CN217011326U - Pulse heating type full-automatic accurate pressing device - Google Patents
Pulse heating type full-automatic accurate pressing device Download PDFInfo
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- CN217011326U CN217011326U CN202220255083.9U CN202220255083U CN217011326U CN 217011326 U CN217011326 U CN 217011326U CN 202220255083 U CN202220255083 U CN 202220255083U CN 217011326 U CN217011326 U CN 217011326U
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Abstract
The utility model provides a pulse heating type full-automatic accurate pressing device which comprises a machine table, wherein a guide rail, a stopping mechanism, a feeding mechanism, a pre-pressing mechanism, a welding and pressing mechanism and a main pressing mechanism are arranged on the machine table; inputting a carrier carrying a PCB to a machine table from the outside through an inflow port, wherein a stopping mechanism is arranged corresponding to the inflow port, and a discharge conveyor belt is arranged at an outflow port; the stopping mechanism, the prepressing mechanism, the welding and pressing mechanism, the main pressing mechanism and the discharging conveyor belt are sequentially arranged along the flow direction of the guide rail, and at least one carrying mechanism moving on the guide rail is arranged on the guide rail; when the feeding mechanism works, a flexible circuit board is conveyed to the prepressing mechanism, and when the prepressing mechanism works, the flexible circuit board and the PCB are pressed and fixed; the PCB comprises a welding area and a bonding area, the welding mechanism is arranged corresponding to the welding area, and the pressing mechanism is arranged corresponding to the bonding area. The device can fully automatically realize the hot-press welding process between the flexible circuit board and the PCB.
Description
Technical Field
The utility model relates to the technical field of electronic product processing, in particular to a pulse heating type full-automatic accurate pressing device.
Background
The hot-press welding is a welding process for connecting the flexible circuit board to the PCB, and is used as a new manufacturing process and an important component in the technical field of microelectronic surface assembly, and the stable and efficient hot-press welding process is an important link for ensuring good quality of products.
With the improvement of living standard, the supply of electronic products is not in demand, but the automation degree of the existing hot-press welding process is low, and manual production is needed, so the following problems exist:
firstly, the production efficiency is low, and the existing requirements cannot be met;
secondly, the operating personnel are easily influenced by uncertain factors such as bad states, inattention and the like, the operating quality cannot be guaranteed, bad repair is easy to occur, and the company cost and the product risk are increased;
thirdly, the labor cost is high.
In view of the above problems, it is desirable to provide a pressing device capable of fully automatically and precisely completing the thermocompression bonding.
Disclosure of Invention
The utility model aims to provide a pulse heating type full-automatic accurate pressing device.
The technical scheme adopted by the utility model is as follows: a pulse heating type full-automatic accurate pressing device comprises a machine table, wherein a guide rail, a stopping mechanism, a feeding mechanism, a pre-pressing mechanism, a welding and pressing mechanism and a main pressing mechanism are arranged on the machine table;
an inflow port is formed in the machine table corresponding to the first end of the guide rail, an outflow port is formed in the machine table corresponding to the second end of the guide rail, a carrier loaded with a PCB is input into the machine table from the outside through the inflow port, the stopping mechanism is arranged corresponding to the inflow port, and a discharge conveyor belt is arranged corresponding to the outflow port;
the stopping mechanism, the pre-pressing mechanism, the welding and pressing mechanism, the local pressing mechanism and the discharging conveyor belt are sequentially arranged along the flow direction of the guide rail, at least one carrying mechanism moving on the guide rail is arranged on the guide rail, and the carrying mechanism grabs and carries the carrier among the stopping mechanism, the pre-pressing mechanism, the welding and pressing mechanism, the local pressing mechanism and the discharging conveyor belt when in work;
when the pre-pressing mechanism works, the flexible circuit board and the PCB are pressed and fixed; the flexible circuit board is provided with a first image recognition point, the PCB is provided with a second image recognition point, and the prepressing mechanism is provided with a first CCD alignment unit;
the PCB comprises a welding area and a bonding area, the welding mechanism corresponds to the welding area, and the pressing mechanism corresponds to the bonding area.
