CN216480721U

CN216480721U - Heat dissipation external member of LED projecting lamp

Info

Publication number: CN216480721U
Application number: CN202123109860.3U
Authority: CN
Inventors: 陈伟
Original assignee: Jiangmen Jingtian Photoelectric Technology Co ltd
Current assignee: Jiangmen Jingtian Photoelectric Technology Co ltd
Priority date: 2021-12-13
Filing date: 2021-12-13
Publication date: 2022-05-10
Anticipated expiration: 2031-12-13

Abstract

The utility model discloses a heat dissipation external member of LED projecting lamp, including lamp body and mounting bracket, the lamp body back is equipped with the radiating piece, the radiating piece includes heat-absorbing structure, semiconductor refrigeration piece, heat radiation structure and two fan structures, the semiconductor refrigeration piece is located between heat-absorbing structure and the heat radiation structure, and semiconductor refrigeration piece system cold side and heat-absorbing structure laminating. The utility model discloses in, be provided with lamp body and radiating piece, and the radiating piece includes heat absorbing structure, the semiconductor refrigeration piece, heat radiation structure, fan structure and battery, thereby can refrigerate to LED projecting lamp inside through the refrigeration side of semiconductor refrigeration piece, make the LED projecting lamp production of heat exchanged, and fan structure and heat radiation structure can reduce the temperature of semiconductor refrigeration piece opposite side, improve the heat dissipation side radiating effect of semiconductor refrigeration piece, and then improve semiconductor refrigeration piece refrigeration effect, the realization is to the inside cooling heat dissipation of LED projecting lamp, and the radiating effect compares single fin radiating effect better.

Description

Heat dissipation external member of LED projecting lamp

Technical Field

The utility model relates to a LED projecting lamp heat dissipation technical field especially relates to a heat dissipation external member of LED projecting lamp.

Background

The LED projector is a lamp whose illumination on the designated illuminated surface is higher than that of the surrounding environment, also called a spotlight, can be aimed in any direction, has a structure that is not affected by weather conditions, and is mainly used in large-area operation sites, mines, building outlines, stadiums, overpasses, monuments, parks, flower beds, and the like.

The luminance of LED projecting lamp is very big, and consequently the LED projecting lamp is after long-time illumination, and itself can produce very big heat to influence LED projecting lamp life, the heat dissipation of the LED projecting lamp on the present market all relies on the fin at the casing back to dispel the heat, even the heat dissipation fan does not all, and this kind of radiating mode is single and the effect is general, consequently the utility model provides a heat dissipation external member of LED projecting lamp.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcomings existing in the prior art and providing a heat dissipation external member of a LED projection lamp.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a heat dissipation external member of LED projecting lamp, includes lamp body and mounting bracket, the lamp body back is equipped with the heat dissipation piece, the heat dissipation piece includes heat absorption structure, semiconductor refrigeration piece, heat radiation structure and two fan structures, the semiconductor refrigeration piece is located between heat absorption structure and the heat radiation structure, and the laminating of semiconductor refrigeration piece system cold side and heat absorption structure, the lamp body is close to heat dissipation piece one side and has seted up the opening, and lamp body back both sides all are fixed with two first connecting plates, two a plurality of first perforation have all been seted up on first connecting plate surface, heat absorption structure includes the absorber plate, and the absorber plate is close to heat radiation structure one side and has seted up a plurality of screw holes, the absorber plate bottom mounting has the bottom plate, the absorber plate top is fixed with solar cell panel.

Furthermore, two second connecting plates are fixed on two sides of the heat absorbing plate, a plurality of second through holes are formed in the surfaces of the second connecting plates, and a plurality of bolts are arranged on the second through holes and the corresponding first through holes in a penetrating mode, so that the heat absorbing plate can be fixed on the back face of the lamp body through the bolts.

Furthermore, the heat absorbing plate is fixed with a plurality of heat absorbing sheets near one side of the lamp body, and a plurality of heat absorbing sheets penetrate through the opening and extend to the inside of the lamp body, the upper surface of the heat absorbing plate is attached to the surface of the semiconductor refrigerating sheet, so that the heat absorbing sheet can be refrigerated through the semiconductor refrigerating sheet, and then the heat absorbing sheet exchanges with the heat generated inside the lamp body 1, and the heat dissipation effect is achieved.

Further, semiconductor refrigeration piece and solar cell panel electric connection, semiconductor refrigeration piece and solar cell panel can store the electricity of generating in the battery to can generate electricity and save daytime through solar cell panel, and supply power, the energy saving more to the semiconductor refrigeration piece.

