CN216461441U - Semiconductor plastic package defective products tool of doing over again - Google Patents
Semiconductor plastic package defective products tool of doing over again Download PDFInfo
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- CN216461441U CN216461441U CN202123176029.XU CN202123176029U CN216461441U CN 216461441 U CN216461441 U CN 216461441U CN 202123176029 U CN202123176029 U CN 202123176029U CN 216461441 U CN216461441 U CN 216461441U
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Abstract
The utility model discloses a semiconductor plastic package defective product reworking jig, which relates to the technical field of semiconductor package product processing equipment and comprises a pressing plate, a cutting part, a positioning part and a base which are arranged in sequence, wherein the cutting part is opposite to the positioning part; a guide rod is fixed on the base, and the pressure plate is connected with the guide rod in a sliding manner and can move along the guide rod; one side of the cutting part facing the positioning part is provided with a cutter in a protruding way; the positioning part is provided with positioning grids and guide grooves, the cutter is opposite to the positioning grids, the positioning grids and the guide grooves are all adapted to semiconductor plastic package products, and the cutter is adapted to the positioning grids. And the semiconductor plastic package product is inserted into the guide groove and aligned to the positioning grids, the cutter is over against the positioning grids, the pressing plate is moved to drive the cutting part to move until the cutter moves to cut off the defective products. The cutting device is very convenient, an operator only needs to place the semiconductor plastic package product at a specified position and move the pressing plate, so that defective products can be cut off, excessive time does not need to be consumed relatively, and consumption of human resources is reduced.
Description
Technical Field
The utility model relates to a semiconductor package product processing equipment technical field, concretely relates to semiconductor plastic envelope defective products tool of doing over again.
Background
Semiconductor plastic packaging is a necessary process in the production process. In the plastic packaging process, the situation that the frame pins are damaged due to improper operation of an operator can occur, defective products are generated, and in order to avoid scrapping of the whole semiconductor plastic packaging product, the semiconductor plastic packaging product with the defective products needs to be reworked.
The existing reworking processing mode is a manual processing mode, namely, an operator uses a blade tool to cut off the damaged part of the pins on the frame of the semiconductor plastic package product. Since the pins are difficult to observe by naked eyes, the handling of semiconductor plastic package products in this way is very inconvenient, so that the operator needs to be careful and needs a long time, which results in a great consumption of human resources.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: aiming at the problems, the semiconductor plastic package defective product reworking jig assists operators to cut off defective products and is simple to operate.
The utility model adopts the technical scheme as follows:
a semiconductor plastic package defective product reworking jig is characterized in that defective products and other defective products are fixed on a frame together to form a semiconductor plastic package product, and the semiconductor plastic package defective product reworking jig comprises a pressing plate, a cutting part, a positioning part and a base which are sequentially arranged, wherein the cutting part is opposite to the positioning part; a guide rod is fixed on the base, and the pressure plate is connected with the guide rod in a sliding manner and can move along the guide rod; a cutter is arranged on one surface of the cutting part facing the positioning part in a protruding mode; the positioning part is provided with the positioning grids and the guide grooves, the cutter is opposite to the positioning grids, the positioning grids and the guide grooves are all adapted to the semiconductor plastic package product, the semiconductor plastic package product can move along the guide grooves, and the cutter is adapted to the positioning grids.
By adopting the technical scheme, the semiconductor plastic package product is positioned in the guide groove, the defective product is aligned to the cutter of the cutting piece, the cutting piece is moved, and the defective product is cut off by the cutter. Only need move the clamp plate, just can realize the excision of defective products, need not use the blade excision one by one to the defective products, convenient operation is swift.
Preferably, the guide rod is sleeved with the elastic part, the guide rod and the elastic part are not connected, one end of the elastic part is fixed on the base, the other end of the elastic part is connected with the pressing plate, and the pressing plate can move along the guide rod and compress the elastic part.
By adopting the technical scheme, the pressing plate receives the reaction force of the elastic piece when moving, so that the pressing plate moves slowly, the pressing plate is prevented from moving too fast, the cutter driving the cutting piece impacts the semiconductor plastic package product, and the cutter and the semiconductor plastic package product are damaged.
Preferably, the semiconductor plastic package defective product reworking jig further comprises a fixing plate fixed on the base, and a working port is formed in the fixing plate; the positioning piece is positioned between the base and the fixed plate, and the positioning grids are opposite to the working opening and expose out of the working opening; the fixed plate is provided with a first guide groove, the base is provided with a second guide groove, the first guide groove and the second guide groove are opposite and communicated and spliced to form the same groove, and the groove formed by splicing is matched with the semiconductor plastic package product; the first guide groove is flush with the guide groove in height and is communicated with the guide groove in a straight line.
By adopting the technical scheme, the working port is convenient for operators to observe defective products, the defective products are aligned with the positioning grids on the positioning piece, and the defective products are prevented from being positioned incorrectly, so that dislocation is avoided, and further, cutting errors are caused.
Preferably, the base is provided with an installation groove, the positioning piece is fixed in the installation groove, and the positioning piece is flush with the base.
