CN217485949U - Higher harmonic filter - Google Patents
Higher harmonic filter Download PDFInfo
- Publication number
- CN217485949U CN217485949U CN202221182288.5U CN202221182288U CN217485949U CN 217485949 U CN217485949 U CN 217485949U CN 202221182288 U CN202221182288 U CN 202221182288U CN 217485949 U CN217485949 U CN 217485949U
- Authority
- CN
- China
- Prior art keywords
- water tank
- top cover
- harmonic filter
- shell
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 44
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 238000005057 refrigeration Methods 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 239000000110 cooling liquid Substances 0.000 description 5
- 239000002826 coolant Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000002026 carminative Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/40—Arrangements for reducing harmonics
Abstract
The utility model discloses a higher harmonic filter belongs to the harmonic filter field, including a loading board, one side of loading board is provided with two mounting brackets through screw rod detachable, and the loading board divide into upper, middle and lower three region through two mounting brackets. The utility model discloses a higher harmonic filter, have the advantage that easy access and radiating effect are good, solved in the in-service use, power equipment's different parts can receive the influence of the harmonic on the electric power system, for example, the motor can suffer hysteresis loss because the vortex that establishes in the motor inner core, this can increase generating heat of motor core, if it is overheated the life-span that will shorten the motor, the harmonic also can produce vibration, increase noise level, can further lead to communication line and electronic circuit's failure and fault situation, simultaneously because the parcel of casing, the staff can be because of the operating space undersize when overhauing it, lead to being difficult to the problem of overhauing.
Description
Technical Field
The utility model belongs to the harmonic filter field, concretely relates to higher harmonic filter.
Background
The harmonic filter is used for filtering one or more times of harmonic in the electric power system; the structure of the passive filter is mainly formed by combining elements such as an inductor, a capacitor, a resistor and the like, namely the passive filter.
In actual use, different parts of electric equipment can be affected by harmonic waves on an electric system, for example, a motor can suffer from hysteresis loss due to eddy current established in an iron core of the motor, the heat generation of the iron core of the motor can be increased, the service life of the motor can be shortened if the iron core of the motor is overheated, the harmonic waves can also generate vibration, the noise level is increased, the failure and the fault condition of a communication line and an electronic circuit can be further caused, meanwhile, due to the wrapping of a shell, a worker can difficultly overhaul the electric equipment due to the fact that the operation space is too small when the electric equipment is overhauled, and therefore a higher harmonic wave filter is provided.
SUMMERY OF THE UTILITY MODEL
To prior art's above defect or improve in the demand one or more, the utility model provides a higher harmonic filter has the advantage that easy access and radiating effect are good.
In order to achieve the purpose, the utility model provides a higher harmonic filter, which comprises a bearing plate, wherein one side surface of the bearing plate is detachably provided with two mounting frames through a screw rod, and the bearing plate is divided into an upper region, a middle region and a lower region through the two mounting frames;
the upper region is internally provided with a dielectric resonator, the middle region is internally provided with a reactance component and an inductance component, and the lower region is internally provided with a capacitance component; and
the supporting assembly is arranged on the lower end face of the bearing plate;
the shell is arranged on the supporting component in a sliding mode, one side face, away from the bearing plate, of the shell is hinged to a door plate through a hinge, and a top cover is detachably arranged on the upper end face of the shell;
and the heat dissipation assembly is arranged on the upper end surface of the shell and inside the top cover.
As a further improvement, the supporting component comprises a supporting frame, the supporting frame is welded in the lower terminal surface of loading board, the inside welding of supporting frame has two slide bars just the one end of slide bar extends to the outside of support frame, shell sliding connection is in two the outside of slide bar, the extension end outside of slide bar is provided with the screw thread, there is a fixed helicoidal outside the outside of slide bar through threaded connection.
As a further improvement of the utility model, radiator unit includes a water tank, the water tank set up in shell up end and one end are located inside the top cap, the water tank is located the inside one end intercommunication of top cap has a water pump, the one end that the water tank was kept away from to the water pump and the one end that the water tank is located inside the top cap all are linked together with a conduction temperature pipe, radiator unit still includes a radiator fan, radiator fan imbed in the up end of top cap just is in same axial with conduction temperature pipe, first hole portion has all been seted up to the up end of shell and top cap, the one end that the water tank is located the top cap outside is provided with a semiconductor refrigeration piece.
