CN217008116U - Big data server heat dissipation equipment of computer - Google Patents

Abstract

The utility model discloses a heat dissipation device of a computer big data server, which relates to the technical field of servers and comprises a server component and a heat dissipation component, wherein a positioning plate is inserted into a slot on a partition plate through a second cooling block at the lower end, the second cooling block is positioned at the upper end of the inner side of a server body, a first cooling block is positioned at the inner side of a heat dissipation chamber, the first cooling block and the second cooling block are internally filled with cooling liquid, so that the first cooling block and the second cooling block can exchange heat with heat in the server body through the cooling liquid in the first cooling block and the second cooling block, the first cooling block and the second cooling block are formed by combining copper plates, the heat conduction effect of the first cooling block and the second cooling block is better, the heat exchange efficiency is improved, the heat is conveyed into the heat dissipation chamber through the second cooling block, the heat absorption and conduction can be carried out on the heat through honeycomb holes arranged on the surface, so that the heat can flow at a constant speed, and the circulated heat is discharged outwards through the heat dissipation port.

Description

A computer big data server cooling device

technical field

The utility model relates to the technical field of servers, in particular to a cooling device for a computer big data server.

Background technique

A server is a type of computer that runs faster, has a higher load, and is more expensive than a normal computer. The server provides computing or application services for other clients (such as PCs, smart phones, terminals such as ATMs, and even large-scale equipment such as train systems) in the network. The server has high-speed CPU computing power, long-term reliable operation, powerful I/O external data throughput and better scalability. According to the services provided by the server, generally speaking, the server has the ability to respond to service requests, undertake services, and guarantee services. As an electronic device, the internal structure of the server is very complex, but it is not much different from the internal structure of an ordinary computer, such as: cpu, hard disk, memory, system, system bus, etc.

Nowadays, many computer big data servers are cooled by fans when they are dissipating heat, but the cooling efficiency of fans is low. Most of the rooms are fixed by screws, and tools are required for disassembly and assembly, which is time-consuming and labor-intensive.

Utility model content

The purpose of this section is to outline some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part and the abstract of the specification and the title of the utility model of this application to avoid obscuring the purpose of this part, the abstract of the specification and the title of the utility model, and such simplification or omission cannot be used to limit the utility model range.

In view of the above and/or existing problems in a computer big data server cooling device, the present utility model is proposed.

Therefore, the problem to be solved by the present invention is how to provide a cooling device for a computer big data server.

In order to solve the above-mentioned technical problems, the utility model provides the following technical solutions: a computer big data server cooling device, comprising,

The server assembly includes a server body, an outer plate, a magnetic box, a top cover and a heat dissipation port. The front of the server body is provided with an outer plate, the front of the outer plate is provided with a magnetic box, the upper end of the server body is provided with a top cover, and the top cover The upper part is provided with a cooling vent;

The heat dissipation assembly includes a heat dissipation chamber, a positioning plate and a heat absorbing sheet. The upper end of the server body is provided with a heat dissipation chamber, the inner side of the heat dissipation chamber is installed with a positioning plate, and the upper end of the positioning plate is provided with a heat absorption sheet to absorb heat. The sheet is located on the lower end of the top cover.

Based on the above technical features: when heat is generated inside the server body, the heat can be transferred to the inside of the heat dissipation chamber through the positioning plate, and then the heat is discharged through the heat dissipation port on the top cover through the absorption of the heat absorbing sheet.

As a preferred solution of the computer big data server cooling device of the present invention, wherein: the four corners of the lower end of the top cover are provided with fixed plates, and the two sides of the lower end of the fixed plate are welded with connecting plates, and the middle of the connecting plates is movable. A bending plate is connected, and the bending plate is arranged in an inclined shape.

Based on the above technical features: when it is necessary to install and remove the top cover for internal maintenance of the server body, the fixing plate at the four corners of the lower end of the top cover can be inserted into the heat dissipation chamber first, and then the bending plate can be squeezed to the side close to the fixing plate. pressure.

As a preferred solution of the computer big data server cooling device of the present invention, wherein: the bending plate is hinged with the connecting plate through the connecting shaft, and one side of the bending plate is fixed with a buffer spring. The plates are connected, and the upper end side of the bent plate is also welded with a card plate.

