CN216531920U - Low-impedance multilayer board - Google Patents

Abstract

The utility model discloses a low-impedance multi-layer board, which comprises a base, a fixing plate is arranged on the front part of the upper end and the rear part of the upper end of the base; Each of them is provided with a card slot, and the main body plate is clipped in the two card slots. The upper left part of the base is provided with a No. 2 limit plate, and the left front part of the second limit plate and the rear part of the left end are both set There is a heat dissipation device, a number limit plate is set on the right part of the upper end of the base, a chute is provided on the front side of the upper end of the base and the rear side of the upper end, and a set of reinforcement bolts are arranged on the left part of the upper end of the base and the right part of the upper end. The two groups of the reinforcing bolts are symmetrically distributed on the left and right, and each group is provided with two. In the low-impedance multilayer board of the utility model, by setting the No. 1 limit plate, the No. 2 limit board and the heat dissipation device, and by adjusting the left and right positions of the No. 1 limit board and the No. 2 limit board, the improved The stability of the multi-layer board, while improving the heat dissipation effect.

Description

A low-impedance multilayer board

technical field

The utility model relates to the technical field of circuit boards, in particular to a low-impedance multilayer board.

Background technique

The market for the circuit board sector is constantly developing, mainly due to two driving forces. First, the market space of the circuit board application industry continues to expand. The application of the communication industry and the notebook computer industry has improved, making the high-end multi-layer circuit board market grow very rapidly, and the current application ratio has reached 50%. At the same time, the proportion of digital circuit boards for color TVs, mobile phones, and automotive electronics has also increased significantly, making the space for the circuit board industry continue to expand. The impedance can be any combination of resistance, capacitance, and inductance that hinders the current. Since the impedance of the capacitor to the DC current is infinite, and the impedance of the inductor to the DC current is zero, the impedance is more used to describe the current in the AC circuit. Compared with traditional circuit boards, low-impedance multilayer circuit boards have wider applicability. In the prior art: 1. The heat dissipation effect of the existing multi-layer board is poor, so that the multi-layer board is easily damaged due to high temperature, thereby reducing the use efficiency; 2. The existing equipment limits the position of the multi-layer board The fixing effect is poor, which affects the stability of the multilayer board, thus causing the limitation of the use of the low-impedance multilayer board. Therefore, we propose a new type of low-impedance multilayer board.

Utility model content

The main purpose of the present invention is to provide a low-impedance multilayer board, which can effectively solve the problems in the background technology.

To achieve the above purpose, the technical scheme adopted by the present utility model is:

A low-impedance multi-layer board, comprising a base, the upper front part of the base and the upper rear part of the base are provided with fixed plates, the two fixed plates are symmetrically distributed in the front and the rear, and the inner walls of the two fixed plates are provided with card slots , a main body plate is clamped in the two card slots, a No. 2 limit plate is arranged on the left part of the upper end of the base, and a heat dissipation device is arranged on the left front and the left rear of the No. 2 limit plate. The right part of the upper end of the base is provided with a limit plate, the front side of the upper end of the base and the rear side of the upper end are provided with a chute; The pegs are symmetrically distributed from left to right and each group is set to two.

Preferably, the left end of the No. 1 limit plate is provided with a plurality of heat dissipation grooves that pass through left and right, a set of perforations are formed on the left part of the upper end and the right part of the upper end of the base, and the left end of the No. Each of the bases is provided with installation grooves, the upper left and right upper ends of the base are provided with a plurality of screw grooves, and support plates are provided on the lower right and left lower parts of the No. 1 and No. 2 limit plates.

Preferably, the upper end of the support plate is provided with a limit bolt, and the first and second limit plates are provided with sliding blocks at the front and rear of the lower ends.

Preferably, a plurality of the heat dissipation grooves are distributed at an equal distance, and a plurality of the screw grooves are distributed at an equal distance.

Preferably, the cooling device includes an installation frame, a fan is arranged inside the installation frame, a rotating column is arranged at the output end of the fan, a fan blade is arranged at the right end of the rotating column, and a plurality of ventilation holes are arranged at the left end of the installation frame slot, the mounting bracket is connected in the mounting slot.

Preferably, a plurality of the ventilation grooves are distributed in an annular array.

