CN217094218U - Flow control device for conductive adhesive for chip manufacturing - Google Patents
Flow control device for conductive adhesive for chip manufacturing Download PDFInfo
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- CN217094218U CN217094218U CN202220142934.9U CN202220142934U CN217094218U CN 217094218 U CN217094218 U CN 217094218U CN 202220142934 U CN202220142934 U CN 202220142934U CN 217094218 U CN217094218 U CN 217094218U
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Abstract
The utility model relates to the technical field of chip manufacturing, in particular to a flow control device for conductive adhesive for chip manufacturing, which comprises an adhesive guiding device, a control device and an adhesive rolling device, wherein the control device is fixedly connected with the adhesive guiding device and is positioned on one side of the adhesive guiding device; the rubber coating device is including removing the subassembly, the backup pad, first cylinder, first connecting plate, the second cylinder, the second connecting plate, the roller frame, roller and daub the brush, the control device control is led the mucilage binding and is gone on leading of chip and glue when using, lead behind the gluey first cylinder with first connecting plate downstream to suitable position, the roller frame on the second cylinder promotes the second connecting plate, the roller on the roller frame is gone on the chip evenly rolls and is paintd electrically conductive gluey, the brush of daub assists evenly to paint, thereby the solution is because of not having even device of paining, lead to the inhomogeneous problem of rubber coating.
Description
Technical Field
The utility model relates to a chip manufacture technical field especially relates to a chip manufacture's flow control device for conducting resin.
Background
The existing contact type dispensing is easy to scratch a product, so that a piezoelectric injection valve is adopted, the characteristics of a piezoelectric material are utilized, mechanical force is generated through voltage, and when the piezoelectric material below is charged, the valve is opened; when the overlying piezoelectric material is charged, the valve closes. Because the space for opening and closing the valve is extremely small, the action frequency is extremely high, the liquid material with extremely small quantity can be ejected at high speed, the ejected liquid material is uniform, the surface of a product can not be contacted, and the scratch can be avoided. However, after the equipment is standby, a large amount of glue needs to be discharged, glue is wasted, and the flow control of gluing and glue discharging is difficult.
The prior art (CN214160304U) discloses a flow control device for conductive adhesive made of chips, which comprises piezoelectric ceramics and a positioning block, wherein the bottom of the piezoelectric ceramics is hinged with a lever, one end of the lever is fixed on a rack, the other end of the lever is hinged with a pressing cylinder, and a firing pin is fixed inside the pressing cylinder; the top of the positioning block is provided with a sliding chute, the bottom of the sliding chute is provided with a glue discharging hole, one side of the positioning block is provided with a glue applying hole communicated with the glue discharging hole, and the firing pin is slidably arranged in the glue discharging hole; the bottom end of the firing pin is provided with a needle head, the bottom end of the glue discharging hole is fixedly clamped with a nozzle abutted against the needle head, and the nozzle is provided with a through hole of which one end is blocked by the needle head; compared with the structure of the rubber tube adopted in the prior art, the rubber tube discharging and gluing can be smoothly carried out, the rubber tube does not need to be frequently replaced, the movement of the needle head can be quickly responded, and the flow control is more accurate; the utility model provides a nozzle installation and change are all comparatively convenient to realize the change of rubberizing volume and rubberizing area through changing the nozzle.
By adopting the mode, the problem of uneven gluing is caused because of no uniform smearing device when the chip is glued.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip-manufacturing's flow control device for conducting resin aims at solving because of not having the even device of paining, leads to the inhomogeneous problem of rubber coating.