Further, heat radiation structure includes the heating panel, and the heating panel both sides correspond with a plurality of screw holes and have seted up a plurality of third and perforate, and the heating panel laminates with the semiconductor refrigeration piece, is equipped with the bolt in screw hole and the third perforation, can be connected the heating panel with the absorber plate through the bolt to fix the semiconductor refrigeration piece centre gripping in the centre, thereby the heating panel can dispel the heat to the heat dissipation side of semiconductor refrigeration piece, thereby improves the refrigeration effect of its system cold side.

Furthermore, a plurality of radiating fins are fixed on one side, away from the semiconductor refrigeration fin, of the radiating plate, and a plurality of radiating holes are formed in the surfaces of the radiating fins, so that the air among the radiating fins can flow faster.

Further, two the fan structure all includes the casing, and the casing inside wall is fixed with two connecting rods, two the connecting rod other end is fixed with the motor jointly, motor drive shaft is connected with the flabellum, fan structure and fin fixed connection to can accelerate the heat dissipation on fin surface through the fan structure.

The utility model has the advantages that:

1. the utility model discloses when using, through setting up lamp body and radiating piece, and the radiating piece includes heat absorption structure, the semiconductor refrigeration piece, heat radiation structure, fan structure and battery, thereby can refrigerate to LED projecting lamp inside through the refrigeration side of semiconductor refrigeration piece, make the LED projecting lamp produce the heat and be exchanged, and fan structure and heat radiation structure can reduce the temperature of semiconductor refrigeration piece opposite side, improve the heat dissipation side radiating effect of semiconductor refrigeration piece, and then improve semiconductor refrigeration piece refrigeration effect, realize the inside cooling heat dissipation of LED projecting lamp, and the radiating effect compares single fin radiating effect better.

2. The utility model discloses when using, can dismantle each other between through setting up heat absorbing structure, semiconductor refrigeration piece and the heat radiation structure, when the semiconductor refrigeration piece breaks down, can dismantle the maintenance fast or change it, it is nimble more convenient to use.

Drawings

FIG. 1 is an exploded view of the present invention;

FIG. 2 is a front view of the present invention;

fig. 3 is a sectional view of the present invention.

Illustration of the drawings:

1. a lamp body; 11. an opening; 12. a first connecting plate; 13. a first perforation; 14. a mounting frame; 2. a heat sink; 3. a heat absorbing structure; 31. a heat absorbing plate; 32. a heat absorbing sheet; 33. a threaded hole; 34. a second connecting plate; 35. a second perforation; 4. a semiconductor refrigeration sheet; 5. a heat dissipation structure; 51. a heat dissipation plate; 52. a third perforation; 53. a heat sink; 54. heat dissipation holes; 6. a fan structure; 61. a housing; 62. a connecting rod; 63. a motor; 64. a fan blade; 7. a base plate; 8. a solar cell panel.

Detailed Description

As shown in fig. 1 and fig. 2, a heat dissipation kit of an LED projector is disclosed, which comprises a lamp body 1 and a mounting frame 14, wherein a heat dissipation member 2 is disposed on the back of the lamp body 1, the heat dissipation member 2 comprises a heat absorption structure 3, a semiconductor refrigeration sheet 4, a heat dissipation structure 5 and two fan structures 6, the semiconductor refrigeration sheet 4 is disposed between the heat absorption structure 3 and the heat dissipation structure 5, a cold side of the semiconductor refrigeration sheet 4 is attached to the heat absorption structure 3, an opening 11 is disposed on one side of the lamp body 1 close to the heat dissipation member 2, two first connection plates 12 are fixed on two sides of the back of the lamp body 1, a plurality of first through holes 13 are disposed on the surfaces of the two first connection plates 12, the heat absorption structure 3 comprises a heat absorption plate 31, a plurality of threaded holes 33 are disposed on one side of the heat absorption plate 31 close to the heat dissipation structure 5, a bottom plate 7 is fixed at the bottom end of the heat absorption plate 31, a solar cell panel 8 is fixed at the top end of the heat absorption plate 31, two second connection plates 34 are fixed at two sides of the heat absorption plate 31, a plurality of second through holes 35 are formed in the surfaces of the two second connecting plates 34, and bolts are arranged through the second through holes 35 and the corresponding first through holes 13. A plurality of heat absorbing sheets 32 are fixed on one side of the heat absorbing plate 31 close to the lamp body 1, the heat absorbing sheets 32 penetrate through the opening 11 and extend into the lamp body 1, and the upper surface of the heat absorbing plate 31 is attached to the surface of the semiconductor refrigeration sheet 4. The semiconductor refrigerating sheet 4 is electrically connected with the solar cell panel 8. The heat dissipation structure 5 includes a heat dissipation plate 51, and a plurality of third through holes 52 are formed on two sides of the heat dissipation plate 51 corresponding to the plurality of threaded holes 33, and the heat dissipation plate 51 is attached to the semiconductor chilling plate 4. The heat dissipating plate 51 is fixed with a plurality of heat dissipating fins 53 at a side thereof away from the semiconductor cooling fins 4, and a plurality of heat dissipating holes 54 are formed on the surfaces of the plurality of heat dissipating fins 53.

