CN216849908U - Axial module diode structure with bypass function - Google Patents
Axial module diode structure with bypass function Download PDFInfo
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- CN216849908U CN216849908U CN202122981391.8U CN202122981391U CN216849908U CN 216849908 U CN216849908 U CN 216849908U CN 202122981391 U CN202122981391 U CN 202122981391U CN 216849908 U CN216849908 U CN 216849908U
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Abstract
本实用新型涉及一种具有旁路功能的轴向模块二极管结构，第一电极通过焊接粘连层与二极管芯片的正极相连，在第一电极上连接有第一引线，第一引线的另一端与第一导电片相连；所述第二电极通过焊接粘连层与二极管芯片的负极相连，第二电极上连接有第二引线，第二引线的另一端与第二导电片相连；且所述二极管芯片、第一电极、第二电极以及部分第一引线、部分第二引线均位于所述绝缘护胶内。本实用新型左右散热均匀，且散热面积更大，接线盒额定电流可以做更大；能简化接线盒内部电路结构，减少内部电路的连接装配，减少连接风险；左右对称结构，有利于接线盒的简化设计，提升灌胶密封性。
The utility model relates to an axial module diode structure with bypass function. A first electrode is connected with a positive electrode of a diode chip through a welding adhesion layer, a first lead is connected on the first electrode, and the other end of the first lead is connected to a second lead. A conductive sheet is connected; the second electrode is connected to the negative electrode of the diode chip through a welding adhesion layer, a second lead is connected to the second electrode, and the other end of the second lead is connected to the second conductive sheet; and the diode chip, The first electrode, the second electrode, and part of the first lead and part of the second lead are all located in the insulating protective glue. The utility model dissipates heat evenly on the left and right, and has a larger heat dissipation area, and the rated current of the junction box can be made larger; the internal circuit structure of the junction box can be simplified, the connection and assembly of the internal circuit can be reduced, and the connection risk can be reduced; Simplify the design and improve the sealing performance of the glue.
Description
Technical Field
The utility model relates to a diode structure, in particular to an axial module diode structure with a bypass function in a junction box for a solar cell module.
Background
At present, the mainstream junction box circuits of the photovoltaic module mainly comprise three circuits, namely R6 axial diode resistance welding copper sheet conductors (the advantage is that the diode is designed to be symmetrical left and right and the heat dissipation is uniform, and the defect is that the heat dissipation is influenced by the need of reconnection with the copper sheet conductors); the TO263 surface mount diode reflow soldering copper sheet diode (has the advantages of large connection surface with a copper conductor, good heat dissipation performance, uneven heat dissipation, complex reflow soldering process and low efficiency); the jumper structure module diode (the advantage is that the copper sheet and the patch diode are combined to be combined, the heat dissipation performance is better, and the disadvantage is that the heat dissipation is uneven, and the hidden crack risk of an internal chip is large).
Disclosure of Invention
The utility model aims to overcome the defects in the prior art and provide an axial module diode structure of a module circuit, which can uniformly radiate heat, reduce hidden crack risk of a chip, reduce connection of an electric appliance and increase current carrying capacity.
According to the technical scheme provided by the utility model, the axial module diode structure with the bypass function comprises a diode chip, a first electrode, a second electrode, a first lead, a second lead, a first conducting strip, a second conducting strip and insulating protective glue, wherein the first electrode and the second electrode are both in a sheet shape, and the overall dimensions of the first electrode and the second electrode are both larger than the overall dimension of the diode chip; the first electrode is connected with the anode of the diode chip through a welding adhesion layer, a first lead is connected to the first electrode, and the other end of the first lead is connected with the first conducting strip; the second electrode is connected with the cathode of the diode chip through a welding adhesion layer, a second lead is connected to the second electrode, and the other end of the second lead is connected with the second conducting strip; and the diode chip, the first electrode, the second electrode, part of the first lead and part of the second lead are all positioned in the insulating protective adhesive.
Preferably, a first tin storage tank is arranged on the front surface of the first conducting plate, and the rear surface of the first conducting plate is a plane.
Preferably, a second tin storage tank is arranged on the front surface of the second conducting plate, and the rear surface of the second conducting plate is a plane.
Preferably, the plane of the first conducting strip is perpendicular to the plane of the first electrode.
Preferably, the plane of the second conducting strip is perpendicular to the plane of the second electrode.
The utility model has the following advantages:
1. the utility model has even left and right heat dissipation, larger heat dissipation area and larger rated current of the junction box;
2. the utility model can simplify the internal circuit structure of the junction box, reduce the connection assembly of the internal circuit and reduce the connection risk;
3. the utility model has a bilateral symmetry structure, is beneficial to simplifying the design of the junction box and improves the sealant filling tightness.
Drawings
Fig. 1 is a bottom view of the present invention.
Fig. 2 is a right side view of the present invention.
Fig. 3 is a front view of the present invention.
Fig. 4 is a left side view of the present invention.
Fig. 5 is a top view of the present invention.
Fig. 6 is a rear view of the present invention.
Fig. 7 is a perspective view of the present invention.
Fig. 8 is a bottom view of the present invention after the removal of the insulating gel.
Fig. 9 is a right side view of the present invention after the insulating sheath is removed.
Fig. 10 is a front view of the present invention after the insulating sheath is removed.
Fig. 11 is a left side view of the present invention after the insulating sheath is removed.
Fig. 12 is a top view of the present invention after the insulating gel has been removed.