In order to achieve the purpose, the glue guiding device comprises a glue guiding device, a control device and a glue rolling device, wherein the control device is fixedly connected with the glue guiding device and is positioned on one side of the glue guiding device; the glue rolling device comprises a moving assembly, a supporting plate, a first air cylinder, a first connecting plate, a second air cylinder, a second connecting plate, a roller shaft frame, a roller shaft and a coating brush, wherein the moving assembly is fixedly connected with the glue guiding device and is positioned on the side edge of the glue guiding device; the supporting plate is fixedly connected with the moving assembly and is positioned on the side edge of the moving assembly; the first cylinder is fixedly connected with the supporting plate and is positioned on one side, far away from the moving assembly, of the supporting plate; the first connecting plate is fixedly connected with the telescopic rod of the first cylinder and is positioned on one side of the telescopic rod of the first cylinder; the second cylinder is fixedly connected with the first connecting plate and is positioned on the side edge of the first connecting plate; the second connecting plate with the telescopic link fixed connection of second cylinder, and be located one side of second cylinder telescopic link, the roller frame with second connecting plate fixed connection, and be located the second connecting plate is kept away from one side of second cylinder, the roller with the roller frame rotates to be connected, and is located in the roller frame, the brush of scribbling with second connecting plate fixed connection, and be located the second connecting plate and be close to roller frame one side.
The glue guide device comprises a glue guide device body, a glue inlet and a glue outlet, wherein the glue guide device body is fixedly connected with the moving assembly and is positioned on the side edge of the moving assembly; the glue inlet is communicated with the glue guide device body and is positioned on one side of the glue guide device body; the glue discharging port is communicated with the glue guiding device body and is positioned at the bottom of the glue guiding device body.
The control device comprises a control device body, a third air cylinder, a lever, a pressing cylinder and a pressing plate, wherein the control device body is positioned above the glue guide device body; the third cylinder is fixedly connected with the control device body and is positioned on one side of the control device body; the lever is fixedly connected with the telescopic rod of the third cylinder and is positioned on one side of the telescopic rod of the third cylinder; the pressing cylinder is fixedly connected with the lever and is positioned on the side edge of the lever; the pressing plate is fixedly connected with the pressing cylinder, is positioned in the glue guiding device body in a sliding connection mode, and is positioned in the glue guiding device body.
The moving assembly comprises a sliding rail and a sliding block, and the sliding rail is fixedly connected with the glue guiding device body and is positioned on the side edge of the glue guiding device body; the sliding block is connected with the sliding rail in a sliding mode and is located on the sliding rail.
The moving assembly further comprises a fixed block, and the fixed block is fixedly connected with the sliding block and is positioned on one side of the sliding block.
The utility model discloses a flow control device for conductive adhesive for chip manufacturing, which is fixedly connected with a glue guide device and is positioned at one side of the glue guide device; the control device is used for controlling the glue outlet flow of the glue guide device, the glue rolling device comprises a moving assembly, a supporting plate, a first air cylinder, a first connecting plate, a second air cylinder, a second connecting plate, a roller shaft frame, a roller shaft and a coating brush, and the moving assembly is fixedly connected with the glue guide device and is positioned on the side edge of the glue guide device; the supporting plate is fixedly connected with the moving assembly and is positioned on the side edge of the moving assembly; the supporting plate is adjusted in height through the moving assembly, and the first air cylinder is fixedly connected with the supporting plate and is positioned on one side, far away from the moving assembly, of the supporting plate; the first connecting plate is fixedly connected with the telescopic rod of the first cylinder and is positioned on one side of the telescopic rod of the first cylinder; the first air cylinder controls the first connecting plate to move downwards, and the second air cylinder is fixedly connected with the first connecting plate and is positioned on the side edge of the first connecting plate; the second connecting plate is fixedly connected with the telescopic rod of the second cylinder and is positioned on one side of the telescopic rod of the second cylinder; the second cylinder controls the second connecting plate to move, and the roller shaft frame is fixedly connected with the second connecting plate and is positioned on one side, far away from the second cylinder, of the second connecting plate; the roll shaft is rotationally connected with the roll shaft frame and is positioned in the roll frame; the roller frame moves back and forth on the second connecting plate through the telescopic rod of the second cylinder, the roller shaft evenly coats conductive adhesive, the coating brush is fixedly connected with the second connecting plate and is positioned on one side, close to the roller frame, of the second connecting plate, the coating brush is used for dispersing the conductive adhesive to better coat the adhesive when the conductive adhesive or the conductive adhesive cannot roll evenly through the roller shaft, the control device controls the adhesive guide device to conduct adhesive guide on a chip when in use, after the adhesive is guided, the first cylinder downwards moves the first connecting plate to a proper position, the second cylinder pushes the roller frame on the second connecting plate, the roller shaft on the roller frame evenly rolls and coats the conductive adhesive on the chip, and the coating brush assists in evenly coating, so that the problem that no even coating device exists is solved, resulting in the problem of uneven application of glue.