Based on the above technical features: the bending plate can be hinged on one side of the fixed plate through the connecting shaft. At this time, when the two are squeezed, the buffer spring will also be squeezed and deformed. When the top cover is completely pressed against the server body At the top, the card plate will also be aligned with the card slots in the four corners of the cooling chamber. At this time, the buffer spring will rebound and bend the plate, and the card plate will also enter the inner side of the card slot for limit clamping and fixing. When the top cover needs to be removed When it is installed, the personnel can directly press the card board to make it out of the inner side of the card slot, and then directly lift the top cover upwards, which is simple and convenient, and does not need to use other tools to assist disassembly and assembly.

As a preferred solution of the cooling device for a computer big data server according to the present invention, a dust-proof net is installed on the inner side of the heat-dissipating port, and the dust-proof net is made of a metal filter net.

Based on the above technical features: the installed dust filter can not only filter the radiated heat, but also prevent external impurities and dust from falling into the inside of the server body.

As a preferred solution of the computer big data server heat dissipation device of the present invention, wherein: the lower end of the heat dissipation chamber is provided with a partition plate, the surface of the partition plate is provided with slots with equal intervals, and the heat dissipation is Four corners of the chamber are also provided with card slots, and the card plates are movably connected with the card slots.

Based on the above technical features, the partition plate can limit the positioning plate through the slot, and the card slot can clamp and limit the card plate, so that the top cover and the server body are not easily separated.

As a preferred solution of the computer big data server cooling device of the present invention, wherein: the upper end of the positioning plate is provided with first cooling blocks with equal intervals, and the lower end of the positioning plate is symmetrically provided with second cooling blocks , and the second cooling block is movably plugged into the slot.

Based on the above technical features: the positioning plate is inserted into the slot on the partition plate through the second cooling block at the lower end. At this time, the second cooling block will be located at the inner upper end of the server body, and the first cooling block will be located inside the cooling chamber. .

As a preferred solution of the computer big data server cooling device of the present invention, wherein: the first cooling block and the second cooling block have the same structure, and the interiors of the two are filled with cooling liquid, and the first cooling block has the same structure as the second cooling block. The block and the second cooling block are composed of copper plates.

Based on the above technical features: since the first cooling block and the second cooling block are filled with cooling liquid, they can exchange heat with the heat inside the server body through the internal cooling liquid, and the first cooling block and the second cooling block It is composed of copper plates, which also makes the heat conduction effect of the two better and improves the heat exchange efficiency.

As a preferred solution of the computer big data server cooling device of the present invention, the surface of the heat-absorbing sheet is provided with honeycomb holes, and the heat-absorbing sheet is composed of a silicone gasket.

Based on the above technical features: the exchanged heat is transported to the inside of the heat dissipation chamber through the second cooling block, and the heat absorbing sheet provided at this time can absorb and conduct the heat, and through the honeycomb holes opened on the surface, the heat can be circulated at a uniform speed, and the circulation After the heat will be exhausted through the cooling vents.

The beneficial effect of the utility model is as follows: the positioning plate is inserted into the slot on the partition plate through the second cooling block at the lower end. At this time, the second cooling block will be located at the inner upper end of the server body, and the first cooling block will be located in the heat dissipation cavity On the indoor side, since the first cooling block and the second cooling block are filled with cooling liquid, they can exchange heat with the heat inside the server body through the internal cooling liquid, and the first cooling block and the second cooling block are copper plates. The combination of the two also makes the heat conduction effect of the two better and improves the heat exchange efficiency. When the first cooling block performs cold and heat exchange, the exchanged heat can be transported to the inside of the heat dissipation chamber through the second cooling block. The heat absorbing sheet can absorb and conduct heat, and through the honeycomb holes opened on the surface, the heat can be circulated at a uniform speed, and the heat after circulation will be discharged through the heat dissipation port. The heat is filtered, and at the same time, foreign impurities and dust can be prevented from falling into the interior of the server body. When the top cover needs to be installed and removed to repair the inside of the server body, the fixing plates at the four corners of the lower end of the top cover can be inserted into the heat dissipation chamber first. Then, the clamping plate and the bending plate can be squeezed to the side close to the fixed plate, and the bending plate can be hinged on one side of the fixed plate through the connecting shaft. At this time, when the two are squeezed, the buffer spring will also be squeezed. When the top cover is completely pressed against the top of the server body, the card plate will also be aligned with the card slots at the four corners of the cooling chamber. At this time, the buffer spring will rebound and bend the plate, and the card plate will also enter the card slot. When the top cover needs to be disassembled, the personnel can directly press the card plate to release it from the inside of the card slot, and then directly lift the top cover upwards. Pack.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. , for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative labor. in:

FIG. 1 is a structural diagram of a cooling device for a computer big data server.