As shown in fig. 1 and fig. 3, the two fan structures 6 each include a housing 61, two connecting rods 62 are fixed to the inner side wall of the housing 61, a motor 63 is fixed to the other end of each connecting rod 62, and a fan blade 64 is connected to the driving shaft of the motor 63.

When in use: when the LED projecting lamp produces a large amount of heats after the illumination, the refrigeration side of semiconductor refrigeration piece 4 begins to refrigerate heat absorbing plate 31, thereby reduce the temperature of heat absorbing plate 31 and heat absorbing piece 32, low temperature heat absorbing piece 32 exchanges with the inside heat of LED projecting lamp, thereby realize the inside cooling heat dissipation of LED projecting lamp, simultaneously heat dissipating plate 51 and fin 53 of the 4 radiating sides of semiconductor refrigeration piece can increase heat radiating area, and motor 63 can drive flabellum 64 and rotate, air flow between the fin 53 accelerates, and then take away the temperature on fin 53 surface, improve the radiating effect of the 4 radiating sides of semiconductor refrigeration piece from this, the radiating effect of the 4 radiating sides of semiconductor refrigeration piece improves the back, the refrigeration effect of its refrigeration side also can be better, can further improve the heat absorbing piece 32 and the inside thermal exchange of projecting lamp, realize high-efficiency heat dissipation.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The utility model provides a heat dissipation external member of LED projecting lamp, includes lamp body (1) and mounting bracket (14), its characterized in that: the heat radiation structure is characterized in that the back surface of the lamp body (1) is provided with a heat radiation piece (2), the heat radiation piece (2) comprises a heat absorption structure (3), a semiconductor refrigeration piece (4), a heat radiation structure (5) and two fan structures (6), the semiconductor refrigeration piece (4) is positioned between the heat absorption structure (3) and the heat radiation structure (5), a refrigeration side of the semiconductor refrigeration piece (4) is attached to the heat absorption structure (3), one side, close to the heat radiation piece (2), of the lamp body (1) is provided with an opening (11), two sides of the back surface of the lamp body (1) are both fixed with two first connecting plates (12), the surfaces of the two first connecting plates (12) are both provided with a plurality of first through holes (13), the heat absorption structure (3) comprises a heat absorption plate (31), one side, close to the heat radiation structure (5), of the heat absorption plate (31) is provided with a plurality of threaded holes (33), and the bottom end of the heat absorption plate (31) is fixed with a bottom plate (7), and a solar panel (8) is fixed at the top end of the heat absorbing plate (31).

2. The heat dissipation kit for an LED projector according to claim 1, wherein: two second connecting plates (34) are fixed on two sides of the heat absorbing plate (31), a plurality of second through holes (35) are formed in the surfaces of the two second connecting plates (34), and bolts penetrate through the second through holes (35) and the corresponding first through holes (13) together.

3. The heat dissipation kit for an LED projector according to claim 1, wherein: a plurality of heat absorbing sheets (32) are fixed on one side, close to the lamp body (1), of the heat absorbing plate (31), the heat absorbing sheets (32) penetrate through the opening (11) and extend to the interior of the lamp body (1), and the upper surface of the heat absorbing plate (31) is attached to the surface of the semiconductor refrigerating sheet (4).

4. The heat dissipation kit for an LED projector according to claim 1, wherein: the semiconductor refrigerating sheet (4) is electrically connected with the solar cell panel (8).

5. The heat dissipation kit for an LED projector according to claim 1, wherein: the heat dissipation structure (5) comprises a heat dissipation plate (51), a plurality of third through holes (52) are formed in the two sides of the heat dissipation plate (51) and correspond to the threaded holes (33), and the heat dissipation plate (51) is attached to the semiconductor refrigeration sheet (4).

6. The heat dissipation kit of an LED projector as claimed in claim 5, wherein: a plurality of radiating fins (53) are fixed on one side of the radiating plate (51) far away from the semiconductor refrigeration sheet (4), and a plurality of radiating holes (54) are formed in the surfaces of the radiating fins (53).

7. The heat dissipation kit for an LED projector according to claim 1, wherein: two fan structure (6) all include casing (61), and casing (61) inside wall is fixed with two connecting rods (62), two connecting rod (62) other end is fixed with motor (63) jointly, motor (63) drive shaft is connected with flabellum (64).