CN217468374U

CN217468374U - Automatic conveying device for thin wafers

Info

Publication number: CN217468374U
Application number: CN202221366881.5U
Authority: CN
Inventors: 解树平; 顾伟中
Original assignee: Suzhou Ruifei Photoelectric Technology Co ltd
Current assignee: Suzhou Ruifei Photoelectric Technology Co ltd
Priority date: 2022-06-02
Filing date: 2022-06-02
Publication date: 2022-09-20
Anticipated expiration: 2032-06-02

Abstract

The utility model discloses an automatic conveying device facing to thin wafers, which comprises a supporting seat, wherein the supporting seat is arranged below a conveying frame, and one side of the conveying frame is provided with an electric cabinet; the conveying device comprises a conveying frame, a first sliding groove, a second sliding seat and a conveying frame, wherein the first sliding groove is arranged on the conveying frame, a conveying seat is arranged above the conveying frame, the second sliding seat is arranged below the conveying seat, and one end of the second sliding seat extends into the first sliding groove; the gear row is arranged inside the first sliding groove, the third motor is arranged inside the second sliding seat, the second sliding seat is provided with a second rotating groove, a gear is arranged inside the second rotating groove, the gear and the output end of the third motor are connected into an integral structure, the gear is meshed with the gear row and is connected, when the automatic transmission device is used for grabbing and transmitting thin wafers, the thin wafers are evenly stressed, the thin wafers cannot be warped due to uneven stress of the thin wafers, the thin wafers are damaged, and the transmission effect is improved.

Description

Automatic conveying device for thin wafers

Technical Field

The utility model relates to a wafer transmission technical field specifically is an automatic conveying device towards thin wafer.

Background

The wafer is a basic material for manufacturing a semiconductor chip, the most main raw material of a semiconductor integrated circuit is silicon, so that the wafer is a corresponding silicon wafer, and the wafer is a silicon wafer used for manufacturing the silicon semiconductor integrated circuit and is called as a wafer because the wafer is circular in shape; various circuit device structures can be fabricated on the silicon wafer to become IC products with specific electrical functions; the starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide.

The Chinese patent publication No. CN112397429A, the granted announcement date is 2021, 02, 23, and the automatic wafer conveying device with the multi-axis linkage manipulator comprises a frame; the manipulator transmission mechanism and the air box transmission mechanism are fixedly arranged in the rack; the manipulator mechanism is in transmission connection with the manipulator transmission mechanism, the manipulator mechanism is linked through a plurality of manipulator transmission assemblies to form a multi-axis linkage manipulator, and a clamping mechanism is arranged on the manipulator mechanism; and the air box mechanism is in transmission connection with the air box transmission mechanism and is movably arranged on the rack. XY direction motion is provided through the multi-axis linkage of the manipulator mechanism, the manipulator transmission mechanism provides upper and lower Z axis motion, the wafer can be loaded to the corresponding positions of different processing machine types, the problem that a single piece of loading equipment cannot be compatible with different processing machine types can be effectively solved, the problem that the business cost rises sharply due to the fact that different styles of fixed plate-making loading equipment need to be configured is avoided, and the automatic wafer feeding device has the advantage of being high in applicability.

The above prior art solutions have the following drawbacks: the thickness of the wafer can be thinned to about 100um in the advanced packaging process, the rigidity of the wafer can be lowered, the stress of the thin wafer is uneven in the transmission process, the large wafer warping is easy to occur, the transmission effect of the thin wafer is reduced, and the use requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an automatic conveying device towards thin wafer to propose the wafer in solving above-mentioned background art and can attenuate to about 100um thickness in advanced packaging process, the wafer rigidity can the step-down, and thin wafer atress is uneven in the transmission course, appears big wafer warpage easily, has reduced the problem of the transmission effect of thin wafer.

In order to achieve the above object, the utility model provides a following technical scheme: an automatic conveying device facing to thin wafers comprises a conveying frame;

the supporting seat is arranged below the transmission frame, one side of the transmission frame is provided with an electric cabinet, and the supporting seat and the electric cabinet are both connected with the transmission frame through screws;

the first sliding groove is arranged on the transmission frame, a transmission seat is arranged above the transmission frame, a second sliding seat is arranged below the transmission seat and connected with the transmission seat through screws, and one end of the second sliding seat extends into the first sliding groove;

the tooth row is arranged in the first sliding groove, the tooth row is connected with the transmission frame through screws, a third motor is arranged in the second sliding seat, the third motor is connected with the second sliding seat through screws, a second rotating groove is formed in the second sliding seat, a gear is arranged in the second rotating groove, the gear is connected with the output end of the third motor into a whole, and the gear is meshed with the tooth row.

