CN216671567U

CN216671567U - Semiconductor packaging equipment

Info

Publication number: CN216671567U
Application number: CN202122395689.0U
Authority: CN
Inventors: 程天映
Original assignee: Rongtai Semiconductor Jiangsu Co ltd
Current assignee: Rongtai Semiconductor Jiangsu Co ltd
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2022-06-03
Anticipated expiration: 2031-09-30

Abstract

The utility model relates to semiconductor packaging equipment, which comprises a box body, wherein four corners of the bottom of the box body are fixedly connected with supporting columns, a box door is arranged on the surface of the box body, a bearing is fixedly connected with the middle position of the bottom of the box body, and an installation plate is fixedly connected with the bottom of the box body. The automatic glue dispensing device is simple in structure and convenient to use, the first servo motor, the workbench, the push block, the air cylinder, the first electric push rod and the glue storage barrel are arranged to be matched with each other, automatic feeding and discharging and glue dispensing treatment can be carried out on a semiconductor, a full-automatic processing mode is adopted, the processing efficiency and quality are improved, the semiconductor to be packaged is placed into the connecting bin through the groove in the left side surface of the box body, the air cylinder is started, the push block is pushed by the air cylinder to reciprocate in the connecting bin, the semiconductor to be packaged is pushed into the clip-shaped block, glue dispensing is facilitated, after glue dispensing is completed, the second electric push rod pushes the limiting block to push the packaged semiconductor out, and a user can take the semiconductor conveniently.

Description

Semiconductor packaging equipment

Technical Field

The utility model relates to semiconductor packaging equipment, and belongs to the technical field of mechanical numerical control machines.

Background

The conductor is a substance with conductivity between the insulator and the conductor, and the conductivity of the conductor is easy to control and can be used as an element material for information processing. Semiconductors are very important from the viewpoint of technological or economic development. The core elements of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity change of semiconductors to process information. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.

In order to prevent the semiconductor device from short circuit caused by falling dust in the using process of the semiconductor device, a protective film is coated on the surface of the semiconductor in the production process. On one hand, the device is isolated from the outside so as to prevent the electric performance from being reduced due to the corrosion of impurities in the air to a device circuit; on the other hand, the packaged device is more convenient to install and transport. The existing semiconductor packaging equipment has low efficiency and poor packaging effect.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the present invention is to overcome the existing defects, and to provide a semiconductor package device, which can effectively solve the problems in the background art.

In order to solve the technical problems, the utility model provides the following technical scheme:

the utility model provides a semiconductor packaging equipment, includes the box, the equal fixed connection in bottom four corners position of box has the support column, and the surface of box is equipped with the chamber door, the bottom intermediate position fixed connection of box has the bearing, and the bottom fixed connection of box has the mounting panel, the inside fixed connection of mounting panel has a servo motor, and a servo motor's projecting shaft and bearing fixed connection, the inside fixed connection of bearing has the connecting axle, and the top fixed connection of connecting axle has the workstation, the left end fixed surface of box is connected has the fixed plate, and the surface of fixed plate has the cylinder through bolt fixed connection, the fixed surface of cylinder is connected has the ejector pad, the inner wall left end fixed connection of box has the connection storehouse.

Furthermore, the top of the inner wall of the box body is fixedly connected with a heat dissipation box, the top end of the inner part of the box body is fixedly connected with a temperature sensor, the top of the inner wall of the box body is fixedly connected with a connecting ring, and the bottom surface of the connecting ring is fixedly connected with a lamp strip.

Further, the setting of support column has four groups, and the mutual symmetry of support column sets up, the inboard fixed surface of support column is connected has the fixed column, and the bottom fixed surface of support column is connected has the round piece, the bottom fixed connection of round piece has the concave plate, and the inner wall fixed connection of concave plate has the pivot.

Further, the junction fixed connection of chamber door and box has the hinge, and the hinge is equipped with a plurality of, the surperficial intermediate position fixed connection of chamber door has the observation board, and the observation board is made by the ya keli material, the fixed connection in surface of chamber door has the handle, the handle constitutes fixed knot through welding and chamber door and constructs.

Furthermore, the overlooking of the workbench is circular, the surface of the workbench is fixedly connected with a square block, the bottom surface of the square block is fixedly connected with a second electric push rod, the top of the second electric push rod is fixedly connected with a limiting block, and the limiting block and the square block form a sliding structure.

Furthermore, the main view of the connecting bin is in a T shape, the left end surface of the connecting bin is communicated with the box body, the inner wall surface of the connecting bin is in contact with the surface of the push block, and the connecting bin and the push block form a sliding structure.