The relevant content in the above technical solution is explained as follows:
1. in the above scheme, the prepressing mechanism includes a prepressing head and a prepressing platform, the prepressing platform moves between a first waiting position and a prepressing position, wherein the prepressing position is arranged on a moving path of the prepressing head, and the first waiting position is arranged corresponding to the carrying mechanism; when the feeding mechanism works, the flexible circuit board is moved to the prepressing position through a transfer platform, and the prepressing head picks up the flexible circuit board from the prepressing position; when the prepressing platform works, the carrier is driven to the prepressing position from the first waiting position, and the flexible circuit board is pressed and fixed on the PCB by the prepressing head.
2. In the above scheme, a stacking position is provided in the feeding mechanism, the flexible circuit boards are stacked on the stacking position, and a protective film is coated on each flexible circuit board; feed mechanism is including picking up the arm, tearing the membrane counterpoint camera, tearing the membrane clamping jaw and transfer the platform, tear the membrane counterpoint camera with it sets up to tear a membrane position that the membrane clamping jaw corresponds, the picking up arm during operation is followed it picks up to pile up position department the flexible circuit board to remove this flexible circuit board in proper order to tear the membrane position with on the transfer platform, the transfer platform is in feed mechanism with it removes to flatten the inter-platform in advance.
3. In the above scheme, feed mechanism is including the throwing box that is used for collecting the waste material.
4. In the above scheme, the welding mechanism includes a welding head and a welding platform, the welding platform moves between a second waiting position and a welding position, wherein the welding position is arranged on a moving path of the welding head, and the second waiting position is arranged corresponding to the carrying mechanism; this pressure mechanism includes this pressure head and this platform that flattens, this platform that flattens removes between a third treats material position and a this pressure position, wherein this pressure position is located on the removal route of this pressure head, the third is treated the material position and is corresponded transport mechanism sets up.
5. In the above scheme, the welding mechanism and the pressing mechanism are both provided with two groups on the machine table.
6. In the scheme, a second CCD alignment unit is arranged corresponding to the welding mechanisms and moves between the two groups of welding mechanisms; and a third CCD alignment unit is arranged corresponding to the local pressing mechanisms and moves between the two groups of local pressing mechanisms.
7. In the above scheme, the carrying mechanism comprises an air cylinder, two clamping ends and a horizontal pressing plate, wherein the two clamping ends are driven by the air cylinder to move close to or away from each other in the horizontal direction; the horizontal pressing plate is arranged between the two clamping ends, and a plurality of suction nozzles are arranged on the horizontal pressing plate from top to bottom.
8. In the above scheme, the number of the conveying mechanisms is four, and the conveying mechanisms include a first conveying mechanism, a second conveying mechanism, a third conveying mechanism and a fourth conveying mechanism; the first carrying mechanism is arranged between the stopping mechanism and the pre-pressing mechanism, the second carrying mechanism is arranged between the pre-pressing mechanism and the welding mechanism, the third carrying mechanism is arranged between the welding mechanism and the local pressing mechanism, and the fourth carrying mechanism is arranged between the local pressing mechanism and the discharge conveyor belt.
9. In the above scheme, be equipped with material information sign indicating number on the carrier, flow-in port department is equipped with sweeps a yard rifle.
The utility model has the beneficial effects that: through this full-automatic accurate compression fittings of pulse heating formula, can realize the hot-pressing welding technology between flexible circuit board and the PCB board full-automatically, degree of automation is high, need not artifical the participation production, has greatly improved production efficiency from this, has ensured operation quality to the personnel selection cost has been reduced.
Drawings
FIG. 1 is a schematic diagram of one embodiment of the present invention;
FIG. 2 is a schematic view of the pre-press mechanism of the embodiment shown in FIG. 1;
FIG. 3 is a schematic view of a loading mechanism in the embodiment of FIG. 1;
FIG. 4 is a schematic view of the handling mechanism in the embodiment of FIG. 1.
