CN217217012U - A dust-proof and shock-resistant multilayer circuit board for intelligent equipment - Google Patents

Abstract

The utility model relates to the technical field of multi-layer circuit boards, and discloses a dust-proof and shock-resistant multilayer circuit board for intelligent equipment, comprising a dust-proof cover, the dust-proof cover is arranged in a ring shape, and a plurality of intervals are arranged on both sides of an inner wall The installation groove is set, and circuit boards are inserted into the two adjacent installation grooves, and connecting plates are fixed on both sides of the dust cover. A mounting screw is fixed, the upper end of the rotating rod is fixed with a first limit plate, the lower end of the rotating rod is fixed with a second limit plate, and a buffer mechanism is arranged between the second limit plate and the connecting plate to prevent Both sides of the dust cover are provided with elastic opening and closing mechanisms. The utility model can carry out dust-proof wrapping protection for the circuit board, reduce the accumulation of dust, and at the same time provide buffer protection when the circuit board is installed.

Description

A dust-proof and shock-resistant multilayer circuit board for intelligent equipment

technical field

The utility model relates to the technical field of multi-layer circuit boards, in particular to a dust-proof and shock-proof multi-layer circuit board for intelligent equipment.

Background technique

The circuit board is an indispensable part in the existing intelligent equipment, and the multi-layer board refers to the printing of the conductive pattern layer with more than three layers and the insulating material in between, and the conductive pattern is interconnected as required. plate.

In the process of realizing this application, the inventor found that there are at least the following problems in this technology. After the current multi-layer circuit board is installed, the circuit board is installed inside the equipment. It is possible to drop the surface of the circuit board through the heat dissipation holes, and the accumulation of dust will affect the use of the circuit board.

Utility model content

The purpose of the utility model is to solve the problem that the circuit board will accumulate more dust on the surface after a long use time in the prior art, which affects the stable use of the circuit board, and proposes a dust-proof and shock-resistant multi-layer for intelligent equipment. circuit board.

In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions:

A dust-proof and shock-resistant multi-layer circuit board for intelligent equipment, comprising a dust cover, the dust cover is arranged in a ring shape, and a plurality of spaced installation grooves are arranged on both sides of an inner wall, and two adjacent installation grooves are provided. A circuit board is inserted into the slot, a connecting plate is fixed on both sides of the dust cover, and a rotating rod is rotatably passed through the inner two ends of the connecting plate, and the bottom of the rotating rod is fixed with a mounting plate screw, the upper end of the rotating rod is fixedly sleeved with a first limit plate, the lower end of the rotating rod is fixedly sleeved with a second limit plate, and a buffer mechanism is provided between the second limit plate and the connecting plate , both sides of the dust cover are provided with elastic opening and closing mechanisms.

Preferably, a twisting block is fixed on the top of the plurality of rotating rods, and a hexagonal slot is opened on the top of the twisting block.

Preferably, the buffer mechanism includes a sliding plate, the sliding plate is slidably sleeved on the outer side of the rotating rod, the lower end of the rotating rod is sleeved with a spring, and the two sides of the spring are respectively connected with the sliding plate and the second limit plate. Fixed connection.

Preferably, the elastic opening and closing mechanism includes a dust-proof plate, both ends of the lower side of the dust cover are fixedly provided with a fixed plate, and a first cross bar is rotated between the two fixed plates. The dust plate is fixedly sleeved on the outer side of the first crossbar, both ends of the first crossbar are sleeved with torsion springs, and the two ends of the torsion spring are respectively fixedly connected with the first crossbar and the fixing plate.

Preferably, a plurality of mesh holes are opened inside the dust-proof plate.

Preferably, a plurality of spaced threading grooves are opened inside the dustproof plate, a second transverse rod is fixed laterally in the threading groove, and a baffle plate is fixedly sleeved on the rod wall of the second transverse rod.

Compared with the prior art, the utility model provides a dust-proof and shock-resistant multilayer circuit board for intelligent equipment, which has the following beneficial effects:

1. The smart device uses a dust-proof and shock-resistant multi-layer circuit board. Through the provided dust cover, installation slot and elastic opening and closing mechanism, through the double cooperation of the dust cover and the dust plate, the circuit board can be wrapped and protected. Try to avoid dust falling on the surface of the circuit board.

