CN216624207U - Glue pressing device for integrated circuit board - Google Patents
Glue pressing device for integrated circuit board Download PDFInfo
- Publication number
- CN216624207U CN216624207U CN202122452929.6U CN202122452929U CN216624207U CN 216624207 U CN216624207 U CN 216624207U CN 202122452929 U CN202122452929 U CN 202122452929U CN 216624207 U CN216624207 U CN 216624207U
- Authority
- CN
- China
- Prior art keywords
- pressing
- seat
- integrated circuit
- base
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003825 pressing Methods 0.000 title claims abstract description 88
- 239000003292 glue Substances 0.000 title abstract description 15
- 238000006073 displacement reaction Methods 0.000 claims abstract description 39
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive Effects 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002035 prolonged Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Abstract
The utility model relates to a glue pressing device for an integrated circuit board, belonging to the field of integrated circuit board production; a is used for integrated circuit board adhesive pressing device includes: the base is fixedly arranged in a working area; the bottom of the supporting seat is fixedly connected with the top of the base; the pressing mechanism is arranged in the supporting seat; the utility model relates to a glue pressing device for an integrated circuit board, which is characterized in that a pressing mechanism is arranged to be matched with a workbench to perform glue pressing work on the integrated circuit board, a driving cylinder is driven to perform pressing work according to different board types and pressing parameters, and a damping spring is arranged between a lower displacement seat and the pressing platform, so that the pressing force can be effectively reduced, and the board damage caused by the large pressure can be prevented; therefore, the utility model can carry out glue pressing work on different integrated circuit boards, thereby improving the working efficiency.
Description
Technical Field
The utility model relates to a glue pressing device for an integrated circuit board, and belongs to the field of integrated circuit board production.
Background
After more than sixty years of development, the integrated board industry is continuously promoted and even fused with upstream and downstream industries under the drive of new materials and new processes, and becomes an indispensable supporting column industry in strategic significance industries such as national defense and military industry, chip manufacturing and the like.
In the prior art, the production of the integrated circuit board is to produce different types of boards according to the requirements of drawings; after the production of the circuit board is finished, glue pressing and shaping are needed, so that the service life of the integrated circuit board is prolonged; however, the existing circuit board has different styles and different materials, and further has different parameters of adhesive pressing, and the traditional adhesive pressing is manual adhesive pressing, so that the efficiency is low, the adhesive pressing force required by work cannot be met, and the service life of the integrated circuit board is shortened.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: the glue pressing device for the integrated circuit board is provided to solve the above mentioned problems.
The technical scheme is as follows: a is used for integrated circuit board adhesive pressing device, includes:
the base is fixedly arranged in a working area; the bottom of the supporting seat is fixedly connected with the top of the base; and the pressing mechanism is arranged in the supporting seat.
In a further embodiment, the pressing mechanism comprises: one end of the first sliding rod is connected with the inner side of the supporting seat, and the top of the base at the other end of the first sliding rod is connected with the top of the supporting seat; the upper displacement seat is sleeved on the first sliding rod; one end of the rib plate is connected with the top of the upper displacement seat through a bolt; one end of the lower displacement seat is connected with the bottom bolt of the ribbed plate and is sleeved on the first sliding rod; the telescopic rod of the displacement cylinder is connected with the bottom bolt of the upper displacement seat; the mounting seat is connected with the lower displacement seat through four groups of supporting rods; the pressing air cylinder is arranged on the mounting seat; the pressing seat is sleeved with the support rod and is connected with a telescopic rod of the pressing cylinder; the second sliding rod is sleeved on the mounting seat, and one end of the second sliding rod is connected with the top of the pressing seat; one end of the pressure rod is connected with the bottom of the pressure seat and is sleeved with the lower displacement seat; and the pressing platform is connected with the other end of the pressing rod.
In a further embodiment, a fixed seat is arranged on the base and is arranged on the base; the workbench is simultaneously connected with the base and the fixed seat through a connecting rod; the jig is arranged on the workbench.