Compared with the prior art, the utility model has the following beneficial effects:

1. In the present utility model, by setting the cooling device on the whole device, when in use, the installation frame is connected to the left front and rear of the second limit plate, and the fan is connected to the inside of the installation frame, and the rotating column is connected. It is connected to the output end of the fan, the fan blade is connected to the right end of the rotating column, and a plurality of ventilation grooves are opened at the left end of the installation frame. Makes the heat emitted by the multi-layer board easy to discharge, thereby improving the heat dissipation effect;

2. In the present utility model, by setting the No. 1 limit plate and the No. 2 limit plate, when in use, the fixed plate is connected to the upper front and the rear of the upper end of the base, and the inner walls of the two fixed plates are provided with card slots. , connect the main board in the card slot, connect the No. 1 limit plate to the right part of the upper end of the base, connect the No. 2 limit board to the left part of the upper end of the base, and connect the slider to the No. 1 limit board and the The front part of the lower end of the No. 2 limit plate and the rear part of the lower end, and the slider is slidably connected in the chute, and then the support plate is connected to the lower part of the right end of the No. 1 limit plate and the lower part of the left end of the No. 2 limit plate. When the slider drives When the No. 1 limit plate and the No. 2 limit plate are moved to the middle, and the multi-layer board is located between the No. 1 limit plate and the No. 2 limit plate, the limit bolt is inserted through the support plate and screwed into the screw groove. Therefore, it is convenient to reinforce the No. 1 limit plate and the No. 2 limit board. Under the clamping and fixing of the No. 1 limit board and the No. 2 limit board to the main board, the stability of the main board can be improved.

Description of drawings

1 is a schematic diagram of the overall structure of a low-impedance multilayer board of the present invention;

2 is a schematic diagram of the overall structure of a base of a low-impedance multilayer board of the present invention;

3 is a schematic diagram of the overall structure of a support plate of a low-impedance multilayer board of the present invention;

4 is a schematic diagram of the overall structure of a heat dissipation device for a low-impedance multilayer board of the present invention.

In the figure: 1. Base; 2. Reinforcement bolt; 3. Fixed plate; 4. Main body plate; 5. No. 1 limit plate; 6, No. 2 limit plate; Card slot; 10, cooling slot; 11, perforation; 12, screw slot; 13, support plate; 14, installation slot; 15, limit bolt; 16, slider; 71, mounting frame; 72, fan; 73, rotation Column; 74, fan blade; 75, ventilation groove.

Detailed ways

In order to make the technical means, creation features, achievement goals and effects of the present invention easy to understand and understand, the present invention will be further described below with reference to the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" The orientation or positional relationship indicated by "" etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, so as to The specific orientation configuration and operation is therefore not to be construed as a limitation of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

In the description of the present utility model, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "provided with", "connected", etc., should be understood in a broad sense, for example, "connected" may be a fixed The connection can also be a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be internal communication between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

As shown in Figure 1-4, a low-impedance multi-layer board includes a base 1. The upper front and the rear of the upper end of the base 1 are provided with fixed plates 3. The two fixed plates 3 are symmetrically distributed in the front and rear. The two fixed plates 3. The inner wall is provided with a card slot 9, and the main body plate 4 is clipped in the two card slots 9. The left part of the upper end of the base 1 is provided with a second limit plate 6, and the left front part of the second limit plate 6 and the left rear part Both are provided with heat dissipation equipment 7, the upper right part of the base 1 is provided with a No. 1 limit plate 5, the upper front and the upper rear of the base 1 are provided with chute 8, and the upper left and upper right of the base 1 are provided with a set of reinforcements. Bolts 2, two sets of reinforcement bolts 2 are distributed symmetrically on the left and right, and each group is provided with two.

The left end of the No. 1 limit plate 5 is provided with a plurality of heat dissipation grooves 10 that pass through left and right, a set of perforations 11 are formed on the left and right parts of the upper end of the base 1 , and the left front and rear of the second limit plate 6 are provided with The installation groove 14, the upper left part of the base 1 and the upper right part of the upper end are provided with a plurality of screw grooves 12; The No. 1 limit plate 5 and the No. 2 limit board 6 move toward the middle, so that the main body plate 4 can be easily fixed and fixed, thereby improving the stability of the main body plate 4 .

The upper end of the support plate 13 is provided with a limit bolt 15, and the first limit plate 5 and the second limit plate 6 are provided with sliders 16 at the front and rear of the lower end; In the screw groove 12 , the stability of the first limit plate 5 and the second limit plate 6 can be improved. The plurality of heat dissipation grooves 10 are distributed at equal distances, and the plurality of screw grooves 12 are distributed at equal distances.

The heat dissipation device 7 includes an installation frame 71, a fan 72 is arranged inside the installation frame 71, a rotation column 73 is arranged at the output end of the fan 72, a fan blade 74 is arranged at the right end of the rotation column 73, and a plurality of ventilation slots 75 are opened at the left end of the installation frame 71 for installation. The frame 71 is connected in the installation slot 14; the rotating column 73 and the fan blade 74 are driven by the fan 72, and under the action of the fan blade 74, the wind force can be transported to the lower end of the main body plate 4, thereby improving the heat dissipation effect, a plurality of ventilation grooves 75 distributed in a circular array.

