side wall (33) far away from the second side wall (32), the opening is formed between the two connecting plates (34), and the mounting frame (3) is connected with the cooling pipe (2) through the connecting plates (34).

10. A laser comprising a laser power supply according to any one of claims 1 to 9.