CN216435850U

CN216435850U - Microelectronic chip stacking and pressing device

Info

Publication number: CN216435850U
Application number: CN202122820674.4U
Authority: CN
Inventors: 蒋大泽
Original assignee: Runlian Electronic Materials Jiangsu Co ltd
Current assignee: Runlian Electronic Materials Jiangsu Co ltd
Priority date: 2021-11-17
Filing date: 2021-11-17
Publication date: 2022-05-03
Anticipated expiration: 2031-11-17

Abstract

The utility model discloses a microelectronic chip piles up biasing means relates to microelectronic chip production technical field. The utility model discloses a conveying plummer and electric putter, the surface of conveying plummer is provided with the bearing plate, the surface of bearing plate has been seted up and has been adsorbed the fluting, the top of bearing plate is provided with the rubber coating mechanism, the connection stand is installed to the lateral wall of conveying plummer, electric putter install in the top face of connection stand, electric putter's output laminating has closed clamp plate. This practicality wholly adopts automatic technology flow, can carry out the operation of automatic rubber coating and pressfitting to two sets of chips that need pile up, and whole process manual work participates in less, and keeps the laminating of chip stable through the negative pressure effect among the pressfitting process, and whole course of working efficiency is higher, replaces traditional a large amount of robotic arm, has not only reduced use cost, reduces the follow-up maintenance degree of difficulty.

Description

Microelectronic chip stacking and pressing device

Technical Field

The utility model relates to a microelectronics chip production technical field especially relates to a microelectronics chip piles up biasing means.

Background

The microelectronics technology is a new technology developed along with integrated circuits, especially very large scale integrated circuits, and includes a series of special technologies such as system circuit design, device physics, process technology, material preparation, automatic test, packaging and assembly, and the microelectronics technology is the sum of all process technologies in microelectronics.

At present, most of microelectronic chip processing is operated by combining a plurality of groups of mechanical arms, but the production and use cost of the mechanical arms is high, so that a lot of small factories cannot pay the cost for a long time, and the mechanical arms are complex in structure, need to be periodically overhauled, and increase the cost expenditure again.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a microelectronic chip piles up biasing means to solve current problem: however, because the production and use costs of the mechanical arm are high, many small factories cannot pay the cost for a long time, and the mechanical arm needs to be periodically overhauled due to the complex structure, which increases the cost again.

In order to solve the technical problem, the utility model discloses a realize through following technical scheme:

the utility model relates to a microelectronic chip piles up biasing means, including conveying plummer and electric putter, the surface of conveying plummer is provided with the bearing board, the surface of bearing board has been seted up and has been adsorbed the fluting, the top of bearing board is provided with rubber coating mechanism, the connection stand is installed to the lateral wall of conveying plummer, electric putter install in the top face of connection stand, electric putter's output laminating has closed clamp plate, electric putter's the place ahead is provided with gland mechanism.

Further, the rubber coating mechanism is including gluing the layer board, dispensing head and storing up gluey storehouse, the lateral wall of conveying plummer is installed and is stored up gluey storehouse, the top of storing up gluey storehouse is provided with the gluey layer board of gluing, the inboard movable joint of gluing the layer board has a dispensing head, store up gluey storehouse and dispensing head and pass through the hose connection.

Furthermore, the dispensing head is movably connected with the inner wall of the dispensing support plate, a feeding table is arranged in front of the conveying bearing table, the surface of the feeding table is made of rubber, and the bearing support plates are arranged on the surface of the conveying bearing table at equal intervals.

Further, the gland mechanism includes conveying storehouse, check baffle and conveyer belt, the top of bearing plate is provided with the conveying storehouse, the surface laminating in conveying storehouse has the conveyer belt, the surface laminating of conveyer belt has the conveyer belt, check baffle adopts square plate form, check baffle install in the surface top-down of conveyer belt is equidistant to be distributed.

Furthermore, the appearance structure of conveying storehouse is square cavity design, the conveyer belt about the central point bilateral symmetry of conveying storehouse distributes, and two sets of the conveyer belt passes through motor drive and rotates to the inboard, the lateral wall in conveying storehouse with conveying plummer fixed connection.

Further, adsorb grooved below and be connected with the absorption connecting pipe, the end-to-end connection of absorption connecting pipe has the negative pressure pump, the negative pressure pump passes through the absorption connecting pipe with adsorb to constitute the connectivity between the fluting, closed clamp plate with constitute extending structure between the electric putter, the top of absorption connecting pipe with adsorb grooved bottom and pass through loose axle sealing connection.

