CN217134382U - Optical sensor and bracket set - Google Patents

Abstract

The utility model discloses a light sensor and support group. The optical sensor comprises a first bracket group, a second bracket group, a light receiving component, a light emitting component and a packaging structure. The first/second support group comprises a first/second die bonding support and a first/second wiring support. The first/second die bonding bracket includes a first/second fixing portion, and the first/second wiring bracket includes a first/second wiring portion. At least one of the first/second die bonding part and the first/second wiring part extends towards the first/second wiring part or the first/second die bonding part to form a first/second protruding part, and the thickness of the first/second protruding part is smaller than that of the first/second die bonding bracket or the first/second wiring bracket connected with the first/second protruding part. The utility model discloses an optical sensor has good dampproofing effect to and the reliance of comparatively compact encapsulation volume, preferred.

Description

Optical sensor and bracket set

Technical Field

The utility model relates to a light sensor and support group especially relate to a light sensor and support group with good dampproofing effect.

Background

The existing common optical sensor is in a humid environment, external moisture easily permeates into the optical sensor from the space between the packaging structure and the support group, and further the optical sensor can be caused to malfunction, even fail and destroy. In addition, the conventional common optical sensor also has the problem of large packaging volume. Therefore, it is a problem to be solved for the related art to reduce the size and improve the moisture-proof effect of the optical sensor.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a light sensor and support group, its one of them purpose are used for improving current light sensor, and in humid environment, outside aqueous vapor is easily by between packaging structure and the support group, in the infiltration light sensor to lead to the light sensor malfunction, inefficacy or destroy.

The utility model discloses a light sensor and support group, another purpose is used for improving the current common light sensor encapsulation bulky, the not good problem of reliability.

The utility model discloses a one of them embodiment discloses an optical sensor, its characterized in that, optical sensor contains: the light emitting module comprises a first bracket group, a second bracket group, a light receiving component, a light emitting component and a packaging structure. The first bracket group comprises: a first die bonding bracket and a first wiring bracket. The first die bonding bracket comprises a first die bonding part; the first wiring support comprises a first wiring part, and the first wiring support and the first die bonding support are oppositely arranged at intervals; at least one of the first die bonding part and the first wiring part extends towards the first wiring part or the first die bonding part to form a first protruding part, and the thickness of the first protruding part is smaller than that of the first die bonding bracket or the first wiring bracket connected with the first protruding part; the second stent set comprises: a second die bonding bracket and a second wiring bracket. The second die bonding bracket comprises a second die bonding part; the second wiring support comprises a second wiring part, and the second wiring support and the second die bonding support are arranged oppositely at intervals; at least one of the second die bonding part and the second wiring part extends towards the second wiring part or the second die bonding part to form a second protruding part, and the thickness of the second protruding part is smaller than that of a second die bonding bracket or a second wiring bracket connected with the second protruding part; the light receiving assembly is arranged on the first bracket group; the light emitting component is arranged on the second bracket group; the packaging structure wraps the peripheries of the first die bonding support, the first wiring support, the second die bonding support and the second wiring support, fills a space between the first wiring support and the first die bonding support and a space between the second wiring support and the second die bonding support, and wraps the first protruding portion and the second protruding portion.

Preferably, the optical sensor includes at least one first groove and at least one second groove, the at least one first groove is formed in at least one of the first die attach bracket and the first wire attach bracket, and the at least one first groove is correspondingly disposed on a side of at least one of the first die attach portion and the first wire attach portion; the at least one second groove is formed in at least one of the second die bonding support and the second wiring support, and the at least one second groove is correspondingly arranged on the side edge of at least one of the second die bonding portion and the second wiring portion.

Preferably, the first die bonding bracket further comprises a first welding part arranged opposite to the first die bonding part and a second welding part arranged opposite to the first wiring part; the second die bonding support further comprises a third welding part and a fourth welding part, wherein the third welding part is opposite to the second die bonding part, and the fourth welding part is opposite to the second wiring part.

Preferably, the light receiving element includes a light receiving chip and a first metal wire, the light receiving chip is disposed on the first die attach portion and electrically coupled to the first wiring portion through the first metal wire; the light emitting component comprises a light emitting chip and a second metal wire, wherein the light emitting chip is arranged on the second die bonding part and is electrically coupled with the second wiring part through the second metal wire.

Preferably, the package structure includes a first cavity and a second cavity, the light receiving element is located in the first cavity, and the light receiving element, a portion of the first die bonding portion and a portion of the first wiring portion are exposed out of the first cavity; the light emitting assembly is located in the second cavity, and the light emitting assembly, a part of the second die bonding portion and a part of the second wiring portion are exposed out of the second cavity.

Preferably, the optical sensor further includes two packages respectively disposed in the first chamber and the second chamber.

Preferably, the packaging structure includes a plurality of first retaining walls and a plurality of second retaining walls, an intermediate retaining wall and two spacing portions, the intermediate retaining wall is located between the first bracket set and the second bracket set, the plurality of first retaining walls and the plurality of second retaining walls and the intermediate retaining wall define a first chamber and a second chamber together, one of the spacing portions is located between the first die bonding portion and the first wiring portion, and the other spacing portion is located between the second die bonding portion and the second wiring portion.

Preferably, the package structure further includes two dam portions, each dam portion is located at one side of the corresponding first retaining walls and the corresponding second retaining walls opposite to the first support set and the second support set, the two dam portions, the first retaining walls and the second retaining walls form two auxiliary grooves together, and the two auxiliary grooves are communicated with the corresponding first chamber and the corresponding second chamber; two dam parts above the middle retaining wall form a reserved groove together.

Preferably, the width of the pre-groove is one third of the total width of the two dam portions above the middle retaining wall.

Preferably, the plurality of first retaining walls and the plurality of second retaining walls surround and cover the periphery of the first die attach bracket, the periphery of the first wire connecting bracket, the periphery of the second die attach bracket and the periphery of the second wire connecting bracket, and are filled in the first groove and the second groove, and at least part of the first welding part, the second welding part, the third welding part and the fourth welding part are exposed.