As a further improvement, the top cover is provided with a notch, and the one end of the semiconductor refrigeration piece and the water tank are both positioned in the notch.
As a further improvement, the support frame has the gliding second hole portion of confession shell, the one end embedding that the support frame is close to the shell has a plurality of ball just the ball is laminated with the shell mutually, the shell has a plurality of and is used for carminative louvre.
As a further improvement, the heat conducting pipe is designed to be continuous S-shaped and one end of the heat conducting pipe extends to the first hole part on the shell, and the inside of the heat conducting pipe and the water tank is filled with cooling liquid.
Generally, through the utility model discloses above technical scheme that conceive compares with prior art, and the beneficial effect that has includes:
(1) the utility model discloses a higher harmonic filter, when needs overhaul, accessible supporting component is with the whole roll-off of shell to be used for enlarging the exposed surface of each function piece, and then the operating space when improving the maintenance is convenient for the staff and is overhauld, realizes convenient to overhaul's effect.
(2) The utility model discloses a higher harmonic filter, in use, the cold air that forms through radiator unit can dispel the heat to each function piece in the shell, has optimized inner structure simultaneously, helps inside to dispel the heat rapidly to realize the advantage that the radiating effect is good.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the bearing plate of the present invention;
FIG. 3 is a schematic view of the supporting assembly of the present invention;
fig. 4 is a schematic view of a part of the structure of the heat dissipation assembly of the present invention.
Throughout the drawings, like reference numerals designate like features, and in particular: 1. carrying a plate; 2. a mounting frame; 3. a dielectric resonator; 4. a reactive component; 5. an inductance component; 6. a support assembly; 61. a support frame; 62. a slide bar; 63. fixing the coil; 7. a housing; 8. a door panel; 9. a top cover; 10. a heat dissipating component; 101. a water tank; 102. a water pump; 103. a heat conducting pipe; 104. a heat radiation fan; 105. a first hole portion; 106. a semiconductor refrigeration sheet; 11. a notch; 12. a second hole portion; 13. a ball bearing; 14. heat dissipation holes; 15. a capacitive component.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
As shown in fig. 1-2, a higher harmonic filter includes a bearing plate 1, the bearing plate 1 is a rectangular metal plate, two mounting frames 2 are detachably disposed on one side surface of the bearing plate 1 through screws, the mounting frames 2 are square frame type grids, and the bearing plate 1 is divided into an upper region, a middle region and a lower region through the two mounting frames 2; the upper region is internally provided with a dielectric resonator 3, the middle region is internally provided with a reactance component 4 and an inductance component 5, and the lower region is internally provided with a capacitance component 15; the supporting component 6 is arranged on the lower end face of the bearing plate 1; the shell 7 is slidably arranged on the supporting component 6, the shell 7 is a rectangular box body, one side surface of the shell 7, which is far away from the bearing plate 1, is hinged with a door plate 8 through a hinge, and the upper end surface of the shell 7 is detachably provided with a top cover 9 through a screw rod; a heat dissipation component 10, wherein the heat dissipation component 10 is arranged on the upper end surface of the shell 7 and inside the top cover 9.
Referring to fig. 2-3, the supporting assembly 6 includes a supporting frame 61, the supporting frame 61 is welded on the lower end surface of the loading plate 1, the inner weld of the supporting frame 61 has two sliding rods 62, one end of each sliding rod 62 extends to the outer side of the supporting frame 61, the shell 7 is slidably connected to the outer sides of the two sliding rods 62, the outer side of the extending end of each sliding rod 62 is provided with a thread, the outer side of each sliding rod 62 is connected with a fixed spiral ring 63 through a threaded thread, and the fixed spiral ring 63 is used for limiting the shell 7, so as to prevent the shell 7 from naturally slipping.
In this embodiment, when the functional components need to be overhauled, the fixing coil 63 can be rotated out of the sliding rod 62 to cancel the fixing of the shell 7, and then the shell 7 can be pulled to slide on the sliding rod 62 and finally pulled away from the sliding rod 62.