In a further embodiment, a damping spring is arranged between the lower displacement seat and the pressing platform.
In a further embodiment, the base is provided with a cylinder block, the bottom of the displacement cylinder being mounted on the cylinder block.
Has the advantages that: the utility model relates to a glue pressing device for an integrated circuit board, which is characterized in that a pressing mechanism is arranged to be matched with a workbench to perform glue pressing work on the integrated circuit board, a driving cylinder is driven to perform pressing work according to different board types and pressing parameters, and a damping spring is arranged between a lower displacement seat and the pressing platform, so that the pressing force can be effectively reduced, and the board damage caused by the large pressure can be prevented; therefore, the utility model can carry out glue pressing work on different integrated circuit boards, thereby improving the working efficiency.
Drawings
Fig. 1 is an isometric view of the present invention.
Fig. 2 is a front view of the present invention.
Fig. 3 is a cross-sectional view of the present invention.
Reference numerals: the device comprises a base 1, a supporting seat 2, a pressing mechanism 3, a fixed seat 4, a workbench 5, a connecting rod 6, a jig 7, a cylinder seat 8, a first slide rod 31, an upper displacement seat 32, a rib plate 33, a lower displacement seat 34, a displacement cylinder 35, an installation seat 36, a supporting rod 37, a pressing cylinder 38, a pressing seat 39, a second slide rod 40, a pressing rod 43, a pressing platform 41 and a damping spring 42.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these details; in other instances, well-known features have not been described in order to avoid obscuring the utility model.
A is used for integrated circuit board adhesive pressing device, includes: the device comprises a base 1, a supporting seat 2, a pressing mechanism 3, a fixed seat 4, a workbench 5, a connecting rod 6, a jig 7, a cylinder seat 8, a first slide rod 31, an upper displacement seat 32, a rib plate 33, a lower displacement seat 34, a displacement cylinder 35, an installation seat 36, a supporting rod 37, a pressing cylinder 38, a pressing seat 39, a second slide rod 40, a pressing rod 43, a pressing platform 41 and a damping spring 42.
In one embodiment, as shown in fig. 1, a base 1, is fixedly mounted to a work area; the bottom of the supporting seat 2 is fixedly connected with the top of the base 1; a pressing mechanism 3 installed in the support base 2; the base 1 is provided with a fixed seat 4 which is arranged on the base 1; the workbench 5 is simultaneously connected with the base 1 and the fixed seat 4 through a connecting rod 6; and the jig 7 is arranged on the workbench 5.
In one embodiment, as shown in fig. 2, the pressing mechanism 3 includes: one end of the first sliding rod 31 is connected with the inner side of the supporting seat 2, and the top of the base 1 at the other end is connected; the upper displacement seat 32 is sleeved on the first sliding rod 31; a rib plate 33 having one end bolted to the top of the upper displacement seat 32; one end of the lower displacement seat 34 is connected with the bottom bolt of the ribbed plate 33 and is sleeved on the first sliding rod 31; a displacement cylinder 35, the telescopic rod of which is connected with the bottom bolt of the upper displacement seat 32; a mounting seat 36 connected to the lower displacement seat 34 via four sets of struts 37; a pressing cylinder 38 mounted on the mounting base 36; the pressing seat 39 is sleeved with the supporting rod 37 and is connected with an expansion rod of the pressing cylinder 38; the second sliding rod 40 is sleeved on the mounting seat 36, and one end of the second sliding rod is connected with the top of the pressing seat 39; a pressing rod 43, one end of which is connected with the bottom of the pressing seat 39 and is sleeved with the lower displacement seat 34; and a pressing table 41 connected to the other end of the pressing rod 43.
In one embodiment, as shown in fig. 3, a damping spring 42 is provided between the lower displacement seat 34 and the pressing platform 41; the base 1 is provided with a cylinder block 8, and the bottom of the displacement cylinder 35 is mounted on the cylinder block 8.