Drawings
In order to more clearly illustrate the embodiments or prior art solutions in the present application, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a flow control device for conductive adhesive in chip manufacturing according to the present invention.
Fig. 2 is a schematic partial structural diagram of a flow control device for conductive adhesive manufactured by a chip according to the present invention.
Fig. 3 is a cross-sectional view of a flow control device for conductive adhesive manufactured by a chip according to the present invention.
1-glue guiding device, 2-control device, 3-glue rolling device, 11-glue guiding device body, 12-glue inlet, 13-glue outlet, 21-control device body, 22-third cylinder, 23-lever, 24-pressing cylinder, 25-pressing plate, 31-moving component, 32-supporting plate, 33-first cylinder, 34-first connecting plate, 35-second cylinder, 36-second connecting plate, 37-roller frame, 38-roller shaft, 39-smearing brush, 311-sliding rail, 312-sliding block and 313-fixing block.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 3, the present invention provides a flow control device for conductive adhesive used in chip manufacturing, including a adhesive guiding device 1, a control device 2 and a glue rolling device 3, wherein the control device 2 is fixedly connected to the adhesive guiding device 1 and is located at one side of the adhesive guiding device 1; the glue rolling device 3 comprises a moving component 31, a supporting plate 32, a first air cylinder 33, a first connecting plate 34, a second air cylinder 35, a second connecting plate 36, a roller frame 37, a roller 38 and a smearing brush 39, wherein the moving component 31 is fixedly connected with the glue guiding device 1 and is positioned on the side edge of the glue guiding device 1; the supporting plate 32 is fixedly connected with the moving component 31 and is positioned at the side of the moving component 31; the first cylinder 33 is fixedly connected with the support plate 32 and is located on one side of the support plate 32 away from the moving assembly 31; the first connecting plate 34 is fixedly connected with the telescopic rod of the first cylinder 33 and is positioned at one side of the telescopic rod of the first cylinder 33; the second cylinder 35 is fixedly connected with the first connecting plate 34 and is positioned at the side edge of the first connecting plate 34; the second connecting plate 36 is fixedly connected with an expansion rod of the second cylinder 35 and is located on one side of the expansion rod of the second cylinder 35, the roller frame 37 is fixedly connected with the second connecting plate 36 and is located on one side, far away from the second cylinder 35, of the second connecting plate 36, the roller shaft 38 is rotatably connected with the roller frame 37 and is located in the roller frame, and the smearing brush 39 is fixedly connected with the second connecting plate 36 and is located on one side, close to the roller frame 37, of the second connecting plate 36.