Preferably, the first retaining wall and the middle retaining wall partially close to the first bracket set jointly form a first groove bottom opening, and the total area of the packaging structure filled in each first groove exposed out of the first groove bottom opening is 0.3-1 times of the total area of the first bracket set exposed out of the first groove bottom opening.

Preferably, the second retaining wall and the middle retaining wall, which are partially close to the second bracket set, form a second groove bottom opening together, and the total area of the package structure filled in each second groove exposed out of the second groove bottom opening is 0.3-1 times of the total area of the second bracket set exposed out of the second groove bottom opening.

Preferably, the thickness of the intermediate retaining wall gradually decreases from the end close to the first bracket set and the second bracket set to the end far away from the first bracket set and the second bracket set.

Preferably, the maximum thickness of the intermediate retaining wall is at least 2 times the minimum thickness of the intermediate retaining wall.

Preferably, a pre-groove is formed at one end of the intermediate retaining wall, and the height of the pre-groove does not exceed the height of the intermediate retaining wall.

Preferably, at least one of the first die bonding support, the first wire bonding support, the second die bonding support and the second wire bonding support has an auxiliary recess and a sharp corner structure formed in a recess on one side thereof, and the auxiliary recess and the sharp corner structure are covered by the package structure.

Preferably, the number of the at least one first groove and the first protruding portion of the first bracket set is two, the two first grooves are respectively formed on the first die attach bracket and the first wire connecting bracket, and the two first protruding portions are opposite and have a spacing configuration; one first groove is arranged around three sides of the first die bonding part, the other first groove is arranged around three sides of the first wiring part, and two ends of each first groove extend to one side of the first die bonding bracket or the first wiring bracket and are communicated with the first die bonding bracket or the first wiring bracket at intervals; each first protruding portion protrudes from one side of the adjacent first welding portion or the adjacent second welding portion, each first protruding portion and the adjacent first welding portion or the adjacent second welding portion respectively define a first recess, and the package structure is filled in the first recess.

Preferably, the number of the at least one second groove and the second protrusion of the second bracket set is two, the two second grooves are respectively formed on the second die attach bracket and the second wire connection bracket, and the two second protrusions are opposite and have a spacing configuration; one of the second grooves is arranged around three sides of the second die bonding part, the other second groove is arranged around three sides of the second wiring part, and two ends of each second groove extend to one side of the second die bonding bracket or the second wiring bracket and are communicated with the second die bonding bracket or the second wiring bracket at intervals; each second protruding portion protrudes from one side of the adjacent third soldering portion or the adjacent fourth soldering portion, and each second protruding portion and the adjacent third soldering portion or the adjacent fourth soldering portion respectively define a second recess, and the package structure is filled in the second recess.

Preferably, at least one side of at least one of the first die attach carrier and the first wire bond carrier is recessed to form a first recess, and the package structure is filled in the first recess.

Preferably, at least one side of at least one of the second die attach carrier and the second wire bond carrier is recessed to form a second recess, and the package structure is filled in the second recess.

The utility model discloses a one of them embodiment discloses a support group, its characterized in that, support group contains: solid brilliant support, wiring support and an at least recess. The die bonding bracket comprises a die bonding part; the wiring support comprises a wiring part, and the wiring support and the die bonding support are oppositely arranged at intervals; at least one groove is formed in at least one of the die bonding support and the wiring support, and the at least one groove is correspondingly arranged on the side edge of at least one of the die bonding part and the wiring part; at least one of the die bonding part and the wire connection part extends towards the wire connection part or the die bonding part to form a protruding part, and the thickness of the protruding part is smaller than that of the die bonding support or the wire connection support connected with the protruding part.

Preferably, the die bonding bracket further comprises a first welding part arranged opposite to the die bonding part and a second welding part arranged opposite to the wire connecting part.

Preferably, one side of at least one of the die bonding support and the wire connection support is concave, and an auxiliary concave and sharp-angled structure is formed.

Preferably, the number of the at least one groove and the protruding parts of the bracket set is two, the two grooves are respectively formed on the die attach bracket and the wire connecting bracket, and the two protruding parts are opposite and have a spacing configuration; one groove is arranged around three sides of the die bonding part, the other groove is arranged around three sides of the wiring part, and two ends of each groove extend to one side of the die bonding bracket or the wiring bracket and are communicated with the space; each protruding portion protrudes from one side of the adjacent first welding portion or the adjacent second welding portion, and each protruding portion and the adjacent first welding portion or the adjacent second welding portion respectively define a recess together.

Preferably, at least one side of at least one of the die bonding support and the wire connection support is recessed to form a recess.

The utility model discloses a one of them embodiment discloses a light sensor, and it contains: a first bracket set, a second bracket set, a light receiving component, a light emitting component and a packaging structure. The first bracket group comprises: a first die bonding support, a first wiring support and at least one first groove. The first die bonding bracket comprises a first die bonding part; the first wiring support comprises a first wiring part, and the first wiring support and the first die bonding support are arranged at intervals; at least one first groove is formed in at least one of the first die bonding support and the first wiring support and correspondingly surrounds at least one of the first die bonding part and the first wiring part; the second stent set comprises: a second die bonding support, a second wiring support and at least one second groove. The second die bonding bracket comprises a second die bonding part; the second wiring support comprises a second wiring part, and the second wiring support and the second die bonding support are arranged at intervals; at least one second groove is formed in at least one of the second die bonding support and the second wiring support and correspondingly surrounds at least one of the second die bonding part and the second wiring part; the light receiving assembly is arranged on the first bracket group; the light emitting component is arranged on the second bracket group; the packaging structure wraps the peripheries of the first die bonding support, the first wiring support, the second die bonding support and the second wiring support and is filled in the first groove and the second groove.