Preferably, one side of the transmission frame is provided with a feeding plate, the feeding plate is connected with the transmission frame through screws, rubber pads are arranged at the upper ends of the feeding plate and the transmission seat, and the rubber pads are connected with the feeding plate and the transmission seat in a fitting mode.

Preferably, one side of transmission frame is provided with the material loading frame, and the material loading frame passes through screwed connection with the transmission frame, be provided with the second spout on the material loading frame, the inside of second spout is provided with first sliding seat, and first sliding seat and last material loading frame sliding connection, the below of first sliding seat is provided with electric telescopic handle, and electric telescopic handle passes through screwed connection with first sliding seat, electric telescopic handle's lower extreme is provided with the sucking disc, and the sucking disc is connected structure as an organic whole with electric telescopic handle.

Preferably, one side of the feeding frame is provided with a first motor, the first motor is connected with the feeding frame through screws, a threaded rod is arranged inside the second sliding groove, one end of the threaded rod is connected with the output end of the first motor to form an integral structure, the threaded rod is connected with the first sliding seat through threads, and the threaded rod is connected with the feeding frame in a rotating mode.

Preferably, be provided with first turning groove on the transmission seat, the top of transmission seat is provided with the translucent cover, one side of translucent cover is provided with the turning block, and the turning block is connected structure as an organic whole with the translucent cover, the one end of turning block extends to the inside of first turning groove, the both sides of turning block all are provided with the bull stick, and the bull stick passes through the screw connection with the turning block, the bull stick rotates with the transmission seat to be connected, one side of transmission seat is provided with the second motor, and the second motor passes through the screw connection with the transmission seat, the output and the bull stick of second motor are connected structure as an organic whole.

Preferably, the upper end of transmission frame is provided with the rolling groove, the lower extreme of transmission seat is provided with the ball, and ball and transmission seat roll connection, the one end of ball extends to the inside of rolling groove, and ball and transmission frame sliding connection.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a device passes through the setting of tooth row, third motor, second motor and translucent cover, tiles thin wafer on the transmission seat, and thin wafer atress is even, can not appear warping, and the third motor drives the gear rotation, and the rotation along with the gear drives the transmission seat and moves along the tooth row to realize thin wafer transmission, and indirect drive translucent cover rotates under the effect of second motor, uses the translucent cover can cover thin wafer, avoids thin wafer transmission process to receive the windage to drop, has improved thin wafer transmission effect;

2. the utility model discloses a device passes through the setting of sucking disc, electric telescopic handle and first motor, and the sucking disc can adsorb thin wafer, and absorbent thin wafer atress is even, and the thin wafer of indirect drive goes up and down under electric telescopic handle's effect, and the thin wafer translation of indirect drive under the effect of first motor can realize thin wafer automatic feeding, has improved thin wafer transmission efficiency.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a cross-sectional view of the present invention;

FIG. 3 is a diagram showing the connection relationship between the transparent cover and the transmission seat of the present invention;

fig. 4 is a partially enlarged view of the area a of fig. 2 according to the present invention.

In the figure: 1. a transmission rack; 2. a supporting seat; 3. an electric cabinet; 4. a first chute; 5. a feeding frame; 6. a first motor; 7. a transmission seat; 8. feeding plates; 9. a suction cup; 10. an electric telescopic rod; 11. a transparent cover; 12. a second motor; 13. a tooth row; 14. a rubber pad; 15. a second chute; 16. a first sliding seat; 17. a threaded rod; 18. a gear; 19. a second sliding seat; 20. a third motor; 21. a first rotating groove; 22. rotating the block; 23. a rotating rod; 24. a ball bearing; 25. rolling a groove; 26. a second rotation groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-4, the present invention provides an embodiment: an automatic conveying device facing to thin wafers comprises a conveying frame 1;

the supporting seat 2 is arranged below the transmission frame 1, one side of the transmission frame 1 is provided with an electric cabinet 3, and the supporting seat 2 and the electric cabinet 3 are both connected with the transmission frame 1 through screws;

the first sliding groove 4 is arranged on the transmission frame 1, the transmission seat 7 is arranged above the transmission frame 1, the second sliding seat 19 is arranged below the transmission seat 7, the second sliding seat 19 is connected with the transmission seat 7 through screws, one end of the second sliding seat 19 extends into the first sliding groove 4, and the thin wafer is flatly laid on the transmission seat 7, so that the thin wafer is uniformly stressed and does not warp;