Further, the heat dissipation case is the rectangle that the level was placed, and the bottom fixed surface of heat dissipation case is connected has the dust screen, the top left end fixed connection of heat dissipation case has motor drive, and motor drive passes through the wire and is connected with temperature sensor, the inside top fixed connection of heat dissipation case has second servo motor, and second servo motor's extension shaft fixed connection have the flabellum, second servo motor passes through the wire and is connected with motor drive.

Further, the top right-hand member fixed connection of box inner wall has first electric putter, and the fixed surface of the bottom of first electric putter connects has the connecting block, overlooking of connecting block is the annular, and the bottom fixed connection of connecting block has the connecting pipe, the top fixed connection of connecting block has the storage to glue the bucket, and stores up and glue the bucket and be linked together with the connecting pipe.

Further, the surface of the rotating shaft is fixedly connected with a moving wheel, the surface of the outer side of the concave plate is fixedly connected with a rectangular block, the interior of the rectangular block is connected with a bolt column through threads, the surface of the bottom of the bolt column is fixedly connected with a brake plate, and the top of the bolt column is fixedly connected with a rotating handle.

The utility model has the technical effects and advantages that:

1. the utility model can automatically carry out feeding and discharging and glue dispensing treatment on the semiconductor by arranging the first servo motor, the workbench, the push block, the cylinder, the first electric push rod and the glue storage barrel which are mutually matched, adopts a full-automatic processing mode to improve the processing efficiency and quality, puts the semiconductor to be packaged into the connecting bin through the groove on the left side surface of the box body, starts the cylinder, pushes the push block to reciprocate in the connecting bin, pushes the semiconductor to be packaged into the square-shaped block, starts the first servo motor, drives the connecting shaft to rotate, simultaneously drives the workbench to rotate by the connecting shaft, moves the semiconductor to be packaged to a proper position, starts the first electric push rod, pushes the glue storage barrel to slide downwards, the connecting pipe is contacted with the surface of the semiconductor to be packaged, and carries out glue dispensing on the semiconductor to be packaged, the whole practicability is improved, when the dispensing is finished, the second electric push rod is started, the second electric push rod pushes the limiting block to push out the packaged semiconductor, the semiconductor is convenient to take by a user, and the processing efficiency and quality are improved by adopting a full-automatic processing mode;

2. according to the utility model, through the arrangement of the box door and the handle, the influence of excessive dust on the packaging of the semiconductor is avoided, the working efficiency is further improved, the practicability and the working efficiency are improved through the box door and the observation plate, the packaging efficiency is improved, when the temperature sensor detects that the temperature inside the box body is overhigh, the motor driver is started, the motor driver starts the second servo motor, the second servo motor drives the fan blade to rotate, the temperature inside the box body is cooled, the problem that the packaging efficiency is influenced due to overhigh temperature inside the box body is avoided, the problem that external dust enters the inside of the box body through the arranged dustproof net, the packaging efficiency is further influenced, the working efficiency is further improved, and the overall practicability is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the principles of the utility model and not to limit the utility model.

Fig. 1 is a schematic overall perspective view of the present invention.

Fig. 2 is a schematic structural view of the present invention.

Fig. 3 is a front view of the present invention.

Fig. 4 is a schematic sectional view of the present invention.

Fig. 5 is a main sectional view of the present invention.

Fig. 6 is a side view schematic of the present invention.

Fig. 7 is a schematic top view of the present invention.

Reference numbers in the figures: 1. a box body; 2. a support pillar; 3. a box door; 4. a bearing; 5. mounting a plate; 6. a first servo motor; 7. a connecting shaft; 8. a work table; 9. a fixing plate; 10. a cylinder; 11. a push block; 12. a connecting bin; 13. a heat dissipation box; 14. a temperature sensor; 15. a connecting ring; 16. a light bar; 17. a first electric push rod; 18. connecting blocks; 19. a connecting pipe; 20. a glue storage barrel; 21. fixing a column; 22. a round block; 23. a concave plate; 24. a rotating shaft; 25. a moving wheel; 26. a rectangular block; 27. a bolt column; 28. a brake plate; 29. rotating the handle; 30. a hinge; 31. an observation plate; 32. a grip; 33. a returning block; 34. a square block; 35. a second electric push rod; 36. a limiting block; 37. a dust screen; 38. a motor driver; 39. a second servo motor; 40. a fan blade.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