In the present embodiment, the control device 2 is fixedly connected to the glue guiding device 1 and is located on one side of the glue guiding device 1; the control device 2 is used for controlling the glue outlet flow of the glue guiding device 1, the glue rolling device 3 comprises a moving assembly 31, a support plate 32, a first air cylinder 33, a first connecting plate 34, a second air cylinder 35, a second connecting plate 36, a roller frame 37, a roller 38 and a smearing brush 39, and the moving assembly 31 is fixedly connected with the glue guiding device 1 and is positioned on the side edge of the glue guiding device 1; the supporting plate 32 is fixedly connected with the moving component 31 and is positioned at the side of the moving component 31; the supporting plate 32 is adjusted in height by the moving assembly 31, and the first cylinder 33 is fixedly connected with the supporting plate 32 and is located on one side of the supporting plate 32 away from the moving assembly 31; the first connecting plate 34 is fixedly connected with the telescopic rod of the first cylinder 33 and is positioned at one side of the telescopic rod of the first cylinder 33; the first air cylinder 33 controls the first connecting plate 34 to move downwards, and the second air cylinder 35 is fixedly connected with the first connecting plate 34 and is positioned at the side edge of the first connecting plate 34; the second connecting plate 36 is fixedly connected with the telescopic rod of the second cylinder 35 and is positioned on one side of the telescopic rod of the second cylinder 35; the second air cylinder 35 controls the second connecting plate 36 to move, and the roller frame 37 is fixedly connected with the second connecting plate 36 and is positioned on one side of the second connecting plate 36 away from the second air cylinder 35; the roll shaft 38 is rotatably connected with the roll shaft frame 37 and is positioned in the roll shaft frame 37; the roller frame 37 moves back and forth on the second connecting plate 36 through the telescopic rod of the second cylinder 35, the roller 38 applies conductive adhesive uniformly, the smearing brush 39 is fixedly connected with the second connecting plate 36 and is positioned on one side of the second connecting plate 36 close to the roller frame 37, the smearing brush 39 is used for dispersing the conductive adhesive to better coat the conductive adhesive when the conductive adhesive or the conductive adhesive cannot roll uniformly through the roller 38, the control device 2 controls the adhesive guiding device 1 to guide the adhesive to the chip when in use, after the adhesive is guided, the first cylinder 33 moves the first connecting plate 34 downwards to a proper position, the second cylinder 35 pushes the roller frame 37 on the second connecting plate 36, and the roller 38 on the roller frame 37 applies the conductive adhesive uniformly on the chip in a rolling manner, the smearing brush 39 assists in evenly smearing, thereby solving the problem of uneven smearing caused by the lack of an even smearing device.
Further, the glue guiding device 1 comprises a glue guiding device body 11, a glue inlet 12 and a glue outlet 13, wherein the glue guiding device body 11 is fixedly connected with the moving assembly 31 and is positioned on the side edge of the moving assembly 31; the glue inlet 12 is fixedly connected with the glue guiding device body 11 and is positioned at one side of the glue guiding device body 11; the glue discharging port 13 is fixedly connected with the glue guiding device body 11 and is positioned at the bottom of the glue guiding device body 11.
In the present embodiment, the conductive adhesive is injected into the adhesive guiding device body 11 through the adhesive inlet 12, and the conductive adhesive is extruded on the chip through the adhesive outlet 13.
Further, the control device 2 comprises a control device body 21, a third air cylinder 22, a lever 23, a pressing cylinder 24 and a pressing plate 25, wherein the control device body 21 is located above the glue guide device body 11; the third cylinder 22 is fixedly connected with the control device body 21 and is positioned on one side of the control device body 21; the lever 23 is fixedly connected with the telescopic rod of the third cylinder 22 and is positioned on one side of the telescopic rod of the third cylinder 22; the pressing cylinder 24 is fixedly connected with the lever 23 and is positioned on the side edge of the lever 23; the pressing plate 25 is fixedly connected with the pressing cylinder 24, is positioned in the glue guiding device body 11 in a sliding connection mode, and is positioned in the glue guiding device body 11.
In this embodiment, the third air cylinder 22 controls the pressing cylinder 24 connected to the lever 23 to press the pressing plate 25 downward, thereby controlling the glue discharging amount of the glue guide body 11.
Further, the moving assembly 31 includes a slide rail 311 and a slide block 312, the slide rail 311 is fixedly connected to the glue guiding device body 11 and is located at a side of the glue guiding device body 11; the sliding block 312 is slidably connected to the sliding rail 311 and is located on the sliding rail 311, the moving assembly 31 further includes a fixing block 313, and the fixing block 313 is fixedly connected to the sliding block 312 and is located on one side of the sliding block 312.
In this embodiment, the slider 312 moves on the slide rail 311 to adjust a suitable height, the fixed block 313 fixes the adjusted height of the slider 312, and the fixed block 313 is engaged with the slide rail 311 inward to prevent the slider 312 from moving.