the tooth row 13 is arranged inside the first sliding groove 4, the tooth row 13 is connected with the transmission frame 1 through screws, a third motor 20 is arranged inside the second sliding seat 19, the third motor 20 is connected with the second sliding seat 19 through screws, a second rotating groove 26 is formed in the second sliding seat 19, a gear 18 is arranged inside the second rotating groove 26, the gear 18 is connected with the output end of the third motor 20 into a whole, the gear 18 is meshed with the tooth row 13 and is connected with the gear 18, the third motor 20 drives the gear 18 to rotate, the transmission frame 7 is driven to move along the transmission frame 1 along with the rotation of the gear 18, and thin wafer transmission is achieved.

Referring to fig. 1 and 2, a feeding plate 8 is disposed on one side of the transmission frame 1, the feeding plate 8 is connected to the transmission frame 1 through screws, rubber pads 14 are disposed at the upper ends of the feeding plate 8 and the transmission seat 7, and the rubber pads 14 are connected to the feeding plate 8 and the transmission seat 7 in a fitting manner.

Referring to fig. 1 and 2, a feeding frame 5 is arranged on one side of a transmission frame 1, the feeding frame 5 is connected with the transmission frame 1 through screws, a second sliding groove 15 is formed in the feeding frame 5, a first sliding seat 16 is arranged inside the second sliding groove 15, the first sliding seat 16 is connected with the feeding frame 5 in a sliding manner, an electric telescopic rod 10 is arranged below the first sliding seat 16, the electric telescopic rod 10 is connected with the first sliding seat 16 through screws, a suction cup 9 is arranged at the lower end of the electric telescopic rod 10, the suction cup 9 is connected with the electric telescopic rod 10 into an integrated structure, the electric telescopic rod 10 drives the suction cup 9 to lift, the suction cup 9 is used for adsorbing thin wafers, the adsorption stress is uniformly distributed, and the thin wafers are prevented from warping due to uneven stress when the thin wafers are taken.

Referring to fig. 1 and 2, a first motor 6 is disposed on one side of the feeding frame 5, the first motor 6 is connected to the feeding frame 5 through a screw, a threaded rod 17 is disposed inside the second chute 15, one end of the threaded rod 17 is connected to an output end of the first motor 6, the threaded rod 17 is in threaded connection with the first sliding seat 16, the threaded rod 17 is rotatably connected to the feeding frame 5, the threaded rod 17 is driven by the first motor 6 to rotate, and the first sliding seat 16 is driven by the rotation of the threaded rod 17 to move in the second chute 15, so that the thin wafer is translated.

Referring to fig. 1 and 3, a first rotating groove 21 is disposed on a transmission base 7, a transparent cover 11 is disposed above the transmission base 7, a rotating block 22 is disposed on one side of the transparent cover 11, the rotating block 22 and the transparent cover 11 are connected into an integral structure, one end of the rotating block 22 extends into the first rotating groove 21, rotating rods 23 are disposed on both sides of the rotating block 22, the rotating rods 23 are connected with the rotating block 22 through screws, the rotating rods 23 are rotatably connected with the transmission base 7, a second motor 12 is disposed on one side of the transmission base 7, the second motor 12 is connected with the transmission base 7 through screws, an output end of the second motor 12 is connected with the rotating rods 23 into an integral structure, the rotating rods 23 are driven by the second motor 12 to rotate, the transparent cover 11 is driven to rotate along with the rotation of the rotating rods 23, a thin wafer can be covered by the transparent cover 11, and the thin wafer is prevented from falling off from the transmission base 7 due to wind resistance in the thin wafer transmission process, the thin wafer transmission effect is improved.

Referring to fig. 2 and 4, the upper end of the transmission frame 1 is provided with a rolling groove 25, the lower end of the transmission base 7 is provided with a ball 24, the ball 24 is connected with the transmission base 7 in a rolling manner, one end of the ball 24 extends into the rolling groove 25, the ball 24 is connected with the transmission frame 1 in a sliding manner, and the moving transmission base 7 can be guided and limited by the ball 24 and the rolling groove 25.