Fig. 13 is a rear view of the present invention after the insulating gel has been removed.
Fig. 14 is a perspective view of the present invention after the insulating gel is removed.
Detailed Description
The present invention will be further described with reference to the following specific examples.
The axial module diode structure with the bypass function of the utility model is shown in fig. 1-14, and comprises a diode chip 1, a first electrode 2.1, a second electrode 2.2, a first lead 3.1, a second lead 3.2, a first conducting strip 4.1, a second conducting strip 4.2 and an insulating protective adhesive 5, wherein the first electrode 2.1 and the second electrode 2.2 are both in a sheet shape, and the external dimensions of the first electrode 2.1 and the second electrode 2.2 are both larger than the external dimension of the diode chip 1; the first electrode 2.1 is connected with the anode of the diode chip 1 through a welding adhesion layer, a first lead 3.1 is connected to the first electrode 2.1, and the other end of the first lead 3.1 is connected with a first conducting strip 4.1; the second electrode 2.2 is connected with the cathode of the diode chip 1 through a welding adhesion layer, a second lead 3.2 is connected to the second electrode 2.2, and the other end of the second lead 3.2 is connected with a second conducting strip 4.2; and the diode chip 1, the first electrode 2.1, the second electrode 2.2, a part of the first lead 3.1 and a part of the second lead 3.2 are all positioned in the insulating protective adhesive 5.
The front surface of the first conducting strip 4.1 is provided with a first tin storage tank 4.11, and the back surface of the first conducting strip 4.1 is a plane.
The front surface of the second conducting strip 4.2 is provided with a second tin storage tank 4.22, and the back surface of the second conducting strip 4.2 is a plane.
The plane of the first conducting strip 4.1 is perpendicular to the plane of the first electrode 2.1.
The plane of the second conducting strip 4.2 is perpendicular to the plane of the second electrode 2.2.
In the utility model, the first electrode 2.1 and the second electrode 2.2 are both circular, the first conducting strip 4.1 and the second conducting strip 4.2 are both rectangular, the first tin storage tank 4.11 and the second tin storage tank 4.22 are both rectangular, and the first tin storage tank 4.11 and the second tin storage tank 4.22 can store tin during use, thereby being more beneficial to welding.
In the utility model, the shapes of the first conducting strip 4.1 and the second conducting strip 4.2 can be adjusted according to different junction box structure requirements, and the size of the diode chip 1 can also be selected according to the requirements of the rated current of the junction box.
The axial module diode structure with the bypass function is arranged in a bilateral symmetry mode, so that the simplified design of a junction box is facilitated, and the sealant pouring tightness is improved.
In the utility model, the first electrode 2.1, the first conducting strip 4.1, the second electrode 2.2 and the second conducting strip 4.2 are arranged in bilateral symmetry, so that the heat dissipation is uniform from left to right, and the first electrode 2.1, the first conducting strip 4.1, the second electrode 2.2 and the second conducting strip 4.2 are all of sheet structures, so that the heat dissipation area is larger, and the rated current of the junction box can be larger.
Claims (5)
1. An axial module diode structure with a bypass function comprises a diode chip (1), a first electrode (2.1), a second electrode (2.2), a first lead (3.1), a second lead (3.2), a first conducting strip (4.1), a second conducting strip (4.2) and insulating protective glue (5), wherein the first electrode (2.1) and the second electrode (2.2) are both in a sheet shape, and the overall dimensions of the first electrode (2.1) and the second electrode (2.2) are both larger than that of the diode chip (1); the method is characterized in that: the first electrode (2.1) is connected with the anode of the diode chip (1) through a welding adhesion layer, a first lead (3.1) is connected to the first electrode (2.1), and the other end of the first lead (3.1) is connected with a first conducting strip (4.1); the second electrode (2.2) is connected with the cathode of the diode chip (1) through a welding adhesion layer, a second lead (3.2) is connected to the second electrode (2.2), and the other end of the second lead (3.2) is connected with a second conducting strip (4.2); and the diode chip (1), the first electrode (2.1), the second electrode (2.2), part of the first lead (3.1) and part of the second lead (3.2) are all positioned in the insulating protective adhesive (5).
2. The axial modular diode structure with bypass function of claim 1, wherein: a first tin storage groove (4.11) is formed in the front surface of the first conducting strip (4.1), and the rear surface of the first conducting strip (4.1) is a plane.
3. The axial modular diode structure with bypass function of claim 1, wherein: a second tin storage groove (4.22) is formed in the front surface of the second conducting strip (4.2), and the rear surface of the second conducting strip (4.2) is a plane.
4. The axial modular diode structure with bypass function of claim 1, wherein: the plane of the first conducting strip (4.1) is perpendicular to the plane of the first electrode (2.1).
5. The axial modular diode structure with bypass function of claim 1, wherein: the plane of the second conducting strip (4.2) is perpendicular to the plane of the second electrode (2.2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122981391.8U CN216849908U (en) | 2021-11-30 | 2021-11-30 | Axial module diode structure with bypass function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122981391.8U CN216849908U (en) | 2021-11-30 | 2021-11-30 | Axial module diode structure with bypass function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216849908U true CN216849908U (en) | 2022-06-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122981391.8U Active CN216849908U (en) | 2021-11-30 | 2021-11-30 | Axial module diode structure with bypass function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216849908U (en) |
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2021
- 2021-11-30 CN CN202122981391.8U patent/CN216849908U/en active Active
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