As shown in fig. 1-7, a semiconductor packaging device comprises a box body 1, four corners of the bottom of the box body 1 are fixedly connected with supporting columns 2, a box door 3 is arranged on the surface of the box body 1, a bearing 4 is fixedly connected with the middle position of the bottom of the box body 1, a mounting plate 5 is fixedly connected with the bottom of the box body 1, a first servo motor 6 is fixedly connected with the inside of the mounting plate 5, an extending shaft of the first servo motor 6 is fixedly connected with the bearing 4, a connecting shaft 7 is fixedly connected with the inside of the bearing 4, a workbench 8 is fixedly connected with the top of the connecting shaft 7, a fixing plate 9 is fixedly connected with the surface of the left end of the box body 1, a cylinder 10 is fixedly connected with the surface of the fixing plate 9 through a bolt, a push block 11 is fixedly connected with the surface of the cylinder 10, a connecting bin 12 is fixedly connected with the left end of the inner wall of the box body 1, and a starting cylinder 10 is fixedly connected with the surface of the fixing plate, the cylinder 10 pushes the push block 11 to reciprocate in the connecting bin 12, and a full-automatic processing mode is adopted, so that the processing efficiency and quality are improved.

As shown in fig. 1 and 4, in the embodiment, a heat dissipation box 13 is fixedly connected to the top of the inner wall of a box body 1, a temperature sensor 14 is fixedly connected to the top of the inside of the box body 1, a connection ring 15 is fixedly connected to the top of the inner wall of the box body 1, a light bar 16 is fixedly connected to the bottom surface of the connection ring 15, a first electric push rod 17 is fixedly connected to the right end of the top of the inner wall of the box body 1, a connection block 18 is fixedly connected to the bottom surface of the first electric push rod 17, the connection block 18 is annular when viewed from above, a connection pipe 19 is fixedly connected to the bottom of the connection block 18, a glue storage barrel 20 is fixedly connected to the top of the connection block 18, the glue storage barrel 20 is communicated with the connection pipe 19, the first electric push rod 17 is started, the first electric push rod 17 pushes the glue storage barrel 20 to slide downwards, the connection pipe 19 is in contact with the surface of a semiconductor to be packaged, and glue is dispensed to the semiconductor to be packaged, the holistic practicality has been improved, and after the point was glued and is accomplished, start second electric putter 35, second electric putter 35 promotes stopper 36, and the semiconductor that will encapsulate the completion is released, makes things convenient for the user of service to get and takes, adopts full automatization's processing mode, has improved the efficiency and the quality of processing.

As shown in fig. 1 and fig. 6, there are four sets of the supporting columns 2 in the present embodiment, and the supporting columns 2 are symmetrically arranged, the inner side surfaces of the supporting columns 2 are fixedly connected with fixing columns 21, and the bottom surface of the supporting column 2 is fixedly connected with a round block 22, the bottom of the round block 22 is fixedly connected with a concave plate 23, and the inner wall of the concave plate 23 is fixedly connected with a rotating shaft 24, the surface of the rotating shaft 24 is fixedly connected with a moving wheel 25, the outer side surface of the concave plate 23 is fixedly connected with a rectangular block 26, and the inside of the rectangular block 26 is screwed with a bolt column 27, the bottom surface of the bolt column 27 is fixedly connected with a brake plate 28, and the top of the bolt column 27 is fixedly connected with a rotating handle 29, by screwing the rotating handle 29, the rotating handle 29 slides downwards to push the brake plate 28 to contact with the ground, so that the problem of intention processing efficiency caused by accidental shaking of the box body 1 is avoided.

As shown in fig. 1 and 4, the hinge 30 is fixedly connected to the connection portion between the box door 3 and the box body 1, the hinge 30 is provided with a plurality of hinges, the observation plate 31 is fixedly connected to the surface middle position of the box door 3, the observation plate 31 is made of acrylic material, the handle 32 is fixedly connected to the surface of the box door 3, the handle 32 forms a fixed structure with the box door 3 by welding, and by arranging the box door 3 and the handle 32, the influence of excessive dust on the packaging of the semiconductor is avoided, the working efficiency is further improved, and through the box door 3 and the observation plate 31, the practicability and the working efficiency are improved, and the packaging efficiency is improved.