The utility model discloses a one of them embodiment discloses a support group, its characterized in that, support group contains: solid brilliant support and wiring support. The die bonding bracket comprises a die bonding part; the wiring support comprises a wiring part, and the wiring support and the die bonding support are oppositely arranged at intervals; at least one of the die bonding part and the wiring part extends towards the wiring part or the die bonding part to form a protruding part, and the thickness of the protruding part is smaller than that of the die bonding support or the wiring support connected with the protruding part.

To sum up, the utility model discloses an optical sensor and support group through designs such as first recess, first protruding portion, second recess and second protruding portion, can promote optical sensor's dampproofing effect effectively, and can promote optical sensor's life effectively.

For a further understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are only intended to illustrate the present invention, and not to limit the scope of the present invention.

Drawings

Fig. 1 is a schematic view of the optical sensor of the present invention.

Fig. 2 is a top view of the optical sensor of the present invention.

Fig. 3 is a bottom view of the optical sensor of the present invention.

Fig. 4 is a schematic view of the bracket set, the light receiving module and the light emitting module of the present invention.

Fig. 5 is a schematic view of the bracket set of the present invention.

Fig. 6 is a top view of the bracket set of the present invention.

Fig. 7 is a bottom view of the bracket set of the present invention.

Fig. 8 is a schematic sectional view along the sectional line VIII-VIII of fig. 6.

Fig. 9 is a schematic sectional view along the line IX-IX of fig. 6.

Fig. 10 is a schematic sectional view taken along the line X-X of fig. 6.

Fig. 11 is a schematic sectional view along the section line XI-XI of fig. 6.

Fig. 12 is a cross-sectional view taken along section line XII-XII in fig. 2.

Fig. 13 is a schematic sectional view along the section line XIII-XIII of fig. 2.

FIG. 14 is a schematic sectional view taken along line XIV-XIV of FIG. 2.

Fig. 15 is a schematic sectional view taken along line XV-XV in fig. 2.

Fig. 16 is a top view of another embodiment of a support assembly in accordance with the present invention.

Detailed Description

In the following description, reference is made to or shown in the accompanying drawings for the purpose of illustrating the subject matter described herein, and in which is shown by way of illustration only, and not by way of limitation, specific reference may be made to the drawings.

Referring to fig. 1 to 4, an optical sensor 100 of the present invention includes a first bracket set 1, a second bracket set 2, a light receiving element 3, a light emitting element 4, and a package structure 5. In the present embodiment, the optical sensor 100 further includes two packages 6, but not limited thereto. In various embodiments, the light sensor 100 may not include the package 6.

The light receiving component 3 is disposed on the first bracket set 1, the light emitting component 4 is disposed on the second bracket set 2, and the package structure 5 is used for covering a portion of the first bracket set 1 and a portion of the second bracket set 2. In the present embodiment, the light receiving element 3 includes a light receiving chip 31 and a first metal wire 32; the light emitting element 4 includes a light emitting chip 41 and a second metal wire 42, but not limited thereto. For example, in other embodiments, the light emitting element 4 may be a flip chip (flip chip).

As shown in fig. 4 to 9, 10, and 12, the first rack set 1 includes: a first die bonding frame 11 and a first wire bonding frame 12, and the first die bonding frame 11 and the first wire bonding frame 12 are separated from each other (i.e. they are not directly connected) and have a gap G1. In addition, the first bracket set 1 further includes at least one first groove 13 formed on the first die bond bracket 11 and/or the first wire connection bracket 12.

The first die bonding bracket 11 includes a first die bonding portion 111, a first protrusion 112 and a first soldering portion 113. The first die bonding portion 111 is used to dispose the light receiving chip 31 of the light receiving module 3, and the light receiving chip 31 may be a red light receiving chip or a laser receiving chip, but not limited thereto. In the embodiment, two first grooves 13 are taken as an example, but the number, structure and forming position of the first grooves 13 included in the first bracket set 1 are not limited by the embodiment of the present invention, and may be changed according to design requirements. In detail, one of the first grooves 13 is formed in the first die bonding bracket 11, and the first groove 13 is disposed around at least two sides of the first die bonding portion 111. In other words, the first groove 13 may be formed continuously or discontinuously on the first die attach carrier 11. In the present embodiment, the first groove 13 is disposed around three sides of the first die bonding part 111, and two ends of the first groove 13 are disposed to extend to one side of the first die bonding support 11 and communicate with the gap G1.

The first welding portion 113 is disposed opposite to the first die bonding portion 111, and the first welding portion 113 and the first die bonding portion 111 are disposed on two opposite sides of the first die bonding frame 11. The first soldering portion 113 is used to be soldered and fixed to the related circuit board.

In addition, the first die bonding frame 11 further includes at least one first recess 114, in other words, at least one side of the first die bonding frame 11 is recessed to form the first recess 114. For example, the first die bonding portion 111 extends to the direction of the first wire bonding portion 121 to form a first protrusion 112, and the thickness of the first protrusion 112 is smaller than that of the first die bonding bracket 11, so that the first protrusion 112 and the adjacent first bonding portion 113 together form a first recess 114. In the present embodiment, it is preferable that the four sides of the first die bonding support 11 are recessed to form the first recesses 114, but the number of the first recesses 114 included in the first die bonding support 11 is not limited thereto, and may be changed according to the shape of the first die bonding support 11.

As shown in fig. 4 to 9 and 10, the first wire connecting bracket 12 includes a first wire connecting portion 121, a first protruding portion 122 and a second soldering portion 123. The first wire portion 121 is electrically coupled to one end of the first metal wire 32 of the light receiving element 3, and the other end of the first metal wire 32 is electrically coupled to the light receiving chip 31.

Another first groove 13 is formed in the first wire connection bracket 12, and the first groove 13 is disposed around at least two sides of the first wire connection portion 121, and both ends of the first groove 13 extend to one side of the first wire connection bracket 12 to be disposed and communicate with the gap G1.

The second welding part 123 is disposed opposite to the first wire part 121, and the second welding part 123 and the first wire part 121 are disposed on opposite sides of the first wire holder 12. The second soldering portion 123 is used for being soldered and fixed to the related circuit board.