1. The utility model adopts an automatic process flow, can automatically glue and press two groups of chips to be stacked, has less manual participation in the whole process, and keeps the stable lamination of the chips through the negative pressure effect in the pressing process;

2. the utility model can adjust the horizontal position of the dispensing head through the movable connection of the dispensing head and the dispensing support plate, and further can put the dispensing in different positions of the chip, thereby realizing the adhesion in different degrees, being applicable to the adhesion of chips with different shapes and sizes, having wider application range, realizing the automatic putting on the surface of a square bearing support plate through the inclined design of the feeding table, and enabling the chip to move stably by adopting the feeding table made of rubber materials;

3. the utility model has the advantages that the negative pressure attraction of the negative pressure pump ensures that the adsorption slotting part has downward negative pressure attraction, so that each chip placed on the surface of the bearing supporting plate keeps stable, the subsequent gluing and pressing are more orderly and stable, a large number of traditional mechanical arms are replaced, the use cost is reduced, the equipment cost is reduced, and the cost expenditure of subsequent maintenance is reduced;

4. the utility model discloses a drive of two sets of conveyer belts can be with bearing another group chip on check baffle surface and continuously stably drag downwards to make closed clamp plate reciprocate through electric putter's drive, can carry out stable integration with piling up two sets of chips of accomplishing, have higher laminating efficiency.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of a microelectronic chip stacking and pressing device according to the present invention;

fig. 2 is a side view of a transport carrier of a microelectronic die stacking pressure applicator of the present invention;

fig. 3 is a bottom view of the dispensing support plate of the microelectronic chip stacking and pressing device of the present invention;

fig. 4 is a side view of the adsorption slot of the microelectronic die stacking and pressing device of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a conveying bearing table; 2. a load bearing plate; 3. carrying out adsorption grooving; 4. an adsorption connecting pipe; 5. a negative pressure pump; 6. dispensing a supporting plate; 7. dispensing a glue head; 8. a glue storage bin; 9. a transfer bin; 10. a grid baffle; 11. a conveyor belt; 12. connecting the upright posts; 13. an electric push rod; 14. closing the pressure plate; 15. a feeding table.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Please refer to fig. 1-4, the utility model relates to a microelectronic chip piles up biasing means, including conveying plummer 1 and electric putter 13, conveying plummer 1's surface is provided with bearing plate 2, bearing plate 2's surface has been seted up and has been adsorbed fluting 3, bearing plate 2's top is provided with rubber coating mechanism, conveying plummer 1's lateral wall is installed and is connected stand 12, electric putter 13 is installed in the top face of connecting stand 12, electric putter 13's output laminating has closed clamp plate 14, electric putter 13's the place ahead is provided with gland mechanism.

Specifically, the glue coating mechanism comprises a glue dispensing supporting plate 6, a glue dispensing head 7 and a glue storage bin 8, the glue storage bin 8 is installed on the side wall of the conveying bearing platform 1, the glue dispensing supporting plate 6 is arranged above the glue storage bin 8, the glue dispensing heads 7 are movably attached to the inner side of the glue dispensing supporting plate 6, the glue storage bin 8 is connected with the glue dispensing heads 7 through a hose, the glue dispensing heads 7 are movably connected with the inner wall of the glue dispensing supporting plate 6, a feeding platform 15 is arranged in front of the conveying bearing platform 1, the surface of the feeding platform 15 is made of rubber, the bearing supporting plate 2 is installed on the surface of the conveying bearing platform 1 and distributed at equal intervals, the horizontal position of the glue dispensing heads 7 can be adjusted through the movable connection of the glue dispensing heads 7 and the glue dispensing supporting plate 6, glue can be dispensed at different positions of chips, and can be adhered at different degrees, the glue dispensing device is suitable for adhering the chips with different shapes and sizes, the application range is wide, automatic dispensing on the surface of the square bearing supporting plate 2 through the inclined design of the feeding platform 15, the feeding table 15 made of rubber can stabilize the movement of the chip.

Accurately, the gland mechanism comprises a conveying bin 9, grid baffles 10 and conveying belts 11, the conveying bin 9 is arranged above the bearing support plate 2, the conveying belts 11 are attached to the surface of the conveying bin 9, the conveying belts 11 are attached to the surface of the conveying belts 11, the grid baffles 10 are square plate-shaped, the grid baffles 10 are arranged on the surface of the conveying belts 11 and distributed at equal intervals from top to bottom, the appearance structure of the conveying bin 9 is in a square hollow design, the conveying belts 11 are distributed in bilateral symmetry about the central point of the conveying bin 9, and the two groups of conveying belts 11 are driven by a motor to rotate inwards; the lateral wall and the conveying plummer 1 fixed connection of conveying storehouse 9 can be with bearing another group chip on check baffle 10 surface continuously stable drag downwards through the drive of two sets of conveyer belts 11 to make closed clamp plate 14 reciprocate through electric putter 13's drive, can carry out stable integration with piling up two sets of chips of accomplishing, have higher laminating efficiency.