Description of the symbols: 1. a machine platform; 2. a guide rail; 21. a first carrying mechanism; 22. a second carrying mechanism; 23. a third carrying mechanism; 24. a fourth carrying mechanism; 25. a cylinder; 26. a clamping end; 27. a horizontal pressing plate; 28. a suction nozzle; 3. a gear stop mechanism; 4. a feeding mechanism; 41. a pick-up arm; 42. a film tearing alignment camera; 43. a film tearing clamping jaw; 44. a transfer platform; 45. a material throwing box; 5. a pre-pressing mechanism; 51. a first CCD alignment unit; 52. pre-pressing a head; 53. prepressing the platform; 6. a welding mechanism; 61. a second CCD alignment unit; 7. the pressing mechanism; 71. a third CCD alignment unit; 8. a discharge conveyor belt; 9. a carrier is provided.
Detailed Description
The utility model is further described with reference to the following figures and examples:
the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure may be shown and described, and which, when modified and varied by the techniques taught herein, can be made by those skilled in the art without departing from the spirit and scope of the disclosure.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms "a", "an", "the" and "the", as used herein, also include the plural forms.
The terms "first," "second," and the like, as used herein, do not denote any order or importance, nor do they denote any order or importance, but rather are used to distinguish one element from another element or operation described in such technical terms.
As used herein, "connected" or "positioned" refers to two or more elements or devices being in direct physical contact with each other or in indirect physical contact with each other, and may also refer to two or more elements or devices being in operation or acting on each other.
As used herein, the terms "comprising," "including," "having," and the like are open-ended terms that mean including, but not limited to.
As used herein, the term (terms), unless otherwise indicated, shall generally have the ordinary meaning as commonly understood by one of ordinary skill in the art, in this application, and in the special art. Certain terms used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the disclosure.
The terms "front", "rear", "upper", "lower", "left" and "right" used herein are directional terms, and are used only for describing the positional relationship between the structures, and are not intended to limit the scope of protection and the actual direction of the present invention.
As shown in fig. 1 to 4, an embodiment of the present invention provides a pulse heating type full-automatic precise pressing apparatus, which includes a machine table 1, and the machine table 1 is provided with a guide rail 2, a stopping mechanism 3, a feeding mechanism 4, a pre-pressing mechanism 5, a welding mechanism 6, and a main pressing mechanism 7.
An inflow port is formed in the machine table 1 corresponding to the first end of the guide rail 2, an outflow port is formed in the machine table corresponding to the second end of the guide rail 2, a carrier 9 carrying a PCB is input into the machine table 1 through the inflow port from the outside, the stopping mechanism 3 is arranged corresponding to the inflow port, and a discharge conveyor belt 8 is arranged corresponding to the outflow port.
Keep off mechanism 3, prepressing mechanism 5 weld pressing mechanism 6 this pressing mechanism 7 with exit conveyor 8 follows the flow direction of guide rail 2 sets gradually, be equipped with at least one transport mechanism who moves on this guide rail 2 on the guide rail 2, transport mechanism during operation keep off mechanism 3 in advance pressing mechanism 5 weld pressing mechanism 6 this pressing mechanism 7 with snatch and carry between exit conveyor 8 carrier 9.
The carrier 9 flows into the machine table 1 from the inflow port, and under the transportation of the transportation mechanism, the carrier sequentially passes through the stopping mechanism 3, the pre-pressing mechanism 5, the welding and pressing mechanism 6 and the local pressing mechanism 7, and finally leaves the machine table 1 through the discharge conveyor belt 8.