The working principle is as follows: when the thin wafer lifting device is used, a thin wafer is placed on the material loading plate 8, the electric telescopic rod 10 is driven to drive the suction cup 9 to descend to be attached to the thin wafer, the suction cup 9 is used for sucking the thin wafer, and then the electric telescopic rod 10 is driven to lift the thin wafer; the first motor 6 is driven to drive the threaded rod 17 to rotate, the first sliding seat 16 is driven to move along with the rotation of the threaded rod 17, the thin wafer is moved to the position above the transmission seat 7, the electric telescopic rod 10 is driven to place the thin wafer on the transmission seat 7, and the sucker 9 is loosened to be separated from the thin wafer. The second motor 12 is started to drive the transparent cover 11 to rotate, and the thin wafer is covered by the transparent cover 11, so that the thin wafer can be prevented from falling off from the transmission seat 7 due to wind resistance in the thin wafer transmission process; the third motor 20 is started to drive the gear 18 to rotate, and the transmission seat 7 is driven to move along the transmission frame 1 along with the rotation of the gear 18, so that the thin wafer is automatically transmitted.

Those not described in detail in this specification are within the skill of the art.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An automatic conveying device facing to thin wafers comprises a conveying frame (1), and is characterized in that:

the supporting seat (2) is arranged below the transmission frame (1), an electric cabinet (3) is arranged on one side of the transmission frame (1), and the supporting seat (2) and the electric cabinet (3) are connected with the transmission frame (1) through screws;

the conveying device comprises a first sliding chute (4) arranged on a conveying frame (1), a conveying seat (7) is arranged above the conveying frame (1), a second sliding seat (19) is arranged below the conveying seat (7), the second sliding seat (19) is connected with the conveying seat (7) through screws, and one end of the second sliding seat (19) extends into the first sliding chute (4);

the gear row (13) is arranged in the first sliding groove (4), the gear row (13) is connected with the transmission frame (1) through screws, a third motor (20) is arranged in the second sliding seat (19), the third motor (20) is connected with the second sliding seat (19) through screws, a second rotating groove (26) is formed in the second sliding seat (19), a gear (18) is arranged in the second rotating groove (26), the gear (18) is connected with the output end of the third motor (20) into a whole, and the gear (18) is meshed with the gear row (13).

2. The automatic thin wafer-oriented transport device of claim 1, wherein: one side of the transmission frame (1) is provided with an upper material plate (8), the upper material plate (8) is connected with the transmission frame (1) through screws, rubber pads (14) are arranged at the upper ends of the upper material plate (8) and the transmission seat (7), and the rubber pads (14) are connected with the upper material plate (8) and the transmission seat (7) in a fitting mode.

3. The automatic conveying device for thin wafers as claimed in claim 1, wherein: one side of transmission frame (1) is provided with work or material rest (5), and goes up work or material rest (5) and pass through bolted connection with transmission frame (1), it is provided with second spout (15) on work or material rest (5), the inside of second spout (15) is provided with first sliding seat (16), and first sliding seat (16) and last work or material rest (5) sliding connection, the below of first sliding seat (16) is provided with electric telescopic handle (10), and electric telescopic handle (10) and first sliding seat (16) pass through bolted connection, the lower extreme of electric telescopic handle (10) is provided with sucking disc (9), and sucking disc (9) are connected as an organic whole structure with electric telescopic handle (10).

4. The automatic conveying device for thin wafers as claimed in claim 3, wherein: go up one side of work or material rest (5) and be provided with first motor (6), and first motor (6) pass through screw connection with last work or material rest (5), the inside of second spout (15) is provided with threaded rod (17), and the one end of threaded rod (17) is connected structure as an organic whole with the output of first motor (6), threaded rod (17) and first sliding seat (16) threaded connection, and threaded rod (17) rotate with last work or material rest (5) and be connected.

5. The automatic conveying device for thin wafers as claimed in claim 1, wherein: be provided with first rotation groove (21) on transmission seat (7), the top of transmission seat (7) is provided with translucent cover (11), one side of translucent cover (11) is provided with turning block (22), and turning block (22) is connected structure as an organic whole with translucent cover (11), the one end of turning block (22) extends to the inside of first rotation groove (21), the both sides of turning block (22) all are provided with bull stick (23), and bull stick (23) and turning block (22) pass through the screw connection, bull stick (23) rotate with transmission seat (7) and are connected, one side of transmission seat (7) is provided with second motor (12), and second motor (12) pass through the screw connection with transmission seat (7), the output and the bull stick (23) of second motor (12) are connected structure as an organic whole.

6. The automatic conveying device for thin wafers as claimed in claim 1, wherein: the upper end of transmission frame (1) is provided with slot rolling (25), the lower extreme of transmission seat (7) is provided with ball (24), and ball (24) and transmission seat (7) roll connection, the one end of ball (24) extends to the inside of slot rolling (25), and ball (24) and transmission frame (1) sliding connection.