As shown in fig. 1 and fig. 6, the top view of the worktable 8 of this embodiment is circular, the surface of the worktable 8 is fixedly connected with the return blocks 33, the return blocks 33 are annularly distributed on the surface of the worktable 8, the bottom surface of the return blocks 33 is fixedly connected with the square blocks 34, the bottom surface of the square blocks 34 is fixedly connected with the second electric push rod 35, the top of the second electric push rod 35 is fixedly connected with the limiting blocks 36, the limiting blocks 36 and the return blocks 33 form a sliding structure, the second electric push rod 35 is started, the second electric push rod 35 pushes the limiting blocks 36, the packaged semiconductor is pushed out, the semiconductor is convenient for users to take, a full-automatic processing mode is adopted, and the processing efficiency and quality are improved.

As shown in fig. 1 and 4, the connection bin 12 of the present embodiment is mainly regarded as "T" shaped, the left end surface of the connection bin 12 is communicated with the box body 1, the inner wall surface of the connection bin 12 is in contact with the surface of the push block 11, and the connection bin 12 and the push block 11 form a sliding structure, which is more convenient for a user to use.

As shown in fig. 1 and 7, the heat dissipation box 13 of this embodiment is a horizontally disposed rectangle, and the bottom surface of the heat dissipation box 13 is fixedly connected with a dust screen 37, the left end of the top of the heat dissipation box 13 is fixedly connected with a motor driver 38, and the motor driver 38 is connected with the temperature sensor 14 through a wire, the top end of the interior of the heat dissipation box 13 is fixedly connected with a second servo motor 39, and the extending shaft of the second servo motor 39 is fixedly connected with a fan blade 40, and the second servo motor 39 is connected with the motor driver 38 through a wire, when the temperature sensor 14 detects that the temperature inside the box 1 is too high, the motor driver 38 is started, the motor driver 38 starts the second servo motor 39, and the second servo motor 39 drives the fan blade 40 to rotate, so as to cool the interior of the box 1, thereby avoiding the problem that the temperature inside the box 1 is too high and the packaging efficiency is affected, through the dust screen 37, the box body has the advantages that the phenomenon that external dust enters the box body 1 is avoided, the packaging efficiency is further improved, and the overall practicability is improved.

For the convenience of understanding the technical solutions of the present invention, the following detailed description will be made on the working principle or the operation mode of the present invention in the practical process.

The working principle of the utility model is as follows: when the semiconductor packaging machine is used, a semiconductor to be packaged is placed into the connecting bin 12 through the groove on the left side surface of the box body 1, the air cylinder 10 is started, the air cylinder 10 pushes the push block 11 to reciprocate in the connecting bin 12, the semiconductor to be packaged is pushed into the return block 33, the first servo motor 6 is started, the first servo motor 6 drives the connecting shaft 7 to rotate, meanwhile, the connecting shaft 7 drives the workbench 8 to rotate, the semiconductor to be packaged is moved to a proper position, the first electric push rod 17 is started, the first electric push rod 17 pushes the glue storage barrel 20 to slide downwards, the connecting pipe 19 is in contact with the surface of the semiconductor to be packaged, glue dispensing is carried out on the semiconductor to be packaged, the overall practicability is improved, after glue dispensing is completed, the second electric push rod 35 is started, the second electric push rod 35 pushes the limiting block 36 to push out the packaged semiconductor, and a user can take the semiconductor conveniently, the full-automatic processing mode is adopted, the processing efficiency and quality are improved, the box door 3 and the handle 32 are arranged, the phenomenon that excessive dust affects the packaging of semiconductors is avoided, the working efficiency is further improved, the practicability and the working efficiency are improved through the box door 3 and the observation plate 31, the packaging efficiency is improved, when the temperature sensor 14 detects that the temperature inside the box body 1 is overhigh, the motor driver 38 is started, the motor driver 38 starts the second servo motor 39, the second servo motor 39 drives the fan blade 40 to rotate, the temperature inside the box body 1 is reduced, the problem that the temperature inside the box body 1 is overhigh and the packaging efficiency is affected is avoided, the dust screen 37 is arranged, external dust is prevented from entering the box body 1, the packaging efficiency is further affected, the working efficiency is further improved, the overall practicability is improved, the concave plate 23 and the moving wheel 25 are arranged, the convenience is transported box 1, the practicality is improved, move rotation handle 29 through twisting, rotation handle 29 slides down, promote brake block 28 and ground contact, avoided box 1 to take place the accident and rock, intention machining efficiency's problem through support column 2 and fixed column 21, stability when improving the support, indirect improvement work efficiency, through go-between 15 and lamp strip 16, the convenience throws light on to box 1's inside, packaging efficiency and work efficiency have been improved.

The above embodiments are preferred embodiments of the present invention, and those skilled in the art can make variations and modifications to the above embodiments, therefore, the present invention is not limited to the above embodiments, and any obvious improvements, substitutions or modifications made by those skilled in the art based on the present invention are within the protection scope of the present invention.