In this embodiment, the number of the conveying mechanisms is four, including a first conveying mechanism 21, a second conveying mechanism 22, a third conveying mechanism 23, and a fourth conveying mechanism 24; the first carrying mechanism 21 is arranged between the stop mechanism 3 and the pre-pressing mechanism 5 and used for moving the carrier 9 from the stop mechanism 3 to the pre-pressing mechanism 5, the second carrying mechanism 22 is arranged between the pre-pressing mechanism 5 and the welding mechanism 6 and used for moving the carrier 9 from the pre-pressing mechanism 5 to the welding mechanism 6, the third carrying mechanism 23 is arranged between the welding mechanism 6 and the local pressing mechanism 7 and used for moving the carrier 9 from the welding mechanism 6 to the local pressing mechanism 7, and the fourth carrying mechanism 24 is arranged between the local pressing mechanism 7 and the discharge conveyor belt 8 and used for moving the carrier 9 from the local pressing mechanism 7 to the discharge conveyor belt 8; thereby improving the production efficiency.
The carrying mechanism comprises an air cylinder 25, two clamping ends 26 and a horizontal pressing plate 27, wherein the two clamping ends 26 are driven by the air cylinder 25 to move close to or away from each other in the horizontal direction so as to clamp or lower the carrier 9; the horizontal pressing plate 27 is disposed between the two clamping ends 26, the horizontal pressing plate 27 is provided with a plurality of suction nozzles 28 from top to bottom, and the PCB loaded on the carrier 9 can be pressed flat by the horizontal pressing plate 27.
The feeding mechanism 4 conveys a flexible circuit board to the pre-pressing mechanism 5 when in work, and the pre-pressing mechanism 5 presses and fixes the flexible circuit board and the PCB board when in work.
In this embodiment, the pre-pressing mechanism 5 includes a pre-pressing head 52 and a pre-pressing platform 53, the pre-pressing platform 53 moves between a first waiting position and a pre-pressing position, the pre-pressing position is disposed on a moving path of the pre-pressing head 52, the first waiting position corresponds to the carrying mechanism, and the pre-pressing platform 53 receives the carrier 9 brought by the carrying mechanism at the first waiting position.
When the feeding mechanism 4 works, the flexible circuit board is moved to the prepressing position through a transfer platform 44, and the prepressing head 52 picks up the flexible circuit board from the prepressing position; when the pre-pressing platform 53 works, the carrier 9 is driven to the pre-pressing position from the first waiting position, and after the flexible circuit board and the PCB are in place, the pre-pressing head 52 presses and fixes the flexible circuit board on the PCB.
The feed mechanism 4 in this embodiment is provided on the back of the pre-press mechanism 5.
The specific pressing structure and pressing principle of the pre-pressing mechanism 5 are well known to those skilled in the art, and are not the point of the present invention, and therefore, no detailed description is given here.
The flexible circuit board is provided with a first image recognition point, the PCB is provided with a second image recognition point, the pre-pressing mechanism 5 is provided with a first CCD alignment unit 51, and the flexible circuit board and the PCB are accurately aligned through the first CCD alignment unit 51; the first CCD alignment unit 51 includes a Flex camera and a PCB camera, which are respectively disposed corresponding to the flexible circuit board and the PCB board.
The specific structures of the various alignment units, alignment cameras and corresponding image processing methods described herein are all known in the art and are well known to those skilled in the art, and therefore are not described herein again.
In this embodiment, a stacking position is provided in the feeding mechanism 4, the flexible printed circuit board is stacked on the stacking position, and the flexible printed circuit board is manually placed at the stacking position before the work is started; each flexible circuit board is coated with a protective film; feed mechanism 4 includes pick-up arm 41, dyestripping counterpoint camera 42, dyestripping clamping jaw 43 and transfer platform 44, dyestripping counterpoint camera 42 with dyestripping clamping jaw 43 corresponds a dyestripping position setting, pick-up arm 41 during operation is followed pile up position department and picks up the flexible circuit board to move this flexible circuit board in proper order extremely dyestripping position with on the transfer platform 44, transfer platform 44 is in feed mechanism 4 with remove between pre-compaction platform 53.
Wherein the feeding mechanism 4 comprises a material throwing box 45 for collecting waste materials, the waste materials comprise a torn protective film and a waste flexible circuit board which is returned through the transfer platform 44 after the alignment failure at the prepressing mechanism 5.