The utility model discloses a flow control device for conducting resin that chip was made is when using controlling means 2 control it carries out to lead gluey device 1 to the chip, leads gluey back first cylinder 33 will behind the suitable position of first connecting plate 34 downstream, second cylinder 35 promotes on the second connecting plate 36 roller frame 37, on the roller frame 37 roller 38 carries out on the chip and evenly rolls to scribble to conducting resin, scribble brush 39 and assist evenly to scribble to the solution is because of not having even device of scribbling, leads to inhomogeneous rubber coating problem.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. A flow control device for conductive adhesive manufactured by a chip is characterized in that,
the glue rolling device comprises a glue guiding device, a control device and a glue rolling device, wherein the control device is fixedly connected with the glue guiding device and is positioned on one side of the glue guiding device; the glue rolling device comprises a moving assembly, a supporting plate, a first air cylinder, a first connecting plate, a second air cylinder, a second connecting plate, a roller shaft frame, a roller shaft and a coating brush, wherein the moving assembly is fixedly connected with the glue guiding device and is positioned on the side edge of the glue guiding device; the supporting plate is fixedly connected with the moving assembly and is positioned on the side edge of the moving assembly; the first cylinder is fixedly connected with the supporting plate and is positioned on one side of the supporting plate, which is far away from the moving assembly; the first connecting plate is fixedly connected with the telescopic rod of the first cylinder and is positioned on one side of the telescopic rod of the first cylinder; the second cylinder is fixedly connected with the first connecting plate and is positioned on the side edge of the first connecting plate; the second connecting plate is fixedly connected with the telescopic rod of the second cylinder and is positioned on one side of the telescopic rod of the second cylinder; the roller shaft frame is fixedly connected with the second connecting plate and is positioned on one side, far away from the second cylinder, of the second connecting plate; the roll shaft is rotationally connected with the roll shaft frame and is positioned in the roll shaft frame; the smearing brush is fixedly connected with the second connecting plate and is positioned on one side, close to the roll shaft frame, of the second connecting plate.
2. The flow control device for conductive paste for chip manufacturing according to claim 1,
the glue guide device comprises a glue guide device body, a glue inlet and a glue outlet, and the glue guide device body is fixedly connected with the moving assembly and is positioned on the side edge of the moving assembly; the glue inlet is communicated with the glue guide device body and is positioned on one side of the glue guide device body; the glue discharging port is communicated with the glue guiding device body and is positioned at the bottom of the glue guiding device body.
3. A flow control device for conductive paste for chip manufacture according to claim 2,
the control device comprises a control device body, a third air cylinder, a lever, a pressing cylinder and a pressing plate, wherein the control device body is positioned above the glue guide device body; the third cylinder is fixedly connected with the control device body and is positioned on one side of the control device body; the lever is fixedly connected with the telescopic rod of the third cylinder and is positioned on one side of the telescopic rod of the third cylinder; the pressing cylinder is fixedly connected with the lever and is positioned on the side edge of the lever; the pressing plate is fixedly connected with the pressing cylinder, is positioned in the glue guide device body in a sliding connection mode, and is positioned in the glue guide device body.
4. A flow control device for conductive paste for chip manufacture according to claim 2,
the moving assembly comprises a sliding rail and a sliding block, and the sliding rail is fixedly connected with the glue guiding device body and is positioned on the side edge of the glue guiding device body; the sliding block is connected with the sliding rail in a sliding mode and is located on the sliding rail.
5. A flow control device for conductive paste for chip fabrication according to claim 4,
the moving assembly further comprises a fixed block, and the fixed block is fixedly connected with the sliding block and is positioned on one side of the sliding block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220142934.9U CN217094218U (en) | 2022-01-19 | 2022-01-19 | Flow control device for conductive adhesive for chip manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220142934.9U CN217094218U (en) | 2022-01-19 | 2022-01-19 | Flow control device for conductive adhesive for chip manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217094218U true CN217094218U (en) | 2022-08-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220142934.9U Active CN217094218U (en) | 2022-01-19 | 2022-01-19 | Flow control device for conductive adhesive for chip manufacturing |
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| Country | Link |
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| CN (1) | CN217094218U (en) |
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- 2022-01-19 CN CN202220142934.9U patent/CN217094218U/en active Active
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