Claims

1. A semiconductor packaging apparatus includes a case (1), characterized in that: the bottom four corners of the box body (1) are fixedly connected with support columns (2), the surface of the box body (1) is provided with a box door (3), the bottom middle position of the box body (1) is fixedly connected with a bearing (4), the bottom of the box body (1) is fixedly connected with a mounting plate (5), the inside of the mounting plate (5) is fixedly connected with a first servo motor (6), an extension shaft of the first servo motor (6) is fixedly connected with the bearing (4), the inside of the bearing (4) is fixedly connected with a connecting shaft (7), the top of the connecting shaft (7) is fixedly connected with a workbench (8), the left end of the box body (1) is fixedly connected with a fixing plate (9), the surface of the fixing plate (9) is fixedly connected with a cylinder (10) through a bolt, the surface of the cylinder (10) is fixedly connected with a push block (11), the left end of the inner wall of the box body (1) is fixedly connected with a connecting bin (12).

2. The semiconductor package device of claim 1, wherein: the heat dissipation box (13) is fixedly connected to the top of the inner wall of the box body (1), the temperature sensor (14) is fixedly connected to the top of the inner portion of the box body (1), the connecting ring (15) is fixedly connected to the top of the inner wall of the box body (1), and the lamp strip (16) is fixedly connected to the surface of the bottom of the connecting ring (15).

3. The semiconductor package device of claim 1, wherein: the utility model discloses a solar water heater, including support column (2), inboard fixed surface of support column (2) is connected has fixed column (21), and the bottom fixed surface of support column (2) is connected has round piece (22), the bottom fixed connection of round piece (22) has notch board (23), and the inner wall fixed connection of notch board (23) has pivot (24), and support column (2) symmetry each other sets up.

4. The semiconductor package device of claim 1, wherein: the junction fixed connection of chamber door (3) and box (1) has hinge (30), and hinge (30) are equipped with a plurality of, the surperficial intermediate position fixed connection of chamber door (3) has observation board (31), and observation board (31) are made by ya keli material, the fixed surface connection of chamber door (3) has handle (32), handle (32) constitute fixed knot through welding and chamber door (3) and construct fixed knot.

5. The semiconductor package device of claim 1, wherein: the overlook of workstation (8) is circular, and what the fixed surface of workstation (8) connected has piece (33) that returns, it is in to return piece (33) the surface of workstation (8) is the annular and distributes, what the fixed surface of the bottom of piece (33) connected has square piece (34), and what the fixed surface of the bottom of square piece (34) connected has second electric putter (35), the top fixed connection's of second electric putter (35) stopper (36), stopper (36) and return piece (33) and constitute sliding construction.

6. The semiconductor package device of claim 1, wherein: the main body of the connecting bin (12) is in a T shape, the left end surface of the connecting bin (12) is communicated with the box body (1), the inner wall surface of the connecting bin (12) is in contact with the surface of the push block (11), and the connecting bin (12) and the push block (11) form a sliding structure.

7. A semiconductor packaging apparatus according to claim 2, wherein: the rectangle that heat dissipation case (13) were placed for the level, and the bottom fixed surface of heat dissipation case (13) is connected has dust screen (37), the top left end fixed connection of heat dissipation case (13) has motor driver (38), and motor driver (38) are connected with temperature sensor (14) through the wire, the inside top fixed connection of heat dissipation case (13) has second servo motor (39), and the projecting shaft fixed connection of second servo motor (39) has flabellum (40), second servo motor (39) are connected with motor driver (38) through the wire.

8. The semiconductor package device of claim 1, wherein: the utility model discloses a glue storage tank, including box (1), box (17), the top right-hand member fixed connection of inner wall has first electric putter (17), and the bottom fixed surface of first electric putter (17) is connected has connecting block (18), overlook for the annular of connecting block (18), and the bottom fixed connection of connecting block (18) has connecting pipe (19), the top fixed connection of connecting block (18) have the storage to glue bucket (20), and store up and glue bucket (20) and connecting pipe (19) and be linked together.

9. A semiconductor packaging apparatus according to claim 3, wherein: the surface of the rotating shaft (24) is fixedly connected with a moving wheel (25), the outer side surface of the concave plate (23) is fixedly connected with a rectangular block (26), the interior of the rectangular block (26) is connected with a bolt column (27) through threads, the bottom surface of the bolt column (27) is fixedly connected with a brake plate (28), and the top of the bolt column (27) is fixedly connected with a rotating handle (29).