The PCB comprises a welding area and a gluing area, the welding mechanism 6 is arranged corresponding to the welding area, and the pressing mechanism 7 is arranged corresponding to the gluing area; the welding area comprises a plurality of welding points, and the bonding area is provided with TSA glue, so that the flexible circuit board and the PCB are firmly connected through welding and bonding; the connection between the flexible circuit board and the PCB can be realized by heating and pressing the welding point and the TSA glue, the welding mechanism 6 and the pressing mechanism 7 have the same structure and working principle, and the difference is only that the positions of the pressing head corresponding to the PCB are different.
The welding mechanism 6 comprises a welding head and a welding platform, the welding platform moves between a second material waiting position and a welding position, the welding position is arranged on a moving path of the welding head, the second material waiting position is arranged corresponding to the carrying mechanism, and the welding platform receives a carrier 9 brought by the carrying mechanism at the second material waiting position; when the carrier 9 is moved to the bonding position, the bonding area on the PCB board is bonded by the bonding head.
The pressing mechanism 7 comprises a pressing head and a pressing platform, the pressing platform moves between a third material waiting position and a local pressing position, the local pressing position is arranged on a moving path of the pressing head, the third material waiting position is arranged corresponding to the carrying mechanism, and the pressing platform receives a carrier 9 brought by the carrying mechanism at the third material waiting position; when the carrier 9 is moved to the pressing position, the bonding area on the PCB board is pressed by the pressing head.
The structure of the welding pressure head is the same as that of the pressure head, and no difference exists except that the welding pressure head corresponds to different positions on a PCB.
The specific pressing structure and pressing principle of the bonding mechanism 6 and the present pressing mechanism 7 are well known to those skilled in the art, and are not the point of the present invention, so that detailed descriptions thereof are omitted here.
In this embodiment, the welding mechanism 6 and the pressing mechanism 7 are both provided with two sets of welding mechanisms on the machine table 1, and the welding and pressing processes consume more time than the pre-pressing process, so that the production efficiency can be improved through the setting of the double stations, and the waiting time of equipment is saved.
A second CCD alignment unit 61 is arranged corresponding to the welding mechanisms 6, the second CCD alignment unit 61 moves between the two groups of welding mechanisms 6, and the second CCD alignment unit 61 ensures accurate alignment of the flexible circuit board and the PCB in the welding process; and third CCD alignment units 71 are arranged corresponding to the pressing mechanisms 7, the third CCD alignment units 71 move between the two groups of pressing mechanisms 7, and the alignment accuracy of the flexible circuit board and the PCB in the welding process is ensured through the third CCD alignment units 71.
In this embodiment, be equipped with material information sign indicating number on the carrier 9, flow-in port department is equipped with sweeps a yard rifle, from this when carrier 9 gets into board 1, confirms material information through sweeping the sign indicating number, avoids makeing mistakes.