Preferably, a partition board is further fixed on the fixing board at the working opening and arranged along the width direction of the working opening.
By adopting the technical scheme, the partition plate is used for separating the semiconductor plastic package products exposed from the working port, so that operators can observe the products in different areas conveniently.
Preferably, the semiconductor plastic package defective product reworking jig further comprises a top protection plate, the top protection plate is connected with one end of the guide rod, and the pressing plate is located between the top protection plate and the base.
Preferably, a cleaning opening is formed in the base and located in the mounting groove, the cleaning opening is opposite to the working opening, and the opening size of the cleaning opening is not smaller than that of the working opening.
By adopting the technical scheme, the cut defective products can fall off from the cleaning port, so that the cleaning is convenient.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that: the semiconductor plastic package product is inserted into the guide groove and aligned with the positioning grids, the cutter is just opposite to the positioning grids, the pressing plate is moved to drive the cutting part to move until the cutter moves to cut off defective products. The jig is very convenient to rework, operators only need to place semiconductor plastic package products at specified positions and move the pressing plate, so that defective products can be cut off, excessive time does not need to be consumed relatively, and consumption of manpower resources is reduced.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the present invention cooperating with the semiconductor plastic package product.
FIG. 3 is a schematic view of the engagement of the pressure plate with the cut-out.
Fig. 4 is a schematic structural diagram of the fixing plate, the positioning member and the base in cooperation with the semiconductor plastic package product.
Fig. 5 is a schematic structural view of the fixing plate, the positioning member and the base.
Fig. 6 is a front view of the fixing plate engaged with the base.
Fig. 7 is a schematic view of the structure of the positioning element and the base.
Fig. 8 is a schematic view of the cut-out.
Fig. 9 is a schematic structural view of the fixing plate.
Fig. 10 is a schematic view of another angle structure of the fixing plate.
Fig. 11 is a schematic structural diagram of a positioning member.
Fig. 12 is a schematic structural view of the base.
The labels in the figure are: the device comprises a top protection plate-1, a pressing plate-2, a cutting piece-3, a cutter-31, a fixing plate-4, a working opening-41, a first guide groove-42, a partition plate-43, a positioning piece-5, a positioning grid-51, a guide groove-52, a base-6, a second guide groove-61, a mounting groove-62, a cleaning opening-63, a guide rod-7, an elastic piece-71 and a semiconductor plastic package product-9.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 to 12, a semiconductor plastic package defective product reworking jig is disclosed, in which defective products and other defective products are fixed on a frame together to form a semiconductor plastic package product 9. Semiconductor plastic envelope defective products tool of doing over again includes guide arm 7 including protecting roof 1, clamp plate 2, excision piece 3, fixed plate 4, setting element 5, the base 6 that from top to bottom sets gradually, protects roof 1, clamp plate 2, fixed plate 4 and is rectangular shaped plate, and base 6 is the cuboid.
The upper ends of the guide rods 7 are fixedly connected with the top protection plate 1, the lower ends of the guide rods 7 are fixedly connected with the base 6, and the number of the guide rods 7 is four, and the four guide rods are respectively positioned at four corners of the top protection plate 1 and the base 6; four angles of clamp plate 2 are established on guide arm 7, and do not contact with guide arm 7 or with guide arm 7 sliding connection, clamp plate 2 can move along guide arm 7.
Each guide rod 7 is sleeved with an elastic piece 71, the guide rod 7 is connected with the elastic piece 71, the upper end of the elastic piece 71 is fixedly connected with the pressing plate 2, and the lower end of the elastic piece 71 is fixedly connected with the base 6; when the pressing plate 2 moves, the pressing plate 2 is slowly moved by the counterforce of the elastic piece 71, the pressing plate 2 is prevented from moving too fast, the cutter 31 driving the cutting piece 3 impacts the semiconductor plastic package product 9, and the cutter 31 and the semiconductor plastic package product 9 are damaged.
The pressing plate 2 is fixedly connected with the cutting part 3, and the cutting part 3 is opposite to the positioning part 5; a cutter 31 is fixed on one surface of the cutting part 3 facing the positioning part 5 in a protruding way; one surface of the positioning piece 5 facing the cutting piece 3 is provided with a positioning grid 51 and a guide groove 52, the cutter 31 is opposite to the positioning grid 51, the positioning grid 51 and the guide groove 52 are both adapted to the semiconductor plastic package product 9, and the cutter 31 is adapted to the positioning grid 51.
The fixed plate 4 is fixed on the base 6, a working opening 41 is formed in the fixed plate 4, the working opening 41 is opposite to the positioning grids 51 and the cutter 31, and the positioning grids 51 are exposed out of the working opening 41; the working opening 41 is used for enabling an operator to intensively observe defective products, aligning the defective products with the positioning grids 51 on the positioning piece 5, and preventing the defective products from being positioned incorrectly to cause dislocation and further cutting errors.