Referring to fig. 1 and 4, the heat dissipation assembly 10 includes a water tank 101, the water tank 101 is disposed on the upper end surface of the housing 7, one end of the water tank 101 is located inside the top cover 9, one end of the water tank 101 located inside the top cover 9 is communicated with a water pump 102, one end of the water pump 102 away from the water tank 101 and one end of the water tank 101 located inside the top cover 9 are both communicated with a temperature guide pipe 103, the temperature guide pipe 103 and the water tank 101 are both made of metal, the heat dissipation assembly 10 further includes a heat dissipation fan 104, the heat dissipation fan 104 is embedded in the upper end surface of the top cover 9 and is located in the same axial direction as the temperature guide pipe 103, the upper end surfaces of the housing 7 and the top cover 9 are both provided with first hole portions 105, the two first hole portions 105 are vertically symmetrically distributed, and one end of the water tank 101 located outside the top cover 9 is provided with a semiconductor refrigeration sheet 106;
in this embodiment, when the water pump 102 is powered on and then turned on, the water pump can drive the coolant to flow in the water tank 101 and the heat conducting pipe 103 in sequence, the semiconductor cooling fins 106 can cool the water tank 101 and cool the coolant passing through the inside of the water tank, and at the same time, the coolant can cool the heat conducting pipe 103 to reduce the surface temperature of the heat conducting pipe 103 after circulating inside the heat conducting pipe 103, and the air blown into the housing 7 by the cooling fan 104 can form cool air after contacting the heat conducting pipe 103, and the cool air starts to sink after entering the housing 7 and cools each functional component in sequence and finally is discharged from the heat dissipation holes 14, so that the heat dissipation process can be completed.
Referring to fig. 1, a notch 11 is formed in the top cover 9, one ends of the semiconductor refrigeration piece 106 and the water tank 101 are located in the notch 11, the same binding surface of the water tank 101 of the semiconductor refrigeration piece 106 is a refrigeration surface, the other surface of the semiconductor refrigeration piece is a heating surface, the heating surface and the refrigeration surface of the semiconductor refrigeration piece 106 are separated by the top cover 9, and the heat generated by the heating surface is prevented from affecting the heat dissipation effect in the shell 7.
Referring to fig. 1 and 3, the supporting frame 61 has a second hole portion 12 for the housing 7 to slide, a plurality of balls 13 are embedded into one end of the supporting frame 61 close to the housing 7, the balls 13 are attached to the housing 7, the housing 7 has a plurality of heat dissipation holes 14 for exhausting air, the balls 13 can reduce the friction force between the balls and the housing 7, and further the housing 7 is prevented from being difficult to slide due to excessive friction force, and the heat dissipation holes 14 are used for exhausting the air for heat dissipation.
Referring to fig. 4, the heat conducting pipe 103 is designed in a continuous S shape, one end of the heat conducting pipe extends into the first hole 105 of the housing 7, the inside of the heat conducting pipe 103 and the inside of the water tank 101 are both filled with cooling liquid, and the heat conducting pipe 103 is designed in an S shape, so that the area of heat exchange between the heat conducting pipe 103 and air is greatly increased, and further, the heat exchange efficiency is improved.
The first innovation point implementation step:
when the functional parts need to be overhauled, the fixing spiral ring 63 can be rotated out of the sliding rod 62 to cancel the fixation of the shell 7, then the shell 7 can be pulled to slide on the sliding rod 62 and finally pulled away from the sliding rod 62, and due to the fact that the shielding of the shell 7 is lost, the functional parts can be exposed, the operation space is improved, and then the functional parts can be conveniently overhauled by workers.