FIG. 2 is a disassembled diagram of a cooling device for a computer big data server.

FIG. 3 is a partial enlarged structural diagram of part A in FIG. 2 of a cooling device for a computer big data server.

In the accompanying drawings, the list of components represented by each number is as follows:

100, server assembly; 101, server body; 102, outer plate; 103, magnetic box; 104, top cover; 104a, fixing plate; 104b, connecting plate; 104c, bending plate; 104c-1, connecting shaft; 104c- 2. Buffer spring; 104c-3, card board; 105, cooling port; 105a, dust filter; 200, cooling assembly; 201, cooling chamber; 201a, partition plate; 201b, slot; 201c, card slot; 202, a positioning plate; 202a, a first cooling block; 202b, a second cooling block; 203, a heat absorbing sheet; 203a, a honeycomb hole.

Detailed ways

In order to make the above objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

In the following description, many specific details are set forth in order to fully understand the present utility model, but the present utility model can also be implemented in other ways different from those described herein, and those skilled in the art can do so without departing from the connotation of the present utility model. Therefore, the present invention is not limited by the specific embodiments disclosed below.

Second, reference herein to "one embodiment" or "an embodiment" refers to a particular feature, structure, or characteristic that may be included in at least one implementation of the present invention. The appearances of "in one embodiment" in various places in this specification are not all referring to the same embodiment, nor are they separate or selectively mutually exclusive from other embodiments.

Example 1

Referring to FIG. 1 and FIG. 2, it is the first embodiment of the present invention, which provides a computer big data server cooling device, including:

The server assembly 100 includes a server body 101 , an outer plate 102 , a magnetic box 103 , a top cover 104 and a heat dissipation port 105 . The top cover 104 is installed on the upper end of the 101 , and the top cover 104 is provided with a heat dissipation port 105 . The heat dissipation chamber 201 has a positioning plate 202 installed on the inner side of the heat dissipation chamber 201, and the dustproof net 105a is made of a metal filter screen. The slots 201b are equally spaced, the upper end of the positioning plate 202 is installed with first cooling blocks 202a at equal intervals, and the lower end of the positioning plate 202 is symmetrically provided with second cooling blocks 202b, and the second cooling blocks 202b are movably inserted into the slots 201b. Then, the first cooling block 202a and the second cooling block 202b have the same structure, and the inside of the two are filled with cooling liquid, and the first cooling block 202a and the second cooling block 202b are composed of copper plates.

The positioning plate 202 is inserted into the slot 201b on the partition plate 201a through the second cooling block 202b at the lower end. At this time, the second cooling block 202b will be located at the inner upper end of the server body 101, and the first cooling block 201a will be located in the heat dissipation cavity Inside the chamber 201, since the first cooling block 202a and the second cooling block 202b are filled with cooling liquid, the two can exchange heat with the heat inside the server body 101 through the cooling liquid inside, and the first cooling block 202a and the second cooling block 202a can exchange heat with the internal cooling liquid. The second cooling block 202b is composed of copper plates, which also makes the heat conduction effect of the two better and improves the heat exchange efficiency. After the first cooling block 202a performs cold and heat exchange, the exchanged heat can be transferred to the Inside the heat dissipation chamber 201 .

Example 2

1 and 2 , it is the second embodiment of the present invention, which is different from the first embodiment in that the upper end of the positioning plate 202 is provided with a heat-absorbing sheet 203 , and the heat-absorbing sheet 203 is located at the lower end of the top cover 104 The inner side of the heat dissipation port 105 is provided with a dust filter 105a, the surface of the heat absorbing sheet 203 is provided with a honeycomb hole 203a, and the heat absorbing sheet 203 is composed of a silicone gasket.

The provided heat absorbing sheet 203 can absorb and conduct heat, and through the honeycomb holes 203a opened on the surface, the heat can be circulated at a uniform speed, and the heat after the circulation will be discharged through the heat dissipation port 105, and the provided dustproof net 105a, Not only can the dissipated heat be filtered, but also foreign impurities and dust can be prevented from falling into the inside of the server body 101 .