In addition, the first wire connection bracket 12 further includes at least one first recess 124, in other words, at least one side of the first wire connection bracket 12 is recessed to form the first recess 124. For example, the first wire connecting portion 121 extends toward the first die attach carrier 11 to form a first protrusion 122, and the thickness of the first protrusion 122 is smaller than that of the first wire attach carrier 12, so that the first protrusion 122 and the adjacent second soldering portion 123 together form a first recess 124. The first protrusion 122 and the second welding portion 123 form a first recess 124, and the first protrusion 112 and the adjacent first welding portion 113 form a first recess 114, which are disposed opposite to each other. In the present embodiment, it is preferable that the first recesses 124 are formed by recessing four sides of the first wire connection bracket 12, but the number of the first recesses 124 included in the first wire connection bracket 12 is not limited thereto, and may vary according to the shape of the first wire connection bracket 12.

It should be noted that, in different embodiments, the first bracket set 1 may also include only a single first groove 13, and the first groove 13 may be formed in the first die attach bracket 11 or the first wire attach bracket 12. In different embodiments, the first bracket group 1 may only include a single first protrusion, and the single first protrusion may be formed on the first die attach bracket 11 or the first wire attach bracket 12.

As shown in fig. 4 to 9, 11 and 12, the second bracket set 2 includes: a second die attach frame 21, a second wire attach frame 22, and the second die attach frame 21 and the second wire attach frame 22 are separated from each other (i.e. they are not directly connected) and have a gap G2. In addition, the second bracket set 2 further includes at least one second groove 23 formed on the second die attach bracket 21 and/or the second wire attach bracket 22.

The second die bonding bracket 21 includes a second die bonding portion 211, a second protrusion 212 and a third soldering portion 213. The second die bonding portion 211 is used to dispose the light emitting chip 41 of the light emitting device 4, and the light emitting chip 41 may be a red light emitting chip or a laser light emitting chip, but not limited thereto. In the embodiment, two second grooves 23 are taken as an example, but the number, structure and forming position of the second grooves 23 included in the second bracket set 2 are not limited to the embodiment of the present invention, and may be changed according to design requirements. In detail, one of the second grooves 23 is formed in the second die bonding bracket 21, and the second groove 23 is disposed around at least two sides of the second die bonding portion 211. In other words, the second groove 23 may be formed continuously or discontinuously on the second die attach frame 21. In the present embodiment, the second groove 23 is disposed around three sides of the second die bonding part 211, and two ends of the second groove 23 extend to one side of the second die bonding bracket 21 and are connected to the gap G2.

The third welding portion 213 is disposed opposite to the second die bonding portion 211, and the third welding portion 213 and the second die bonding portion 211 are disposed on two opposite sides of the second die bonding frame 21. The third soldering portion 213 is used for soldering and fixing to the related circuit board.

In addition, the second die bonding support 21 further includes at least one second recess 214, in other words, at least one side of the second die bonding support 21 is recessed to form the second recess 214. For example, the second die bonding portion 211 extends toward the second wire connecting portion 221 to form a second protrusion 212, and the thickness of the second protrusion 212 is smaller than that of the second die bonding bracket 21, so that the second protrusion 212 and the adjacent third bonding portion 213 together form a second recess 214.

In the present embodiment, it is preferable that the second die bonding frame 21 is formed with the second recesses 214 recessed into four sides, but the number of the second recesses 214 included in the second die bonding frame 21 is not limited thereto, and may be changed according to the shape of the second die bonding frame 21.

The second wire holder 22 includes a second wire portion 221, a second protrusion 222 and a fourth soldering portion 223. The second wiring portion 221 is electrically coupled to one end of the second metal wire 42 of the light emitting device 4, and the other end of the second metal wire 42 is electrically coupled to the light emitting chip 41.

Another second groove 23 is formed in the second wire connection bracket 22, and the second groove 23 is disposed around at least two sides of the second wire connection portion 221, and both ends of the second groove 23 extend to one side of the second wire connection bracket 22 to be disposed and communicate with the gap G2.

The fourth welding part 223 is disposed opposite to the second wire connecting part 221, and the fourth welding part 223 and the second wire connecting part 221 are disposed on opposite sides of the second wire connecting bracket 22. The fourth soldering portion 223 is used for soldering and fixing to the related circuit board.

Furthermore, the second wire holder 22 further includes at least one second recess 224, in other words, at least one side of the second wire holder 22 is recessed to form the second recess 224. For example, the second wire connecting portion 221 extends toward the second die attach bracket 21 to form a second protrusion 222, and the thickness of the second protrusion 222 is smaller than that of the second wire connecting bracket 22, so that the second protrusion 222 and the adjacent fourth soldering portion 223 together form a second recess 224. The second protrusion 222 and the fourth welding portion 223 form a second recess 224, and the second protrusion 212 and the adjacent third welding portion 213 form a second recess 214, which are disposed opposite to each other.

In the present embodiment, it is preferable that the second recess 224 is formed in all four sides of the second wire connecting bracket 22, but the number of the second recesses 224 included in the second wire connecting bracket 22 is not limited thereto, and may be changed according to the shape of the second wire connecting bracket 22. In the embodiment where the second wire holder 22 includes only a single second recess 224, the second recess 224 may be formed by the second protrusion 222 and the fourth soldering portion 223.

It should be noted that, in different embodiments, the second holder group 2 may also include only a single second groove 23, and the second groove 23 may be formed in the second die attach holder 21 or the second wire attach holder 22. In different embodiments, the second holder group 2 may only include a single second protrusion, and the single second protrusion may be formed on the second die attach holder 21 or the second wire attach holder 22.