Further, the lower part of the adsorption slot 3 is connected with an adsorption connecting pipe 4, the tail end of the adsorption connecting pipe 4 is connected with a negative pressure pump 5, the negative pressure pump 5 forms a communicating structure through the adsorption connecting pipe 4 and the adsorption slot 3, a telescopic structure is formed between the closed pressing plate 14 and the electric push rod 13, the top end of the adsorption connecting pipe 4 is connected with the bottom end of the adsorption slot 3 through a movable shaft in a sealing mode, the position of the adsorption slot 3 has downward negative pressure attraction through the negative pressure attraction of the negative pressure pump 5, each chip placed on the surface of the bearing plate 2 is kept stable, so that subsequent glue coating and pressing are more orderly and stable, a large number of traditional mechanical arms are replaced, the use cost is reduced, the equipment cost is reduced, and the cost expenditure of subsequent maintenance is reduced.

One specific application of this embodiment is: when the device is used, firstly, the device is externally connected with a power supply, then, chips to be stacked are placed on the surface of a feeding table 15 in an inclined design one by one through mechanized equipment, the chips are driven by the feeding table 15 to move to the position above a conveying bearing table 1 and fall off the position above a bearing supporting plate 2 in a square design, an adsorption slot 3 is formed in the bearing supporting plate 2, the adsorption slot 3 has a downward negative pressure effect through the driving of a negative pressure pump 5, so that the chips at the bottom layer are adsorbed on the surface of the bearing supporting plate 2, then, the bearing supporting plate 2 moves clockwise through the driving of the conveying bearing table 1 and moves to the position below a dispensing supporting plate 6, the colloid in a colloid storage bin 8 is poured into a dispensing head 7 through a hose to be downwards sprayed and dropped on the chips, then, the bearing supporting plate 2 continuously moves to the position below a conveying bin 9, and another group of chips are stored on the inner side of a grid baffle plate 10, under the drive of conveyer belt 11 another group of chip falls into directly over to carrier plate 2 to steady putting is in the top of bottom chip, makes two sets of chip laminating through the glue solution, then recycles electric putter 13's drive and makes closed clamp plate 14 downstream, with two sets of chip laminating stable can.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended to aid in the description of the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A microelectronic die stacking pressure applicator, comprising: including conveying plummer (1) and electric putter (13), the surface of conveying plummer (1) is provided with bearing plate (2), adsorption fluting (3) have been seted up on bearing plate's (2) surface, bearing plate's (2) top is provided with the rubber coating mechanism, connecting column (12) are installed to the lateral wall of conveying plummer (1), electric putter (13) install in the top end face of connecting column (12), the output laminating of electric putter (13) has closed clamp plate (14), the place ahead of electric putter (13) is provided with gland mechanism.

2. The microelectronic chip stacking and pressing device according to claim 1, wherein the glue coating mechanism comprises a glue dispensing support plate (6), a glue dispensing head (7) and a glue storage bin (8), the glue storage bin (8) is installed on a sidewall of the conveying carrier (1), the glue dispensing support plate (6) is arranged above the glue storage bin (8), and the glue dispensing head (7) is movably attached to an inner side of the glue dispensing support plate (6).

3. The microelectronic chip stacking and pressing device according to claim 2, characterized in that the dispensing head (7) is movably connected to the inner wall of the dispensing carrier (6), a feeding table (15) is disposed in front of the conveying carrier (1), and the surface of the feeding table (15) is made of rubber.

4. The microelectronic die stack pressure applying apparatus according to claim 1, wherein the capping mechanism comprises a conveying bin (9), a grid baffle (10) and a conveyor belt (11), the conveying bin (9) is disposed above the carrier plate (2), the conveyor belt (11) is attached to a surface of the conveying bin (9), and the conveyor belt (11) is attached to a surface of the conveyor belt (11).

5. A microelectronic chip stack pressure-applying device according to claim 4, characterized in that the outer shape of the transport magazine (9) is of a square hollow design, the transport belts (11) are arranged symmetrically left and right about the center point of the transport magazine (9), and both sets of transport belts (11) are rotated to the inside by a motor drive.

6. The microelectronic chip stacking pressure applying device according to claim 1, wherein an adsorption connecting pipe (4) is connected below the adsorption slot (3), a negative pressure pump (5) is connected to an end of the adsorption connecting pipe (4), the negative pressure pump (5) forms a communicating structure with the adsorption slot (3) through the adsorption connecting pipe (4), and a telescopic structure is formed between the closing pressure plate (14) and the electric pushing rod (13).