The pulse heating type full-automatic accurate pressing device has the following flow in working:
firstly, a carrier 9 carrying a PCB enters a machine table 1 from an inflow port until the carrier is blocked by a blocking mechanism 3, and a code scanning gun scans a code of the carrier 9 to confirm material information;
then, the first carrying mechanism 21 moves the carrier 9 from the stopping mechanism 3 to the prepressing mechanism 5, and the prepressing platform 53 receives the carrier 9 at the first waiting position;
meanwhile, the feeding mechanism 4 picks up the flexible circuit board through the picking arm 41, moves the flexible circuit board to a film tearing position, performs alignment through the film tearing alignment camera 42, and performs a film tearing action through the film tearing clamping jaw 43, and then the picking arm 41 moves the flexible circuit board to the transfer platform 44, so that the transfer platform 44 drives the flexible circuit board to a pre-pressing position;
then, the prepressing head 52 of the prepressing mechanism 5 moves to the prepressing position to suck the flexible circuit board, then the transfer platform 44 leaves, and the prepressing head 52 returns to the original position to wait for the prepressing platform 53 to move to the prepressing position with the carrier 9;
secondly, after the flexible circuit board and the PCB are in place, the first CCD contraposition unit 51 confirms that the contraposition of the flexible circuit board and the PCB is accurate, if the contraposition fails, the flexible circuit board is brought back to the feeding mechanism 4 by the transfer platform 44 and thrown into the throwing material box 45 by the picking arm 41; after the alignment is successful, the flexible circuit board is fixed on the PCB in a pressing mode through the pre-pressing head 52, and the initial fixing of the flexible circuit board and the PCB is achieved;
then, the pre-pressing platform 53 brings the carrier 9 back to the first waiting position, the second carrying mechanism 22 moves the carrier 9 to the welding mechanism 6, and the welding platform of the welding mechanism 6 receives the carrier 9 at the second waiting position;
then, the welding and pressing platform carries the carrier 9 to move from the second material waiting position to the welding and pressing position, the second CCD aligning unit 61 confirms that the flexible circuit board and the PCB are accurately aligned, and then the welding area on the PCB is pressed through the welding and pressing head;
then, after the welding is completed, the welding platform brings the carrier 9 back to the second waiting position, the third carrying mechanism 23 moves the carrier 9 to the local pressing mechanism 7, and the local pressing platform of the local pressing mechanism 7 receives the carrier 9 at the third waiting position;
then, the flattening table carries the carrier 9 to move from the third waiting position to the local pressing position, the third CCD alignment unit 71 confirms that the flexible circuit board and the PCB board are aligned accurately, and then the pressing head presses the bonding area on the PCB board;
finally, after the pressing is completed, the pressing platform brings the carrier 9 back to the third waiting position, the carrier 9 is moved to the discharging conveyor belt 8 by the fourth carrying mechanism 24, and the discharging conveyor belt 8 discharges the carrier 9 from the outflow port.
In conclusion, through the pulse heating type full-automatic accurate pressing device, the hot-press welding process between the flexible circuit board and the PCB can be realized fully automatically, the automation degree is high, manual production is not needed, the production efficiency is greatly improved, the operation quality is guaranteed, and the labor cost is reduced.
The above embodiments are only for illustrating the technical idea and features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the protection scope of the present invention by this means. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. The utility model provides a full-automatic accurate compression fittings of pulse heating formula which characterized in that:
the automatic welding machine comprises a machine table, wherein a guide rail, a stopping mechanism, a feeding mechanism, a pre-pressing mechanism, a welding mechanism and a pressing mechanism are arranged on the machine table;
an inflow port is formed in the machine table corresponding to the first end of the guide rail, an outflow port is formed in the machine table corresponding to the second end of the guide rail, a carrier loaded with a PCB is input into the machine table from the outside through the inflow port, the blocking mechanism is arranged corresponding to the inflow port, and a discharge conveyor belt is arranged corresponding to the outflow port;
the stopping mechanism, the pre-pressing mechanism, the welding and pressing mechanism, the local pressing mechanism and the discharging conveyor belt are sequentially arranged along the flow direction of the guide rail, at least one carrying mechanism moving on the guide rail is arranged on the guide rail, and the carrying mechanism grabs and carries the carrier among the stopping mechanism, the pre-pressing mechanism, the welding and pressing mechanism, the local pressing mechanism and the discharging conveyor belt when in work;
when the pre-pressing mechanism works, the flexible circuit board and the PCB are pressed and fixed; the flexible circuit board is provided with a first image recognition point, the PCB is provided with a second image recognition point, and the prepressing mechanism is provided with a first CCD alignment unit;
the PCB comprises a welding area and a bonding area, the welding mechanism corresponds to the welding area, and the pressing mechanism corresponds to the bonding area.