It should be noted that the present invention is a low-impedance multi-layer board. By setting the heat dissipation device 7, when in use, the mounting frame 71 is connected to the left front and left rear of the No. 2 limit plate 6, and the fan is installed. 72 is connected inside the mounting frame 71, the rotating column 73 is connected to the output end of the fan 72, the fan blade 74 is connected to the right end of the rotating column 73, and a plurality of ventilation slots 75 are opened at the left end of the mounting frame 71, and the rotating column is driven by the fan 72. 73 and fan blades 74, so that the wind force can be injected into the lower end face of the multi-layer board from the ventilation groove 75, so that the heat emitted by the multi-layer board can be easily discharged, thereby improving the heat dissipation effect; by setting the first limit plate 5 and the second limit plate When the plate 6 is in use, the fixing plate 3 is connected to the upper front and the rear of the base 1, and the inner walls of the two fixing plates 3 are provided with a card slot 9, and the main body plate 4 is clipped in the card slot 9, and then Connect the No. 1 limit plate 5 to the right part of the upper end of the base 1, connect the No. 2 limit plate 6 to the upper left part of the base 1, and connect the slider 16 to the No. 1 limit plate 5 and the No. 2 limit plate 6 The front part of the lower end and the rear part of the lower end, and the slider 16 is slidably connected in the chute 8, and then the support plate 13 is connected to the lower part of the right end of the No. 1 limit plate 5 and the lower part of the left end of the No. Drive the No. 1 limit plate 5 and the No. 2 limit board 6 to move to the middle, and place the multi-layer board between the No. 1 limit board 5 and the No. 2 limit board 6, and then pass the limit bolt 15 through the support plate. 13 and screwed into the screw groove 12, so as to facilitate the reinforcement of the first limit plate 5 and the second limit plate 6, and the first limit plate 5 and the second limit plate 6 to clamp the main body plate 4 When fixed, the stability of the main body board 4 can be improved.

The basic principles and main features of the present invention and the advantages of the present invention are shown and described above. It should be understood by those skilled in the art that the present invention is not limited by the above-mentioned embodiments. The above-mentioned embodiments and descriptions only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention There will also be various changes and improvements in the new model, which all fall within the scope of the claimed invention. The claimed scope of the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. A low impedance multilayer board, includes base (1), its characterized in that: base (1) upper end front portion and upper end rear portion all are provided with fixed plate (3), two symmetric distribution around fixed plate (3) is, two draw-in groove (9) have all been seted up to fixed plate (3) inner wall, two equal joint has main part board (4) in draw-in groove (9), base (1) upper end left part is provided with No. two limiting plates (6), No. two limiting plates (6) left end front portion and left end rear portion all are provided with heat-radiating equipment (7), base (1) upper end right part is provided with limiting plate (5), spout (8) have all been seted up to base (1) upper end front side and upper end rear side, base (1) upper end left part and upper end right part all are provided with a set of reinforcement bolt (2), and are two sets up to two with reinforcement bolt (2) are bilateral symmetry and distribute and every group sets up to two.

2. The low impedance multilayer sheet of claim 1 wherein: a plurality of radiating grooves (10) of controlling the break-over are seted up to limiting plate (5) left end, a set of perforation (11) have all been seted up to base (1) upper end left part and upper end right part, mounting groove (14) have all been seted up to No. two limiting plate (6) left end front portions and left end rear portion, a plurality of spiral shell grooves (12) have all been seted up to base (1) upper end left part and upper end right part, limiting plate (5) and No. two limiting plate (6) right-hand member lower part and left end lower part all are provided with extension board (13).

3. The low impedance multilayer sheet of claim 2 wherein: the upper end of the support plate (13) is provided with a limiting bolt (15), and the front part of the lower end of the first limiting plate (5) and the rear part of the lower end of the second limiting plate (6) are provided with sliders (16).

4. The low impedance multilayer sheet of claim 3 wherein: the heat dissipation grooves (10) are distributed at equal intervals, and the screw grooves (12) are distributed at equal intervals.

5. The low impedance multilayer sheet of claim 4 wherein: the heat dissipation device (7) comprises a mounting frame (71), a fan (72) is arranged inside the mounting frame (71), a rotating column (73) is arranged at the output end of the fan (72), fan blades (74) are arranged at the right end of the rotating column (73), a plurality of ventilation grooves (75) are formed in the left end of the mounting frame (71), and the mounting frame (71) is connected in the mounting groove (14).

6. The low impedance multilayer sheet of claim 5 wherein: the plurality of air-permeable grooves (75) are distributed in an annular array.

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