As shown in fig. 1 to 4 and 12 to 15, the package structure 5 covers the periphery of the first die attach bracket 11, the periphery of the first wire attach bracket 12, the periphery of the second die attach bracket 21, and the periphery of the second wire attach bracket 22, and is filled in at least one of the first recess 13, the first recesses 114, 124, the second recess 23, and the second recesses 214, 224, and the package structure 5 is filled in the gaps G1, G2, and exposes at least the light receiving module 3, the light emitting module 4, a portion of the first die attach portion 111 and the first solder portion 113, a portion of the first wire attach portion 121 and the second solder portion 123, a portion of the second die attach portion 211 and the third solder portion 213, and a portion of the second wire attach portion 221 and the fourth solder portion 223. In practical applications, the package structure 5 may be formed on the first frame set 1 and the second frame set 2 by using an injection molding technique, but not limited thereto.

The package structure 5 includes a plurality of retaining walls and a plurality of spacers. In the present embodiment, the package structure 5 includes three first walls 53A, an intermediate wall 54, three second walls 53B and two spacers 51 and 52. The three first retaining walls 53A and the intermediate retaining wall 54 are connected and wrap around the periphery of the first die bond support 11 and the periphery of the first wiring support 12 to form a first cavity 55, and the light receiving element 3 is correspondingly located in the first cavity 55. The three second retaining walls 53B and the intermediate retaining wall 54 are connected to and surround and cover the periphery of the second die attach carrier 21 and the periphery of the second wire attach carrier 22 to form a second cavity 56, and the light emitting element 4 is correspondingly located in the second cavity 56. In the present embodiment, two packages 6 are correspondingly disposed in the first cavity 55 and the second cavity 56, respectively covering the light receiving element 3 and the light emitting element 4. Wherein, the two packaging bodies 6 are made of light-permeable materials.

Briefly, as shown in fig. 1 to 3 and 12 to 15, the light receiving element 3 is located in the first cavity 55, and the light receiving element 3, a portion of the first die bonding portion 111 and a portion of the first wire connecting portion 121 are exposed out of the first cavity 55; the light emitting assembly 4 is located in the second cavity 56, and the light emitting assembly 4, a portion of the second die bonding portion 211 and a portion of the second wiring portion 221 are exposed out of the second cavity 56; a portion of the first soldering portion 113, a portion of the second soldering portion 123, a portion of the third soldering portion 213 and a portion of the fourth soldering portion 223 are exposed to the other side of the package structure 5. Because the pin design of publicly-known outwards extending and buckling has been avoided, so the utility model discloses an optical sensor's encapsulation volume can be comparatively compact.

As shown in fig. 12 to 15, in the present embodiment, a portion of the first retaining wall 53A and the intermediate retaining wall 54 is filled in the adjacent first groove 13 and the adjacent first recesses 114 and 124 to cover the side of the first die attach carrier 11 and the side of the first wire attach carrier 12.

Similarly, as shown in fig. 12 to 15, a portion of the second retaining wall 53B and the intermediate retaining wall 54 is filled in the adjacent second groove 23 and the adjacent second recesses 214 and 224 to cover the side of the second die attach bracket 21 and the side of the second wire attach bracket 22. As shown in fig. 1, 2, 14 and 15, the two spacers are respectively defined as a first spacer 51 and a second spacer 52. The first spacer 51 is located in the first cavity 55 and located between the first die bonding portion 111 and the first wire portion 121. The second spacer 52 is located in the second cavity 56 and between the second die bonding portion 211 and the second wire portion 221.

As shown in fig. 14, the first partition 51 may include an upper section 511, a middle section 512 and a lower section 513, wherein two ends of the middle section 512 are respectively connected to the upper section 511 and the lower section 513. In the present embodiment, the upper section 511 covers a top surface 1121 of the portion of the first protrusion 112 and a top surface 1221 of the portion of the first protrusion 122; the middle section 512 is located between the first protrusion 112 of the first die attach carrier 11 and the first protrusion 122 of the first wire attach carrier 12, and fills up the gap G1 between the first die attach carrier 11 and the first wire attach carrier 12; a portion of the lower section 513 is filled in the first recess 114 formed by the first protrusion 112 and the first welding portion 113, and the first recess 124 formed by the first protrusion 122 and the second welding portion 123. In other words, the first spacing portion 51 has a substantially i-shaped profile in the cross-sectional view of fig. 14, so as to effectively cover the edge of the first die bonding bracket 11 and the edge of the first wire connecting bracket 12. By the design of the upper section 511, the middle section 512, and the lower section 513 of the first spacing portion 51, the connection strength between the first die attach bracket 11 and the first wire connecting bracket 12 can be effectively strengthened, and the first die attach bracket 11 can be prevented from moving relative to the first wire connecting bracket 12, thereby effectively preventing the first metal wire 32 from being broken.

As shown in fig. 15, the second spacer 52 may include an upper stage 521, a middle stage 522 and a lower stage 523, wherein two ends of the middle stage 522 are respectively connected to the upper stage 521 and the lower stage 523. In the present embodiment, the upper section 521 covers a portion of a top surface 2121 of the second protrusion 212 and a top surface 2221 of the second protrusion 222; the middle section 522 is located between the second protrusion 222 of the second die attach bracket 21 and the second protrusion 222 of the second wire attach bracket 22, and fills the gap G2 between the second die attach bracket 21 and the second wire attach bracket 22; the lower segment 523 fills the second recess 214 formed by the second protrusion 212 and the third welding part 213, and the second recess 224 formed by the second protrusion 222 and the fourth welding part 223.

In other words, the second spacer 52 has a substantially i-shaped profile in the cross-sectional view shown in fig. 15, so as to effectively cover the edge of the second die attach carrier 21 and the edge of the second wire attach carrier 22. By the design of the upper section 521, the middle section 522, and the lower section 523 of the second spacing portion 52, the connection strength between the second die attach bracket 21 and the second wire attach bracket 22 can be effectively strengthened, and the second die attach bracket 21 can be prevented from moving relative to the second wire attach bracket 22, so as to effectively prevent the second metal wire 42 from being broken.

As described above, the connection strength between the package structure 5 and the first and second frame assemblies 1 and 2 can be effectively strengthened by the design of the first recess 13, the first recesses 114 and 124, the second recess 23, the second recesses 214 and 224, and the design of the first retaining wall 53A, the first spacing portion 51, the second retaining wall 53B, the second spacing portion 52, and the intermediate retaining wall 54.

Furthermore, as shown in fig. 12 and 13, in a preferred embodiment, the thickness of the intermediate wall 54 gradually decreases from the end close to the first bracket set 1 and the second bracket set 2 to the end away from the first bracket set 1 and the second bracket set 2, and the maximum thickness of the intermediate wall 54 is at least 2 times of the minimum thickness of the intermediate wall 54, so that the connection strength between the intermediate wall 54, the first bracket set 1 and the second bracket set 2 can be further improved, and the light of the emitting chip 41 can be effectively prevented from penetrating the intermediate wall 54, and the Dark Current (Dark Current) caused by the light leakage from the emitting chip 41 received by the light receiving chip 31 can be prevented. Because if the light receiving chip 31 receives the light beam leaked from the light emitting chip 41 (i.e. the optical crosstalk problem occurs), the light sensor 100 may malfunction, and even the light sensor 100 may fail.

In addition, as shown in fig. 12 and 13, the intermediate retaining wall 54 can be divided into an upper section 54A, a middle section 54B and a lower section 54C, wherein one end of the middle section 54B is connected to the upper section 54A. The first and second chambers 55, 56 are located on either side of the upper section 54A; the middle section 54B is located between the first bracket set 1 and the second bracket set 2; a portion of the lower section 54C is located in the first recesses 114, 124 of the first bracket set 1, another portion of the lower section 54C is located in the second recesses 214, 224 of the second bracket set 2, and the entire intermediate retaining wall 54 is generally i-shaped. Therefore, the connection strength between the retaining wall 54, the first bracket set 1 and the second bracket set 2 can be further improved.

In addition, as shown in fig. 1, fig. 2, fig. 12 and fig. 13, in one preferred embodiment, the three first retaining walls 53A and the intermediate retaining wall 54 define a first trench bottom opening 551 together, and the total area of the package structure 54X filled in each first groove 13 exposed to the first trench bottom opening 551 is 0.3 to 1 times the total area of the first frame set (i.e., a part of the surface of the first die bonding portion 111 and a part of the surface of the first wire bonding portion 121) exposed to the first trench bottom opening 551.

Similarly, the three second retaining walls 53B and the middle retaining wall 54 define a second trench bottom 561 together, and the total area of the package structure 54Y filled in each second groove 23 exposed to the second trench bottom 561 is 0.3-1 times of the total area of the second support set (i.e. a part of the surface of the second die bonding portion 211 and a part of the surface of the second wire portion 221) exposed to the second trench bottom 561. Therefore, the package structure 5, the first bracket set 1 and the second bracket set 2 have relatively better strength, and the overall moisture-proof effect of the optical sensor 100 can be effectively improved.

As shown in fig. 1, 2 and 12 to 15, in a preferred embodiment, the package structure 5 may further include two dam portions 57, and each dam portion 57 is located on a side of the plurality of retaining walls 53A and 53B opposite to the first bracket set 1 and the second bracket set 2. Since the dam 57 is connected to the plurality of retaining walls 53A/53B and forms a stepped structure with a step difference, the two dam 57 and the plurality of retaining walls 53A, 53B together form two auxiliary tanks 571, and each auxiliary tank 571 is communicated with the corresponding first chamber 55/second chamber 56. In this embodiment, one of the packages 6 is filled in the first chamber 55 and one of the auxiliary slots 571, and the other package 6 is filled in the second chamber 56 and the other auxiliary slot 571. The connection strength between the package 6 and the package structure 5 can be effectively enhanced by the design of the two dam portions 57 and the auxiliary groove 571. In one preferred embodiment, as shown in fig. 12, the two dam portions 57 at one end of the upper section 54A of the intermediate wall 54 may be unconnected or partially connected to each other and together define a predetermined groove 541. The width 541D of the pre-groove 541 may be approximately one third of the total width 57D of the two dam portions 57 located above the intermediate wall 54, and the height 541H of the pre-groove 541 does not exceed the height of the intermediate wall 54. In other embodiments, the dam 57 may be omitted from the package structure 5, and a pre-groove 541 is formed in an end of the upper section 54A of the middle wall 54 that is recessed toward the middle section 54B, but not limited thereto.

As described above, by the design of the pre-groove 541, when the related equipment pours more than a predetermined amount of the packaging adhesive into the first chamber 55 or the second chamber 56, the packaging adhesive overflowing from the first chamber 55 or the second chamber 56 can flow into the pre-groove 541, so that the problem that the package 6 in the first chamber 55 and the package 6 in the second chamber 56 are connected to each other can be effectively avoided. Since crosstalk (crosstalk) occurs in the optical sensor 100 if the package 6 in the first cavity 55 is communicated with the package 6 in the second cavity 56, the optical sensor 100 can be greatly reduced in the design of the reserved groove 541, thereby improving the product reliability.

Next, please refer to fig. 16, which is a top view of another embodiment of the bracket set according to the present invention. The present embodiment is different from the previous embodiments in that: a first auxiliary recess 115 is formed in one side of the first die bonding support 11, and a first sharp corner structure 116 is correspondingly formed; a first auxiliary recess 125 is formed at a concave side of the first connecting bracket 12, and a first pointed structure 126 is correspondingly formed; a second auxiliary recess 215 is formed in a concave portion on one side of the second die attach bracket 21, and a second sharp corner structure 216 is correspondingly formed; a second auxiliary recess 225 is formed in a side of the second terminal support 22, and a second pointed structure 226 is correspondingly formed.

The auxiliary recesses 115, 125, 215, 225 and the pointed structures 116, 126, 216, 226 are used for covering the package structure 5 (as shown in fig. 1), so that the connection strength between the first bracket set 1 (or the second bracket set 2) having the auxiliary recesses and the pointed structures and the package structure 5 can be effectively improved. The positions of the auxiliary recesses and the corresponding pointed structures are not limited to those shown in the drawings, and may be varied according to the requirements. In different embodiments, at least one of the first die bonding bracket 11, the first wire bonding bracket 12, the second die bonding bracket 21 and the second wire bonding bracket 22 may have an auxiliary recess and a corresponding pointed structure.

In particular, the holder groups (the first holder group 1 and the second holder group 2) described in the above embodiments may be manufactured, implemented, or sold separately in practical applications, and the holder groups (the first holder group 1 and the second holder group 2) are not limited to being manufactured, implemented, or sold together with the optical sensor 100.

To sum up, the utility model discloses an optical sensor and support group through design such as first/second recess, first/second protruding portion, first/second are sunken, packaging structure, can promote packaging structure and support group joint strength each other by a wide margin, from this, can also prevent outside dirt, aqueous vapor from getting into support group further to can further promote optical sensor's dampproofing, dirt-proof effect, and can promote the holistic life of optical sensor.

The above is only the feasible embodiment of preferred of the utility model, therefore not limit the patent scope of the utility model, so all use the equivalent technical change that the contents of the specification and the attached drawings were done all contain in the protection scope of the utility model.

Claims (27)

1. A light sensor, comprising:

a first bracket set comprising

A first die bonding bracket including a first die bonding portion; and

the first wiring support comprises a first wiring part, and the first wiring support and the first die bonding support are oppositely arranged at intervals;

at least one of the first die bonding part and the first wiring part extends towards the first wiring part or the first die bonding part to form a first protruding part, and the thickness of the first protruding part is smaller than that of the first die bonding bracket or the first wiring bracket connected with the first protruding part;

a second stent group comprising

A second die bonding support including a second die bonding portion; and

the second wiring support comprises a second wiring part, and the second wiring support and the second die bonding support are oppositely arranged at intervals;

at least one of the second die bonding part and the second wiring part extends towards the second wiring part or the second die bonding part to form a second protruding part, and the thickness of the second protruding part is smaller than that of the second die bonding bracket or the second wiring bracket connected with the second protruding part;

a light receiving assembly disposed on the first bracket set;

the light emitting component is arranged on the second bracket group; and

and the packaging structure covers the peripheries of the first die bonding support, the first wiring support, the second die bonding support and the second wiring support, fills a gap between the first wiring support and the first die bonding support and a gap between the second wiring support and the second die bonding support, and covers the first protruding part and the second protruding part.

2. The optical sensor according to claim 1, further comprising at least one first groove and at least one second groove, wherein the at least one first groove is formed on at least one of the first die attach carrier and the first wire attach carrier, and the at least one first groove is correspondingly disposed on a side of at least one of the first die attach carrier and the first wire attach carrier; the at least one second groove is formed in at least one of the second die bonding support and the second wiring support, and the at least one second groove is correspondingly arranged on the side edge of at least one of the second die bonding portion and the second wiring portion.

3. The optical sensor according to claim 2, wherein the first die attach frame further comprises a first bonding portion disposed opposite to the first die attach portion, and a second bonding portion disposed opposite to the first wiring portion; the second die bonding support further comprises a third welding portion and a fourth welding portion, the third welding portion is opposite to the second die bonding portion, and the fourth welding portion is opposite to the second wiring portion.

4. The optical sensor according to claim 3, wherein the light receiving element comprises a light receiving chip and a first metal wire, the light receiving chip is disposed on the first die attach portion and electrically coupled to the first wiring portion through the first metal wire; the light emitting assembly comprises a light emitting chip and a second metal wire, wherein the light emitting chip is arranged on the second die bonding part and is electrically coupled with the second wiring part through the second metal wire.

5. The optical sensor according to claim 3, wherein the package structure comprises a first cavity and a second cavity, the light receiving element is located in the first cavity, and the light receiving element, a portion of the first die bonding portion and a portion of the first wiring portion are exposed to the first cavity; the light emitting assembly is located in the second cavity, and the light emitting assembly, a part of the second die bonding portion and a part of the second wiring portion are exposed out of the second cavity.

6. The light sensor of claim 5, further comprising two packages disposed in the first and second chambers, respectively.

7. The optical sensor according to claim 5, wherein the package structure includes a plurality of first walls and a plurality of second walls, a plurality of intermediate walls, and two spacers, the intermediate walls are located between the first frame set and the second frame set, the plurality of first walls and the plurality of second walls and the intermediate walls define together to form the first chamber and the second chamber, one of the spacers is located between the first die-bonding portion and the first wiring portion, and the other spacer is located between the second die-bonding portion and the second wiring portion.

8. The optical sensor according to claim 7, wherein the package structure further comprises two dam portions, each dam portion is located on a side of the corresponding first retaining walls and the second retaining walls opposite to the first bracket set and the second bracket set, and the two dam portions and the first retaining walls and the second retaining walls together form two auxiliary grooves, and the two auxiliary grooves are communicated with the corresponding first cavities and the corresponding second cavities; and a preformed groove is formed on the two dam enclosing parts above the middle retaining wall.

9. The optical sensor according to claim 8, wherein the width of the pre-groove is one third of the total width of the two dam portions located above the intermediate wall.

10. The optical sensor as claimed in claim 7, wherein a plurality of the first retaining walls and a plurality of the second retaining walls surround and cover the periphery of the first die attach carrier, the periphery of the first wire attach carrier, the periphery of the second die attach carrier and the periphery of the second wire attach carrier, and are filled in the first groove and the second groove to expose at least a portion of the first solder portion, the second solder portion, the third solder portion and the fourth solder portion.

11. The optical sensor as claimed in claim 7, wherein a first trench bottom opening is formed on a portion of the first retaining wall and the middle retaining wall adjacent to the first trench group, and a total area of the package structure filled in each of the first trenches exposed to the first trench bottom opening is 0.3 to 1 times of a total area of the first trench group exposed to the first trench bottom opening.