2. The full-automatic precise press-fitting device of pulse heating type as claimed in claim 1, wherein: the prepressing mechanism comprises a prepressing head and a prepressing platform, the prepressing platform moves between a first material waiting position and a prepressing position, the prepressing position is arranged on the moving path of the prepressing head, and the first material waiting position is arranged corresponding to the carrying mechanism;
when the feeding mechanism works, the flexible circuit board is moved to the prepressing position through a transfer platform, and the prepressing head picks up the flexible circuit board from the prepressing position;
when the prepressing platform works, the carrier is driven to the prepressing position from the first material waiting position, and the flexible circuit board is pressed and fixed on the PCB by the prepressing head.
3. The full-automatic precise press-fitting device of pulse heating type as claimed in claim 2, wherein: the feeding mechanism is internally provided with a stacking position, the flexible circuit boards are stacked on the stacking position, and a protective film is coated on each flexible circuit board; feed mechanism is including picking up the arm, tearing the membrane counterpoint camera, tearing the membrane clamping jaw, tear the membrane counterpoint camera with it sets up to tear a membrane position that the membrane clamping jaw corresponds, pick up the arm during operation and follow it picks up to pile up position department flexible circuit board to remove this flexible circuit board in proper order extremely tear the membrane position with on the transfer platform, the transfer platform is in feed mechanism with move between the platform that flattens in advance.
4. The full-automatic precise press-fitting device of pulse heating type as claimed in claim 3, wherein: the feed mechanism includes a waste material collection pod.
5. The full-automatic precise press-fitting device of pulse heating type as claimed in claim 1, wherein: the welding mechanism comprises a welding head and a welding platform, the welding platform moves between a second material waiting position and a welding position, the welding position is arranged on a moving path of the welding head, and the second material waiting position is arranged corresponding to the carrying mechanism; this pressure mechanism includes this pressure head and this platform that flattens, this platform that flattens removes between a third is expected the position and this pressure position, wherein this pressure position is located on the removal route of this pressure head, the third is expected the position correspondence to waiting transport mechanism sets up.
6. The full-automatic precise press-fitting device of pulse heating type as claimed in claim 5, wherein: the welding mechanism and the pressing mechanism are both provided with two groups on the machine table.
7. The pulse heating type full-automatic precise pressing device according to claim 6, wherein: a second CCD alignment unit is arranged corresponding to the welding mechanisms and moves between the two groups of welding mechanisms; and a third CCD alignment unit is arranged corresponding to the local pressing mechanisms and moves between the two groups of local pressing mechanisms.
8. The full-automatic precise press-fitting device of pulse heating type as claimed in claim 1, wherein: the carrying mechanism comprises an air cylinder, two clamping ends and a horizontal pressing plate, and the two clamping ends are driven by the air cylinder to be close to or far away from each other in the horizontal direction; the horizontal pressing plate is arranged between the two clamping ends and is provided with a plurality of suction nozzles from top to bottom.
9. The pulse heating type full-automatic precise pressing device according to claim 8, wherein: the number of the conveying mechanisms is four, and the conveying mechanisms comprise a first conveying mechanism, a second conveying mechanism, a third conveying mechanism and a fourth conveying mechanism; the first carrying mechanism is arranged between the stopping mechanism and the pre-pressing mechanism, the second carrying mechanism is arranged between the pre-pressing mechanism and the welding mechanism, the third carrying mechanism is arranged between the welding mechanism and the local pressing mechanism, and the fourth carrying mechanism is arranged between the local pressing mechanism and the discharge conveyor belt.
10. The full-automatic precise press-fitting device of pulse heating type as claimed in claim 1, wherein: be equipped with material information sign indicating number on the carrier, flow-in port department is equipped with sweeps a yard rifle.
Priority Applications (1)
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CN202220255083.9U CN217011326U (en) | 2022-02-08 | 2022-02-08 | Pulse heating type full-automatic accurate pressing device |
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CN202220255083.9U CN217011326U (en) | 2022-02-08 | 2022-02-08 | Pulse heating type full-automatic accurate pressing device |
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CN217011326U true CN217011326U (en) | 2022-07-19 |
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CN202220255083.9U Active CN217011326U (en) | 2022-02-08 | 2022-02-08 | Pulse heating type full-automatic accurate pressing device |
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