A first guide groove 42 is formed in the width direction of one side, facing the base 6, of the fixing plate 4 in a penetrating mode, a second guide groove 61 is formed in the width direction of one side, facing the fixing plate 4, of the base 6, the first guide groove 42 and the second guide groove 61 are opposite to each other and are communicated and spliced to form the same groove, and the groove formed by splicing is matched with the semiconductor plastic package product 9; the first guide groove 42 is flush in height with the guide groove 52 and communicates linearly; a partition plate 43 is further fixed on the fixing plate 4 at the working opening 41, and the partition plate 43 is arranged along the width direction of the working opening 41; the partition plate 43 is used for partitioning the semiconductor plastic package products 9 exposed in the working opening 41, so that operators can observe the products in different areas conveniently.
An installation groove 62 is formed in the base 6, the positioning piece 5 is fixed in the installation groove 62, and the positioning piece 5 is flush with the base 6; vertically run through on the base 6 and seted up clearance mouth 63, clearance mouth 63 is located mounting groove 62, and clearance mouth 63 is just to working port 41, and the opening size of clearance mouth 63 is not less than the opening size of working port 41, and the defective products that are amputated can drop from clearance mouth 63, the clearance of being convenient for.
The use mode of the jig is as follows:
an operator inserts the semiconductor plastic package product 9 into the groove formed by splicing the first guide groove 42 and the second guide groove 61 and moves along the groove. In the whole treatment process, the semiconductor plastic package product 9 penetrates through the base 6 and one side of the fixing plate 4, penetrates through the guide groove 52 of the positioning piece 5 and then penetrates out of the base 6 and the other side of the fixing plate 4.
During the process of moving the semiconductor plastic packaged product 9, an operator positions a defective product on the semiconductor plastic packaged product 9 at the position of the positioning grid 51 and exposes the working opening 41.
The operator applies force to press the pressing plate 2, the pressing plate 2 compresses the elastic piece 71 until the cutter 31 contacts a defective product, the defective product is cut off, the defective product passes through the cleaning port 63 and drops to the operating platform, and the cutting of the defective product is finished.
The principles and embodiments of the present invention have been explained herein using specific examples, which are presented only to aid in understanding the methods and their core concepts. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (7)
1. A semiconductor plastic package defective products reworking jig, defective products and other defective products are fixed on a frame together to form semiconductor plastic package products, and the semiconductor plastic package defective products reworking jig is characterized by comprising a pressing plate, a cutting part, a positioning part and a base which are arranged in sequence, wherein the cutting part is opposite to the positioning part; a guide rod is fixed on the base, and the pressure plate is connected with the guide rod in a sliding manner and can move along the guide rod; a cutter is arranged on one surface of the cutting part facing the positioning part in a protruding mode; the positioning part is provided with the positioning grids and the guide grooves, the cutter is opposite to the positioning grids, the positioning grids and the guide grooves are all adapted to the semiconductor plastic package product, the semiconductor plastic package product can move along the guide grooves, and the cutter is adapted to the positioning grids.
2. A semiconductor plastic package defective product rework fixture as recited in claim 1, wherein the guide bar is sleeved with an elastic member, and the elastic member and the guide bar are not connected, one end of the elastic member is fixed on the base, the other end is connected with the pressing plate, and the pressing plate can move along the guide bar and compress the elastic member.
3. A semiconductor plastic package defective product reworking jig according to claim 1, further comprising a fixing plate fixed on the base, wherein the fixing plate is provided with a working port; the positioning piece is positioned between the base and the fixed plate, and the positioning grids are opposite to the working opening and expose out of the working opening; the fixed plate is provided with a first guide groove, the base is provided with a second guide groove, the first guide groove and the second guide groove are opposite and communicated and spliced to form the same groove, and the groove formed by splicing is matched with the semiconductor plastic package product; the first guide groove is flush with the guide groove in height and is communicated with the guide groove in a straight line.
4. A semiconductor plastic package defective product reworking jig according to claim 3, wherein the base is provided with an installation groove, the positioning member is fixed in the installation groove, and the positioning member is flush with the base.
5. A semiconductor plastic package defective product reworking jig according to claim 4, wherein a partition plate is further fixed on the fixing plate at the working port and arranged along the width direction of the working port.
6. A semiconductor plastic package defective product rework fixture as recited in claim 1, further comprising a top protection plate, wherein the top protection plate is connected to one end of the guide rod, and the pressing plate is located between the top protection plate and the base.
7. A semiconductor plastic package defective product reworking jig according to claim 4, wherein the base is provided with a cleaning opening, the cleaning opening is positioned in the mounting groove, the cleaning opening is opposite to the working opening, and the opening size of the cleaning opening is not smaller than that of the working opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123176029.XU CN216461441U (en) | 2021-12-16 | 2021-12-16 | Semiconductor plastic package defective products tool of doing over again |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123176029.XU CN216461441U (en) | 2021-12-16 | 2021-12-16 | Semiconductor plastic package defective products tool of doing over again |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216461441U true CN216461441U (en) | 2022-05-10 |
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ID=81423102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123176029.XU Active CN216461441U (en) | 2021-12-16 | 2021-12-16 | Semiconductor plastic package defective products tool of doing over again |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216461441U (en) |
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2021
- 2021-12-16 CN CN202123176029.XU patent/CN216461441U/en active Active
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