2. The smart device uses a dust-proof and shock-resistant multi-layer circuit board, which is provided with a twisting block, a rotating rod, a connecting plate, a first limit plate, a second limit plate, a mounting screw and a buffer mechanism. The elastic force can make the installed circuit board have good shock-absorbing and buffering ability.

The parts not involved in the device are the same as the existing technology or can be realized by using the existing technology. The utility model is easy to operate, can carry out dust-proof wrapping protection for the circuit board, reduce the accumulation of dust, and at the same time buffer the circuit board when it is installed. For protection, try to avoid vibration directly acting on the circuit board to improve the stability of the circuit board.

Description of drawings

1 is a schematic structural diagram of a dust-proof and shock-resistant multi-layer circuit board for intelligent equipment proposed by the utility model;

Fig. 2 is a structural enlarged view of part A in Fig. 1;

Fig. 3 is the top view structure schematic diagram of Fig. 1;

FIG. 4 is an enlarged view of the structure of part B in FIG. 3 .

In the picture: 1 dust cover, 2 installation slot, 3 circuit board, 4 connecting plate, 5 rotating rod, 6 installation screw, 7 first limit plate, 8 second limit plate, 9 screw block, 10 hexagonal slot , 11 slide plate, 12 spring, 13 dust plate, 14 fixed plate, 15 first cross bar, 16 torsion spring, 17 second cross bar, 18 baffle.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inside", The orientation or positional relationship indicated by "outside" is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation , are constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

1-4, a dust-proof and shock-resistant multilayer circuit board for smart devices includes a dust cover 1, the dust cover 1 is arranged in a ring shape, and a plurality of spaced installation slots 2 are provided on both sides of the inner wall, A circuit board 3 is inserted into the two adjacent installation slots 2, and a connecting plate 4 is fixed on both sides of the dust cover 1. The circuit board 3 can be effectively protected against dust by the setting of the dust cover 1. ;

The inner two ends of the connecting plate 4 are rotated and pass through the rotating rods 5, the tops of the plurality of rotating rods 5 are fixedly provided with a twisting block 9, the top of the twisting block 9 is provided with a hexagonal slot 10, and the bottom of the rotating rods 5 is fixed. There is a mounting screw 6, which can drive the rotating rod 5 to rotate the mounting screw 6 through the hexagonal slot 10 to complete the installation of the plurality of circuit boards 3. The upper end of the rotating rod 5 is fixedly sleeved with a first limit plate 7, and the rotation The lower end of the rod 5 is fixedly sleeved with a second limiting plate 8 .

A buffer mechanism is provided between the second limit plate 8 and the connecting plate 4 . The buffer mechanism includes a sliding plate 11 . The sliding plate 11 is slidably sleeved on the outer side of the rotating rod 5 . The sides are respectively fixedly connected with the sliding plate 11 and the second limiting plate 8 , and the vibration of the circuit board 3 can be effectively buffered after the installation of the circuit board 3 by the elastic force of the spring 12 .

Both sides of the dust cover 1 are provided with elastic opening and closing mechanisms. The elastic opening and closing mechanism includes a dust-proof plate 13. The interior of the dust-proof plate 13 is provided with a plurality of mesh holes. The setting of the dust-proof plate 13 cooperates with the dust cover. The use of 1 can comprehensively wrap and dust the circuit board 3;

Both ends of the lower side of the dust cover 1 are fixedly provided with a fixed plate 14 , a first cross bar 15 is rotated between the two fixed plates 14 , and the dust plate 13 is fixedly sleeved on the outer side of the first cross bar 15 to prevent the dust cover 1 . The interior of the dust board 13 is provided with a plurality of threading grooves arranged at intervals, and a second transverse rod 17 is fixed laterally in the threading groove. , the cable connected to the circuit board 3 can be drawn out;

Both ends of the first crossbar 15 are sleeved with torsion springs 16 , and both ends of the torsion springs 16 are fixedly connected to the first crossbar 15 and the fixing plate 14 respectively.