The implementation step of the second innovation point:
when in use, the water pump 102 can drive the cooling liquid to flow in the water tank 101 and the heat conducting pipe 103 in sequence after being powered on and opened, the semiconductor refrigerating sheet 106 can refrigerate the water tank 101 and cool the cooling liquid passing through the inside of the water tank, meanwhile, the cooling liquid can cool the heat conducting pipe 103 to reduce the surface temperature of the heat conducting pipe after circulating inside the heat conducting pipe 103, the air blown into the shell 7 along with the cooling fan 104 can form cold air after contacting with the heat conducting pipe 103, the cold air begins to sink after entering the shell 7 and cools each functional part in sequence to dissipate heat and finally discharge from the heat dissipation holes 14, so that the heat dissipation process can be completed, the internal structure is optimized, the rapid heat dissipation inside is facilitated, and the advantage of good heat dissipation effect is achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A high-order harmonic filter is characterized by comprising a bearing plate (1), wherein two mounting frames (2) are detachably arranged on one side surface of the bearing plate (1) through screws, and the bearing plate (1) is divided into an upper region, a middle region and a lower region through the two mounting frames (2);
the dielectric resonator (3) is arranged in the upper area, the reactance component (4) and the inductance component (5) are arranged in the middle area, and the capacitor component (15) is arranged in the lower area; and
the supporting component (6) is arranged on the lower end face of the bearing plate (1);
the outer shell (7) is arranged on the support component (6) in a sliding mode, a door panel (8) is hinged to one side face, away from the bearing plate (1), of the outer shell (7) through a hinge, and a top cover (9) is detachably arranged on the upper end face of the outer shell (7);
and the heat dissipation assembly (10) is arranged on the upper end surface of the shell (7) and inside the top cover (9).
2. The higher harmonic filter according to claim 1, wherein the supporting assembly (6) comprises a supporting frame (61), the supporting frame (61) is welded on the lower end surface of the loading plate (1), two sliding rods (62) are welded inside the supporting frame (61) and one end of each sliding rod (62) extends to the outer side of the supporting frame (61), the housing (7) is connected to the outer sides of the two sliding rods (62) in a sliding manner, threads are arranged on the outer sides of the extending ends of the sliding rods (62), and a fixing screw ring (63) is connected to the outer sides of the sliding rods (62) through threaded threads.
3. The higher harmonic filter according to claim 1, characterized in that the heat sink (10) comprises a water tank (101), the water tank (101) is arranged on the upper end surface of the shell (7), one end of the water tank is positioned in the top cover (9), one end of the water tank (101) positioned in the top cover (9) is communicated with a water pump (102), one end of the water pump (102) far away from the water tank (101) and one end of the water tank (101) positioned in the top cover (9) are both communicated with a heat conducting pipe (103), the heat dissipation assembly (10) further comprises a heat dissipation fan (104), the heat dissipation fan (104) is embedded in the upper end face of the top cover (9) and is in the same axial direction with the heat conduction pipe (103), the upper end surfaces of the shell (7) and the top cover (9) are both provided with first hole parts (105), one end of the water tank (101) positioned outside the top cover (9) is provided with a semiconductor refrigeration piece (106).
4. The higher harmonic filter according to claim 3, wherein a notch (11) is formed in the top cover (9), and the semiconductor refrigeration piece (106) and one end of the water tank (101) are both located in the notch (11).
5. The higher harmonic filter according to claim 2, wherein the supporting frame (61) has a second hole portion (12) for sliding the housing (7), a plurality of balls (13) are embedded in one end of the supporting frame (61) close to the housing (7), the balls (13) are attached to the housing (7), and the housing (7) has a plurality of heat dissipation holes (14) for exhausting air.
6. The harmonic filter according to claim 3, wherein the thermal conduit (103) is of a continuous S-shaped design and has one end extending into the first hole (105) in the housing (7), and the thermal conduit (103) and the tank (101) are both filled with cooling fluid.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221182288.5U CN217485949U (en) | 2022-05-17 | 2022-05-17 | Higher harmonic filter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221182288.5U CN217485949U (en) | 2022-05-17 | 2022-05-17 | Higher harmonic filter |
Publications (1)
Publication Number | Publication Date |
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CN217485949U true CN217485949U (en) | 2022-09-23 |
Family
ID=83311044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202221182288.5U Active CN217485949U (en) | 2022-05-17 | 2022-05-17 | Higher harmonic filter |
Country Status (1)
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CN (1) | CN217485949U (en) |
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2022
- 2022-05-17 CN CN202221182288.5U patent/CN217485949U/en active Active
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