12. The optical sensor as claimed in claim 7, wherein a second trench bottom opening is formed on a portion of the second retaining wall and the middle retaining wall adjacent to the second frame set, and a total area of the package structure filled in each of the second grooves exposed to the second trench bottom opening is 0.3-1 times of a total area of the second frame set exposed to the second trench bottom opening.

13. The optical sensor as claimed in claim 7, wherein the thickness of the intermediate wall gradually decreases from the end near the first bracket set and the second bracket set to the end far from the first bracket set and the second bracket set.

14. The optical sensor of claim 13, wherein the maximum thickness of the intermediate retaining wall is at least 2 times greater than the minimum thickness of the intermediate retaining wall.

15. The optical sensor according to claim 13, wherein a pre-groove is formed at one end of the intermediate wall, and the height of the pre-groove does not exceed the height of the intermediate wall.

16. The optical sensor according to claim 1, wherein a side of at least one of the first die attach frame, the first wire attach frame, the second die attach frame, and the second wire attach frame is recessed to form an auxiliary recess and a pointed structure, and the auxiliary recess and the pointed structure are covered by the encapsulation structure.

17. The optical sensor according to claim 3, wherein the number of the at least one first groove and the first protrusion of the first frame set is two, the two first grooves are respectively formed on the first die attach frame and the first wire attach frame, and the two first protrusions are opposite and have a spacing arrangement; one of the first grooves is arranged around three sides of the first die bonding part, the other first groove is arranged around three sides of the first wiring part, and two ends of each first groove extend to one side of the first die bonding bracket or the first wiring bracket and are communicated with the first die bonding bracket or the first wiring bracket at intervals; each first protruding portion protrudes from one side of the adjacent first welding portion or the adjacent second welding portion, each first protruding portion and the adjacent first welding portion or the adjacent second welding portion respectively define a first recess, and the package structure is filled in the first recess.

18. The optical sensor as claimed in claim 17, wherein the number of the at least one second groove and the second protrusion of the second frame set is two, the two second grooves are respectively formed on the second die attach frame and the second wire attach frame, and the two second protrusions are opposite and have a spacing arrangement; one of the second grooves is arranged around three sides of the second die bonding part, the other second groove is arranged around three sides of the second wiring part, and two ends of each second groove extend to one side of the second die bonding bracket or the second wiring bracket and are communicated with the second die bonding bracket or the second wiring bracket at intervals; each second protruding portion protrudes from one side of the adjacent third soldering portion or the adjacent fourth soldering portion, and each second protruding portion and the adjacent third soldering portion or the adjacent fourth soldering portion respectively define a second recess together, and the package structure is filled in the second recess.

19. The optical sensor as claimed in claim 1, wherein at least one side of at least one of the first die attach carrier and the first wire bond carrier has a first recess formed therein, and the package structure is filled in the first recess.

20. The optical sensor as claimed in claim 19, wherein at least one side of at least one of the second die attach carrier and the second wire attach carrier has a second recess formed therein, and the package structure is filled in the second recess.

21. A stent set, comprising:

a die bonding bracket including a die bonding portion;

the wiring support comprises a wiring part, and the wiring support and the die bonding support are oppositely arranged at intervals; and

at least one groove formed in at least one of the die attach bracket and the wire attach bracket, the at least one groove being disposed on a side of at least one of the die attach portion and the wire attach portion;

at least one of the die bonding part and the wiring part extends towards the wiring part or the die bonding part to form a protruding part, and the thickness of the protruding part is smaller than that of the die bonding support or the wiring support connected with the protruding part.

22. The bracket set according to claim 21, wherein the die bonding bracket further comprises a first soldering portion disposed opposite to the die bonding portion, and a second soldering portion disposed opposite to the wire bonding portion.

23. The bracket set according to claim 21, wherein at least one of the die attach bracket and the wire attach bracket has a concave auxiliary recess and a pointed corner structure formed on a side thereof.

24. The bracket assembly according to claim 22, wherein the bracket assembly has two grooves and two protrusions, the two grooves are formed on the die attach bracket and the wire attach bracket, respectively, and the two protrusions are disposed opposite to each other and spaced apart from each other; one of the grooves is arranged around three side edges of the die bonding part, the other groove is arranged around three side edges of the wiring part, and two ends of each groove extend to one side edge of the die bonding support or the wiring support and are communicated with the space; each protruding portion protrudes from one side of the adjacent first welding portion or the adjacent second welding portion, and each protruding portion and the adjacent first welding portion or the adjacent second welding portion respectively define a recess.

25. The bracket set according to claim 21, wherein at least one side of at least one of the die attach bracket and the wire attach bracket is recessed to form a recess.

26. A light sensor, comprising:

a first bracket set including

A first die bonding support including a first die bonding portion;

the first wiring support comprises a first wiring part, and the first wiring support and the first die bonding support are arranged at intervals; and

at least one first groove formed in at least one of the first die attach carrier and the first wire attach carrier, the at least one first groove surrounding at least one of the first die attach section and the first wire attach section;

a second support set including

A second die bonding support including a second die bonding portion;

the second wiring support comprises a second wiring part, and the second wiring support and the second die bonding support are arranged at intervals; and

at least one second groove formed in at least one of the second die attach carrier and the second wire attach carrier, the at least one second groove surrounding at least one of the second die attach portion and the second wire attach portion;

a light receiving assembly disposed on the first bracket set;

the light emitting component is arranged on the second bracket group; and

and the packaging structure wraps the peripheries of the first die bonding support, the first wiring support, the second die bonding support and the second wiring support and is filled in the first groove and the second groove.

27. A stent set, comprising:

a die bonding support including a die bonding portion; and

the wiring support comprises a wiring part, and the wiring support and the die bonding support are oppositely arranged at intervals;

at least one of the die bonding part and the wiring part extends towards the wiring part or the die bonding part to form a protruding part, and the thickness of the protruding part is smaller than that of the die bonding support or the wiring support connected with the protruding part.

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