In the present invention, before the circuit board 3 is installed, the dustproof plate 13 is pulled so that the dustproof plate 13 drives the first cross bar 15 to rotate around the fixed plate 14, twists the torsion spring 16, and then passes through the installation slot. 2. Install and place multiple multi-layer circuit boards, then loosen the dust-proof plate 13, connect the dust-proof plate 13 to the dust-proof cover 1 through the torsion of the torsion spring 16, and wrap the circuit board 3 for dust-proof treatment. Place the dust cover 1 in the installation position, and turn the plurality of screw blocks 9 in turn, so that the screw blocks 9 drive the mounting screws 6 to connect with the inside of the smart device during the rotation process, and the installation of the circuit board 3 is completed. , and during the use of the circuit board 3, due to the sliding sleeve between the rotating rod 5 and the connecting plate 3, and the relative sliding between the spring 12 and the sliding plate 11, when the dust cover 1 and the circuit board 3 are vibrated, The vibration can be effectively buffered, and the dustproof and shockproof capability of the circuit board 3 is improved.

The above description is only a preferred embodiment of the present invention, but the protection scope of the present invention is not limited to this. Equivalent replacement or modification of the new technical solution and its utility model concept shall be included within the protection scope of the present utility model.

Claims (6)

1. A dustproof and shockproof multilayer circuit board for intelligent equipment comprises a dustproof cover (1), it is characterized in that the dust cover (1) is arranged annularly, a plurality of mounting grooves (2) arranged at intervals are arranged on both sides of the inner wall, a circuit board (3) is inserted and connected in two adjacent mounting grooves (2), the two sides of the dust cover (1) are both fixedly provided with connecting plates (4), the two ends of the inner part of each connecting plate (4) are both rotatably penetrated with rotating rods (5), a mounting screw (6) is fixedly arranged at the bottom of the rotating rod (5), a first limiting plate (7) is fixedly sleeved at the upper end of the rotating rod (5), the lower end of the rotating rod (5) is fixedly sleeved with a second limiting plate (8), a buffer mechanism is arranged between the second limiting plate (8) and the connecting plate (4), and elastic opening and closing mechanisms are arranged on two sides of the dust cover (1).

2. The dustproof anti-seismic multilayer circuit board for the intelligent equipment according to claim 1, wherein twisting blocks (9) are fixedly arranged at the tops of the rotating rods (5), and hexagonal grooves (10) are formed in the tops of the twisting blocks (9).

3. The dustproof and shock-resistant multilayer circuit board for the intelligent device according to claim 1, wherein the buffer mechanism comprises a sliding plate (11), the sliding plate (11) is slidably sleeved outside the rotating rod (5), a spring (12) is sleeved at the lower end of the rotating rod (5), and two sides of the spring (12) are fixedly connected with the sliding plate (11) and the second limiting plate (8) respectively.

4. The dustproof and shock-resistant multilayer circuit board for the intelligent equipment according to claim 1, wherein the elastic opening and closing mechanism comprises a dustproof plate (13), fixed plates (14) are fixedly arranged at both ends of the lower side of the dustproof cover (1), a first cross rod (15) is rotatably arranged between the two fixed plates (14), the dustproof plate (13) is fixedly sleeved on the outer side of the first cross rod (15), torsion springs (16) are sleeved at both ends of the first cross rod (15), and both ends of each torsion spring (16) are fixedly connected with the first cross rod (15) and the fixed plates (14) respectively.

5. The dustproof and shock-resistant multilayer circuit board for the intelligent equipment as claimed in claim 4, wherein a plurality of meshes are formed inside the dustproof plate (13).

6. The dustproof and shock-resistant multilayer circuit board for the intelligent equipment as claimed in claim 4, wherein a plurality of spaced threading grooves are formed in the dustproof plate (13), a second cross rod (17) is transversely and fixedly arranged in the threading grooves, and a baffle plate (18) is fixedly sleeved on the rod wall of the second cross rod (17).

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