Example 3

1 and 3, it is the third embodiment of the present utility model, which is different from the first two embodiments in that: the four corners of the lower end of the top cover 104 are installed with a fixing plate 104a, and the two sides of the lower end of the fixing plate 104a are welded with connection Plate 104b, a bending plate 104c is movably connected in the middle of the connecting plate 104b, and the bending plate 104c is arranged in an inclined shape. The buffer spring 104c-2 is connected to the fixing plate 104a, and the upper end side of the bending plate 104c is also welded with a clamping plate 104c-3. The four corners of the heat dissipation chamber 201 are also provided with clamping slots 201c. The clamping plate 104c-3 is connected to the clamping plate 104c-3. slot 201c active connection,

When it is necessary to install and remove the top cover 104 to repair the inside of the server body 101, the fixing plates 104a at the lower four corners of the top cover 104 can be inserted into the heat dissipation chamber 201 first, and then the card plate 104c-3 and the bending plate 104c can be inserted into the heat dissipation chamber 201. The side close to the fixed plate 104a is squeezed, and the bending plate 104c can be hinged on one side of the fixed plate 104a through the connecting shaft 104c-1. At this time, when the two are squeezed, the buffer spring 104c-2 will also be squeezed Deformation occurs. When the top cover 104 is completely pressed against the top of the server body 101, the card board 104c-3 will also be aligned with the card slots 201c at the four corners of the heat dissipation chamber 201. At this time, the buffer spring 104c-2 will rebound and bend the plate 104c, and the card board 104c-3 will also enter the inner side of the card slot 201c for limit clamping and fixing. When the top cover 104 needs to be disassembled, the personnel can directly press the card board 104c-3 to separate it from the inside of the card slot 201c. Then, the top cover 104 can be directly lifted upwards, which is simple and convenient, and does not require other tools to assist disassembly and assembly.

It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should The technical solutions can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be included in the scope of the claims of the present invention.

Claims (8)

1. The utility model provides a big data server heat dissipation equipment of computer which characterized in that: comprises the steps of (a) preparing a mixture of a plurality of raw materials,

the server assembly (100) comprises a server body (101), an outer plate (102), a magnetic box (103), a top cover (104) and a heat dissipation port (105), wherein the outer plate (102) is arranged on the front surface of the server body (101), the magnetic box (103) is arranged on the front surface of the outer plate (102), the top cover (104) is arranged at the upper end of the server body (101), and the heat dissipation port (105) is formed in the top cover (104);

the heat dissipation assembly (200) comprises a heat dissipation chamber (201), a positioning plate (202) and heat absorbing sheets (203), the heat dissipation chamber (201) is formed in an inner cavity in the upper end of the server body (101), the positioning plate (202) is installed on the inner side of the heat dissipation chamber (201), the heat absorbing sheets (203) are arranged at the upper end of the positioning plate (202), and the heat absorbing sheets (203) are located at the lower end of the top cover (104).

2. The heat dissipation device of the computer big data server as claimed in claim 1, wherein: fixing plates (104a) are installed at four corners of the lower end of the top cover (104), connecting plates (104b) are welded on two sides of the lower end of each fixing plate (104a), a bending plate (104c) is movably connected in the middle of each connecting plate (104b), and the bending plates (104c) are arranged in an inclined mode.

3. The heat dissipation device of the computer big data server as claimed in claim 2, wherein: the bending plate (104c) is movably hinged with the connecting plate (104b) through a connecting shaft, one side of the bending plate (104c) is connected with the fixing plate (104a) through a buffer spring (104c-2), and one side of the upper end of the bending plate (104c) is welded with a clamping plate (104 c-3).

4. The computer big data server heat dissipation device of claim 1, wherein: the inner side of the heat dissipation opening (105) is provided with a dust screen (105a), and the dust screen (105a) is made of a metal filter screen.

5. The computer big data server heat dissipation device of claim 1, wherein: the lower extreme of heat dissipation cavity (201) is provided with division board (201a), and slot (201b) that the interval is equal are seted up on the surface of division board (201a) to draw-in groove (201c) have still been seted up to the four corners of heat dissipation cavity (201), cardboard (104c-3) and draw-in groove (201c) swing joint.

6. The computer big data server heat dissipation device of claim 1, wherein: the upper end of the positioning plate (202) is provided with first cooling blocks (202a) with equal intervals, the lower end of the positioning plate (202) is symmetrically provided with second cooling blocks (202b), and the second cooling blocks (202b) are movably inserted into the slots (201 b).

7. The computer big data server heat dissipation device of claim 6, wherein: the first cooling block (202a) and the second cooling block (202b) are identical in structure, cooling liquid is filled inside the first cooling block and the second cooling block, and the first cooling block (202a) and the second cooling block (202b) are formed by combining copper plates.

8. The heat dissipation device of the computer big data server as claimed in claim 1, wherein: the surface of the heat absorbing sheet (203) is provided with honeycomb holes (203a), and the heat absorbing sheet (203) is formed by a silica gel gasket.

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