The working principle is as follows: when the circuit board pressing device works, firstly, a circuit board needing to be pressed with glue is placed in the jig 7, then the device is started, and the pressing mechanism 3 works;
firstly, the displacement cylinder 35 is driven, the upper displacement seat 32 is driven to move downwards through the telescopic rod, the lower displacement plate is driven to work through the ribbed plate 33, the first slide bar 31 moves downwards, and when the first slide bar reaches a working position, the first slide bar stops;
secondly, the pressing air cylinder 38 is driven to work, the telescopic rod drives the pressing base 39 to perform certain movement, the pressing base 39 moves downwards on the second sliding rod 40, meanwhile, the pressing rod 43 also works due to the movement of the pressing base 39, the pressing table 41 is driven to perform pressing work, and the pressing table 41 is used for installing an integrated circuit board placed in the jig 7, so that the pressing work is completed, all the parts are returned to work, and the next process is performed; therefore, the pressing mechanism 3 is arranged to be matched with the workbench 5 to perform glue pressing work on the integrated circuit board, meanwhile, the driving air cylinder is driven to perform pressing work according to different board types and pressing parameters, and meanwhile, the damping spring 42 is arranged between the lower displacement seat 34 and the pressing platform 41, so that the pressing force can be effectively reduced, and the board damage caused by the large pressure can be prevented; therefore, the utility model can carry out glue pressing work on different integrated circuit boards, thereby improving the working efficiency.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the embodiments, and various equivalent changes can be made to the technical solution of the present invention within the technical idea of the present invention, and these equivalent changes are within the protection scope of the present invention.
Claims (4)
1. The utility model provides a be used for integrated circuit board adhesive pressing device which characterized in that includes:
the base is fixedly arranged in a working area; the bottom of the supporting seat is fixedly connected with the top of the base; the pressing mechanism is arranged in the supporting seat;
the pressing mechanism includes: one end of the first sliding rod is connected with the inner side of the supporting seat, and the other end of the first sliding rod is connected with the top of the base; the upper displacement seat is sleeved on the first sliding rod; one end of the rib plate is connected with the top of the upper displacement seat through a bolt; one end of the lower displacement seat is connected with the bottom bolt of the ribbed plate and is sleeved on the first sliding rod; the telescopic rod of the displacement cylinder is connected with the bottom bolt of the upper displacement seat; the mounting seat is connected with the lower displacement seat through four groups of supporting rods; the pressing air cylinder is arranged on the mounting seat; the pressing seat is sleeved with the support rod and is connected with a telescopic rod of the pressing cylinder; the second sliding rod is sleeved on the mounting seat, and one end of the second sliding rod is connected with the top of the pressing seat; one end of the pressure rod is connected with the bottom of the pressure seat and is sleeved with the lower displacement seat; and the pressing platform is connected with the other end of the pressing rod.
2. The IC board laminating apparatus of claim 1,
the base is provided with a fixed seat and is arranged on the base; the workbench is simultaneously connected with the base and the fixed seat through a connecting rod; the jig is arranged on the workbench.
3. The IC board laminating apparatus of claim 1,
and a damping spring is arranged between the lower displacement seat and the pressing platform.
4. The IC board laminating apparatus of claim 1,
the base is provided with a cylinder seat, and the bottom of the displacement cylinder is arranged on the cylinder seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122452929.6U CN216624207U (en) | 2021-10-12 | 2021-10-12 | Glue pressing device for integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122452929.6U CN216624207U (en) | 2021-10-12 | 2021-10-12 | Glue pressing device for integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216624207U true CN216624207U (en) | 2022-05-27 |
Family
ID=81692191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122452929.6U Active CN216624207U (en) | 2021-10-12 | 2021-10-12 | Glue pressing device for integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216624207U (en) |
-
2021
- 2021-10-12 CN CN202122452929.6U patent/CN216624207U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |